JP7242557B2 - 低粘度及び低処理温度を有する銀分子インク - Google Patents

低粘度及び低処理温度を有する銀分子インク Download PDF

Info

Publication number
JP7242557B2
JP7242557B2 JP2019563711A JP2019563711A JP7242557B2 JP 7242557 B2 JP7242557 B2 JP 7242557B2 JP 2019563711 A JP2019563711 A JP 2019563711A JP 2019563711 A JP2019563711 A JP 2019563711A JP 7242557 B2 JP7242557 B2 JP 7242557B2
Authority
JP
Japan
Prior art keywords
ink
silver
substrate
weight
traces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019563711A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020510740A (ja
JP2020510740A5 (https=
Inventor
リュー、シャンヤン
パケ、シャンタル
ジェイ． ケル、アーノルド
ロラン ルシアン マレファン、パトリック
デオール、バーバナ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Council of Canada
Original Assignee
National Research Council of Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Council of Canada filed Critical National Research Council of Canada
Publication of JP2020510740A publication Critical patent/JP2020510740A/ja
Publication of JP2020510740A5 publication Critical patent/JP2020510740A5/ja
Application granted granted Critical
Publication of JP7242557B2 publication Critical patent/JP7242557B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/22—Metallic printing; Printing with powdered inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C09D11/104—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
JP2019563711A 2017-02-08 2018-02-08 低粘度及び低処理温度を有する銀分子インク Active JP7242557B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762456322P 2017-02-08 2017-02-08
US62/456,322 2017-02-08
PCT/IB2018/050791 WO2018146619A2 (en) 2017-02-08 2018-02-08 Silver molecular ink with low viscosity and low processing temperature

Publications (3)

Publication Number Publication Date
JP2020510740A JP2020510740A (ja) 2020-04-09
JP2020510740A5 JP2020510740A5 (https=) 2021-03-18
JP7242557B2 true JP7242557B2 (ja) 2023-03-20

Family

ID=63107622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019563711A Active JP7242557B2 (ja) 2017-02-08 2018-02-08 低粘度及び低処理温度を有する銀分子インク

Country Status (9)

Country Link
US (1) US11746246B2 (https=)
EP (1) EP3580285B1 (https=)
JP (1) JP7242557B2 (https=)
KR (1) KR102568858B1 (https=)
CN (2) CN120775422A (https=)
CA (1) CA3052747A1 (https=)
FI (1) FI3580285T3 (https=)
TW (1) TWI842668B (https=)
WO (1) WO2018146619A2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201842087A (zh) * 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
US11993719B2 (en) 2017-10-27 2024-05-28 National Research Council Of Canada Boron nitride nanotube coated substrates for sintering of metallic traces by intense pulse light
KR102218363B1 (ko) * 2019-11-26 2021-02-19 백운석 Ehd 잉크젯 프린팅용 실버계 잉크 조성물

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537386A (ja) 2001-10-05 2005-12-08 スーペリア　マイクロパウダーズ　リミテッド　ライアビリティ　カンパニー 導電性電子フィーチャを堆積するための低粘度前駆体組成物および方法
WO2012133767A1 (ja) 2011-03-31 2012-10-04 ナミックス株式会社 熱伝導性組成物及び熱伝導体
CN104263082A (zh) 2014-08-29 2015-01-07 南京航空航天大学 一种石墨烯有机银导电油墨及其制备方法
JP2015109273A (ja) 2013-11-13 2015-06-11 ゼロックス コーポレイションＸｅｒｏｘ Ｃｏｒｐｏｒａｔｉｏｎ 金属カルボン酸塩を含む導電性組成物
WO2015192248A1 (en) 2014-06-19 2015-12-23 National Research Council Of Canada Molecular inks
US20160168408A1 (en) 2014-08-05 2016-06-16 Pesolve Co., Ltd. Silver ink

Family Cites Families (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099376A (en) 1955-06-29 1978-07-11 The B.F. Goodrich Company Gas generator and solid propellant with a silicon-oxygen compound as a burning rate modifier, and method for making the same
US3228897A (en) 1961-10-26 1966-01-11 Minnesota Mining & Mfg Reflective coating compositions containing glass beads, metal flake pigment and binder
US3729339A (en) * 1970-11-25 1973-04-24 Owens Illinois Inc Hydroxy functional acrylic ink
US3702259A (en) 1970-12-02 1972-11-07 Shell Oil Co Chemical production of metallic silver deposits
JPS5413260B2 (https=) 1973-09-04 1979-05-29
US3989644A (en) 1974-09-27 1976-11-02 General Electric Company Radiation curable inks
US4088801A (en) 1976-04-29 1978-05-09 General Electric Company U.V. Radiation curable electrically conductive ink and circuit boards made therewith
US4180407A (en) 1977-03-28 1979-12-25 Gibson Donald M Ink for application to unglazed paper surfaces
DE2728465C2 (de) 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
US4487811A (en) 1980-12-29 1984-12-11 General Electric Company Electrical conductor
US4396666A (en) 1981-11-02 1983-08-02 Cts Corporation Solderable conductive employing an organic binder
JPS604552A (ja) 1983-06-23 1985-01-11 Mitsubishi Gas Chem Co Inc 導電性組成物
JPS61136978A (ja) 1984-12-06 1986-06-24 アルプス電気株式会社 厚膜回路形成用導電ペ−スト
US4687597A (en) 1986-01-29 1987-08-18 E. I. Du Pont De Nemours And Company Copper conductor compositions
US4775594A (en) 1986-06-20 1988-10-04 James River Graphics, Inc. Ink jet transparency with improved wetting properties
DE3706860A1 (de) 1987-03-04 1988-09-15 Byk Chemie Gmbh Thixotrope zubereitungen, verwendung von polycarbonsaeureamiden zu ihrer herstellung und mit polycarbonsaeureamiden beschichtetes siliciumdioxid
JPS63278983A (ja) 1987-05-09 1988-11-16 Toyota Autom Loom Works Ltd 金属有機物インク
DE3810958A1 (de) 1988-03-31 1989-10-12 Basf Ag Tinten fuer ink-jet-aufzeichnungsverfahren
US5064921A (en) * 1989-06-07 1991-11-12 Bayer Aktiengesellschaft Hydroxy functional copolymers, a process for the preparation and their use as binders or binder components
JP2619289B2 (ja) 1989-06-20 1997-06-11 三井金属鉱業株式会社 銅導電性組成物
JP2660937B2 (ja) 1990-07-16 1997-10-08 三井金属鉱業株式会社 銅導電性組成物
CN1071182A (zh) 1991-09-28 1993-04-21 胡贵友 热敏变色油墨
US5306590A (en) 1991-12-23 1994-04-26 Xerox Corporation High solids liquid developer containing carboxyl terminated polyester toner resin
JPH08113696A (ja) * 1994-10-14 1996-05-07 Toray Dow Corning Silicone Co Ltd 粉体塗料用樹脂組成物
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US5989700A (en) 1996-01-05 1999-11-23 Tekscan Incorporated Pressure sensitive ink means, and methods of use
WO1997033323A1 (en) 1996-03-04 1997-09-12 Uniax Corporation Polyfluorenes as materials for photoluminescence and electroluminescence
AU5561696A (en) 1996-04-18 1997-11-07 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
JP3912844B2 (ja) 1997-04-09 2007-05-09 キヤノン株式会社 有機金属を含有するインク並びに電極、電子放出素子および画像形成装置の製造方法
US5980622A (en) 1997-08-29 1999-11-09 Hewlett-Packard Company Magenta dyes for ink-jet inks
US6048389A (en) 1998-02-18 2000-04-11 Eastman Kodak Company Ink jet inks containing modifiers for improved drop formation
JP3813750B2 (ja) 1998-08-27 2006-08-23 大日精化工業株式会社 カラーフィルターの製造方法及びカラーフィルター
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
DE50000718D1 (de) 1999-09-27 2002-12-12 Ciba Sc Holding Ag Magentafärbende Tinten enthaltend Kupferkomplexazofarbstoffe auf der Bais von 1-Naphthol-di-oder trisulfonsäuren
US6663799B2 (en) 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US6770122B2 (en) 2001-12-12 2004-08-03 E. I. Du Pont De Nemours And Company Copper deposition using copper formate complexes
US6939578B2 (en) 2002-01-18 2005-09-06 E. I. Du Pont De Nemours And Company Volatile copper(II) complexes for deposition of copper films by atomic layer deposition
TW200416261A (en) 2002-10-18 2004-09-01 Nippon Kayaku Kk Phthalocyanine compound for ink-jet printing, water-soluble green ink composition containing such compound and coloring substance using such composition
JP2004162110A (ja) 2002-11-12 2004-06-10 Mitsubishi Paper Mills Ltd 銅／アミン組成物
US7211205B2 (en) 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US7141104B2 (en) 2003-06-05 2006-11-28 Agfa-Gevaert UV-absorbing ink composition for ink-jet printing
US20050070629A1 (en) 2003-08-06 2005-03-31 Roberts C. Chad Inkjet ink
US7731812B2 (en) 2004-10-19 2010-06-08 E.I. Du Pont De Nemours And Company Thick film conductor case compositions for LTCC tape
US7960037B2 (en) 2004-12-03 2011-06-14 The Regents Of The University Of California Carbon nanotube polymer composition and devices
JP4799881B2 (ja) 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
JP4964152B2 (ja) 2005-03-04 2012-06-27 インクテック カンパニー リミテッド 導電性インク組成物及びこの製造方法
JP5064379B2 (ja) 2005-04-20 2012-10-31 フィブロ−テック，インコーポレイテッド 銅粉末の生成方法、金属粉末の生成方法及びニッケル粉末の生成方法
KR100815028B1 (ko) 2005-10-05 2008-03-18 삼성전자주식회사 탄소나노튜브용 분산제 및 이를 포함하는 조성물
US8017863B2 (en) 2005-11-02 2011-09-13 The Regents Of The University Of Michigan Polymer wrapped carbon nanotube near-infrared photoactive devices
TWI312799B (en) 2005-12-30 2009-08-01 Ind Tech Res Inst Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern
JP5205717B2 (ja) 2006-07-04 2013-06-05 セイコーエプソン株式会社 ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法
JP5045015B2 (ja) 2006-07-28 2012-10-10 セイコーエプソン株式会社 ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法
JP5550904B2 (ja) 2006-08-07 2014-07-16 インクテック カンパニー リミテッド 銀ナノ粒子の製造方法、及び薄膜形成方法
CN101583650B (zh) * 2006-11-14 2012-01-18 巴斯夫欧洲公司 高度支化或超支化聚酯及其生产和应用
JP2008205430A (ja) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
KR20080083790A (ko) 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법
EP2042536A1 (en) * 2007-09-20 2009-04-01 Hexion Specialty Chemicals Research Belgium S.A. Hydroxyl polyester resins for dye ink sublimation
EP2227512A1 (en) 2007-12-18 2010-09-15 Lumimove, Inc., Dba Crosslink Flexible electroluminescent devices and systems
CN101519356A (zh) 2008-02-28 2009-09-02 华东理工大学 螺环双亚胺和制备方法及其应用
JP5292857B2 (ja) 2008-03-03 2013-09-18 東レ株式会社 有機半導体コンポジット、有機トランジスタ材料ならびに有機電界効果型トランジスタ
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
CA2720694C (en) 2008-04-11 2017-05-23 Plextronics, Inc. Doped conjugated polymers, devices, and methods of making devices
JP2009256218A (ja) 2008-04-14 2009-11-05 Toray Ind Inc 銅前駆体組成物およびそれを用いた銅膜の製造方法。
CN101271929B (zh) 2008-05-04 2012-02-01 常州亿晶光电科技有限公司 无铅太阳能电池银浆及其制备方法
JP5470763B2 (ja) 2008-07-10 2014-04-16 東レ株式会社 カーボンナノチューブ分散溶液、有機半導体コンポジット溶液、有機半導体薄膜ならびに有機電界効果型トランジスタ
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
WO2010128107A1 (en) 2009-05-07 2010-11-11 Neodec B.V. Process for manufacturing conductive tracks
WO2011057218A2 (en) 2009-11-09 2011-05-12 Carnegie Mellon University Metal ink compositions, conductive patterns, methods, and devices
US9125625B2 (en) 2010-06-10 2015-09-08 The Regents Of The University Of California Textile-based printable electrodes for electrochemical sensing
JP5906027B2 (ja) 2010-07-30 2016-04-20 トッパン・フォームズ株式会社 装飾用又は鏡面用インク組成物、基材及び金属銀層を表面に供えた基材の製造方法
WO2012026791A2 (ko) 2010-08-27 2012-03-01 주식회사 엘지화학 전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법
KR20120046457A (ko) 2010-11-02 2012-05-10 삼성전자주식회사 금속 잉크 조성물, 이를 이용한 전도성 금속막 형성방법 및 이를 이용한 전도성 금속막
KR101276237B1 (ko) 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
CN103597547B (zh) 2011-03-29 2016-12-21 太阳化学公司 含有蜡触变胶的可高纵横比丝网印刷的厚膜糊剂组合物
JP6041517B2 (ja) 2011-04-22 2016-12-07 トッパン・フォームズ株式会社 銀インク組成物
CN102270514A (zh) 2011-05-03 2011-12-07 华中科技大学 一种均相导电浆料
JP2012236870A (ja) 2011-05-10 2012-12-06 Seiko Epson Corp インクジェット記録方法、記録物およびインクセット
KR20120132424A (ko) 2011-05-27 2012-12-05 한양대학교 산학협력단 전도성 구리 나노잉크의 광소결 방법
CN104024351B (zh) * 2011-09-06 2016-11-16 汉高知识产权控股有限责任公司 导电金属和方法
WO2013063320A1 (en) 2011-10-28 2013-05-02 Liquid X Printed Metals, Inc. Transparent conductive- and ito-replacement materials and structures
WO2013073349A1 (ja) 2011-11-15 2013-05-23 日油株式会社 銅パターン形成用組成物及び銅パターンの製造方法
WO2013073331A1 (ja) 2011-11-17 2013-05-23 Jsr株式会社 銅膜形成方法、銅膜、回路基板および銅膜形成組成物溶液
KR101151366B1 (ko) * 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
US9039942B2 (en) 2011-12-21 2015-05-26 E I Du Pont De Nemours And Company Lead-free conductive paste composition and semiconductor devices made therewith
WO2013096664A1 (en) 2011-12-23 2013-06-27 The Board Of Trustees Of The University Of Illinois Ink composition for making a conductive silver structure
KR20150006091A (ko) 2012-02-29 2015-01-15 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. 금속 전구체 나노입자들을 함유한 잉크
JP5923351B2 (ja) 2012-03-16 2016-05-24 株式会社Adeka 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
CN102618033B (zh) 2012-03-28 2013-09-11 成都多吉昌新材料有限公司 一种组合物、含该组合物的led线路板基材和制作方法
US10405422B2 (en) 2012-07-09 2019-09-03 Shikoku Chemicals Corporation Copper film-forming agent and method for forming copper film
KR101941450B1 (ko) 2012-08-02 2019-01-23 엘지디스플레이 주식회사 발광 다이오드 패키지
US8948839B1 (en) 2013-08-06 2015-02-03 L.I.F.E. Corporation S.A. Compression garments having stretchable and conductive ink
US8945328B2 (en) 2012-09-11 2015-02-03 L.I.F.E. Corporation S.A. Methods of making garments having stretchable and conductive ink
KR102059805B1 (ko) * 2012-09-28 2019-12-27 돗빤호무즈가부시기가이샤 은 잉크 조성물, 도전체 및 통신 기기
KR20140044743A (ko) 2012-10-04 2014-04-15 한양대학교 산학협력단 전도성 하이브리드 구리잉크 및 이를 이용한 광소결 방법
CN102863845A (zh) * 2012-10-11 2013-01-09 复旦大学 印制电子用银有机导电油墨
CN103084581B (zh) 2013-01-08 2015-02-04 河南大学 一种铜纳米线的制备方法
KR101350507B1 (ko) 2013-01-09 2014-01-17 (주)쎄미시스코 금속 나노입자를 포함하는 전기전도성 잉크 및 이의 광 소결 방법
JP2014148732A (ja) 2013-02-04 2014-08-21 Yamagata Univ 新規被覆銅微粒子及びその製造方法
JP2014182913A (ja) 2013-03-19 2014-09-29 Fujifilm Corp 導電膜形成用組成物およびこれを用いる導電膜の製造方法
US9283618B2 (en) * 2013-05-15 2016-03-15 Xerox Corporation Conductive pastes containing silver carboxylates
US9198288B2 (en) 2013-05-15 2015-11-24 Xerox Corporation Method of making silver carboxylates for conductive ink
US20140349025A1 (en) 2013-05-23 2014-11-27 E I Du Pont De Nemours And Company Conductive compositions and methods relating thereto
US10046970B2 (en) 2013-08-20 2018-08-14 National Research Council Of Canada Process for purifying semiconducting single-walled carbon nanotubes
KR20150045605A (ko) 2013-10-21 2015-04-29 전자부품연구원 구리 잉크 조성물 및 이를 이용한 도전 패턴 형성 방법
KR101597651B1 (ko) 2013-12-30 2016-02-25 전자부품연구원 고내열성을 갖는 나노산화구리 잉크 조성물 및 이를 이용한 전극 형성방법
KR102233293B1 (ko) 2014-01-15 2021-03-29 (주)창성 구리포메이트-아민 컴플렉스를 포함하는 잉크 조성물의 제조방법
EP2918371A1 (en) 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Solderable conductive polymer thick film composition
JP6468889B2 (ja) 2014-03-11 2019-02-13 三井金属鉱業株式会社 導電性組成物、及びそれを用いた導電体の製造方法
US20150298248A1 (en) 2014-04-17 2015-10-22 Electroninks Incorporated Bonded structure including a conductive bonding layer and low-temperature method of forming a bonded structure
US9982154B2 (en) 2014-04-17 2018-05-29 Electroninks Incorporated Solid ink composition
US10301497B2 (en) 2014-04-17 2019-05-28 Electroninks Incorporated Conductive ink compositions
US9460824B2 (en) 2014-04-23 2016-10-04 Xerox Corporation Stretchable conductive film based on silver nanoparticles
JP6845015B2 (ja) 2014-05-30 2021-03-17 エレクトロニンクス ライタブルズ， インコーポレイテッド 基材上に形成されたローラーボールペンおよび導電性トレースのための導電性インク
WO2016012753A1 (en) 2014-07-22 2016-01-28 Alpha Metals, Inc. Stretchable interconnects for flexible electronic surfaces
US9809489B2 (en) 2014-09-12 2017-11-07 Jsr Corporation Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
CN104479463B (zh) 2015-01-09 2017-07-21 东北大学 一种含有草酸银的透明导电无颗粒银基墨水及其制备方法
CN106147405A (zh) 2016-07-06 2016-11-23 复旦大学 铜导电油墨及铜导电油墨、铜导电薄膜的制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537386A (ja) 2001-10-05 2005-12-08 スーペリア　マイクロパウダーズ　リミテッド　ライアビリティ　カンパニー 導電性電子フィーチャを堆積するための低粘度前駆体組成物および方法
WO2012133767A1 (ja) 2011-03-31 2012-10-04 ナミックス株式会社 熱伝導性組成物及び熱伝導体
JP2015109273A (ja) 2013-11-13 2015-06-11 ゼロックス コーポレイションＸｅｒｏｘ Ｃｏｒｐｏｒａｔｉｏｎ 金属カルボン酸塩を含む導電性組成物
WO2015192248A1 (en) 2014-06-19 2015-12-23 National Research Council Of Canada Molecular inks
US20160168408A1 (en) 2014-08-05 2016-06-16 Pesolve Co., Ltd. Silver ink
CN104263082A (zh) 2014-08-29 2015-01-07 南京航空航天大学 一种石墨烯有机银导电油墨及其制备方法

Also Published As

Publication number Publication date
EP3580285A2 (en) 2019-12-18
US20190375958A1 (en) 2019-12-12
JP2020510740A (ja) 2020-04-09
EP3580285A4 (en) 2020-11-11
CN110382638A (zh) 2019-10-25
US11746246B2 (en) 2023-09-05
WO2018146619A3 (en) 2018-10-04
CA3052747A1 (en) 2018-08-16
TW201842085A (zh) 2018-12-01
WO2018146619A2 (en) 2018-08-16
FI3580285T3 (fi) 2024-05-21
EP3580285B1 (en) 2024-02-21
KR20190111126A (ko) 2019-10-01
CN120775422A (zh) 2025-10-14
KR102568858B1 (ko) 2023-08-18
TWI842668B (zh) 2024-05-21

Similar Documents

Publication Publication Date Title
US11525066B2 (en) Molecular inks
JP7242557B2 (ja) 低粘度及び低処理温度を有する銀分子インク
JP7353185B2 (ja) 熱安定性が改善された分子インク
EP3592816B1 (en) Conductive ink composition
US11891532B2 (en) Copper ink for high conductivity fine printing
JP7241734B2 (ja) 銅インク
KR20150141398A (ko) 금속 나노선을 포함하는 전도성 잉크 조성물 및 이를 이용한 전도성 패턴 또는 막의 제조방법
HK40033666B (en) Molecular inks

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210202

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210202

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20211217

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220107

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220405

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220818

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221115

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230221

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230308

R150 Certificate of patent or registration of utility model

Ref document number: 7242557

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250