JPWO2016199634A1 - 半導体装置およびその製造方法 - Google Patents
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Abstract
Description
(実施の形態1)
最初に、図1〜図3を参照して本発明の実施の形態1の半導体装置1の構成について説明する。主に図1および図2を参照して、本実施の形態の半導体装置1は、プリント配線板2と、半導体素子3と、導電性キャップ4と、ボンディングワイヤ6と、導電性接合部材12と、絶縁被覆部材13とを主に有している。半導体装置1は、後述する基板2aの主面S1に実装された半導体素子3の上方を導電性キャップ4で覆ったものである。
比較例の半導体装置として、図10を参照して比較例1の半導体装置について説明し、図11を参照して比較例2の半導体装置について説明する。以下、比較例1および比較例2では、特に説明しない限り、実施の形態1と同一の構成には同一の符号を付し、説明を繰り返さない。
本発明の実施の形態2の半導体装置について説明する。以下、本実施の形態では、特に説明しない限り、実施の形態1と同一の構成には同一の符号を付し、説明を繰り返さない。
本発明の実施の形態3の半導体装置について説明する。以下、本実施の形態では、特に説明しない限り、実施の形態1と同一の構成には同一の符号を付し、説明を繰り返さない。
本発明の実施の形態4の半導体装置について説明する。以下、本実施の形態では、特に説明しない限り、実施の形態1および実施の形態3と同一の構成には同一の符号を付し、説明を繰り返さない。
今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることを意図される。
Claims (10)
- 主面を有する基板と、
前記主面に実装された半導体素子と、
前記半導体素子を囲むように前記主面に設けられた接地パッドと、
前記接地パッドの外周側を露出し、前記接地パッドの内周側を覆い、かつ前記接地パッド上から前記基板上に段差が形成されるように設けられた絶縁被覆部材と、
前記接地パッドの前記外周側に配置された導電性接合部材と、
前記半導体素子を覆うように前記接地パッドに前記導電性接合部材によって接合された導電性キャップとを備え、
前記導電性キャップの底部の内周端が前記絶縁被覆部材の外周端よりも内周側に配置されており、
前記底部は外周端から前記内周端に向かって前記主面との距離が連続的に小さくなる形状を有する、半導体装置。 - 前記底部の前記外周端から前記内周端に向かって前記主面との距離が連続的に小さくなる形状の内周側の端は、前記絶縁被覆部材から露出した前記接地パッドの前記外周側の領域の中央の真上および真上よりも内周側のいずれかに配置されている、請求項1に記載の半導体装置。
- 前記接地パッドの前記外周側の端は、前記導電性キャップの外周側の端の真下および真下よりも内周側のいずれかに配置されている、請求項1または2に記載の半導体装置。
- 前記導電性キャップは、前記底部と反対側の部分に設けられた凹部を含み、
前記凹部は前記底部に向かって凹んでいる、請求項1〜3のいずれか1項に記載の半導体装置。 - 前記導電性キャップは、前記底部と反対側の前記部分に設けられた凸部を含み、
前記凸部は、前記底部と反対側に突出しており、かつ前記凹部の周囲に設けられている、請求項4に記載の半導体装置。 - 前記導電性キャップは、前記導電性キャップの側面に設けられた最外周凸部と、前記半導体素子を覆う天井部とを含み、
前記最外周凸部は、前記導電性キャップの厚さ方向の中央に設けられており、
前記導電性キャップの厚さ方向において、前記底部から前記天井部までの深さは、前記導電性キャップの厚みの2/3の寸法を有している、請求項1〜5のいずれか1項に記載の半導体装置。 - 前記導電性キャップは、本体部と、本体部の表面を覆う表面部とを含み、
前記本体部は、樹脂成型材料で構成されており、
前記表面部は、導電性材料で構成されており、
前記導電性キャップは、前記導電性キャップの側面に設けられた最外周凸部と、前記半導体素子を覆う天井部とを含み、
前記底部は、前記内周端から前記天井部に向かって前記主面との距離が連続的に大きくなる形状を有し、
前記導電性キャップの厚さ方向において、前記底部から前記最外周凸部まで距離は、前記底部から前記天井部までの距離と等しく、
前記底部の前記内周端から前記天井部に向かう傾斜角度は、前記底部の前記外周端から前記最外周凸部に向かう傾斜角度と等しい、請求項1〜5のいずれか1項に記載の半導体装置。 - 基板の主面に実装された半導体素子を備えた半導体装置の製造方法であって、
前記主面の前記半導体素子を囲む位置に設けられた接地パッドの内周側を覆い、かつ前記接地パッド上から前記基板上に段差が形成されるように設けられた絶縁被覆部材から露出した前記接地パッドの外周側の領域に前記導電性接合部材を供給する工程と、
前記絶縁被覆部材から露出した前記接地パッドの前記外周側の領域において前記導電性接合部材を溶融させる工程と、
外周端から内周端に向かって前記主面との距離が連続的に小さくなる形状を有する底部の前記内周端が前記絶縁被覆部材の外周端よりも内周側に配置された導電性キャップが、前記溶融された前記導電性接合部材に搭載される工程とを備えた、半導体装置の製造方法。 - 前記導電性キャップが搭載される工程において、
前記導電性接合部材が溶融しない温度に前記基板と前記導電性キャップとが加熱されてから加圧されながら前記導電性キャップが搭載される、請求項8に記載の半導体装置の製造方法。 - 前記導電性キャップが搭載される工程において、
前記導電性接合部材が溶融する温度に前記基板と前記導電性キャップとが加熱されてから前記導電性キャップが搭載される、請求項8に記載の半導体装置の製造方法。
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