JPH1065164A5 - - Google Patents
Info
- Publication number
- JPH1065164A5 JPH1065164A5 JP1996232553A JP23255396A JPH1065164A5 JP H1065164 A5 JPH1065164 A5 JP H1065164A5 JP 1996232553 A JP1996232553 A JP 1996232553A JP 23255396 A JP23255396 A JP 23255396A JP H1065164 A5 JPH1065164 A5 JP H1065164A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- impurity
- semiconductor device
- insulated gate
- crystalline semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23255396A JP3634086B2 (ja) | 1996-08-13 | 1996-08-13 | 絶縁ゲイト型半導体装置の作製方法 |
| TW086110814A TW357386B (en) | 1996-08-13 | 1997-07-29 | Insulating gate-type semiconductor and the manufacturing method |
| US08/907,578 US6653687B1 (en) | 1996-08-13 | 1997-08-08 | Insulated gate semiconductor device |
| GB9717145A GB2316227B (en) | 1996-08-13 | 1997-08-12 | Insulated gate semiconductor device and method of manufacturing the same |
| KR1019970039450A KR100443437B1 (ko) | 1996-08-13 | 1997-08-13 | 절연게이트형반도체장치및그제작방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23255396A JP3634086B2 (ja) | 1996-08-13 | 1996-08-13 | 絶縁ゲイト型半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1065164A JPH1065164A (ja) | 1998-03-06 |
| JPH1065164A5 true JPH1065164A5 (enExample) | 2005-02-03 |
| JP3634086B2 JP3634086B2 (ja) | 2005-03-30 |
Family
ID=16941137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23255396A Expired - Fee Related JP3634086B2 (ja) | 1996-08-13 | 1996-08-13 | 絶縁ゲイト型半導体装置の作製方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6653687B1 (enExample) |
| JP (1) | JP3634086B2 (enExample) |
| KR (1) | KR100443437B1 (enExample) |
| GB (1) | GB2316227B (enExample) |
| TW (1) | TW357386B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3634086B2 (ja) | 1996-08-13 | 2005-03-30 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置の作製方法 |
| JP4103968B2 (ja) | 1996-09-18 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置 |
| TW451284B (en) * | 1996-10-15 | 2001-08-21 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
| JP4017706B2 (ja) * | 1997-07-14 | 2007-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US6686623B2 (en) | 1997-11-18 | 2004-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile memory and electronic apparatus |
| JP4236722B2 (ja) | 1998-02-05 | 2009-03-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7245018B1 (en) * | 1999-06-22 | 2007-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof |
| US6420767B1 (en) * | 2000-06-28 | 2002-07-16 | Advanced Micro Devices, Inc. | Capacitively coupled DTMOS on SOI |
| JP3874772B2 (ja) * | 2004-07-21 | 2007-01-31 | 株式会社日立製作所 | 生体関連物質測定装置及び測定方法 |
| JP5247468B2 (ja) | 2005-12-30 | 2013-07-24 | ニューロテック ユーエスエー, インコーポレイテッド | 生物活性分子の送達のための微粒子化デバイスおよびその使用方法 |
| WO2010123994A1 (en) * | 2009-04-23 | 2010-10-28 | Neurotech Usa, Inc. | Cell lines that produce prostaglandin f2 alpha (pgf2a) and uses thereof |
| JP2013507373A (ja) * | 2009-10-08 | 2013-03-04 | ニューロテック ユーエスエー, インコーポレイテッド | 被包された細胞ベースの送達系におけるpedfの使用 |
| BR112013013255A2 (pt) | 2010-12-02 | 2020-08-25 | Neurotech Usa, Inc. | linhagens celulares que secretam anticorpos-esqueletos antiangiogênicos e receptores solúveis e usos das mesmas |
| JP5897910B2 (ja) | 2011-01-20 | 2016-04-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN104640579A (zh) | 2012-05-30 | 2015-05-20 | 神经技术美国有限公司 | 冷冻保存的可植入细胞培养装置及其用途 |
| ES2950987T3 (es) | 2013-09-11 | 2023-10-17 | Neurotech Usa Inc | Cartucho para terapia con células encapsuladas |
| EP3662923A1 (en) | 2015-05-27 | 2020-06-10 | Neurotech USA, Inc. | Use of encapsulated cell therapy for treatment of ophthalmic disorders |
| EP3136446A1 (en) | 2015-08-28 | 2017-03-01 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Tft device and manufacturing method |
| JP2018098338A (ja) * | 2016-12-13 | 2018-06-21 | ソニーセミコンダクタソリューションズ株式会社 | トンネル電界効果トランジスタ |
| WO2022011081A1 (en) | 2020-07-09 | 2022-01-13 | The United States Of America, As Represented By The Secretary, Department Of Health And Human Services | Cell lines that produce human retinoschisin proteins and uses thereof |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4454524A (en) | 1978-03-06 | 1984-06-12 | Ncr Corporation | Device having implantation for controlling gate parasitic action |
| US4549336A (en) * | 1981-12-28 | 1985-10-29 | Mostek Corporation | Method of making MOS read only memory by specified double implantation |
| US5350940A (en) | 1984-02-02 | 1994-09-27 | Fastran, Inc. | Enhanced mobility metal oxide semiconductor devices |
| US4697198A (en) | 1984-08-22 | 1987-09-29 | Hitachi, Ltd. | MOSFET which reduces the short-channel effect |
| JPS61256769A (ja) | 1985-05-10 | 1986-11-14 | Toshiba Corp | 半導体装置 |
| EP0287658A1 (en) | 1986-10-27 | 1988-10-26 | Hughes Aircraft Company | Striped-channel transistor and method of forming the same |
| US4999682A (en) | 1987-08-14 | 1991-03-12 | Regents Of The University Of Minnesota | Electronic and optoelectronic laser devices utilizing light hole properties |
| US4959697A (en) | 1988-07-20 | 1990-09-25 | Vtc Incorporated | Short channel junction field effect transistor |
| JPH0231464A (ja) | 1988-07-21 | 1990-02-01 | Mitsubishi Electric Corp | 半導体装置 |
| JP2507567B2 (ja) | 1988-11-25 | 1996-06-12 | 三菱電機株式会社 | 絶縁体基板上の半導体層に形成されたmos型電界効果トランジスタ |
| JPH02159070A (ja) | 1988-12-13 | 1990-06-19 | Matsushita Electric Ind Co Ltd | 半導体装置とその製造方法 |
| JPH02196468A (ja) | 1989-01-25 | 1990-08-03 | Nec Corp | 半導体装置 |
| JPH0738447B2 (ja) | 1989-02-02 | 1995-04-26 | 松下電器産業株式会社 | Mos型半導体装置 |
| JP3194941B2 (ja) | 1990-03-19 | 2001-08-06 | 富士通株式会社 | 半導体装置 |
| US5210437A (en) | 1990-04-20 | 1993-05-11 | Kabushiki Kaisha Toshiba | MOS device having a well layer for controlling threshold voltage |
| JPH04206971A (ja) | 1990-11-30 | 1992-07-28 | Sharp Corp | 薄膜半導体装置 |
| JPH04286339A (ja) | 1991-03-15 | 1992-10-12 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| US5196367A (en) | 1991-05-08 | 1993-03-23 | Industrial Technology Research Institute | Modified field isolation process with no channel-stop implant encroachment |
| TW222345B (en) | 1992-02-25 | 1994-04-11 | Semicondustor Energy Res Co Ltd | Semiconductor and its manufacturing method |
| JPH05283687A (ja) | 1992-03-31 | 1993-10-29 | Oki Electric Ind Co Ltd | 半導体素子の製造方法 |
| JP3301116B2 (ja) | 1992-07-20 | 2002-07-15 | ソニー株式会社 | 半導体装置及びその製造方法 |
| JP3456242B2 (ja) | 1993-01-07 | 2003-10-14 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
| US5324960A (en) * | 1993-01-19 | 1994-06-28 | Motorola, Inc. | Dual-transistor structure and method of formation |
| JPH06244103A (ja) | 1993-02-15 | 1994-09-02 | Semiconductor Energy Lab Co Ltd | 半導体の製造方法 |
| JP2848757B2 (ja) | 1993-03-19 | 1999-01-20 | シャープ株式会社 | 電界効果トランジスタおよびその製造方法 |
| KR960008735B1 (en) | 1993-04-29 | 1996-06-29 | Samsung Electronics Co Ltd | Mos transistor and the manufacturing method thereof |
| JP2791858B2 (ja) | 1993-06-25 | 1998-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置作製方法 |
| US5426325A (en) | 1993-08-04 | 1995-06-20 | Siliconix Incorporated | Metal crossover in high voltage IC with graduated doping control |
| US5831294A (en) | 1993-09-30 | 1998-11-03 | Sony Corporation | Quantum box structure and carrier conductivity modulating device |
| JP3635683B2 (ja) | 1993-10-28 | 2005-04-06 | ソニー株式会社 | 電界効果トランジスタ |
| JP2759415B2 (ja) | 1993-11-05 | 1998-05-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JPH07226446A (ja) | 1994-02-12 | 1995-08-22 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP3184065B2 (ja) * | 1994-07-25 | 2001-07-09 | セイコーインスツルメンツ株式会社 | 半導体集積回路装置及び電子機器 |
| US5516711A (en) | 1994-12-16 | 1996-05-14 | Mosel Vitelic, Inc. | Method for forming LDD CMOS with oblique implantation |
| US5478763A (en) | 1995-01-19 | 1995-12-26 | United Microelectronics Corporation | High performance field effect transistor and method of manufacture thereof |
| KR0161398B1 (ko) | 1995-03-13 | 1998-12-01 | 김광호 | 고내압 트랜지스터 및 그 제조방법 |
| US5532175A (en) | 1995-04-17 | 1996-07-02 | Motorola, Inc. | Method of adjusting a threshold voltage for a semiconductor device fabricated on a semiconductor on insulator substrate |
| US5661059A (en) | 1995-04-18 | 1997-08-26 | Advanced Micro Devices | Boron penetration to suppress short channel effect in P-channel device |
| US5619053A (en) | 1995-05-31 | 1997-04-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having an SOI structure |
| KR970004074A (ko) * | 1995-06-05 | 1997-01-29 | 빈센트 비. 인그라시아 | 절연 게이트 전계 효과 트랜지스터 및 그 제조 방법 |
| US5674788A (en) | 1995-06-06 | 1997-10-07 | Advanced Micro Devices, Inc. | Method of forming high pressure silicon oxynitride gate dielectrics |
| US5675164A (en) | 1995-06-07 | 1997-10-07 | International Business Machines Corporation | High performance multi-mesa field effect transistor |
| US5670389A (en) | 1996-01-11 | 1997-09-23 | Motorola, Inc. | Semiconductor-on-insulator device having a laterally-graded channel region and method of making |
| US5698884A (en) | 1996-02-07 | 1997-12-16 | Thunderbird Technologies, Inc. | Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same |
| JP3522441B2 (ja) | 1996-03-12 | 2004-04-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US5786618A (en) * | 1996-03-21 | 1998-07-28 | United Microelectronics, Corp. | ROM memory cell with non-uniform threshold voltage |
| JP4014677B2 (ja) | 1996-08-13 | 2007-11-28 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置 |
| JP3634086B2 (ja) | 1996-08-13 | 2005-03-30 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置の作製方法 |
| JP4059939B2 (ja) | 1996-08-23 | 2008-03-12 | 株式会社半導体エネルギー研究所 | パワーmosデバイス及びその作製方法 |
| TW304278B (en) | 1996-09-17 | 1997-05-01 | Nat Science Council | The source-drain distributed implantation method |
| US6118148A (en) | 1996-11-04 | 2000-09-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JPH11233788A (ja) | 1998-02-09 | 1999-08-27 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
-
1996
- 1996-08-13 JP JP23255396A patent/JP3634086B2/ja not_active Expired - Fee Related
-
1997
- 1997-07-29 TW TW086110814A patent/TW357386B/zh not_active IP Right Cessation
- 1997-08-08 US US08/907,578 patent/US6653687B1/en not_active Expired - Lifetime
- 1997-08-12 GB GB9717145A patent/GB2316227B/en not_active Expired - Fee Related
- 1997-08-13 KR KR1019970039450A patent/KR100443437B1/ko not_active Expired - Fee Related
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