JP6843492B2 - 半導体装置 - Google Patents
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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Description
下部コンタクトプラグ上に複数の配線を横切るライン形状のコンタクトパッドが配置されるので、複数の配線とMOSトランジスタとの間の電気的な接続によって上部コンタクトプラグの位置が自由に変更できるという効果がある。
したがって、活性領域の面積が縮小されても、複数の配線とMOSトランジスタとを電気的に接続するコンタクトプラグの工程マージンを向上できるという効果がある。
2 ローデコーダ
3 ページバッファ
4 カラムデコーダ
10 半導体基板
11 素子分離膜
21 ソース不純物領域
22 ドレイン不純物領域
23 ゲート電極
100 第1層間絶縁膜
200 第2層間絶縁膜
ACT、ACT’ 活性領域
ACT1 第1及活性領域
ACT2 第2活性領域
BL ビットライン
BLP ビットラインプラグ
CAR セルアレイ領域
COL DCR カラムデコーダ領域
CP1、CP2、CP3 (第1乃至第3)コンタクトパッド
CSL 共通ソースライン
CSTR セルストリング
CTR コンタクト領域
DS データ格納要素
EL 水平電極
GST 選択トランジスタ
ICL1、ICL2、ICL3、ICL4、ICL5 配線
LCP1、LCP2、LCP3 (第1乃至第3)下部コンタクトプラグ
MCT メモリセルトランジスタ
ME メモリ要素
PBR ページバッファ領域
PER1 周辺回路領域
ROW DCR ローデコーダ領域
SE 選択素子
SST ストリング選択トランジスタ
UCP1、UCP2、UCP3 (第1乃至第3)上部コンタクトプラグ
VS 垂直構造体
WL ワードライン
Claims (11)
- セルアレイ領域及び周辺回路領域を含む基板と、
前記セルアレイ領域の前記基板上において第1高さに延長されるセルアレイ構造体と、
前記周辺回路領域の前記基板上において、前記第1高さより小さい第2高さに延長される周辺ロジック構造体と、
前記周辺ロジック構造体及び前記セルアレイ構造体の上に延長される平行な複数の配線と、
前記周辺ロジック構造体の上部面と前記複数の配線の下部面との間に配置され、平面から見る時、前記周辺ロジック構造体の一部分及び前記複数の配線の一部分を横切るコンタクトパッドと、
前記周辺ロジック構造体と前記コンタクトパッドとを電気的に接続する下部コンタクトプラグと、
前記コンタクトパッドと前記複数の配線のいずれか1つとを接続する上部コンタクトプラグと、を含むことを特徴とする半導体装置。 - 前記セルアレイ構造体は、積層された複数の電極及び前記複数の電極を貫通する垂直構造体を含むことを特徴とする請求項1に記載の半導体装置。
- 前記コンタクトパッドの下部面は、前記垂直構造体の上部面の高さと前記周辺ロジック構造体の上部面の高さとの間に位置することを特徴とする請求項2に記載の半導体装置。
- 前記コンタクトパッドの上部面は、前記垂直構造体の上部面と実質的に共通の面をなすことを特徴とする請求項2に記載の半導体装置。
- 前記周辺回路領域において前記基板は、活性領域を定義する素子分離膜を含み、
前記周辺ロジック構造体は、
前記活性領域上において第1方向に延長されるトランジスタゲート信号ラインと、
前記トランジスタゲート信号ラインの両側の前記活性領域内に形成されたソース及びドレイン領域と、を含み、
前記下部コンタクトプラグは、前記ソース及び前記ドレイン領域の中のいずれか1つに接続されることを特徴とする請求項1に記載の半導体装置。 - 前記複数の配線は、前記第1方向と直交する第2方向に延長され、前記コンタクトパッドは、前記第1方向に延長され、
前記第1方向の前記コンタクトパッドの長さは、前記第1方向の前記活性領域の幅より大きいことを特徴とする請求項5に記載の半導体装置。 - 前記複数の配線は、平面から見る時、前記活性領域と重畳されることを特徴とする請求項5に記載の半導体装置。
- 前記上部コンタクトプラグは、前記第1方向において、前記下部コンタクトプラグと離隔されて配置されることを特徴とする請求項5に記載の半導体装置。
- 前記セルアレイ構造体は、
前記基板上に垂直に積層された複数の第1電極を含む第1積層構造体と、
前記第1積層構造体上に垂直に積層された第2電極を含む第2積層構造体と、
前記第1及び第2積層構造体を貫通する垂直構造体と、を含むことを特徴とする請求項1に記載の半導体装置。 - 前記セルアレイ領域と前記周辺回路領域との間の第1コンタクト領域に配置され、前記第1電極に接続され前記基板から垂直に離隔されて延長される複数の第1プラグと、
前記セルアレイ領域と前記第1コンタクト領域との間の第2コンタクト領域に配置され、前記第2電極に接続され、前記基板から垂直に離隔されて延長される複数の第2プラグと、をさらに含み、
前記コンタクトパッドの垂直高さは、前記複数の第2プラグの中の少なくとも1つの垂直高さより小さくて、前記複数の第2プラグの中の少なくとも他の1つの垂直高さより大きいことを特徴とする請求項9に記載の半導体装置。 - 前記コンタクトパッドの上部面は、前記複数の第1プラグの上部面及び前記複数の第2プラグの上部面と実質的に共通の面をなすことを特徴とする請求項10に記載の半導体装置。
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KR1020130104375A KR102066925B1 (ko) | 2013-08-30 | 2013-08-30 | 반도체 장치 및 그 제조 방법 |
KR10-2013-0104375 | 2013-08-30 |
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JP2015050462A JP2015050462A (ja) | 2015-03-16 |
JP6843492B2 true JP6843492B2 (ja) | 2021-03-17 |
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US (1) | US9287265B2 (ja) |
JP (1) | JP6843492B2 (ja) |
KR (1) | KR102066925B1 (ja) |
CN (2) | CN107611125B (ja) |
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KR102139944B1 (ko) * | 2013-11-26 | 2020-08-03 | 삼성전자주식회사 | 3차원 반도체 메모리 장치 |
US9412745B1 (en) * | 2015-02-12 | 2016-08-09 | United Microelectronics Corp. | Semiconductor structure having a center dummy region |
US9524983B2 (en) | 2015-03-10 | 2016-12-20 | Samsung Electronics Co., Ltd. | Vertical memory devices |
US10204920B2 (en) | 2015-04-09 | 2019-02-12 | Samsung Electronics Co., Ltd. | Semiconductor device including polygon-shaped standard cell |
KR102321605B1 (ko) * | 2015-04-09 | 2021-11-08 | 삼성전자주식회사 | 반도체 장치의 레이아웃 설계 방법 및 그를 이용한 반도체 장치의 제조 방법 |
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