JP5845105B2 - 電子部品の実装用基板と電子部品を実装した基板 - Google Patents
電子部品の実装用基板と電子部品を実装した基板 Download PDFInfo
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- JP5845105B2 JP5845105B2 JP2012033351A JP2012033351A JP5845105B2 JP 5845105 B2 JP5845105 B2 JP 5845105B2 JP 2012033351 A JP2012033351 A JP 2012033351A JP 2012033351 A JP2012033351 A JP 2012033351A JP 5845105 B2 JP5845105 B2 JP 5845105B2
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- substrate
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- electronic component
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
基板の1次面及び2次面の両面に電子部品を実装する電子部品の実装用基板であって、
先に電子部品を実装する前記基板の2次面のランドのサイズよりも、後で電子部品を実装する前記基板の1次面のランドのサイズを大きくしたことを特徴とする。
102 BGAチップ
103 BGAチップ
105 インターポーザ
106 ダイ
107 はんだボール
110,120 インターポーザのランド
111,121 基板のランド
Claims (5)
- 基板の1次面及び2次面の両面に電子部品を実装する電子部品の実装用基板であって、
先に電子部品を実装する前記基板の2次面のランドのサイズよりも、後で電子部品を実装する前記基板の1次面のランドのサイズを大きくしたことを特徴とする実装用基板。 - 前記基板の1次面及び2次面に実装するそれぞれの電子部品では、ともにインターポーザのランドのサイズとランドのピッチが同じであることを特徴とする請求項1に記載の実装用基板。
- 前記電子部品は、BGAチップであることを特徴とする請求項1又は2に記載の実装用基板。
- 基板の1次面及び2次面の両面に電子部品を実装した基板であって、
前記基板の2次面にリフローにより実装された電子部品インターポーザのランドのサイズと、前記基板の2次面のランドのサイズとが同じであり、前記基板の2次面のリフローに続いて前記基板の1次面にリフローにより実装された電子部品インターポーザのランドのサイズよりも、前記基板の1次面のランドのサイズが大きいことを特徴とする電子部品を実装した基板。 - 前記基板の1次面及び2次面に実装するそれぞれの電子部品は、ともにインターポーザのランドのサイズとランドのピッチが同じであることを特徴とする請求項4に記載の電子部品を実装した基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012033351A JP5845105B2 (ja) | 2012-02-17 | 2012-02-17 | 電子部品の実装用基板と電子部品を実装した基板 |
PCT/JP2013/052118 WO2013121882A1 (en) | 2012-02-17 | 2013-01-24 | Circuit board for mounting electronic components |
US14/364,171 US9414488B2 (en) | 2012-02-17 | 2013-01-24 | Circuit board for mounting electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012033351A JP5845105B2 (ja) | 2012-02-17 | 2012-02-17 | 電子部品の実装用基板と電子部品を実装した基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013171886A JP2013171886A (ja) | 2013-09-02 |
JP2013171886A5 JP2013171886A5 (ja) | 2015-04-02 |
JP5845105B2 true JP5845105B2 (ja) | 2016-01-20 |
Family
ID=48983997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012033351A Active JP5845105B2 (ja) | 2012-02-17 | 2012-02-17 | 電子部品の実装用基板と電子部品を実装した基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9414488B2 (ja) |
JP (1) | JP5845105B2 (ja) |
WO (1) | WO2013121882A1 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0312993A (ja) | 1989-06-12 | 1991-01-21 | Fujitsu Ltd | 電子回路パッケージにおける半田付け方法 |
JPH0927678A (ja) | 1995-07-11 | 1997-01-28 | Nippon Avionics Co Ltd | プリント配線板の部品実装方法 |
US20020061665A1 (en) * | 2000-07-03 | 2002-05-23 | Victor Batinovich | Method and apparatus for vertically stacking and interconnecting ball grid array (BGA) electronic circuit devices |
US7317165B2 (en) * | 2003-06-24 | 2008-01-08 | Ngk Spark Plug Co., Ltd. | Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate |
JP2007149828A (ja) | 2005-11-25 | 2007-06-14 | Fujifilm Corp | 電子部品実装用基板 |
KR100648040B1 (ko) * | 2005-11-25 | 2006-11-23 | 삼성전자주식회사 | 다수의 금속 랜드를 가지는 인터포저 기판, 및 이로부터제작되는 인터포저를 포함하는 적층 칩 패키지 |
US7476570B2 (en) * | 2006-05-02 | 2009-01-13 | Honeywell International Inc. | System and method of attaching an integrated circuit assembly to a printed wiring board |
JP2010010644A (ja) * | 2008-05-27 | 2010-01-14 | Toshiba Corp | 半導体装置の製造方法 |
JP5330184B2 (ja) | 2009-10-06 | 2013-10-30 | 新光電気工業株式会社 | 電子部品装置 |
JP2011204765A (ja) | 2010-03-24 | 2011-10-13 | Toshiba Corp | 半導体装置の製造方法及び半導体装置 |
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2012
- 2012-02-17 JP JP2012033351A patent/JP5845105B2/ja active Active
-
2013
- 2013-01-24 US US14/364,171 patent/US9414488B2/en active Active
- 2013-01-24 WO PCT/JP2013/052118 patent/WO2013121882A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2013171886A (ja) | 2013-09-02 |
US20140374152A1 (en) | 2014-12-25 |
US9414488B2 (en) | 2016-08-09 |
WO2013121882A1 (en) | 2013-08-22 |
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