JP6324876B2 - 配線基板、半導体装置及び配線基板の製造方法 - Google Patents

配線基板、半導体装置及び配線基板の製造方法 Download PDF

Info

Publication number
JP6324876B2
JP6324876B2 JP2014228803A JP2014228803A JP6324876B2 JP 6324876 B2 JP6324876 B2 JP 6324876B2 JP 2014228803 A JP2014228803 A JP 2014228803A JP 2014228803 A JP2014228803 A JP 2014228803A JP 6324876 B2 JP6324876 B2 JP 6324876B2
Authority
JP
Japan
Prior art keywords
wiring
layer
insulating layer
metal
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014228803A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016029697A (ja
JP2016029697A5 (enExample
Inventor
清水　規良
規良 清水
雄資 郷津
雄資 郷津
潤 古市
古市　　潤
六川　昭雄
昭雄 六川
伊藤　隆司
隆司 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014228803A priority Critical patent/JP6324876B2/ja
Priority to US14/791,670 priority patent/US9875957B2/en
Publication of JP2016029697A publication Critical patent/JP2016029697A/ja
Publication of JP2016029697A5 publication Critical patent/JP2016029697A5/ja
Priority to US15/866,686 priority patent/US10366949B2/en
Application granted granted Critical
Publication of JP6324876B2 publication Critical patent/JP6324876B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H10W70/635—
    • H10W70/6525—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H10W70/60—
    • H10W70/614—
    • H10W70/69—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/241—
    • H10W72/252—
    • H10W72/354—
    • H10W72/387—
    • H10W74/15—
    • H10W90/00—
    • H10W90/401—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Geometry (AREA)
JP2014228803A 2014-07-16 2014-11-11 配線基板、半導体装置及び配線基板の製造方法 Active JP6324876B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014228803A JP6324876B2 (ja) 2014-07-16 2014-11-11 配線基板、半導体装置及び配線基板の製造方法
US14/791,670 US9875957B2 (en) 2014-07-16 2015-07-06 Wiring substrate and semiconductor device
US15/866,686 US10366949B2 (en) 2014-07-16 2018-01-10 Wiring substrate and semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014146231 2014-07-16
JP2014146231 2014-07-16
JP2014228803A JP6324876B2 (ja) 2014-07-16 2014-11-11 配線基板、半導体装置及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2016029697A JP2016029697A (ja) 2016-03-03
JP2016029697A5 JP2016029697A5 (enExample) 2017-08-03
JP6324876B2 true JP6324876B2 (ja) 2018-05-16

Family

ID=55075195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014228803A Active JP6324876B2 (ja) 2014-07-16 2014-11-11 配線基板、半導体装置及び配線基板の製造方法

Country Status (2)

Country Link
US (2) US9875957B2 (enExample)
JP (1) JP6324876B2 (enExample)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6341714B2 (ja) 2014-03-25 2018-06-13 新光電気工業株式会社 配線基板及びその製造方法
JP6661232B2 (ja) * 2016-03-01 2020-03-11 新光電気工業株式会社 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法
JP6816964B2 (ja) * 2016-03-10 2021-01-20 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP6594264B2 (ja) * 2016-06-07 2019-10-23 新光電気工業株式会社 配線基板及び半導体装置、並びにそれらの製造方法
JP6951838B2 (ja) 2016-08-29 2021-10-20 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
CN114945242B (zh) * 2016-10-12 2024-12-27 住友电工印刷电路株式会社 印刷电路板及其制造方法
CN108633174B (zh) * 2017-03-23 2020-08-18 欣兴电子股份有限公司 线路板堆叠结构及其制作方法
CN108633175B (zh) * 2017-03-23 2020-08-28 欣兴电子股份有限公司 线路板堆叠结构及其制作方法
TWI685284B (zh) * 2018-12-11 2020-02-11 欣興電子股份有限公司 封裝結構及其製造方法
US10950535B2 (en) 2017-05-09 2021-03-16 Unimicron Technology Corp. Package structure and method of manufacturing the same
US10714448B2 (en) 2017-05-09 2020-07-14 Unimicron Technology Corp. Chip module with porous bonding layer and stacked structure with porous bonding layer
US10178755B2 (en) 2017-05-09 2019-01-08 Unimicron Technology Corp. Circuit board stacked structure and method for forming the same
US10685922B2 (en) 2017-05-09 2020-06-16 Unimicron Technology Corp. Package structure with structure reinforcing element and manufacturing method thereof
US10643936B2 (en) * 2017-05-31 2020-05-05 Dyi-chung Hu Package substrate and package structure
JP6989603B2 (ja) * 2017-06-07 2022-01-05 日本特殊陶業株式会社 配線基板、及び配線基板の製造方法
TWI640068B (zh) * 2017-11-30 2018-11-01 矽品精密工業股份有限公司 電子封裝件及其製法
JP7430481B2 (ja) * 2018-05-31 2024-02-13 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US11508648B2 (en) * 2018-06-29 2022-11-22 Intel Corporation Coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boards
US10622292B2 (en) * 2018-07-06 2020-04-14 Qualcomm Incorporated High density interconnects in an embedded trace substrate (ETS) comprising a core layer
US10879157B2 (en) * 2018-11-16 2020-12-29 Xilinx, Inc. High density substrate and stacked silicon package assembly having the same
KR102543186B1 (ko) * 2018-11-23 2023-06-14 삼성전자주식회사 반도체 패키지
KR102724892B1 (ko) * 2018-12-04 2024-11-01 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP7145068B2 (ja) * 2018-12-28 2022-09-30 新光電気工業株式会社 配線基板及びその製造方法
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
JP2020161727A (ja) * 2019-03-27 2020-10-01 イビデン株式会社 配線基板
US10978417B2 (en) * 2019-04-29 2021-04-13 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
US11069605B2 (en) * 2019-04-30 2021-07-20 Advanced Semiconductor Engineering, Inc. Wiring structure having low and high density stacked structures
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
WO2020241645A1 (ja) * 2019-05-31 2020-12-03 凸版印刷株式会社 多層配線基板及びその製造方法
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
KR102669257B1 (ko) * 2019-07-12 2024-05-28 삼성전자주식회사 패키지 기판 및 이를 포함하는 반도체 패키지
KR102798702B1 (ko) * 2019-07-22 2025-04-23 삼성전자주식회사 반도체 패키지
JP7382170B2 (ja) * 2019-08-02 2023-11-16 ローム株式会社 半導体装置
JP2021027167A (ja) * 2019-08-05 2021-02-22 イビデン株式会社 配線基板
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US20230004243A1 (en) * 2020-01-08 2023-01-05 Panasonic Intellectual Property Management Co., Ltd. Method for manufacturing wiring body, pattern plate, and wiring body
US12048087B2 (en) * 2020-01-30 2024-07-23 Kyocera Corporation Wiring board
JP2021129048A (ja) * 2020-02-14 2021-09-02 イビデン株式会社 配線基板の製造方法及び配線基板
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
TWI720847B (zh) * 2020-03-17 2021-03-01 欣興電子股份有限公司 晶片封裝結構及其製作方法
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11257742B2 (en) * 2020-07-02 2022-02-22 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
EP4192202A4 (en) * 2020-07-29 2024-09-04 Kyocera Corporation CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
US11355426B2 (en) * 2020-07-31 2022-06-07 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
KR20220040732A (ko) * 2020-09-24 2022-03-31 삼성전기주식회사 인쇄회로기판
US12033930B2 (en) * 2020-09-25 2024-07-09 Intel Corporation Selectively roughened copper architectures for low insertion loss conductive features
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
JP7515418B2 (ja) 2021-01-07 2024-07-12 日本特殊陶業株式会社 配線基板および配線基板の製造方法
JPWO2022202553A1 (enExample) * 2021-03-22 2022-09-29
JP7569743B2 (ja) * 2021-04-19 2024-10-18 イビデン株式会社 配線基板
JP7603516B2 (ja) * 2021-04-21 2024-12-20 イビデン株式会社 配線基板
JP2022175730A (ja) * 2021-05-14 2022-11-25 イビデン株式会社 配線基板及び配線基板の製造方法
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
JP7578071B2 (ja) * 2021-06-08 2024-11-06 新光電気工業株式会社 配線基板及びその製造方法
TWI901331B (zh) * 2021-08-06 2025-10-11 群創光電股份有限公司 封裝元件的製作方法
KR102460218B1 (ko) * 2021-08-30 2022-10-27 신웅철 인쇄회로기판 제조방법
US20230073823A1 (en) * 2021-09-09 2023-03-09 Qualcomm Incorporated Package comprising a substrate with high-density interconnects
KR20230039144A (ko) * 2021-09-13 2023-03-21 삼성전자주식회사 반도체 패키지
TWI824303B (zh) * 2021-09-23 2023-12-01 欣興電子股份有限公司 電路板線路結構改良方法及電路板線路改良結構
JP2023056890A (ja) * 2021-10-08 2023-04-20 イビデン株式会社 配線基板及び配線基板の製造方法
KR20230055561A (ko) * 2021-10-19 2023-04-26 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 전자부품 패키지
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
JP2023078819A (ja) 2021-11-26 2023-06-07 イビデン株式会社 配線基板及び配線基板の製造方法
US12108530B2 (en) 2022-01-13 2024-10-01 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
TWI781049B (zh) 2022-01-24 2022-10-11 欣興電子股份有限公司 電路板結構及其製作方法
JP2023111607A (ja) * 2022-01-31 2023-08-10 イビデン株式会社 配線基板
US20230317583A1 (en) * 2022-03-29 2023-10-05 Intel Corporation Modification of sinx thin film for improved adhesion of metal-dielectrics for hsio packaging
US12495489B2 (en) * 2022-03-29 2025-12-09 Ibiden Co., Ltd. Printed wiring board
US20230317614A1 (en) * 2022-03-29 2023-10-05 Intel Corporation Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for hsio
TWI825648B (zh) * 2022-03-31 2023-12-11 欣興電子股份有限公司 電路板及其製造方法
EP4255132A1 (en) * 2022-03-31 2023-10-04 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier
US20230420353A1 (en) * 2022-06-23 2023-12-28 Intel Corporation Asymmetrical dielectric-to-metal adhesion architecture for electronic packages
TWI815556B (zh) 2022-07-15 2023-09-11 欣興電子股份有限公司 線路板結構及其製作方法
US20240047229A1 (en) * 2022-08-02 2024-02-08 Advanced Micro Devices, Inc. Organic package core for a substrate with high density plated holes
CN118055551A (zh) 2022-11-15 2024-05-17 华为技术有限公司 布线载板及其制造方法
JP2024085326A (ja) * 2022-12-14 2024-06-26 イビデン株式会社 プリント配線板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG73469A1 (en) * 1996-11-20 2000-06-20 Ibiden Co Ltd Solder resist composition and printed circuit boards
JP5191074B2 (ja) 2001-07-10 2013-04-24 イビデン株式会社 多層プリント配線板
JP2003023252A (ja) 2001-07-10 2003-01-24 Ibiden Co Ltd 多層プリント配線板
US6596384B1 (en) * 2002-04-09 2003-07-22 International Business Machines Corporation Selectively roughening conductors for high frequency printed wiring boards
JP2004342988A (ja) * 2003-05-19 2004-12-02 Shinko Electric Ind Co Ltd 半導体パッケージの製造方法、及び半導体装置の製造方法
JP4341588B2 (ja) * 2005-06-09 2009-10-07 株式会社デンソー 多層基板及びその製造方法
JP2007317900A (ja) * 2006-05-26 2007-12-06 Nitto Denko Corp 配線回路基板およびその製造方法
US8929090B2 (en) * 2010-01-22 2015-01-06 Nec Corporation Functional element built-in substrate and wiring substrate
JP5566720B2 (ja) * 2010-02-16 2014-08-06 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5725962B2 (ja) * 2010-04-27 2015-05-27 京セラ株式会社 配線基板の製造方法及びその実装構造体の製造方法
JP5602584B2 (ja) * 2010-10-28 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法
JP2012216773A (ja) * 2011-03-29 2012-11-08 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
KR20140060767A (ko) * 2012-11-12 2014-05-21 삼성전기주식회사 회로 기판 및 그 제조 방법
JP6169955B2 (ja) * 2013-04-17 2017-07-26 新光電気工業株式会社 配線基板及びその製造方法

Also Published As

Publication number Publication date
US10366949B2 (en) 2019-07-30
JP2016029697A (ja) 2016-03-03
US9875957B2 (en) 2018-01-23
US20180166372A1 (en) 2018-06-14
US20160020163A1 (en) 2016-01-21

Similar Documents

Publication Publication Date Title
JP6324876B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
JP6298722B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
JP6375121B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
JP6158676B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
JP6584939B2 (ja) 配線基板、半導体パッケージ、半導体装置、配線基板の製造方法及び半導体パッケージの製造方法
US9257386B2 (en) Wiring substrate and semiconductor device
US9313904B2 (en) Wiring board and method of manufacturing wiring board
JP6375159B2 (ja) 配線基板、半導体パッケージ
JP7202784B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
JP6247032B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
JP6661232B2 (ja) 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法
US9565775B2 (en) Wiring board, semiconductor device, and method of manufacturing wiring board
JP5547615B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
JP6341714B2 (ja) 配線基板及びその製造方法
JP2018037461A (ja) 配線基板、半導体装置及び配線基板の製造方法
US20190067224A1 (en) Wiring substrate and semiconductor device
US10074601B2 (en) Wiring substrate and semiconductor device
US9392684B2 (en) Wiring substrate and method for manufacturing wiring substrate
JP6368635B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
JP7198154B2 (ja) 配線基板、及び配線基板の製造方法
JP2025035312A (ja) 積層型配線基板、半導体装置及び積層型配線基板の製造方法
JP2025028417A (ja) 配線基板及び配線基板の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170619

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170619

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180214

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180320

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180411

R150 Certificate of patent or registration of utility model

Ref document number: 6324876

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150