JP6382566B2 - 半導体装置、表示装置及び電子機器 - Google Patents
半導体装置、表示装置及び電子機器 Download PDFInfo
- Publication number
- JP6382566B2 JP6382566B2 JP2014094578A JP2014094578A JP6382566B2 JP 6382566 B2 JP6382566 B2 JP 6382566B2 JP 2014094578 A JP2014094578 A JP 2014094578A JP 2014094578 A JP2014094578 A JP 2014094578A JP 6382566 B2 JP6382566 B2 JP 6382566B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- oxide semiconductor
- oxide
- semiconductor film
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014094578A JP6382566B2 (ja) | 2013-05-03 | 2014-05-01 | 半導体装置、表示装置及び電子機器 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013097195 | 2013-05-03 | ||
| JP2013097195 | 2013-05-03 | ||
| JP2014094578A JP6382566B2 (ja) | 2013-05-03 | 2014-05-01 | 半導体装置、表示装置及び電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018145640A Division JP2018185541A (ja) | 2013-05-03 | 2018-08-02 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014232317A JP2014232317A (ja) | 2014-12-11 |
| JP2014232317A5 JP2014232317A5 (ja) | 2017-06-15 |
| JP6382566B2 true JP6382566B2 (ja) | 2018-08-29 |
Family
ID=51840996
Family Applications (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014094578A Active JP6382566B2 (ja) | 2013-05-03 | 2014-05-01 | 半導体装置、表示装置及び電子機器 |
| JP2018145640A Withdrawn JP2018185541A (ja) | 2013-05-03 | 2018-08-02 | 半導体装置 |
| JP2019217839A Active JP7068257B2 (ja) | 2013-05-03 | 2019-12-02 | 半導体装置 |
| JP2022074106A Active JP7378532B2 (ja) | 2013-05-03 | 2022-04-28 | 半導体装置 |
| JP2023186603A Active JP7601990B2 (ja) | 2013-05-03 | 2023-10-31 | 表示装置 |
| JP2024211975A Active JP7675919B2 (ja) | 2013-05-03 | 2024-12-05 | 表示装置 |
| JP2025073994A Active JP7695491B1 (ja) | 2013-05-03 | 2025-04-28 | 表示装置 |
| JP2025094649A Active JP7745120B2 (ja) | 2013-05-03 | 2025-06-06 | 液晶表示装置 |
| JP2025152546A Pending JP2025178308A (ja) | 2013-05-03 | 2025-09-12 | 半導体装置 |
Family Applications After (8)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018145640A Withdrawn JP2018185541A (ja) | 2013-05-03 | 2018-08-02 | 半導体装置 |
| JP2019217839A Active JP7068257B2 (ja) | 2013-05-03 | 2019-12-02 | 半導体装置 |
| JP2022074106A Active JP7378532B2 (ja) | 2013-05-03 | 2022-04-28 | 半導体装置 |
| JP2023186603A Active JP7601990B2 (ja) | 2013-05-03 | 2023-10-31 | 表示装置 |
| JP2024211975A Active JP7675919B2 (ja) | 2013-05-03 | 2024-12-05 | 表示装置 |
| JP2025073994A Active JP7695491B1 (ja) | 2013-05-03 | 2025-04-28 | 表示装置 |
| JP2025094649A Active JP7745120B2 (ja) | 2013-05-03 | 2025-06-06 | 液晶表示装置 |
| JP2025152546A Pending JP2025178308A (ja) | 2013-05-03 | 2025-09-12 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9231002B2 (enExample) |
| JP (9) | JP6382566B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9853053B2 (en) | 2012-09-10 | 2017-12-26 | 3B Technologies, Inc. | Three dimension integrated circuits employing thin film transistors |
| KR102244553B1 (ko) | 2013-08-23 | 2021-04-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 용량 소자 및 반도체 장치 |
| US10008513B2 (en) | 2013-09-05 | 2018-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2015179247A (ja) | 2013-10-22 | 2015-10-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP6506545B2 (ja) | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9766517B2 (en) | 2014-09-05 | 2017-09-19 | Semiconductor Energy Laboratory Co., Ltd. | Display device and display module |
| WO2016099580A2 (en) | 2014-12-23 | 2016-06-23 | Lupino James John | Three dimensional integrated circuits employing thin film transistors |
| WO2016199680A1 (ja) * | 2015-06-08 | 2016-12-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| US9911762B2 (en) | 2015-12-03 | 2018-03-06 | Innolux Corporation | Display device |
| US11659759B2 (en) * | 2021-01-06 | 2023-05-23 | Applied Materials, Inc. | Method of making high resolution OLED fabricated with overlapped masks |
Family Cites Families (198)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4470060A (en) | 1981-01-09 | 1984-09-04 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display with vertical non-single crystal semiconductor field effect transistors |
| US5365079A (en) | 1982-04-30 | 1994-11-15 | Seiko Epson Corporation | Thin film transistor and display device including same |
| JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
| JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
| JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JP2616160B2 (ja) | 1990-06-25 | 1997-06-04 | 日本電気株式会社 | 薄膜電界効果型トランジスタ素子アレイ |
| US5245450A (en) | 1990-07-23 | 1993-09-14 | Hosiden Corporation | Liquid crystal display device with control capacitors for gray-scale |
| FR2679057B1 (fr) | 1991-07-11 | 1995-10-20 | Morin Francois | Structure d'ecran a cristal liquide, a matrice active et a haute definition. |
| JP3150365B2 (ja) | 1991-07-22 | 2001-03-26 | 株式会社東芝 | 液晶表示装置 |
| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| JP3245959B2 (ja) | 1992-06-05 | 2002-01-15 | 松下電器産業株式会社 | 液晶画像表示装置の製造方法 |
| FR2702286B1 (fr) | 1993-03-04 | 1998-01-30 | Samsung Electronics Co Ltd | Affichage à cristaux liquides et procédé pour le fabriquer. |
| JPH06347826A (ja) * | 1993-06-07 | 1994-12-22 | Sanyo Electric Co Ltd | 液晶表示装置 |
| JPH07104312A (ja) | 1993-09-30 | 1995-04-21 | Sanyo Electric Co Ltd | 液晶表示装置の製造方法 |
| US5483366A (en) | 1994-07-20 | 1996-01-09 | David Sarnoff Research Center Inc | LCD with hige capacitance pixel having an ITO active region/poly SI pixel region electrical connection and having poly SI selection line extensions along pixel edges |
| JP3339190B2 (ja) * | 1994-07-27 | 2002-10-28 | ソニー株式会社 | 液晶表示装置 |
| TW289097B (enExample) | 1994-08-24 | 1996-10-21 | Hitachi Ltd | |
| TW347477B (en) | 1994-09-30 | 1998-12-11 | Sanyo Electric Co | Liquid crystal display with storage capacitors for holding electric charges |
| JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
| JPH08306926A (ja) | 1995-05-07 | 1996-11-22 | Semiconductor Energy Lab Co Ltd | 液晶電気光学装置 |
| KR100394896B1 (ko) | 1995-08-03 | 2003-11-28 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 투명스위칭소자를포함하는반도체장치 |
| JPH09146108A (ja) | 1995-11-17 | 1997-06-06 | Semiconductor Energy Lab Co Ltd | 液晶表示装置およびその駆動方法 |
| JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JPH09292504A (ja) | 1996-02-27 | 1997-11-11 | Sharp Corp | 反射板及びその作製方法及びその反射板を用いた反射型液晶表示装置 |
| JP3634089B2 (ja) | 1996-09-04 | 2005-03-30 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| KR100299381B1 (ko) | 1998-08-24 | 2002-06-20 | 박종섭 | 고개구율 및 고투과율을 갖는 액정표시장치 및 그 제조방법 |
| US7106400B1 (en) | 1998-09-28 | 2006-09-12 | Sharp Kabushiki Kaisha | Method of making LCD with asperities in insulation layer under reflective electrode |
| JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| JP3683463B2 (ja) | 1999-03-11 | 2005-08-17 | シャープ株式会社 | アクティブマトリクス基板、その製造方法、及び、該基板を用いたイメージセンサ |
| US6630977B1 (en) | 1999-05-20 | 2003-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with capacitor formed around contact hole |
| KR100494682B1 (ko) | 1999-06-30 | 2005-06-13 | 비오이 하이디스 테크놀로지 주식회사 | 액정표시소자 및 그 제조방법 |
| JP2001051300A (ja) | 1999-08-10 | 2001-02-23 | Toshiba Corp | 液晶表示装置 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| TW495626B (en) | 1999-09-13 | 2002-07-21 | Ind Tech Res Inst | Electrode structure for a wide viewing angle liquid crystal display |
| WO2001033292A1 (fr) | 1999-10-29 | 2001-05-10 | Hitachi, Ltd. | Dispositif d'affichage a cristaux liquides |
| JP4393662B2 (ja) | 2000-03-17 | 2010-01-06 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
| JP2001324725A (ja) | 2000-05-12 | 2001-11-22 | Hitachi Ltd | 液晶表示装置およびその製造方法 |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| TWI247182B (en) | 2000-09-29 | 2006-01-11 | Toshiba Corp | Flat panel display device and method for manufacturing the same |
| KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP3750055B2 (ja) | 2001-02-28 | 2006-03-01 | 株式会社日立製作所 | 液晶表示装置 |
| JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| EP1443130B1 (en) | 2001-11-05 | 2011-09-28 | Japan Science and Technology Agency | Natural superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
| JP2003149673A (ja) * | 2001-11-08 | 2003-05-21 | Sharp Corp | アクティブマトリクス基板、およびそれを用いた表示装置 |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| CN1445821A (zh) | 2002-03-15 | 2003-10-01 | 三洋电机株式会社 | ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法 |
| JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| US6933528B2 (en) | 2002-04-04 | 2005-08-23 | Nec Lcd Technologies, Ltd. | In-plane switching mode active matrix type liquid crystal display device and method of fabricating the same |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| KR100930916B1 (ko) | 2003-03-20 | 2009-12-10 | 엘지디스플레이 주식회사 | 횡전계형 액정표시장치 및 그 제조방법 |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| JP4241238B2 (ja) | 2003-08-29 | 2009-03-18 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
| JP4483235B2 (ja) | 2003-09-01 | 2010-06-16 | カシオ計算機株式会社 | トランジスタアレイ基板の製造方法及びトランジスタアレイ基板 |
| JP2005107489A (ja) | 2003-09-12 | 2005-04-21 | Seiko Epson Corp | 電気光学装置及びその製造方法 |
| TWI226712B (en) | 2003-12-05 | 2005-01-11 | Au Optronics Corp | Pixel structure and fabricating method thereof |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| US20070194379A1 (en) | 2004-03-12 | 2007-08-23 | Japan Science And Technology Agency | Amorphous Oxide And Thin Film Transistor |
| US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| KR101074395B1 (ko) | 2004-09-13 | 2011-10-17 | 엘지디스플레이 주식회사 | 횡전계형 액정 표시 장치 |
| US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| US7382421B2 (en) | 2004-10-12 | 2008-06-03 | Hewlett-Packard Development Company, L.P. | Thin film transistor with a passivation layer |
| KR100689316B1 (ko) | 2004-10-29 | 2007-03-08 | 엘지.필립스 엘시디 주식회사 | 유기전계발광다이오드소자 및 그 제조방법 |
| US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| AU2005302963B2 (en) | 2004-11-10 | 2009-07-02 | Cannon Kabushiki Kaisha | Light-emitting device |
| US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| EP1815530B1 (en) | 2004-11-10 | 2021-02-17 | Canon Kabushiki Kaisha | Field effect transistor employing an amorphous oxide |
| EP2453480A2 (en) | 2004-11-10 | 2012-05-16 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| TWI412138B (zh) | 2005-01-28 | 2013-10-11 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| TWI481024B (zh) | 2005-01-28 | 2015-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| US7544967B2 (en) | 2005-03-28 | 2009-06-09 | Massachusetts Institute Of Technology | Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications |
| US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| JP4623464B2 (ja) | 2005-09-26 | 2011-02-02 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
| JP5064747B2 (ja) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
| EP3614442A3 (en) | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufactoring method thereof |
| JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| US7745798B2 (en) | 2005-11-15 | 2010-06-29 | Fujifilm Corporation | Dual-phosphor flat panel radiation detector |
| CN101667544B (zh) | 2005-11-15 | 2012-09-05 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| US9165505B2 (en) | 2006-01-13 | 2015-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electoric device having the same |
| JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| EP2924498A1 (en) | 2006-04-06 | 2015-09-30 | Semiconductor Energy Laboratory Co, Ltd. | Liquid crystal desplay device, semiconductor device, and electronic appliance |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| US7847904B2 (en) | 2006-06-02 | 2010-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic appliance |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| US8274078B2 (en) | 2007-04-25 | 2012-09-25 | Canon Kabushiki Kaisha | Metal oxynitride semiconductor containing zinc |
| KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| TWI357530B (en) | 2007-09-11 | 2012-02-01 | Au Optronics Corp | Pixel structure and liquid crystal display panel |
| KR101375831B1 (ko) | 2007-12-03 | 2014-04-02 | 삼성전자주식회사 | 산화물 반도체 박막 트랜지스터를 이용한 디스플레이 장치 |
| CN103258857B (zh) | 2007-12-13 | 2016-05-11 | 出光兴产株式会社 | 使用了氧化物半导体的场效应晶体管及其制造方法 |
| US8202365B2 (en) | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
| JP5540517B2 (ja) | 2008-02-22 | 2014-07-02 | 凸版印刷株式会社 | 画像表示装置 |
| JP5182993B2 (ja) | 2008-03-31 | 2013-04-17 | 株式会社半導体エネルギー研究所 | 表示装置及びその作製方法 |
| KR101461127B1 (ko) | 2008-05-13 | 2014-11-14 | 삼성디스플레이 주식회사 | 반도체 장치 및 이의 제조 방법 |
| US9041202B2 (en) | 2008-05-16 | 2015-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
| US8039842B2 (en) | 2008-05-22 | 2011-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and display device including thin film transistor |
| US8314765B2 (en) * | 2008-06-17 | 2012-11-20 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit, display device, and electronic device |
| TWI500159B (zh) | 2008-07-31 | 2015-09-11 | Semiconductor Energy Lab | 半導體裝置和其製造方法 |
| TWI637444B (zh) | 2008-08-08 | 2018-10-01 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| JP5602390B2 (ja) | 2008-08-19 | 2014-10-08 | 富士フイルム株式会社 | 薄膜トランジスタ、アクティブマトリクス基板、及び撮像装置 |
| JP5345359B2 (ja) * | 2008-09-18 | 2013-11-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| EP2172804B1 (en) | 2008-10-03 | 2016-05-11 | Semiconductor Energy Laboratory Co, Ltd. | Display device |
| JP5430113B2 (ja) | 2008-10-08 | 2014-02-26 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| JP5442234B2 (ja) | 2008-10-24 | 2014-03-12 | 株式会社半導体エネルギー研究所 | 半導体装置及び表示装置 |
| EP2515337B1 (en) | 2008-12-24 | 2016-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit and semiconductor device |
| US8330156B2 (en) | 2008-12-26 | 2012-12-11 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with a plurality of oxide clusters over the gate insulating layer |
| JP2010243741A (ja) | 2009-04-06 | 2010-10-28 | Mitsubishi Electric Corp | 薄膜トランジスタアレイ基板、及びその製造方法、並びに液晶表示装置 |
| JP5663214B2 (ja) | 2009-07-03 | 2015-02-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR20220100086A (ko) | 2009-07-10 | 2022-07-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| CN102473362B (zh) | 2009-07-24 | 2013-06-05 | 夏普株式会社 | 薄膜晶体管基板的制造方法 |
| WO2011013523A1 (en) | 2009-07-31 | 2011-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| CN104992984B (zh) | 2009-07-31 | 2019-08-16 | 株式会社半导体能源研究所 | 半导体装置、显示模块及电子装置 |
| KR102097932B1 (ko) | 2009-07-31 | 2020-04-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 디바이스 및 그 형성 방법 |
| CN105097946B (zh) | 2009-07-31 | 2018-05-08 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| TWI528527B (zh) | 2009-08-07 | 2016-04-01 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置之製造方法 |
| KR101460869B1 (ko) | 2009-09-04 | 2014-11-11 | 가부시끼가이샤 도시바 | 박막 트랜지스터 및 그 제조 방법 |
| KR101779349B1 (ko) | 2009-10-14 | 2017-09-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| KR101803554B1 (ko) | 2009-10-21 | 2017-11-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제작방법 |
| KR101093268B1 (ko) * | 2009-12-18 | 2011-12-14 | 삼성모바일디스플레이주식회사 | 표시 장치의 제조 방법 |
| KR101245400B1 (ko) * | 2010-03-24 | 2013-03-19 | 샤프 가부시키가이샤 | 신호 분배 회로, 신호 분배 장치 및 표시 장치 |
| US8629438B2 (en) | 2010-05-21 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| WO2011148537A1 (ja) | 2010-05-24 | 2011-12-01 | シャープ株式会社 | 薄膜トランジスタ基板及びその製造方法 |
| JP2012018970A (ja) | 2010-07-06 | 2012-01-26 | Mitsubishi Electric Corp | 薄膜トランジスタアレイ基板、その製造方法、及び液晶表示装置 |
| US9029861B2 (en) * | 2010-07-16 | 2015-05-12 | Sharp Kabushiki Kaisha | Thin film transistor and shift register |
| KR101609033B1 (ko) * | 2010-08-07 | 2016-04-04 | 샤프 가부시키가이샤 | 박막 트랜지스터 기판 및 이를 구비한 액정표시장치 |
| JP5848912B2 (ja) | 2010-08-16 | 2016-01-27 | 株式会社半導体エネルギー研究所 | 液晶表示装置の制御回路、液晶表示装置、及び当該液晶表示装置を具備する電子機器 |
| JP5253674B2 (ja) | 2010-08-30 | 2013-07-31 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP5626978B2 (ja) * | 2010-09-08 | 2014-11-19 | 富士フイルム株式会社 | 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置 |
| US9230994B2 (en) * | 2010-09-15 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| US8686416B2 (en) * | 2011-03-25 | 2014-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
| JP5052693B1 (ja) * | 2011-08-12 | 2012-10-17 | 富士フイルム株式会社 | 薄膜トランジスタ及びその製造方法、表示装置、イメージセンサー、x線センサー並びにx線デジタル撮影装置 |
| US20140014948A1 (en) | 2012-07-12 | 2014-01-16 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
| WO2014021356A1 (en) | 2012-08-03 | 2014-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8937307B2 (en) | 2012-08-10 | 2015-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2014199899A (ja) | 2012-08-10 | 2014-10-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| DE102013216824B4 (de) | 2012-08-28 | 2024-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| TWI575663B (zh) | 2012-08-31 | 2017-03-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| KR102691397B1 (ko) | 2012-09-13 | 2024-08-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| WO2014103900A1 (en) | 2012-12-25 | 2014-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
-
2014
- 2014-04-28 US US14/263,281 patent/US9231002B2/en active Active
- 2014-05-01 JP JP2014094578A patent/JP6382566B2/ja active Active
-
2018
- 2018-08-02 JP JP2018145640A patent/JP2018185541A/ja not_active Withdrawn
-
2019
- 2019-12-02 JP JP2019217839A patent/JP7068257B2/ja active Active
-
2022
- 2022-04-28 JP JP2022074106A patent/JP7378532B2/ja active Active
-
2023
- 2023-10-31 JP JP2023186603A patent/JP7601990B2/ja active Active
-
2024
- 2024-12-05 JP JP2024211975A patent/JP7675919B2/ja active Active
-
2025
- 2025-04-28 JP JP2025073994A patent/JP7695491B1/ja active Active
- 2025-06-06 JP JP2025094649A patent/JP7745120B2/ja active Active
- 2025-09-12 JP JP2025152546A patent/JP2025178308A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7068257B2 (ja) | 2022-05-16 |
| JP7675919B2 (ja) | 2025-05-13 |
| US9231002B2 (en) | 2016-01-05 |
| JP2025114636A (ja) | 2025-08-05 |
| US20140326993A1 (en) | 2014-11-06 |
| JP7378532B2 (ja) | 2023-11-13 |
| JP7745120B2 (ja) | 2025-09-26 |
| JP2018185541A (ja) | 2018-11-22 |
| JP2014232317A (ja) | 2014-12-11 |
| JP2025178308A (ja) | 2025-12-05 |
| JP2020060769A (ja) | 2020-04-16 |
| JP2022103223A (ja) | 2022-07-07 |
| JP7695491B1 (ja) | 2025-06-18 |
| JP2024020261A (ja) | 2024-02-14 |
| JP7601990B2 (ja) | 2024-12-17 |
| JP2025126185A (ja) | 2025-08-28 |
| JP2025028103A (ja) | 2025-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7695491B1 (ja) | 表示装置 | |
| JP7631405B2 (ja) | 半導体装置の作製方法 | |
| JP7564401B2 (ja) | 液晶表示装置 | |
| JP2023029901A (ja) | 表示装置 | |
| KR102506007B1 (ko) | 트랜지스터의 제작 방법 | |
| JP6495612B2 (ja) | 表示装置 | |
| JP2015188080A (ja) | 半導体装置、該半導体装置を有する表示装置、該表示装置を有する表示モジュール、並びに該半導体装置、該表示装置、及び該表示モジュールを有する電子機器 | |
| US9590111B2 (en) | Semiconductor device and display device including the semiconductor device | |
| JP2014220492A (ja) | 半導体装置 | |
| JP2020112824A (ja) | 液晶表示装置 | |
| TW202403403A (zh) | 半導體裝置 | |
| JP2014212309A (ja) | 半導体装置 | |
| JP2019197922A (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170425 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170425 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171227 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180109 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180307 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180703 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180802 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6382566 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |