JP5849350B2 - 基材を用いた積層造形法 - Google Patents
基材を用いた積層造形法 Download PDFInfo
- Publication number
- JP5849350B2 JP5849350B2 JP2012544820A JP2012544820A JP5849350B2 JP 5849350 B2 JP5849350 B2 JP 5849350B2 JP 2012544820 A JP2012544820 A JP 2012544820A JP 2012544820 A JP2012544820 A JP 2012544820A JP 5849350 B2 JP5849350 B2 JP 5849350B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid resin
- curable liquid
- radiation curable
- radiation
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000654 additive Substances 0.000 title description 30
- 238000004519 manufacturing process Methods 0.000 title description 30
- 230000000996 additive effect Effects 0.000 title description 28
- 239000000463 material Substances 0.000 title description 18
- 230000005855 radiation Effects 0.000 claims description 204
- 229920005989 resin Polymers 0.000 claims description 192
- 239000011347 resin Substances 0.000 claims description 192
- 239000007788 liquid Substances 0.000 claims description 178
- 239000000758 substrate Substances 0.000 claims description 94
- 238000000034 method Methods 0.000 claims description 70
- 238000000926 separation method Methods 0.000 claims description 47
- 239000012952 cationic photoinitiator Substances 0.000 claims description 37
- 150000003254 radicals Chemical class 0.000 claims description 35
- 238000003860 storage Methods 0.000 claims description 31
- 125000002091 cationic group Chemical group 0.000 claims description 25
- 150000001875 compounds Chemical class 0.000 claims description 23
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims description 18
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 17
- 239000012949 free radical photoinitiator Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 13
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 9
- 239000005062 Polybutadiene Substances 0.000 claims description 7
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- ULNJZOIDTANZKR-UHFFFAOYSA-N tris[4-(4-acetylphenyl)sulfanylphenyl]sulfanium Chemical group C1=CC(C(=O)C)=CC=C1SC1=CC=C([S+](C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=C1 ULNJZOIDTANZKR-UHFFFAOYSA-N 0.000 claims description 6
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical group CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 5
- 230000003595 spectral effect Effects 0.000 claims description 4
- 150000001768 cations Chemical class 0.000 claims description 3
- 238000011067 equilibration Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- -1 araliphatic Chemical group 0.000 description 152
- 239000010410 layer Substances 0.000 description 138
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 97
- 239000000203 mixture Substances 0.000 description 42
- 150000003839 salts Chemical class 0.000 description 27
- 230000008569 process Effects 0.000 description 26
- 238000001723 curing Methods 0.000 description 23
- 229920000642 polymer Polymers 0.000 description 21
- 239000003504 photosensitizing agent Substances 0.000 description 19
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 17
- 150000001450 anions Chemical class 0.000 description 14
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 13
- 239000004593 Epoxy Substances 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 10
- 239000011342 resin composition Substances 0.000 description 10
- 239000012965 benzophenone Substances 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 8
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 8
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000012986 chain transfer agent Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000010276 construction Methods 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 7
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 7
- 238000010538 cationic polymerization reaction Methods 0.000 description 7
- 239000000412 dendrimer Substances 0.000 description 7
- 229920000736 dendritic polymer Polymers 0.000 description 7
- 125000005520 diaryliodonium group Chemical group 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 7
- 229920005862 polyol Polymers 0.000 description 7
- 150000003077 polyols Chemical class 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000012954 diazonium Substances 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 5
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 125000003566 oxetanyl group Chemical group 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 238000010526 radical polymerization reaction Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 150000007964 xanthones Chemical class 0.000 description 5
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 229910018286 SbF 6 Inorganic materials 0.000 description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 150000008366 benzophenones Chemical class 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 150000001989 diazonium salts Chemical class 0.000 description 4
- 125000000623 heterocyclic group Chemical group 0.000 description 4
- 239000000852 hydrogen donor Substances 0.000 description 4
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 229920002521 macromolecule Polymers 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- WWMFRKPUQJRNBY-UHFFFAOYSA-N (2,3-dimethoxyphenyl)-phenylmethanone Chemical compound COC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1OC WWMFRKPUQJRNBY-UHFFFAOYSA-N 0.000 description 3
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 3
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 3
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 3
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 3
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 3
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 3
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 3
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 3
- UMWZLYTVXQBTTE-UHFFFAOYSA-N 2-pentylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(CCCCC)=CC=C3C(=O)C2=C1 UMWZLYTVXQBTTE-UHFFFAOYSA-N 0.000 description 3
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 3
- 238000010547 Norrish type II reaction Methods 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- PFHLXMMCWCWAMA-UHFFFAOYSA-N [4-(4-diphenylsulfoniophenyl)sulfanylphenyl]-diphenylsulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC(C=C1)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 PFHLXMMCWCWAMA-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 150000004056 anthraquinones Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 3
- 229930006711 bornane-2,3-dione Natural products 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000011960 computer-aided design Methods 0.000 description 3
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical compound [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 3
- YCWSUKQGVSGXJO-NTUHNPAUSA-N nifuroxazide Chemical group C1=CC(O)=CC=C1C(=O)N\N=C\C1=CC=C([N+]([O-])=O)O1 YCWSUKQGVSGXJO-NTUHNPAUSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- HPAFOABSQZMTHE-UHFFFAOYSA-N phenyl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)C1=CC=CC=C1 HPAFOABSQZMTHE-UHFFFAOYSA-N 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- QKAIFCSOWIMRJG-UHFFFAOYSA-N (4-methylphenyl)-(4-propan-2-ylphenyl)iodanium Chemical compound C1=CC(C(C)C)=CC=C1[I+]C1=CC=C(C)C=C1 QKAIFCSOWIMRJG-UHFFFAOYSA-N 0.000 description 2
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- VKQJCUYEEABXNK-UHFFFAOYSA-N 1-chloro-4-propoxythioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C(OCCC)=CC=C2Cl VKQJCUYEEABXNK-UHFFFAOYSA-N 0.000 description 2
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
- 125000001255 4-fluorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1F 0.000 description 2
- BXAVKNRWVKUTLY-UHFFFAOYSA-N 4-sulfanylphenol Chemical class OC1=CC=C(S)C=C1 BXAVKNRWVKUTLY-UHFFFAOYSA-N 0.000 description 2
- 229910017008 AsF 6 Inorganic materials 0.000 description 2
- 229910017048 AsF6 Inorganic materials 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- ILKOAJGHVUCDIV-UHFFFAOYSA-N FC1=CC=C(N2C=CC=C2)C(F)=C1[Ti]C(C=1F)=C(F)C=CC=1N1C=CC=C1 Chemical compound FC1=CC=C(N2C=CC=C2)C(F)=C1[Ti]C(C=1F)=C(F)C=CC=1N1C=CC=C1 ILKOAJGHVUCDIV-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- HLJYBXJFKDDIBI-UHFFFAOYSA-N O=[PH2]C(=O)C1=CC=CC=C1 Chemical class O=[PH2]C(=O)C1=CC=CC=C1 HLJYBXJFKDDIBI-UHFFFAOYSA-N 0.000 description 2
- QFHHVDSRNKNCOU-UHFFFAOYSA-N OC1(CC=CC=C1)C(=O)C(CC1=CC=CC=C1)(C)O Chemical class OC1(CC=CC=C1)C(=O)C(CC1=CC=CC=C1)(C)O QFHHVDSRNKNCOU-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical class CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 description 2
- RITXQKIGPIMUDC-UHFFFAOYSA-N [4-(4-benzoylphenyl)sulfanylphenyl]-bis(4-chlorophenyl)sulfanium Chemical compound C1=CC(Cl)=CC=C1[S+](C=1C=CC(SC=2C=CC(=CC=2)C(=O)C=2C=CC=CC=2)=CC=1)C1=CC=C(Cl)C=C1 RITXQKIGPIMUDC-UHFFFAOYSA-N 0.000 description 2
- ZGHGKVNECBNXBN-UHFFFAOYSA-N [4-[4-(3-chlorobenzoyl)phenyl]sulfanylphenyl]-bis(4-fluorophenyl)sulfanium Chemical compound C1=CC(F)=CC=C1[S+](C=1C=CC(SC=2C=CC(=CC=2)C(=O)C=2C=C(Cl)C=CC=2)=CC=1)C1=CC=C(F)C=C1 ZGHGKVNECBNXBN-UHFFFAOYSA-N 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- JCJNNHDZTLRSGN-UHFFFAOYSA-N anthracen-9-ylmethanol Chemical compound C1=CC=C2C(CO)=C(C=CC=C3)C3=CC2=C1 JCJNNHDZTLRSGN-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 150000008365 aromatic ketones Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- AENNXXRRACDJAY-UHFFFAOYSA-N bis(2-dodecylphenyl)iodanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC AENNXXRRACDJAY-UHFFFAOYSA-N 0.000 description 2
- YSXJIDHYEFYSON-UHFFFAOYSA-N bis(4-dodecylphenyl)iodanium Chemical compound C1=CC(CCCCCCCCCCCC)=CC=C1[I+]C1=CC=C(CCCCCCCCCCCC)C=C1 YSXJIDHYEFYSON-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 150000004294 cyclic thioethers Chemical class 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 238000013480 data collection Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- HOCOIDRZLNGZMV-UHFFFAOYSA-N ethoxy(oxido)phosphanium Chemical compound CCO[PH2]=O HOCOIDRZLNGZMV-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 2
- DWYMPOCYEZONEA-UHFFFAOYSA-L fluoridophosphate Chemical compound [O-]P([O-])(F)=O DWYMPOCYEZONEA-UHFFFAOYSA-L 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229920000587 hyperbranched polymer Polymers 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 125000001812 iodosyl group Chemical group O=I[*] 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 2
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000269 nucleophilic effect Effects 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 2
- JVCXFJJANZMOCM-UHFFFAOYSA-N phenyl(trimethylgermyl)methanone Chemical compound C[Ge](C)(C)C(=O)C1=CC=CC=C1 JVCXFJJANZMOCM-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 230000000886 photobiology Effects 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- NGDMLQSGYUCLDC-UHFFFAOYSA-N pyren-1-ylmethanol Chemical class C1=C2C(CO)=CC=C(C=C3)C2=C2C3=CC=CC2=C1 NGDMLQSGYUCLDC-UHFFFAOYSA-N 0.000 description 2
- WPFGFHJALYCVMO-UHFFFAOYSA-L rubidium carbonate Chemical compound [Rb+].[Rb+].[O-]C([O-])=O WPFGFHJALYCVMO-UHFFFAOYSA-L 0.000 description 2
- 229910000026 rubidium carbonate Inorganic materials 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 125000005537 sulfoxonium group Chemical group 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 2
- 239000012953 triphenylsulfonium Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- ICDPQXOSMPGEKY-UHFFFAOYSA-N (2-chlorophenyl)-diphenylsulfanium Chemical compound ClC1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ICDPQXOSMPGEKY-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- JLBTVYNENUKINW-UHFFFAOYSA-N (4-pentadecoxyphenyl)-phenyliodanium Chemical compound C1=CC(OCCCCCCCCCCCCCCC)=CC=C1[I+]C1=CC=CC=C1 JLBTVYNENUKINW-UHFFFAOYSA-N 0.000 description 1
- CCEFMUBVSUDRLG-KXUCPTDWSA-N (4R)-limonene 1,2-epoxide Natural products C1[C@H](C(=C)C)CC[C@@]2(C)O[C@H]21 CCEFMUBVSUDRLG-KXUCPTDWSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- WEEGYLXZBRQIMU-UHFFFAOYSA-N 1,8-cineole Natural products C1CC2CCC1(C)OC2(C)C WEEGYLXZBRQIMU-UHFFFAOYSA-N 0.000 description 1
- GPYQCUAEWNGAKQ-UHFFFAOYSA-N 1-(4-iodophenoxy)tetradecan-2-yl N-[3-(trifluoromethyl)phenyl]carbamate Chemical compound CCCCCCCCCCCCC(COC1=CC=C(C=C1)I)OC(=O)NC2=CC=CC(=C2)C(F)(F)F GPYQCUAEWNGAKQ-UHFFFAOYSA-N 0.000 description 1
- AWOGBOARESKNBA-UHFFFAOYSA-N 1-[(3-ethyloxetan-3-yl)methoxy]propan-2-ol Chemical compound CC(O)COCC1(CC)COC1 AWOGBOARESKNBA-UHFFFAOYSA-N 0.000 description 1
- YQMXOIAIYXXXEE-UHFFFAOYSA-N 1-benzylpyrrolidin-3-ol Chemical compound C1C(O)CCN1CC1=CC=CC=C1 YQMXOIAIYXXXEE-UHFFFAOYSA-N 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- CSCSROFYRUZJJH-UHFFFAOYSA-N 1-methoxyethane-1,2-diol Chemical compound COC(O)CO CSCSROFYRUZJJH-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- GOVVHAHLSILYMB-UHFFFAOYSA-N 1-propoxythioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2OCCC GOVVHAHLSILYMB-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- IFOWXFUNZNAQJJ-UHFFFAOYSA-N 2,4-dihydroxy-2,4-dimethylpentan-3-one Chemical compound CC(C)(O)C(=O)C(C)(C)O IFOWXFUNZNAQJJ-UHFFFAOYSA-N 0.000 description 1
- GHTVHGGJFHMYBA-UHFFFAOYSA-N 2-(7-oxabicyclo[4.1.0]heptane-4-carbonyloxy)ethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCCOC(=O)C1CC2OC2CC1 GHTVHGGJFHMYBA-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical class ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- MJNGDTGKCWWIOP-UHFFFAOYSA-N 2-[(3-ethyloxetan-3-yl)methoxy]ethanol Chemical compound OCCOCC1(CC)COC1 MJNGDTGKCWWIOP-UHFFFAOYSA-N 0.000 description 1
- SNAGVRNJNARVRV-UHFFFAOYSA-N 2-[(3-ethyloxetan-3-yl)methoxymethyl]oxolane Chemical compound C1CCOC1COCC1(CC)COC1 SNAGVRNJNARVRV-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- DVSDTPMZVLDKRT-UHFFFAOYSA-N 2-[2-[(3-ethyloxetan-3-yl)methoxy]butoxy]ethanol Chemical compound OCCOCC(CC)OCC1(CC)COC1 DVSDTPMZVLDKRT-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical class CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 1
- 125000003541 2-chlorobenzoyl group Chemical group ClC1=C(C(=O)*)C=CC=C1 0.000 description 1
- TZLVUWBGUNVFES-UHFFFAOYSA-N 2-ethyl-5-methylpyrazol-3-amine Chemical compound CCN1N=C(C)C=C1N TZLVUWBGUNVFES-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- AVMAKAJNOPYJTQ-UHFFFAOYSA-N 2-methyl-10h-anthracen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3CC2=C1 AVMAKAJNOPYJTQ-UHFFFAOYSA-N 0.000 description 1
- VMKYTRPNOVFCGZ-UHFFFAOYSA-N 2-sulfanylphenol Chemical class OC1=CC=CC=C1S VMKYTRPNOVFCGZ-UHFFFAOYSA-N 0.000 description 1
- OILWEQNBDUGJQS-UHFFFAOYSA-N 2-tert-butyl-9,10-dimethoxyanthracene Chemical compound CC(C)(C)C1=CC=C2C(OC)=C(C=CC=C3)C3=C(OC)C2=C1 OILWEQNBDUGJQS-UHFFFAOYSA-N 0.000 description 1
- XXCRXPYEAMCJKH-UHFFFAOYSA-N 3,3,4-trimethyloxepan-2-one Chemical compound CC1CCCOC(=O)C1(C)C XXCRXPYEAMCJKH-UHFFFAOYSA-N 0.000 description 1
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 1
- DKBJETRCOHGWRJ-UHFFFAOYSA-N 3-[(3-ethyloxetan-3-yl)methoxy]propan-1-ol Chemical compound OCCCOCC1(CC)COC1 DKBJETRCOHGWRJ-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- PWGAXPBJOGFFMY-UHFFFAOYSA-N 3-ethyl-3-(2-methylpropoxymethoxymethyl)oxetane Chemical compound CC(C)COCOCC1(CC)COC1 PWGAXPBJOGFFMY-UHFFFAOYSA-N 0.000 description 1
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 1
- LNZCVOLEQJDCJG-UHFFFAOYSA-N 3-ethyl-3-[(2-methylphenoxy)methyl]oxetane Chemical compound C=1C=CC=C(C)C=1OCC1(CC)COC1 LNZCVOLEQJDCJG-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- RRXFVFZYPPCDAW-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethoxymethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1COCC1CC2OC2CC1 RRXFVFZYPPCDAW-UHFFFAOYSA-N 0.000 description 1
- HYYPKCMPDGCDHE-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1CC1CC2OC2CC1 HYYPKCMPDGCDHE-UHFFFAOYSA-N 0.000 description 1
- RBMGGZPJAZDWNE-UHFFFAOYSA-N 4-[(3-ethyloxetan-3-yl)methoxy]butan-1-ol Chemical compound OCCCCOCC1(CC)COC1 RBMGGZPJAZDWNE-UHFFFAOYSA-N 0.000 description 1
- YHTLGFCVBKENTE-UHFFFAOYSA-N 4-methyloxan-2-one Chemical compound CC1CCOC(=O)C1 YHTLGFCVBKENTE-UHFFFAOYSA-N 0.000 description 1
- IKVYHNPVKUNCJM-UHFFFAOYSA-N 4-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C(C(C)C)=CC=C2 IKVYHNPVKUNCJM-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- XEUBDFWTYXHKJO-UHFFFAOYSA-N 5-[(3-ethyloxetan-3-yl)methoxy]pentan-1-ol Chemical compound OCCCCCOCC1(CC)COC1 XEUBDFWTYXHKJO-UHFFFAOYSA-N 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 description 1
- ZHBOFZNNPZNWGB-UHFFFAOYSA-N 9,10-bis(phenylethynyl)anthracene Chemical compound C1=CC=CC=C1C#CC(C1=CC=CC=C11)=C(C=CC=C2)C2=C1C#CC1=CC=CC=C1 ZHBOFZNNPZNWGB-UHFFFAOYSA-N 0.000 description 1
- FYEZXRCDKCOJPP-UHFFFAOYSA-N 9,10-bis(phenylsulfanyl)anthracene Chemical compound C=12C=CC=CC2=C(SC=2C=CC=CC=2)C2=CC=CC=C2C=1SC1=CC=CC=C1 FYEZXRCDKCOJPP-UHFFFAOYSA-N 0.000 description 1
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 1
- FUWFDADDJOUNDL-UHFFFAOYSA-N 9,10-diethoxy-2-ethylanthracene Chemical compound CCC1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 FUWFDADDJOUNDL-UHFFFAOYSA-N 0.000 description 1
- GSMYTXQTSBPOET-UHFFFAOYSA-N 9,10-diethoxy-2-methylanthracene Chemical compound CC1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 GSMYTXQTSBPOET-UHFFFAOYSA-N 0.000 description 1
- GJNKQJAJXSUJBO-UHFFFAOYSA-N 9,10-diethoxyanthracene Chemical compound C1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 GJNKQJAJXSUJBO-UHFFFAOYSA-N 0.000 description 1
- JWJMBKSFTTXMLL-UHFFFAOYSA-N 9,10-dimethoxyanthracene Chemical compound C1=CC=C2C(OC)=C(C=CC=C3)C3=C(OC)C2=C1 JWJMBKSFTTXMLL-UHFFFAOYSA-N 0.000 description 1
- LBQJFQVDEJMUTF-UHFFFAOYSA-N 9,10-dipropoxyanthracene Chemical compound C1=CC=C2C(OCCC)=C(C=CC=C3)C3=C(OCCC)C2=C1 LBQJFQVDEJMUTF-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- SYWNIVZVLMPODI-UHFFFAOYSA-N C(=CC=CC)[Fe] Chemical compound C(=CC=CC)[Fe] SYWNIVZVLMPODI-UHFFFAOYSA-N 0.000 description 1
- XTSVUEHYCRSXFJ-UHFFFAOYSA-N CC1=CC2=C(C3=CC=CC=C3C(=C2C=C1)OC)OC.C(C)C1=CC2=C(C3=CC=CC=C3C(=C2C=C1)OC)OC Chemical compound CC1=CC2=C(C3=CC=CC=C3C(=C2C=C1)OC)OC.C(C)C1=CC2=C(C3=CC=CC=C3C(=C2C=C1)OC)OC XTSVUEHYCRSXFJ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 241000288673 Chiroptera Species 0.000 description 1
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 1
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- CCEFMUBVSUDRLG-XNWIYYODSA-N Limonene-1,2-epoxide Chemical compound C1[C@H](C(=C)C)CCC2(C)OC21 CCEFMUBVSUDRLG-XNWIYYODSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- 238000010546 Norrish type I reaction Methods 0.000 description 1
- VEUHPWRDBGGGBU-UHFFFAOYSA-N OB(O)O.I.I.I Chemical compound OB(O)O.I.I.I VEUHPWRDBGGGBU-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-O Thiophenium Chemical compound [SH+]1C=CC=C1 YTPLMLYBLZKORZ-UHFFFAOYSA-O 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- HYGCUEYOKGLJQZ-UHFFFAOYSA-N [4-(2-hydroxytetradecoxy)phenyl]-phenyliodanium Chemical compound C1=CC(OCC(O)CCCCCCCCCCCC)=CC=C1[I+]C1=CC=CC=C1 HYGCUEYOKGLJQZ-UHFFFAOYSA-N 0.000 description 1
- WXBIFJSVLGJYJX-UHFFFAOYSA-N [4-(4-benzoylphenyl)sulfanylphenyl]-bis(4-fluorophenyl)sulfanium Chemical compound C1=CC(F)=CC=C1[S+](C=1C=CC(SC=2C=CC(=CC=2)C(=O)C=2C=CC=CC=2)=CC=1)C1=CC=C(F)C=C1 WXBIFJSVLGJYJX-UHFFFAOYSA-N 0.000 description 1
- STPAFCHTSFOHPE-UHFFFAOYSA-N [4-(4-benzoylphenyl)sulfanylphenyl]-bis[4-(2-hydroxyethoxy)phenyl]sulfanium Chemical compound C1=CC(OCCO)=CC=C1[S+](C=1C=CC(SC=2C=CC(=CC=2)C(=O)C=2C=CC=CC=2)=CC=1)C1=CC=C(OCCO)C=C1 STPAFCHTSFOHPE-UHFFFAOYSA-N 0.000 description 1
- DXIYJLVGNSDKDI-UHFFFAOYSA-N [4-(4-benzoylphenyl)sulfanylphenyl]-diphenylsulfanium Chemical group C=1C=C(SC=2C=CC(=CC=2)[S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 DXIYJLVGNSDKDI-UHFFFAOYSA-N 0.000 description 1
- MCQAUEZLCUKAJT-UHFFFAOYSA-N [4-[4-(2-chlorobenzoyl)phenyl]sulfanylphenyl]-bis(4-fluorophenyl)sulfanium Chemical compound C1=CC(F)=CC=C1[S+](C=1C=CC(SC=2C=CC(=CC=2)C(=O)C=2C(=CC=CC=2)Cl)=CC=1)C1=CC=C(F)C=C1 MCQAUEZLCUKAJT-UHFFFAOYSA-N 0.000 description 1
- XAKBSHICSHRJCL-UHFFFAOYSA-N [CH2]C(=O)C1=CC=CC=C1 Chemical group [CH2]C(=O)C1=CC=CC=C1 XAKBSHICSHRJCL-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- OTVPWGHMBHYUAX-UHFFFAOYSA-N [Fe].[CH]1C=CC=C1 Chemical compound [Fe].[CH]1C=CC=C1 OTVPWGHMBHYUAX-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- DPKHZNPWBDQZCN-UHFFFAOYSA-N acridine orange free base Chemical compound C1=CC(N(C)C)=CC2=NC3=CC(N(C)C)=CC=C3C=C21 DPKHZNPWBDQZCN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- VUEDNLCYHKSELL-UHFFFAOYSA-N arsonium Chemical class [AsH4+] VUEDNLCYHKSELL-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DZBUGLKDJFMEHC-UHFFFAOYSA-N benzoquinolinylidene Natural products C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 1
- KZYBDOUJLUPBEH-UHFFFAOYSA-N bis(4-ethenoxybutyl) benzene-1,3-dicarboxylate Chemical compound C=COCCCCOC(=O)C1=CC=CC(C(=O)OCCCCOC=C)=C1 KZYBDOUJLUPBEH-UHFFFAOYSA-N 0.000 description 1
- LMMDJMWIHPEQSJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] hexanedioate Chemical compound C1C2OC2CC(C)C1COC(=O)CCCCC(=O)OCC1CC2OC2CC1C LMMDJMWIHPEQSJ-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 210000001217 buttock Anatomy 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910001914 chlorine tetroxide Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- OJOSABWCUVCSTQ-UHFFFAOYSA-N cyclohepta-2,4,6-trienylium Chemical class C1=CC=C[CH+]=C[CH]1 OJOSABWCUVCSTQ-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012955 diaryliodonium Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical class C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- XIMIGUBYDJDCKI-UHFFFAOYSA-N diselenium Chemical compound [Se]=[Se] XIMIGUBYDJDCKI-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940052303 ethers for general anesthesia Drugs 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 238000007046 ethoxylation reaction Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000008377 fluorones Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- YUWFEBAXEOLKSG-UHFFFAOYSA-N hexamethylbenzene Chemical compound CC1=C(C)C(C)=C(C)C(C)=C1C YUWFEBAXEOLKSG-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003707 hexyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 230000033444 hydroxylation Effects 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- RWGFKTVRMDUZSP-UHFFFAOYSA-N isopropyl-benzene Natural products CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 1
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical class C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 1
- 238000012804 iterative process Methods 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- OTRIMLCPYJAPPD-UHFFFAOYSA-N methanol prop-2-enoic acid Chemical compound OC.OC.OC(=O)C=C.OC(=O)C=C OTRIMLCPYJAPPD-UHFFFAOYSA-N 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- 239000007777 multifunctional material Substances 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 125000001477 organic nitrogen group Chemical group 0.000 description 1
- RZFODFPMOHAYIR-UHFFFAOYSA-N oxepan-2-one;prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1CCCCCO1 RZFODFPMOHAYIR-UHFFFAOYSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Chemical compound [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- JEBMZPLGDZQWCZ-UHFFFAOYSA-N phenyl-bis(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC(SC=3C=CC=CC=3)=CC=2)C=CC=1SC1=CC=CC=C1 JEBMZPLGDZQWCZ-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 150000003342 selenium Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052604 silicate mineral Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920006268 silicone film Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- OKYDCMQQLGECPI-UHFFFAOYSA-N thiopyrylium Chemical class C1=CC=[S+]C=C1 OKYDCMQQLGECPI-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/277—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/0011—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for shaping plates or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C2033/0005—Moulds or cores; Details thereof or accessories therefor with transparent parts, e.g. permitting visual inspection of the interior of the cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Plasma & Fusion (AREA)
- Ceramic Engineering (AREA)
- Civil Engineering (AREA)
- Composite Materials (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Polymerisation Methods In General (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Description
本発明は、基材を用いた積層造形法に関する。
[背景技術]
[発明の概要]
1)少なくとも1種類のカチオン硬化性化合物を30〜80重量%、より好ましくは35〜80重量%、より好ましくは35〜75重量%、より好ましくは35〜70重量%含む放射線硬化性液状樹脂層を基材上にコーティングする工程;
2)放射線硬化性液状樹脂層を既硬化層と接触させる工程;
3)放射線硬化性液状樹脂層を化学線源によって提供される化学線に選択的に露光させ、それによって既硬化層に接着する硬化層を形成する工程;
4)分離遅延時間を設け、分離遅延時間の終了後に硬化層と基材を分離する工程;および
5)三次元物体を構築するのに十分な回数、工程1〜4を繰り返す工程;
を含む三次元物体の形成方法であり、
分離遅延時間は、放射線硬化性液状樹脂を1.0秒の露光時間、50mW/cm2の光強度で硬化させる時、実時間動的機械分析装置(Real Time−Dynamic Mechanical Analyzer)で放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)を測定する場合、化学線への放射線硬化性液状樹脂層の最初の露光から、放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)が、露光の開始から測定した時、約9.0×105Paより大きい、好ましくは1.0×106Paより大きい、より好ましくは2.0×106Paより大きい(G’)値に達したことが測定される時点までの時間である。
1)少なくとも1種類のカチオン硬化性化合物を30〜80重量%、より好ましくは35〜80重量%、より好ましくは35〜75重量%、より好ましくは35〜70重量%含 む放射線硬化性液状樹脂層を基材上にコーティングする工程;
2)放射線硬化性液状樹脂層を既硬化層と接触させる工程;
3)放射線硬化性液状樹脂層を化学線源によって提供される化学線に選択的に露光させ、それによって既硬化層に接着する硬化層を形成する工程;
4)硬化層と基材を分離する工程;および
5)三次元物体を構築するのに十分な回数、工程1〜4を繰り返す工程;
を含む三次元物体の形成方法であり、
放射線硬化性液状樹脂を1.0秒の露光時間、50mW/cm2の光強度で硬化させる時、放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)を実時間動的機械分析装置で測定する場合、放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)が、露光の開始から2.0秒で約7.5×105Paより大きい、好ましくは8.5×105Paより大きい、より好ましくは9.5×105Paより大きい(G’)値に達したことが測定される。
1)少なくとも1種類のカチオン硬化性化合物を30〜80重量%、より好ましくは35〜80重量%、より好ましくは35〜75重量%、より好ましくは35〜70重量%含む放射線硬化性液状樹脂層を基材上にコーティングする工程;
2)放射線硬化性液状樹脂層を既硬化層と接触させる工程;
3)放射線硬化性液状樹脂層を化学線源によって提供される化学線に選択的に露光させ、それによって既硬化層に接着する硬化層を形成する工程;
4)分離遅延時間を設け、分離遅延時間の終了後に硬化層と基材を分離する工程;および
5)三次元物体を構築するのに十分な回数、工程1〜4を繰り返す工程;
を含む三次元物体の形成方法であり、
分離遅延時間は、放射線硬化性液状樹脂を1.0秒の露光時間、50mW/cm2の光強度で硬化させる時、放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)を実時間動的機械分析装置で測定する場合、化学線への放射線硬化性液状樹脂層の最初の露光から、放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)が、露光の開始から測定した時、約9.0×105Paより大きい、好ましくは1.0×106Paより大きい、より好ましくは2.0×106Paより大きい(G’)値に達したことが測定される時点までの時間である。
ヘキサフルオロホスフェート、ジフェニル−4−(フェニルチオ)フェニルスルホニウムテトラフルオロボレート、ジフェニル−4−(フェニルチオ)フェニルスルホニウムテトラキス(ペンタフルオロフェニル)ボレート、トリフェニルスルホニウムヘキサフルオロホスフェート、トリフェニルスルホニウムヘキサフルオロアンチモネート、トリフェニルスルホニウムテトラフルオロボレート、トリフェニルスルホニウムテトラキス(ペンタフルオロフェニル)ボレート、ビス[4−(ジ(4−(2−ヒドロキシエトキシ))フェニルスルホニオ)フェニル]スルフィドビスヘキサフルオロホスフェート、ビス[4−(ジ(4−(2−ヒドロキシエトキシ))フェニルスルホニオ)フェニル]スルフィドビステトラフルオロボレート、およびビス[4−(ジ(4−(2−ヒドロキシエトキシ))フェニルスルホニオ)フェニル]スルフィドテトラキス(ペンタフルオロフェニル)ボレート、ならびにこれらの任意の組み合わせからなる群から選択される芳香族スルホニウム塩をベースにするカチオン光開始剤である。
、および、これらの任意の組み合わせである。
(式中、アニオンMXnは、BF4、PF6、SbF6、AsF6、(C6F5)4B、ClO4、CF3SO3、FSO3、CH3SO3、C4F9SO3から選択され、Arは縮合環または多環式アレーンである)のジ(シクロペンタジエニル鉄)アレーン塩化合物が挙げられる。
(式中、Rl〜R2=F;R3=イソプロピル;R4=H;X=PF6である)の化合物;例えば、米国特許第6,054,501号明細書に開示されている、次式:
のチオキサントンをベースにするスルホニウム塩;米国特許第5,159,088号明細書に開示されている、R3−xS+R3xA−タイプの(アシルオキシフェニル)スルホニウム塩(式中、A−は、AsF6−などの非求核性アニオンであり、R3は下記に示すフェニル基:
であってもよい);9,10−ジチオフェノキシアントラセンアルキルジアリールスルホニウム塩、例えば、米国特許第4,760,013号明細書に開示されている、エチルフェニル(9−チオフェノキシ−アントラセニル−10)スルホニウムヘキサフルオロアンチモネート等;など;米国特許第4,245,029号明細書に開示されている、トリフェニルスルホニウムヘキサフルオロホスフェート塩;J Poly Sci,Part A(2003),41(16),2570−2587に開示されている、S,S−ジメチル−S−(3,5−ジメチル−2−ヒドロキシフェニル)スルホニウム塩;J Photochem & Photobiology,A:Chemistry(2003),159(2),161−171に開示されているアントラセン結合スルホニウム塩;J Photopolymer Science & Tech(2000),13(1),117−118、およびJ Poly Science,Part A(2008),46(11),3820−29に開示されている、トリアリールスルホニウム塩;J Macromol Sci,Part A(2006),43(9),1339−1353に開示されている、S−アリール−S,S−シクロアルキルスルホニウム塩;UV & EB Tech Expo & Conf,May 2−5,2004,55−69およびACS Symp Ser(2003),847,219−230に開示されている、ジアルキルフェナシルスルホニウム塩;ACS 224th Natnl Meeting,August 18−22,2002,POLY−726に開示されている、ジアルキル(4−ヒドロキシフェニル)スルホニウム塩、およびそれらの異性体のジアルキル(2−ヒドロキシフェニル)スルホニウム塩;ドデシル(4−ヒドロキシ−3,5−ジメチルフェニル)メチルスルホニウムヘキサフルオロホスフェートおよびドデシル以外の類似のアルキル類似体。ACS Polymer Preprints(2002),43(2),918−919に開示されている、テトラヒドロ−l−(4−ヒドロキシ−3,5−ジメチルフェニル)チオフェニウムヘキサフルオロホスフェートおよびテトラヒドロ−l−(2−ヒドロキシ−3,5−ジメチルフェニル)チオフェニウムヘキサフルオロホスフェート;J Polymr Sci,Part A(2000),38(9),1433−1442に開示されている、一般構造式、Ar’S+CH3(C12H25)SbF6−(式中、Ar’はフェナシル(I)、2−インダノニル(II)、4−メトキシフェナシル(III)、2−ナフトイルメチル(IV)、1−アンスロイルメチル(V)、または1−ピレノイルメチル(VI)である)を有する光開始剤;J Polymr Sci,Part A(1996),34(16),3231−3253に開示されている、BF4−、AsF6−、PF6−、およびSbF6−などの金属ハロゲン化物錯アニオンを有する、トリアリールスルホニウム塩Ar3S+MXn−;Macromolecules(1981),14(5),1141−1147に開示されている、ジアルキルフェナシルスルホニウムおよびジアルキル(4−ヒドロキシフェニル)スルホニウム塩;J.Polymr.Sci,Polymr Chem Edition(1979),17(4),977−99に開示されているトリアリールスルホニウム塩R2R1S+MFn−(R,Rl=Phまたは置換フェニル;M=B、As、P;n=4または6)および、次式(I):
のスルホニウム塩;例えば、PF6−アニオンを有する芳香族スルホニウム塩、例えば、特開2000−239648に開示されている、UVI 6970;および、これらの任意の組み合わせが挙げられる。
1)少なくとも1種類のカチオン硬化性化合物を30〜80重量%、より好ましくは35〜80重量%、より好ましくは35〜75重量%、より好ましくは35〜70重量%含む放射線硬化性液状樹脂層を基材上にコーティングする工程;
2)放射線硬化性液状樹脂層を既硬化層と接触させる工程;
3)放射線硬化性液状樹脂層を化学線源によって提供される化学線に選択的に露光させ、それによって既硬化層に接着する硬化層を形成する工程;
4)硬化層と基材を分離する工程;および
5)三次元物体を構築するのに十分な回数、工程1〜4を繰り返す工程;
を含む三次元物体の形成方法であり、
放射線硬化性液状樹脂を1.0秒の露光時間、50mW/cm2の光強度で硬化させる時、放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)を実時間動的機械分析装置で測定する場合、放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)が、露光の開始から2.0秒で、約7.5×105Paより大きい、好ましくは8.5×105Paより大きい、より好ましくは9.5×105Paより大きい(G’)値に達したことが測定される。
[0114][実時間動的機械分析(RT−DMA)]
[0115]貯蔵剪断弾性率(G’)を含む実時間動的機械分析(RT−DMA)は、8mmのプレートを有し、間隙を0.1mmにしたStressTech Rheometer(Reologicia Instruments AB、スウェーデン)を使用し、光路に配置される365nmの干渉フィルタ(EXFOから入手可能)と光源からレオメータに光を伝送するための液体充填光導波路を装備した水銀ランプ光源(EXFOから入手可能なオムニキュアシリーズ(OMNICURE Series)2000)を備えるように変更して、硬化される組成物について周囲実験室条件(20〜23℃および25〜35%RH)で行う。365nmの干渉フィルタは、図1に示すスペクトル出力を生成する。次のパラメータで試料を評価する:平衡時間10秒;周波数10Hz;XRL140B検出器を備えたIL 1400放射計(インターナショナルライト(International Light)、マサチューセッツ州ニューベリーポート)による光強度50mW/cm2;露光(データ収集の開始から2.0秒後に開始)1.0秒間;曲線のFFT平滑化;G’、付属のデータ解析ソフトウェアを使用してデータ収集の開始から2.5秒後、2.7秒後、3秒後、4秒後および6秒後に測定。
[0118]図3に示す試験装置を使用して、分離時間を測定する。試験装置は、4つのローラー(19、19’、19”および19’”)の往復動キャリッジ(18)と365nmのLEDライト(32)とを備える。LEDライトは、日亜化学工業(株)製(Nichia Co.)のNCSU033A型であり、樹脂表面に投影される焦点スポット径を1mmとする。厚み100ミクロンのTPX製の可撓性放射線透過性箔基材(6)を装置上に位置決めし、教示通り引張する。エレベータ(14)はxy方向で静止し、z方向で移動可能である。システムは、放射線硬化性液状樹脂層(10)を塗布するための主動塗布ローラー(19’”)と従動塗布ローラー(19)とを備える。塗布ローラーは、基材(6)上に実質的に均一な放射線硬化性液状樹脂層(10)を塗布することができる溝付ローラーローラー(メイヤーバー)である。システムは、また、主動ガイドローラー(19”)と従動ガイドローラー(19’)も備える。ガイドローラーは、基材(6)を適切な位置に移動させたり、適切な位置から移動させることにより、基材から新たに硬化した層(10’)を分離させる。
[0122]本発明に従い、様々な放射線硬化性液状樹脂を試験した。放射線硬化性液状樹脂の成分に関する情報を表1に示す。組成物自体については、表2、表3、および表4に示す。各成分の量は、全組成物の重量%として記載する。実施例はExで示し、比較例は(Comp)で示すが、比較例を本発明の実施例と解釈すべきではない。
[0125]実施例1〜18はそれぞれ、測定した最速の分離遅延時間までに9.0×105Paより大きいG’値を達成することができる。G’値は表示された間隔でしか記録されなかったため、データに何らかの補間を行うには、最速の分離遅延時間でG’を測定する必要がある。比較例1は、20mm/sの速度で構築することができない樹脂を示すために記載されている。構築速度20mm/sは、本分離時間試験装置では、最小分離遅延時間3秒に等しい。比較例1は、2.75秒までに9.0×105Paより大きいG’値を達成することができず、20mm/sの構築速度では不合格となる。比較例1は、20mm/sより遅い構築速度では試験しなかった。比較例2は、10mm/sの構築速度を達成することができなかった。硬化層は、基材から十分に分離せず、前の層に固着した。比較例は、点灯2.0秒後までに7.5×105PaのG’値を達成することができず、全てこの値を達成することができる本発明の実施例と対照的である。
Claims (23)
- 1)少なくとも1種類のカチオン硬化性化合物を30〜80重量%含む放射線硬化性液状樹脂層を基材上にコーティングする工程;
2)前記放射線硬化性液状樹脂層を既硬化層と接触させる工程;
3)前記放射線硬化性液状樹脂層を化学線源によって提供される化学線に選択的に露光させ、それによって前記既硬化層に接着する硬化層を形成する工程;
4)分離遅延時間を設け、前記分離遅延時間の終了後に前記硬化層と前記基材を分離する工程;および
5)三次元物体を構築するのに十分な回数、工程1〜4を繰り返す工程;
を含む三次元物体の形成方法であって、
前記分離遅延時間は、前記放射線硬化性液状樹脂を1.0秒の露光時間、50mW/cm2の光強度で硬化させる時、前記放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)を実時間動的機械分析装置で測定する場合、前記放射線硬化性液状樹脂層の化学線への最初の露光から、前記放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)が、前記露光の開始から測定した時、9.0×105Paより大きい(G’)値に達したことが測定される時点までの時間であり、
分離遅延時間が2.75秒を超えない、方法。 - 前記放射線硬化性液状樹脂の貯蔵剪断弾性率が、周囲温度20〜23℃および相対湿度パーセント25〜35%で測定される、請求項1に記載の方法。
- 前記実時間動的機械分析装置が8mmのプレートを有し、試料間隙0.10mmとなるように設定される、請求項1または2に記載の方法。
- 前記放射線硬化性液状樹脂の貯蔵剪断弾性率が、周波数10Hzおよび平衡時間10秒で測定される、請求項1〜3のいずれか1項に記載の方法。
- 前記硬化層が前記基材に接着せず、前記既硬化層に接着する、請求項1〜4のいずれか1項に記載の方法。
- 実時間動的機械分析装置で測定する場合、前記放射線硬化性液状樹脂が、露光開始の2.0秒後に7.5×105より大きい貯蔵剪断弾性率を達成することができる、請求項1〜5のいずれか1項に記載の方法。
- 前記50mW/cm2の光強度が、365nmのピークを有するスペクトル出力を有する、請求項1〜6のいずれか1項に記載の方法。
- 前記50mW/cm2の光強度と前記化学線源が、同じスペクトル出力を有する、請求項1〜7のいずれか1項に記載の方法。
- 前記化学線源が1つ以上のLEDである、請求項1〜8のいずれか1項に記載の方法。
- 前記1つ以上のLEDが、365nmにピークを有する光を発する、請求項9に記載の方法。
- 前記放射線硬化性液状樹脂が、さらに、少なくとも1種類のカチオン光開始剤を0.5〜10重量%;少なくとも1種類のフリーラジカル重合性成分を15〜40重量%;および、少なくとも1種類のフリーラジカル光開始剤を1〜10重量%含む、請求項1〜10のいずれか1項に記載の方法。
- 前記少なくとも1種類のカチオン光開始剤が、トリアリールスルホニウム塩を含む、請求項11に記載の方法。
- 前記トリアリールスルホニウム塩が、トリアリールスルホニウムテトラキス(ペンタフルオロフェニル)ボレートである、請求項12に記載の方法。
- 前記トリアリールスルホニウムテトラキス(ペンタフルオロフェニル)ボレートが、トリス(4−(4−アセチルフェニル)チオフェニル)スルホニウムテトラキス(ペンタフルオロフェニル)ボレートである、請求項13に記載の方法。
- 前記放射線硬化性液状樹脂が、2種類以上のフリーラジカル光開始剤を含む、請求項1〜14のいずれか1項に記載の方法。
- フリーラジカル光開始剤が、ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイドであり、前記放射線硬化性液状樹脂の0.5重量%未満の量で存在する、請求項15に記載の方法。
- 前記基材が実質的に非弾性である、請求項1〜16のいずれか1項に記載の方法。
- 前記基材が厚み250ミクロン未満である、請求項1〜17のいずれか1項に記載の方法。
- 前記カチオン硬化性化合物の量が、40重量%〜60重量%である、請求項1〜18のいずれか1項に記載の方法。
- 前記カチオン硬化性化合物がエポキシ化ポリブタジエンを含み、前記エポキシ化ポリブタジエンが前記放射線硬化性液状樹脂の総量に基づいて5重量%〜20重量%の量で存在する、請求項1〜19のいずれか1項に記載の方法。
- 前記放射線硬化性液状樹脂層が、厚み25ミクロン〜250ミクロンである、請求項1〜20のいずれか1項に記載の方法。
- 前記化学線が前記基材を透過し、前記放射線硬化性液状樹脂に到達しなければならない、請求項1〜21のいずれか1項に記載の方法。
- 1)少なくとも1種類のカチオン硬化性化合物を35〜70重量%含む放射線硬化性液状樹脂層を基材上にコーティングする工程;
2)前記放射線硬化性液状樹脂層を既硬化層と接触させる工程;
3)前記放射線硬化性液状樹脂層を化学線源によって提供される化学線に選択的に露光させ、それによって前記既硬化層に接着する硬化層を形成する工程;
4)前記硬化層と前記基材を分離する工程;および
5)三次元物体を構築するのに十分な回数、工程1〜4を繰り返す工程;
を含む三次元物体の形成方法であって、
前記放射線硬化性液状樹脂を1.0秒の露光時間、50mW/cm2の光強度で硬化させる時、前記放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)を実時間動的機械分析装置で測定する場合、前記放射線硬化性液状樹脂の貯蔵剪断弾性率(G’)が、前記露光の開始から2.0秒で9.5×105Paより大きい(G’)値に達したことが測定される、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28762009P | 2009-12-17 | 2009-12-17 | |
US61/287,620 | 2009-12-17 | ||
PCT/US2010/060722 WO2011084578A1 (en) | 2009-12-17 | 2010-12-16 | Substrate-based additive fabrication process |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013514213A JP2013514213A (ja) | 2013-04-25 |
JP5849350B2 true JP5849350B2 (ja) | 2016-01-27 |
Family
ID=43532791
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012544820A Active JP5849350B2 (ja) | 2009-12-17 | 2010-12-16 | 基材を用いた積層造形法 |
JP2012544810A Active JP5699365B2 (ja) | 2009-12-17 | 2010-12-16 | カチオン系光重合開始剤トリアリールスルホニウムボレートを含む積層造形用液状放射線硬化樹脂 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012544810A Active JP5699365B2 (ja) | 2009-12-17 | 2010-12-16 | カチオン系光重合開始剤トリアリールスルホニウムボレートを含む積層造形用液状放射線硬化樹脂 |
Country Status (7)
Country | Link |
---|---|
US (3) | US20120251841A1 (ja) |
EP (3) | EP2512779B1 (ja) |
JP (2) | JP5849350B2 (ja) |
KR (4) | KR101833078B1 (ja) |
CN (4) | CN106125509B (ja) |
BR (2) | BR112012014890B1 (ja) |
WO (3) | WO2011075555A1 (ja) |
Families Citing this family (110)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101833078B1 (ko) * | 2009-12-17 | 2018-02-27 | 디에스엠 아이피 어셋츠 비.브이. | 적층식 제작을 위한 발광 다이오드 경화성 액체 수지 조성물 |
US8865392B2 (en) | 2010-07-14 | 2014-10-21 | Nippon Kayaku Kabushiki Kaisha | Photosensitive resin composition and cured product thereof |
JP5749631B2 (ja) * | 2010-12-07 | 2015-07-15 | 東京応化工業株式会社 | 厚膜用化学増幅型ポジ型ホトレジスト組成物及び厚膜レジストパターンの製造方法 |
KR101355855B1 (ko) * | 2011-12-19 | 2014-01-29 | 제일모직주식회사 | 이방성 도전 필름 |
JP2013213186A (ja) * | 2011-12-21 | 2013-10-17 | Toyo Ink Sc Holdings Co Ltd | 光重合性組成物及び光学フィルム積層体 |
WO2013137227A1 (ja) * | 2012-03-13 | 2013-09-19 | 株式会社ダイセル | 感光性樹脂組成物及びその硬化物、並びに光学部品 |
US10121254B2 (en) * | 2013-08-29 | 2018-11-06 | Disney Enterprises, Inc. | Methods and systems of detecting object boundaries |
CN104441641B (zh) * | 2013-09-14 | 2017-09-29 | 航天信息股份有限公司 | 基于光固化快速成型的3d打印的实现方法和装置 |
GB201316815D0 (en) * | 2013-09-23 | 2013-11-06 | Renishaw Plc | Additive manufacturing apparatus and method |
US9096722B2 (en) * | 2013-10-18 | 2015-08-04 | Hrl Laboratories, Llc | Method for curing structures using a dual photoinitiator system and a structure made using the same |
CN103587118B (zh) * | 2013-10-30 | 2015-11-25 | 西安交通大学 | 一种基于螺旋扫描、柔性界面的光固化3d打印机 |
EP3971235A1 (en) * | 2013-11-05 | 2022-03-23 | Covestro (Netherlands) B.V. | Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication |
WO2015073841A1 (en) * | 2013-11-15 | 2015-05-21 | Sabic Global Technologies B.V. | Methods for measuring properties in crosslinked polycarbonate |
JP6556424B2 (ja) * | 2014-01-31 | 2019-08-07 | アイカ工業株式会社 | 光カチオン硬化型樹脂組成物 |
CN104093547B (zh) * | 2014-05-26 | 2016-11-16 | 中国科学院自动化研究所 | 3d打印系统 |
US20180016464A1 (en) * | 2014-06-08 | 2018-01-18 | Massivit 3D Printing Technologies Ltd | Method and appratus for manufacture of 3d objects |
CN114734628A (zh) | 2014-06-23 | 2022-07-12 | 卡本有限公司 | 由具有多重硬化机制的材料制备三维物体的方法 |
WO2016077614A1 (en) * | 2014-11-12 | 2016-05-19 | Purdue Research Foundation | Poly(alkylene carbonate)-based amphiphilic block copolymers and methods of use thereof |
CN107614264B (zh) | 2014-12-05 | 2020-02-04 | 佛罗里达大学研究基金会有限公司 | 使用相变材料作为支撑体的3d打印 |
JP6940410B2 (ja) * | 2015-03-19 | 2021-09-29 | ダウ グローバル テクノロジーズ エルエルシー | 光規制ラジカル重合を使用して付加製造する方法 |
US20180046076A1 (en) * | 2015-03-23 | 2018-02-15 | Dow Global Technologies Llc | Photocurable Compositions for Three-Dimensional Printing |
JP6656574B2 (ja) * | 2015-03-31 | 2020-03-04 | 日本電気硝子株式会社 | 立体造形用樹脂組成物 |
US11919229B2 (en) | 2015-04-16 | 2024-03-05 | Lawrence Livermore National Security, Llc | Large area projection micro stereolithography |
US10302163B2 (en) | 2015-05-13 | 2019-05-28 | Honeywell International Inc. | Carbon-carbon composite component with antioxidant coating |
US9944526B2 (en) | 2015-05-13 | 2018-04-17 | Honeywell International Inc. | Carbon fiber preforms |
US10131113B2 (en) | 2015-05-13 | 2018-11-20 | Honeywell International Inc. | Multilayered carbon-carbon composite |
GB201508178D0 (en) * | 2015-05-13 | 2015-06-24 | Photocentric Ltd | Method for making an object |
JP6493875B2 (ja) * | 2015-06-08 | 2019-04-03 | 富士フイルム株式会社 | 3次元造形物の形成方法 |
US10604659B2 (en) | 2015-06-08 | 2020-03-31 | Dsm Ip Assets B.V. | Liquid, hybrid UV/VIS radiation curable resin compositions for additive fabrication |
WO2016200972A1 (en) * | 2015-06-08 | 2016-12-15 | Dsm Ip Assets B.V. | Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication |
DE102015110264A1 (de) * | 2015-06-25 | 2016-12-29 | Cl Schutzrechtsverwaltungs Gmbh | Vorrichtung zur generativen Herstellung wenigstens eines dreidimensionalen Objekts |
US10035305B2 (en) | 2015-06-30 | 2018-07-31 | Honeywell International Inc. | Method of making carbon fiber preforms |
JP6204420B2 (ja) | 2015-08-07 | 2017-09-27 | 株式会社ダイセル | 硬化性組成物、及びそれを用いた光学素子 |
WO2017033427A1 (ja) * | 2015-08-26 | 2017-03-02 | ナガセケムテックス株式会社 | パターニング材料、パターニング方法、およびパターニング装置 |
JP7069006B2 (ja) | 2015-09-04 | 2022-05-17 | カーボン,インコーポレイテッド | 積層造形用シアネートエステル二重硬化樹脂 |
EP3347399B1 (en) | 2015-09-09 | 2020-12-09 | Carbon, Inc. | Epoxy dual cure resins for additive manufacturing |
US10800094B2 (en) | 2015-09-14 | 2020-10-13 | Carbon, Inc. | Light-curable article of manufacture with portions of differing solubility |
US10022890B2 (en) | 2015-09-15 | 2018-07-17 | Honeywell International Inc. | In situ carbonization of a resin to form a carbon-carbon composite |
EP3567428B1 (en) | 2015-10-01 | 2021-06-23 | DSM IP Assets B.V. | Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication |
US10647873B2 (en) * | 2015-10-30 | 2020-05-12 | Carbon, Inc. | Dual cure article of manufacture with portions of differing solubility |
CN108472834B (zh) | 2015-11-17 | 2021-05-25 | 帝斯曼知识产权资产管理有限公司 | 用于加成法制造的经改进的不含锑的可辐射固化组合物及其在熔模铸造工艺中的应用 |
US10300631B2 (en) | 2015-11-30 | 2019-05-28 | Honeywell International Inc. | Carbon fiber preforms |
US20170176856A1 (en) | 2015-12-21 | 2017-06-22 | Az Electronic Materials (Luxembourg) S.A.R.L. | Negative-working photoresist compositions for laser ablation and use thereof |
US10343331B2 (en) | 2015-12-22 | 2019-07-09 | Carbon, Inc. | Wash liquids for use in additive manufacturing with dual cure resins |
US10501572B2 (en) | 2015-12-22 | 2019-12-10 | Carbon, Inc. | Cyclic ester dual cure resins for additive manufacturing |
WO2017112521A1 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Production of flexible products by additive manufacturing with dual cure resins |
JP6944935B2 (ja) | 2015-12-22 | 2021-10-06 | カーボン,インコーポレイテッド | 二重硬化樹脂を用いた積層造形による複数の中間体からの複合生産物の製作 |
WO2017112483A2 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Accelerants for additive manufacturing with dual cure resins |
US10350823B2 (en) | 2015-12-22 | 2019-07-16 | Carbon, Inc. | Dual precursor resin systems for additive manufacturing with dual cure resins |
US10538031B2 (en) | 2015-12-22 | 2020-01-21 | Carbon, Inc. | Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products |
JP6714492B2 (ja) * | 2015-12-24 | 2020-06-24 | 信越化学工業株式会社 | 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法 |
JP6714493B2 (ja) | 2015-12-24 | 2020-06-24 | 信越化学工業株式会社 | 有機膜形成用化合物、有機膜形成用組成物、有機膜形成方法、及びパターン形成方法 |
GB201604322D0 (en) * | 2016-03-14 | 2016-04-27 | Ucl Business Plc | Three-dimensional printing of impregnated plastics for chemical reactions |
EP3429833B1 (en) | 2016-03-14 | 2022-04-13 | Covestro (Netherlands) B.V. | Radiation curable compositions for additive fabrication with improved toughness and high temperature resistance |
CN108472871A (zh) * | 2016-04-05 | 2018-08-31 | 惠普发展公司,有限责任合伙企业 | 光敏材料套装 |
WO2017173646A1 (en) * | 2016-04-08 | 2017-10-12 | Dow Global Technologies Llc | Coating composition containing sorbic acid ester and photocatalyst |
WO2017184135A1 (en) * | 2016-04-20 | 2017-10-26 | Hewlett-Packard Development Company, L.P. | Three-dimensional (3d) printing with epoxy resin |
WO2017196348A1 (en) * | 2016-05-12 | 2017-11-16 | Hewlett-Packard Development Company, L.P. | Tracking cooling time for 3d printing trolley |
JP6623121B2 (ja) * | 2016-06-08 | 2019-12-18 | デクセリアルズ株式会社 | 光硬化性樹脂組成物、並びに画像表示装置、及びその製造方法 |
US10500786B2 (en) | 2016-06-22 | 2019-12-10 | Carbon, Inc. | Dual cure resins containing microwave absorbing materials and methods of using the same |
US9902860B1 (en) * | 2016-08-30 | 2018-02-27 | Nano And Advanced Materials Institute Limited | Photopolymer composition for 3D printing |
US11124644B2 (en) | 2016-09-01 | 2021-09-21 | University Of Florida Research Foundation, Inc. | Organic microgel system for 3D printing of silicone structures |
JP7051336B2 (ja) * | 2016-09-20 | 2022-04-11 | ナガセケムテックス株式会社 | 三次元光造形用のパターニング材料およびそれを用いた鋳造方法 |
CN109982829B (zh) * | 2016-10-28 | 2021-09-28 | 帝斯曼知识产权资产管理有限公司 | 热固性组合物以及由其形成三维物体 |
US20200190245A1 (en) * | 2016-11-14 | 2020-06-18 | Covestro Deutschland Ag | Composite materials based on dual-curing isocyanurate polymers |
JP6954554B2 (ja) * | 2016-11-30 | 2021-10-27 | 公立大学法人大阪 | 光硬化性樹脂組成物の硬化物の製造方法および光照射装置 |
JP6880809B2 (ja) * | 2016-12-09 | 2021-06-02 | 東亞合成株式会社 | 活性エネルギー線硬化型封止剤用組成物 |
WO2018160974A1 (en) | 2017-03-03 | 2018-09-07 | Insituform Technologies Llc | Curing device for curing a pipe liner |
CN110520232A (zh) | 2017-03-28 | 2019-11-29 | 福特全球技术公司 | 稳定的增材制造制品 |
US10239255B2 (en) | 2017-04-11 | 2019-03-26 | Molecule Corp | Fabrication of solid materials or films from a polymerizable liquid |
US10316213B1 (en) | 2017-05-01 | 2019-06-11 | Formlabs, Inc. | Dual-cure resins and related methods |
JP6894015B2 (ja) | 2017-06-21 | 2021-06-23 | カーボン,インコーポレイテッド | 積層造形の方法 |
US10495973B2 (en) * | 2017-06-30 | 2019-12-03 | Align Technology, Inc. | 3D printed composites from a single resin by patterned light exposures |
CN107236096B (zh) * | 2017-07-19 | 2020-05-26 | 中山大简科技有限公司 | 一种透明sla光敏树脂组合物 |
KR102181860B1 (ko) * | 2017-09-22 | 2020-11-23 | 주식회사 엘지화학 | 접착제 조성물, 이를 이용하여 형성된 접착제층을 포함하는 편광판 |
US11384250B2 (en) | 2017-11-07 | 2022-07-12 | 3D Systems, Inc. | Inks for 3D printing having low print through depth |
JP6615849B2 (ja) * | 2017-11-22 | 2019-12-04 | マクセルホールディングス株式会社 | モデル材用組成物 |
CN111433268B (zh) * | 2017-11-29 | 2022-07-05 | 康宁股份有限公司 | 高度负载的无机填充的水性树脂体系 |
JP7215654B2 (ja) | 2017-12-15 | 2023-01-31 | コベストロ (ネザーランズ) ビー.ブイ. | 粘性熱硬化性樹脂を高温噴射して、積層造形を介して固体物品を作製するための組成物及び方法 |
WO2019133349A1 (en) | 2017-12-29 | 2019-07-04 | Dsm Ip Assets, B.V. | Compositions and articles for additive fabrication and methods of using the same |
CN108407289B (zh) * | 2018-02-12 | 2020-02-14 | 永嘉姜君科技有限公司 | 一种3d打印眼镜片的制备方法 |
EP3758916A4 (en) * | 2018-03-02 | 2021-10-27 | Formlabs, Inc. | LATENT CURING RESINS AND RELATED PROCESSES |
MX2020010168A (es) * | 2018-03-28 | 2021-03-09 | Benjamin Lund | Polímeros de triol-acrilato, métodos de síntesis de los mismos y uso en tecnologías de fabricación por adición. |
WO2019195763A1 (en) * | 2018-04-06 | 2019-10-10 | Poly-Med, Inc. | Methods and compositions for photopolymerizable additive manufacturing |
CN112823313B (zh) * | 2018-04-17 | 2024-04-16 | 深圳摩方新材科技有限公司 | 制造三维物体的方法及系统 |
US11739177B2 (en) | 2018-04-20 | 2023-08-29 | Adaptive 3D Technologies | Sealed isocyanates |
EP3781375A4 (en) | 2018-04-20 | 2021-09-29 | Benjamin Lund | BLOCKED ISOCYANATES |
US11084221B2 (en) | 2018-04-26 | 2021-08-10 | General Electric Company | Method and apparatus for a re-coater blade alignment |
GB201808384D0 (en) * | 2018-05-22 | 2018-07-11 | Photocentric Ltd | Methods for making a metal, sand or ceramic object by additive manufacture and formulations for use in said methods |
JP7393367B2 (ja) * | 2018-06-26 | 2023-12-06 | アルケマ フランス | 多段ポリマーをベースとする硬化性組成物 |
US11911956B2 (en) | 2018-11-21 | 2024-02-27 | Adaptive 3D Technologies | Using occluding fluids to augment additive manufacturing processes |
JP7279919B2 (ja) * | 2018-12-25 | 2023-05-23 | 岡本化学工業株式会社 | 光学的立体造形用組成物、並びに立体造形物、及びその製造方法 |
GB201901811D0 (en) * | 2019-02-11 | 2019-03-27 | Photocentric Ltd | Method of making 3D printed objects using two distinct light sources |
CN110171136B (zh) * | 2019-06-11 | 2024-10-15 | 杭州德迪智能制造有限公司 | 一种高效线扫描光固化成像装置和方法 |
CN110342930A (zh) * | 2019-07-15 | 2019-10-18 | 威海市济合材料工程研究院 | 一种用于dlp快速成型的3d打印氧化锆陶瓷的光固化树脂 |
US11602896B2 (en) * | 2019-08-14 | 2023-03-14 | Mighty Buildings, Inc. | 3D printing of a composite material via sequential dual-curing polymerization |
US11866526B2 (en) | 2019-08-30 | 2024-01-09 | Stratasys, Inc. | Liquid, hybrid UV/vis radiation curable resin compositions for additive fabrication |
CN114502662A (zh) * | 2019-10-03 | 2022-05-13 | 3M创新有限公司 | 采用自由基介导固化的有机硅弹性体 |
CN113045706B (zh) * | 2019-12-27 | 2023-09-08 | 台科三维科技股份有限公司 | 低粘着度的光固化树脂组合物及高速三维打印方法 |
US11577460B2 (en) * | 2020-01-17 | 2023-02-14 | Hamilton Sundstrand Corporation | Additive manufacturing spatter shielding |
JP7442659B2 (ja) | 2020-02-04 | 2024-03-04 | キャボット コーポレイション | 液状積層造形用組成物 |
CN111303577A (zh) * | 2020-02-28 | 2020-06-19 | 山东非金属材料研究所 | 一种增材制造用可见光敏液体树脂、其制备方法及使用方法 |
KR102541648B1 (ko) * | 2020-06-03 | 2023-06-08 | 삼성에스디아이 주식회사 | 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기층을 포함하는 유기발광소자 표시장치 |
KR102341722B1 (ko) * | 2020-10-21 | 2021-12-20 | 창원대학교 산학협력단 | 3d 프린팅 시스템 및 이를 이용한 3d 구조물의 제조방법 |
IL302322A (en) * | 2020-10-21 | 2023-06-01 | Stratasys Ltd | Additive manufacturing of objects containing transparent material |
EP4330017A1 (en) * | 2021-04-26 | 2024-03-06 | 3D Systems Incorporated | Systems and methods for layer leveling in large-area microstereolithography |
US20230014456A1 (en) * | 2021-07-12 | 2023-01-19 | Raytheon Company | Ultraviolet curable epoxy dielectric ink |
CN113715337B (zh) * | 2021-09-26 | 2023-10-27 | 上海联泰科技股份有限公司 | 控制装置、方法、3d打印方法及打印设备 |
FR3131585A1 (fr) * | 2021-12-30 | 2023-07-07 | Arkema France | Époxydes cycloaliphatiques polymériques |
CN114479735A (zh) * | 2022-02-14 | 2022-05-13 | 张河远 | 一种阳离子uv固化胶黏剂及其制备方法和应用 |
Family Cites Families (85)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3708296A (en) | 1968-08-20 | 1973-01-02 | American Can Co | Photopolymerization of epoxy monomers |
AU497960B2 (en) | 1974-04-11 | 1979-01-25 | Minnesota Mining And Manufacturing Company | Photopolymerizable compositions |
US4245029A (en) | 1979-08-20 | 1981-01-13 | General Electric Company | Photocurable compositions using triarylsulfonium salts |
US4339567A (en) | 1980-03-07 | 1982-07-13 | Ciba-Geigy Corporation | Photopolymerization by means of sulphoxonium salts |
US4383025A (en) | 1980-07-10 | 1983-05-10 | Ciba-Geigy Corporation | Photopolymerization by means of sulfoxonium salts |
US4398014A (en) | 1980-11-04 | 1983-08-09 | Ciba-Geigy Corporation | Sulfoxonium salts and their use as polymerization catalysts |
JPS58143042A (ja) | 1982-02-19 | 1983-08-25 | 松下電器産業株式会社 | 断熱構造体 |
DE3369398D1 (en) | 1982-05-19 | 1987-02-26 | Ciba Geigy Ag | Curable compositions containing metallocen complexes, activated primers obtained therefrom and their use |
DE3366408D1 (en) | 1982-05-19 | 1986-10-30 | Ciba Geigy Ag | Photopolymerisation with organometal salts |
DE3565013D1 (en) | 1984-02-10 | 1988-10-20 | Ciba Geigy Ag | Process for the preparation of a protection layer or a relief pattern |
US4920156A (en) | 1984-03-23 | 1990-04-24 | Union Carbide Chemicals And Plastics Company Inc. | Blends of cyclic vinyl ether containing compounds and urethane acrylates |
GB8414525D0 (en) | 1984-06-07 | 1984-07-11 | Ciba Geigy Ag | Sulphoxonium salts |
US4575330A (en) | 1984-08-08 | 1986-03-11 | Uvp, Inc. | Apparatus for production of three-dimensional objects by stereolithography |
JPS62156936A (ja) | 1985-12-28 | 1987-07-11 | 日本特許管理株式会社 | チヤツク付袋の製法 |
US4760013A (en) | 1987-02-17 | 1988-07-26 | International Business Machines Corporation | Sulfonium salt photoinitiators |
US5171490A (en) | 1988-11-29 | 1992-12-15 | Fudim Efrem V | Method and apparatus for production of three-dimensional objects by irradiation of photopolymers |
DE3924298A1 (de) | 1989-07-22 | 1991-02-07 | Basf Ag | Neue sulfoniumsalze und deren verwendung |
US5002856A (en) | 1989-08-02 | 1991-03-26 | E. I. Du Pont De Nemours And Company | Thermally stable carbazole diazonium salts as sources of photo-initiated strong acid |
FR2688783A1 (fr) * | 1992-03-23 | 1993-09-24 | Rhone Poulenc Chimie | Nouveaux borates d'onium ou de complexe organometallique amorceurs cationiques de polymerisation. |
US5705116A (en) | 1994-06-27 | 1998-01-06 | Sitzmann; Eugene Valentine | Increasing the useful range of cationic photoinitiators in stereolithography |
US5494618A (en) | 1994-06-27 | 1996-02-27 | Alliedsignal Inc. | Increasing the useful range of cationic photoinitiators in stereolithography |
US5639413A (en) | 1995-03-30 | 1997-06-17 | Crivello; James Vincent | Methods and compositions related to stereolithography |
US5665792A (en) | 1995-06-07 | 1997-09-09 | E. I. Du Pont De Nemours And Company | Stabilizers for use with photoacid precursor formulations |
WO1997047660A1 (fr) | 1996-06-12 | 1997-12-18 | Nippon Kayaku Kabushiki Kaisha | Initiateur de photopolymerisation et composition durcissable par rayonnement actinique comprenant cet initiateur |
JPH1087963A (ja) | 1996-09-20 | 1998-04-07 | Japan Synthetic Rubber Co Ltd | 樹脂組成物および繊維質材料成形型 |
FR2757530A1 (fr) | 1996-12-24 | 1998-06-26 | Rhodia Chimie Sa | Utilisation pour la stereophotolithographie - d'une composition liquide photoreticulable par voie cationique comprenant un photoamorceur du type sels d'onium ou de complexes organometalliques |
EP0889360B1 (de) * | 1997-06-30 | 2002-01-30 | Siemens Aktiengesellschaft | Reaktionsharzmischungen und deren Verwendung |
JP4204113B2 (ja) | 1997-12-04 | 2009-01-07 | 株式会社Adeka | 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法 |
US5973020A (en) * | 1998-01-06 | 1999-10-26 | Rhodia Inc. | Photoinitiator composition including hindered amine stabilizer |
WO2000021735A1 (en) | 1998-10-12 | 2000-04-20 | Dicon A/S | Rapid prototyping apparatus and method of rapid prototyping |
JP2000239648A (ja) | 1999-02-19 | 2000-09-05 | Jsr Corp | 光カチオン重合用光増感剤および光カチオン重合方法 |
JP2001205708A (ja) * | 2000-01-27 | 2001-07-31 | Teijin Seiki Co Ltd | 光学的立体造形方法および装置 |
US6547552B1 (en) | 2000-02-08 | 2003-04-15 | Efrem V. Fudim | Fabrication of three-dimensional objects by irradiation of radiation-curable materials |
US6593388B2 (en) | 2000-04-04 | 2003-07-15 | Renssealer Polytechnic Institute | Oligomeric and polymeric photosensitizers comprising a polynuclear aromatic group |
DE20106887U1 (de) | 2001-04-20 | 2001-09-06 | Envision Technologies GmbH, 45768 Marl | Vorrichtung zum Herstellen eines dreidimensionalen Objekts |
DE10119817A1 (de) | 2001-04-23 | 2002-10-24 | Envision Technologies Gmbh | Vorrichtung und Verfahren für die zerstörungsfreie Trennung ausgehärteter Materialschichten von einer planen Bauebene |
US6865949B2 (en) | 2003-01-31 | 2005-03-15 | Hewlett-Packard Development Company, L.P. | Transducer-based sensor system |
US6927018B2 (en) | 2001-10-29 | 2005-08-09 | Hewlett-Packard Development Company, L.P. | Three dimensional printing using photo-activated building materials |
US7270528B2 (en) | 2002-05-07 | 2007-09-18 | 3D Systems, Inc. | Flash curing in selective deposition modeling |
WO2004029037A1 (ja) | 2002-09-25 | 2004-04-08 | Asahi Denka Co.Ltd. | 新規な芳香族スルホニウム塩化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光学的立体造形用樹脂組成物並びに光学的立体造形法 |
US20040077745A1 (en) * | 2002-10-18 | 2004-04-22 | Jigeng Xu | Curable compositions and rapid prototyping process using the same |
US7211368B2 (en) | 2003-01-07 | 2007-05-01 | 3 Birds, Inc. | Stereolithography resins and methods |
EP1477511A1 (en) * | 2003-05-15 | 2004-11-17 | DSM IP Assets B.V. | Radiation curable thiol-ene composition |
WO2005007759A2 (en) * | 2003-07-23 | 2005-01-27 | Dsm Ip Assets B.V. | Viscosity reducible radiation curable resin composition |
US20050040562A1 (en) | 2003-08-19 | 2005-02-24 | 3D Systems Inc. | Nanoparticle-filled stereolithographic resins |
US20050101684A1 (en) | 2003-11-06 | 2005-05-12 | Xiaorong You | Curable compositions and rapid prototyping process using the same |
JP2007514805A (ja) * | 2003-11-06 | 2007-06-07 | ディーエスエム アイピー アセッツ ビー.ブイ. | 硬化性組成物およびそれを用いるラピッドプロトタイピング法 |
JP4776616B2 (ja) * | 2004-03-22 | 2011-09-21 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | 光硬化性組成物 |
EP1591470A1 (en) * | 2004-04-26 | 2005-11-02 | DSM IP Assets B.V. | Method for photocuring of resin compositions |
EP1744871B1 (de) | 2004-05-10 | 2008-05-07 | Envisiontec GmbH | Verfahren zur herstellung eines dreidimensionalen objekts mit auflösungsverbesserung mittels pixel-shift |
US7592376B2 (en) | 2004-08-23 | 2009-09-22 | Rensselaer Polytechnic Institute | Photopolymerizable epoxide and oxetane compositions |
JP4692874B2 (ja) | 2004-11-26 | 2011-06-01 | 川崎化成工業株式会社 | 1,2,3,4−テトラヒドロアントラセン−9,10−ジエーテル及びその製造法 |
US20060172230A1 (en) | 2005-02-02 | 2006-08-03 | Dsm Ip Assets B.V. | Method and composition for reducing waste in photo-imaging applications |
US7358283B2 (en) | 2005-04-01 | 2008-04-15 | 3D Systems, Inc. | Radiation curable compositions useful in image projection systems |
US7758799B2 (en) | 2005-04-01 | 2010-07-20 | 3D Systems, Inc. | Edge smoothness with low resolution projected images for use in solid imaging |
US7807230B2 (en) | 2005-06-16 | 2010-10-05 | Rensselaer Polytechnic Institute | Curcumin and curcuminoid compounds, and use thereof as photosensitizers of onium salts |
DE602006015319D1 (de) | 2005-07-01 | 2010-08-19 | Basf Se | Sulfoniumsalzinitiatoren |
TWI431416B (zh) * | 2005-10-27 | 2014-03-21 | 3D Systems Inc | 不含銻之光可固化樹脂組合物及三維物件 |
JP2007126612A (ja) | 2005-11-07 | 2007-05-24 | Kawasaki Kasei Chem Ltd | 光増感剤、光感応性酸発生剤及び光硬化性組成物 |
CN101466804B (zh) * | 2006-04-13 | 2012-02-22 | 西巴控股有限公司 | 硫鎓盐引发剂 |
JP5167496B2 (ja) * | 2006-05-01 | 2013-03-21 | ディーエスエム アイピー アセッツ ビー.ブイ. | 放射線硬化性樹脂組成物およびそれを使用した急速三次元的画像形成方法 |
US7467939B2 (en) | 2006-05-03 | 2008-12-23 | 3D Systems, Inc. | Material delivery tension and tracking system for use in solid imaging |
KR101435410B1 (ko) * | 2006-10-24 | 2014-08-29 | 시바 홀딩 인크 | 열 안정성 양이온 광경화성 조성물 |
CN101190931A (zh) | 2006-11-30 | 2008-06-04 | 北京化工大学 | 新型阳离子光引发剂双茂铁芳烃盐的制备及其应用 |
JP5073284B2 (ja) * | 2006-12-22 | 2012-11-14 | ローランドディー.ジー.株式会社 | 三次元造形装置 |
US20080292993A1 (en) | 2006-12-22 | 2008-11-27 | Canon Kabushiki Kaisha | Photo-cationic polymerizable epoxy resin composition, liquid discharge head, and manufacturing method thereof |
US7731887B2 (en) | 2007-01-17 | 2010-06-08 | 3D Systems, Inc. | Method for removing excess uncured build material in solid imaging |
US8221671B2 (en) | 2007-01-17 | 2012-07-17 | 3D Systems, Inc. | Imager and method for consistent repeatable alignment in a solid imaging apparatus |
US7614866B2 (en) | 2007-01-17 | 2009-11-10 | 3D Systems, Inc. | Solid imaging apparatus and method |
US7706910B2 (en) | 2007-01-17 | 2010-04-27 | 3D Systems, Inc. | Imager assembly and method for solid imaging |
US20100140849A1 (en) | 2007-03-22 | 2010-06-10 | Stratasys, Inc. | Extrusion-based layered deposition systems using selective radiation exposure |
US20090004579A1 (en) * | 2007-06-27 | 2009-01-01 | Dsm Ip Assets B.V. | Clear and colorless three-dimensional articles made via stereolithography and method of making said articles |
WO2009004710A1 (ja) | 2007-07-02 | 2009-01-08 | Ohara Inc. | ガラス組成物 |
CN101689799B (zh) | 2007-07-03 | 2013-04-03 | 三菱电机株式会社 | 功率元件的驱动电路 |
JP5304977B2 (ja) | 2007-10-04 | 2013-10-02 | セイコーエプソン株式会社 | 光硬化組成物を用いた硬化物の形成方法およびその硬化物 |
EP2197840B1 (en) * | 2007-10-10 | 2013-11-06 | Basf Se | Sulphonium salt initiators |
US20100297541A1 (en) | 2007-10-10 | 2010-11-25 | Basf Se | Sulphonium salt initiators |
KR101571912B1 (ko) | 2007-10-10 | 2015-11-25 | 바스프 에스이 | 술포늄 염 개시제 |
US8383862B2 (en) * | 2007-11-01 | 2013-02-26 | Adeka Corporation | Salt compound, cationic polymerization initiator and cationically polymerizable composition |
JP5435879B2 (ja) * | 2008-02-14 | 2014-03-05 | 株式会社ダイセル | ナノインプリント用硬化性樹脂組成物 |
US8876513B2 (en) | 2008-04-25 | 2014-11-04 | 3D Systems, Inc. | Selective deposition modeling using CW UV LED curing |
JP5247396B2 (ja) * | 2008-07-02 | 2013-07-24 | 日本化薬株式会社 | Mems用感光性樹脂組成物及びその硬化物 |
US20100056661A1 (en) | 2008-09-03 | 2010-03-04 | Pingyong Xu | Radiation Curable Compositions Useful in Image Projection Systems |
JP5873720B2 (ja) | 2008-12-22 | 2016-03-01 | ネーデルランデ オルガニサチエ ヴォール トエゲパスト−ナツールウェテンスハペリエク オンデルゾエク ティーエヌオーNederlandse Organisatie Voor Toegepast−Natuurwetenschappelijk Onderzoek Tno | 3d有体物の積層製造の方法とそのシステム |
KR101833078B1 (ko) * | 2009-12-17 | 2018-02-27 | 디에스엠 아이피 어셋츠 비.브이. | 적층식 제작을 위한 발광 다이오드 경화성 액체 수지 조성물 |
-
2010
- 2010-12-16 KR KR1020127018753A patent/KR101833078B1/ko active IP Right Grant
- 2010-12-16 BR BR112012014890A patent/BR112012014890B1/pt active IP Right Grant
- 2010-12-16 US US13/515,664 patent/US20120251841A1/en not_active Abandoned
- 2010-12-16 WO PCT/US2010/060677 patent/WO2011075555A1/en active Application Filing
- 2010-12-16 CN CN201610479298.8A patent/CN106125509B/zh active Active
- 2010-12-16 BR BR112012014900A patent/BR112012014900B1/pt active IP Right Grant
- 2010-12-16 KR KR1020187035482A patent/KR101995185B1/ko active IP Right Grant
- 2010-12-16 JP JP2012544820A patent/JP5849350B2/ja active Active
- 2010-12-16 WO PCT/US2010/060668 patent/WO2011075553A1/en active Application Filing
- 2010-12-16 JP JP2012544810A patent/JP5699365B2/ja active Active
- 2010-12-16 EP EP10799194.5A patent/EP2512779B1/en active Active
- 2010-12-16 CN CN201080057939.1A patent/CN102666073B/zh active Active
- 2010-12-16 KR KR20127018605A patent/KR20120109558A/ko active Application Filing
- 2010-12-16 EP EP10799193.7A patent/EP2396299B1/en active Active
- 2010-12-16 EP EP10795586.6A patent/EP2513722B1/en active Active
- 2010-12-16 CN CN201080057944.2A patent/CN102934026B/zh active Active
- 2010-12-16 WO PCT/US2010/060722 patent/WO2011084578A1/en active Application Filing
- 2010-12-16 US US13/515,641 patent/US9034236B2/en active Active
- 2010-12-16 CN CN201080057942.3A patent/CN102858738B/zh active Active
- 2010-12-16 KR KR1020127018596A patent/KR101821426B1/ko active IP Right Grant
- 2010-12-16 US US13/515,629 patent/US20120259031A1/en not_active Abandoned
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5849350B2 (ja) | 基材を用いた積層造形法 | |
US20240076471A1 (en) | Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication | |
JP6414411B2 (ja) | 積層造形用の低粘度液状放射線硬化型歯科アライナー成形型用樹脂組成物 | |
EP2502728B1 (en) | Lightweight and high strength three-dimensional articles producible by additive fabrication processes | |
US11396603B2 (en) | Liquid, hybrid UV/vis radiation curable resin compositions for additive fabrication | |
WO2016200972A1 (en) | Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication | |
JP3820289B2 (ja) | 樹脂製成形用型製造用光硬化性樹脂組成物および樹脂製成形用型の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131025 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140919 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140930 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150623 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150918 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151112 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5849350 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |