JP5277755B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
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- JP5277755B2 JP5277755B2 JP2008172109A JP2008172109A JP5277755B2 JP 5277755 B2 JP5277755 B2 JP 5277755B2 JP 2008172109 A JP2008172109 A JP 2008172109A JP 2008172109 A JP2008172109 A JP 2008172109A JP 5277755 B2 JP5277755 B2 JP 5277755B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/341—Surface mounted components
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Description
図4は本発明の実施形態1による電子部品の構造を示す断面図、図5は図4のX部拡大図である。また、図6は基板の上面図、図7はソルダーレジスト(被覆部材)を除いた状態の基板の上面図、図8は基板の下面図である。ここに示す電子部品51は、基板52の上面に半導体素子53を実装し、基板52と導電性キャップ54からなるパッケージ(ファラデーケージ)内に半導体素子53を納めたものである。
図10は、実施形態1の変形例による電子部品の一部を示す断面図である。この変形例では、引き出し電極59を覆うソルダーレジスト67を除いてあり、フランジ70の押し当て部72を引き出し電極59の表面に当接させている。このような形態では、フランジ70と引き出し電極59の間に充填された導電性接合部材73の厚みは、凹部71の高さと等しくなり、実施形態1の場合よりもやや薄くなる。また、フランジ70と引き出し電極59の間に充填された導電性接合部材73は、その内側に位置する押し当て部72が壁となるので、導電性キャップ54の内側へ流れ込むことがない。
図11は、本発明の実施形態2による電子部品の構造を示す断面図である。また、図12は、図11のY部拡大図である。実施形態2の電子部品81と実施形態1の電子部品51との違いは、実施形態2の電子部品81では、導電性キャップ54のフランジ70に凹部71が設けられておらず、押し当て部72が平坦になっている点だけである。
図14は、実施形態2の変形例による電子部品の一部を示す断面図である。この変形例では、接地電極57の表面のうちソルダーレジスト67から露出している領域をAuメッキ等の不銹性の金属からなるメッキ層82によって覆い、接地電極57を保護している。
図15は、本発明の実施形態3による電子部品の構造を示す断面図である。この電子部品においては、フランジ70の先端(外周端縁)を斜め上方へ向けて傾斜もしくは湾曲させ(1点鎖線はフランジ70の下面を延長した線分である。)、フランジ70基部の押し当て部72をソルダーレジスト67の上面に当接させている。よって、フランジ70の下面と接地電極57の上のメッキ層82との間の空間の厚みをソルダーレジスト67の厚みよりも大きくすることができる。その結果、導電性接合部材73の厚みを大きくでき、導電性キャップ54の接合強度を高めることができる。
図16は、本発明の実施形態4による電子部品の構造を示す断面図である。この実施形態においては、フランジ70に凹部71と押し当て部72を形成された導電性キャップ54を用いている。そして、導電性キャップ54の押し当て部72を、接地電極57よりも内側において絶縁板52aの表面に当接させている。当接部分よりも外周側においては、接地電極57を覆うように塗布された導電性接合部材73によって凹部71の内面と基板52とを接合させている。
図17は、実施形態4の変形例による電子部品の一部を示す断面図である。この変形例においては、接地電極57の内周側において接地電極57から離して絶縁板52aの上面にソルダーレジスト67を形成してある。このソルダーレジスト67は、接地電極57と平行となるようにして環状に形成されている。そして、フランジ70の基部の押し当て部72をソルダーレジスト67の上面に当接させ、ソルダーレジスト67の外周側において、接地電極57を覆うように塗布された導電性接合部材73によって押し当て部72と基板52とを接合させている。
図18は、本発明の実施形態5による電子部品の構造を示す断面図である。この実施形態の電子部品91においては、樹脂(例えば、液晶ポリマー)を用いてキャップ形状に成形された樹脂モールド品のキャップ本体92の表面全体(外面及び内面)を導電膜93(例えば、1層または複数層のメッキ膜)で被覆して導電性キャップ54を構成している。
図19は、本発明の実施形態6による電子部品の構造を示す断面図である。図20は、半導体素子53を実装された基板52を示す上面図、図21はソルダーレジスト67を形成する前の基板52を示す上面図である。この実施形態の電子部品101に用いる基板52では、図21に示すように、アイランド部55と表面側接地パターン58と接地電極57を一体に形成している。すなわち、実施形態1における溝61、63を無くしている。この結果、パッド56だけが溝62によって分離されている。これに伴って、ソルダーレジスト67も、図20に示すように、接地電極57の外周部(導電性接合部材73を塗布する領域)とパッド56を除く金属薄膜領域の全体に形成している。
図22は、本発明の実施形態7による電子部品の構造を示す部分断面図である。この実施形態では、導電性キャップ54の下端部を外周側に向けてやや屈曲または湾曲させて曲げ部102を設けてあり、曲げ部102の先端部下面を押し当て部72としている。この実施形態では水平なフランジ70が存在せず、押し当て部72の外周側には十分に長い領域が存在していないが、この場合でも、図22に示すように、押し当て部72よりも外周側の曲げ部102先端面と接地電極57との間に導電性接合部材73を保持させて導電性キャップ54を接地電極57に接合させることができる。
52 基板
53 半導体素子
54 導電性キャップ
55 アイランド部
57 接地電極
59 引き出し電極
67 ソルダーレジスト
68 ダイボンド樹脂
69 ボンディングワイヤ
70 フランジ
71 凹部
72 押し当て部
73 導電性接合部材
81 電子部品
82 メッキ層
Claims (4)
- 基板の上面に半導体素子を実装し、前記基板の上面の前記半導体素子を囲む領域に接地電極を形成し、前記半導体素子を覆うようにして前記基板の上に導電性キャップを重ねて導電性接合部材により前記導電性キャップの下面全周を前記接地電極に接合させた電子部品において、
前記導電性キャップは下面の一部に押し当て部を有し、
前記接地電極の一部を被覆部材により覆って当該被覆部材で覆われた領域よりも外周側において前記接地電極の一部を当該被覆部材から露出させ、
前記押し当て部を前記被覆部材の上面に配し、前記押し当て部よりも外周側において前記導電性キャップの下面と前記接地電極とを前記導電性接合部材によって接合させたことを特徴とする電子部品。 - 前記導電性キャップ下面の前記押し当て部よりも外周側において、前記導電性キャップの下面を前記押し当て部よりも上方へ窪ませたことを特徴とする、請求項1に記載の電子部品。
- 前記押し当て部よりも外周側へ向かうに従って、前記導電性キャップの下面と前記接地電極との間の隙間が次第に大きくなるようにしたことを特徴とする、請求項1に記載の電子部品。
- 前記押し当て部を前記接地電極の上面に配したことを特徴とする、請求項2または3に記載の電子部品。
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