JP6938543B2 - 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し - Google Patents

透明基板からの、輪郭設定された形状のレーザ切断及び取り外し Download PDF

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Publication number
JP6938543B2
JP6938543B2 JP2018558168A JP2018558168A JP6938543B2 JP 6938543 B2 JP6938543 B2 JP 6938543B2 JP 2018558168 A JP2018558168 A JP 2018558168A JP 2018558168 A JP2018558168 A JP 2018558168A JP 6938543 B2 JP6938543 B2 JP 6938543B2
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Prior art keywords
substrate
plug
glass
laser beam
main surface
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Japanese (ja)
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JP2019520291A5 (enExample
JP2019520291A (ja
Inventor
フレデリック ボウデン，ブラッドリー
フレデリック ボウデン，ブラッドリー
グオ，シャオジュウ
ハッケルト，トーマス
アンドリュー ピエヒ，ギャレット
アンドリュー ピエヒ，ギャレット
アレン ヴィーラント，クリストファー
アレン ヴィーラント，クリストファー
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Corning Inc
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Corning Inc
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Priority to JP2021142280A priority Critical patent/JP2022000410A/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/072—Armoured glass, i.e. comprising reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Surface Treatment Of Glass (AREA)
JP2018558168A 2016-05-06 2017-05-04 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し Active JP6938543B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021142280A JP2022000410A (ja) 2016-05-06 2021-09-01 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662332618P 2016-05-06 2016-05-06
US62/332,618 2016-05-06
US201662350978P 2016-06-16 2016-06-16
US62/350,978 2016-06-16
PCT/US2017/031030 WO2017192835A1 (en) 2016-05-06 2017-05-04 Laser cutting and removal of contoured shapes from transparent substrates

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021142280A Division JP2022000410A (ja) 2016-05-06 2021-09-01 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し

Publications (3)

Publication Number Publication Date
JP2019520291A JP2019520291A (ja) 2019-07-18
JP2019520291A5 JP2019520291A5 (enExample) 2020-06-18
JP6938543B2 true JP6938543B2 (ja) 2021-09-22

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JP2018558168A Active JP6938543B2 (ja) 2016-05-06 2017-05-04 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
JP2021142280A Pending JP2022000410A (ja) 2016-05-06 2021-09-01 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し

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Country Status (9)

Country Link
US (2) US11111170B2 (enExample)
EP (2) EP3957611A1 (enExample)
JP (2) JP6938543B2 (enExample)
KR (2) KR20220078719A (enExample)
CN (1) CN109311725B (enExample)
MY (1) MY194570A (enExample)
SG (1) SG11201809797PA (enExample)
TW (2) TWI742076B (enExample)
WO (1) WO2017192835A1 (enExample)

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CN108161250A (zh) * 2018-01-30 2018-06-15 苏州德龙激光股份有限公司 多焦点动态分布激光加工脆性透明材料的方法及装置
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US11059131B2 (en) 2018-06-22 2021-07-13 Corning Incorporated Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer
US11524366B2 (en) * 2018-07-26 2022-12-13 Coherent Munich GmbH & Co. KG Separation and release of laser-processed brittle material
WO2020021705A1 (ja) * 2018-07-27 2020-01-30 Hoya株式会社 ガラス基板の製造方法及び磁気ディスクの製造方法
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JP7139886B2 (ja) * 2018-10-30 2022-09-21 Ａｇｃ株式会社 孔を有するガラス基板の製造方法、およびアニール用ガラス積層体
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WO2020262702A1 (ja) * 2019-06-28 2020-12-30 Hoya株式会社 ガラス板の製造方法および磁気ディスクの製造方法
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WO2021247284A1 (en) * 2020-06-04 2021-12-09 Corning Incorporated Methods for laser processing transparent workpieces using modified pulse burst profiles
TWI733604B (zh) * 2020-06-10 2021-07-11 財團法人工業技術研究院 玻璃工件雷射處理系統及方法
DE102020123787A1 (de) 2020-09-11 2022-03-17 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Trennen eines transparenten Materials
JP2022077223A (ja) * 2020-11-11 2022-05-23 株式会社ディスコ レーザー加工装置
CN115215538A (zh) * 2021-04-15 2022-10-21 大族激光科技产业集团股份有限公司 一种玻璃的激光切孔方法及激光切割装置
US20240208191A1 (en) * 2021-04-16 2024-06-27 Sk Microworks Co., Ltd. Biaxially stretched film, laminate, and eco-friendly packaging material comprising film
CN113305106B (zh) * 2021-06-03 2022-08-02 四川大学 一种激光清洗微纳颗粒污染物的方法和应用
US12257600B2 (en) * 2021-10-19 2025-03-25 Femtika, UAB Aluminum surface treatment method to increase adhesion with polyurethane coating
CN114682932B (zh) * 2022-04-14 2024-02-09 强一半导体(苏州)股份有限公司 一种适用于生瓷片的激光加工通孔的方法
DE202022105478U1 (de) * 2022-09-28 2022-11-04 4Jet Microtech Gmbh Trennvorrichtung
US20240174544A1 (en) * 2022-11-30 2024-05-30 Corning Incorporated Methods of laser cutting material
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