JP5330184B2 - 電子部品装置 - Google Patents

電子部品装置 Download PDF

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Publication number
JP5330184B2
JP5330184B2 JP2009232372A JP2009232372A JP5330184B2 JP 5330184 B2 JP5330184 B2 JP 5330184B2 JP 2009232372 A JP2009232372 A JP 2009232372A JP 2009232372 A JP2009232372 A JP 2009232372A JP 5330184 B2 JP5330184 B2 JP 5330184B2
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Japan
Prior art keywords
interposer
wiring board
chip
electronic component
wiring
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JP2009232372A
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Japanese (ja)
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JP2011082293A5 (enExample
JP2011082293A (ja
Inventor
昌宏 春原
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2009232372A priority Critical patent/JP5330184B2/ja
Priority to US12/897,082 priority patent/US8379400B2/en
Publication of JP2011082293A publication Critical patent/JP2011082293A/ja
Publication of JP2011082293A5 publication Critical patent/JP2011082293A5/ja
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2009232372A 2009-10-06 2009-10-06 電子部品装置 Active JP5330184B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009232372A JP5330184B2 (ja) 2009-10-06 2009-10-06 電子部品装置
US12/897,082 US8379400B2 (en) 2009-10-06 2010-10-04 Interposer mounted wiring board and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009232372A JP5330184B2 (ja) 2009-10-06 2009-10-06 電子部品装置

Publications (3)

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JP2011082293A JP2011082293A (ja) 2011-04-21
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