JPWO2021065949A1 - - Google Patents

Info

Publication number
JPWO2021065949A1
JPWO2021065949A1 JP2021551337A JP2021551337A JPWO2021065949A1 JP WO2021065949 A1 JPWO2021065949 A1 JP WO2021065949A1 JP 2021551337 A JP2021551337 A JP 2021551337A JP 2021551337 A JP2021551337 A JP 2021551337A JP WO2021065949 A1 JPWO2021065949 A1 JP WO2021065949A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021551337A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021065949A1 publication Critical patent/JPWO2021065949A1/ja
Priority to JP2023106525A priority Critical patent/JP2023127591A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0006—Coupling light into the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G02B6/4242—Mounting of the optical light guide to the lid of the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2021551337A 2019-09-30 2020-09-29 Pending JPWO2021065949A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023106525A JP2023127591A (ja) 2019-09-30 2023-06-28 光導波路パッケージおよび発光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019180926 2019-09-30
JP2019237069 2019-12-26
PCT/JP2020/037009 WO2021065949A1 (ja) 2019-09-30 2020-09-29 光導波路パッケージおよび発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023106525A Division JP2023127591A (ja) 2019-09-30 2023-06-28 光導波路パッケージおよび発光装置

Publications (1)

Publication Number Publication Date
JPWO2021065949A1 true JPWO2021065949A1 (ja) 2021-04-08

Family

ID=75336959

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021551337A Pending JPWO2021065949A1 (ja) 2019-09-30 2020-09-29
JP2023106525A Pending JP2023127591A (ja) 2019-09-30 2023-06-28 光導波路パッケージおよび発光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023106525A Pending JP2023127591A (ja) 2019-09-30 2023-06-28 光導波路パッケージおよび発光装置

Country Status (5)

Country Link
US (1) US20220342140A1 (ja)
EP (1) EP4040515A4 (ja)
JP (2) JPWO2021065949A1 (ja)
CN (1) CN114430809A (ja)
WO (1) WO2021065949A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021132299A1 (de) * 2021-12-08 2023-06-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung einer mehrzahl von optoelektronischen halbleiterbauelementen

Citations (13)

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JPH05167060A (ja) * 1991-12-12 1993-07-02 Nec Corp 光結合回路
US5454055A (en) * 1992-09-29 1995-09-26 Robert Bosch Gmbh Method of making a cover for an integrated optical circuit, cover for an integrated optical circuit, and integrated optical circuit made with this cover
JPH08110446A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 光伝送モジュール
JPH09512353A (ja) * 1995-02-07 1997-12-09 エルディティ ゲーエムベーハー ウント シーオー．レーザー−ディスプレー−テクノロギー カーゲー カラー画像形成システム及びその使用方法
JPH11337777A (ja) * 1998-05-28 1999-12-10 Kyocera Corp 光素子実装用基板ならびに光素子実装構造
JP2002107584A (ja) * 2000-09-29 2002-04-10 Kyocera Corp 光部品実装用基板及びその製造方法並びに光モジュール
JP2004064013A (ja) * 2002-07-31 2004-02-26 Kinseki Ltd 電子部品用パッケ−ジのキャップ封止方法
JP2004258268A (ja) * 2003-02-25 2004-09-16 Tdk Corp 埋込型光部品及びその製造方法並びに埋込型光部品を用いた光回路
JP2007328201A (ja) * 2006-06-08 2007-12-20 Nippon Telegr & Teleph Corp <Ntt> 光集積回路
JP2008516525A (ja) * 2004-10-05 2008-05-15 トラツキング・テクノロジーズ・インコーポレーテツド 無線周波識別タグ及びその製造方法
JP2009003096A (ja) * 2007-06-20 2009-01-08 Sumitomo Bakelite Co Ltd 光導波路モジュール、光導波路モジュールの製造方法
JP2010016030A (ja) * 2008-07-01 2010-01-21 Omron Corp 電子部品
JP2011253951A (ja) * 2010-06-02 2011-12-15 Mitsubishi Electric Corp 電子部品パッケージおよびその製造方法

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JPS6146911A (ja) 1984-08-10 1986-03-07 Nippon Telegr & Teleph Corp <Ntt> 導波形光モジユ−ル
JP2859382B2 (ja) 1990-06-22 1999-02-17 ユニチカ株式会社 セルロース系繊維糸条又は布帛の耐久性防炎加工方法
JP4203837B2 (ja) * 1999-10-13 2009-01-07 富士通株式会社 光伝送モジュール
EP1286194A3 (en) * 2001-08-21 2004-05-19 Canon Kabushiki Kaisha Optical waveguide apparatus
JP2005266179A (ja) * 2004-03-17 2005-09-29 Omron Corp 光導波路装置及び光導波路装置の製造方法並びに光導波路装置の中間体
US11181688B2 (en) * 2009-10-13 2021-11-23 Skorpios Technologies, Inc. Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
WO2012043573A1 (ja) * 2010-10-01 2012-04-05 住友ベークライト株式会社 光導波路、光導波路の製造方法、光導波路モジュール、光導波路モジュールの製造方法および電子機器
JP5799592B2 (ja) * 2011-06-03 2015-10-28 住友ベークライト株式会社 光導波路、光電気混載基板および電子機器
JP5727538B2 (ja) * 2013-03-25 2015-06-03 日本電信電話株式会社 光導波路素子およびその製造方法
US20160291269A1 (en) * 2015-04-01 2016-10-06 Coriant Advanced Technology, LLC Photonic integrated circuit chip packaging
US10180537B2 (en) * 2015-05-12 2019-01-15 Kaiam Corp. RGB combiner using MEMs alignment and PLC
WO2021065078A1 (ja) * 2019-09-30 2021-04-08 京セラ株式会社 光導波路パッケージおよび発光装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167060A (ja) * 1991-12-12 1993-07-02 Nec Corp 光結合回路
US5454055A (en) * 1992-09-29 1995-09-26 Robert Bosch Gmbh Method of making a cover for an integrated optical circuit, cover for an integrated optical circuit, and integrated optical circuit made with this cover
JPH08110446A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 光伝送モジュール
JPH09512353A (ja) * 1995-02-07 1997-12-09 エルディティ ゲーエムベーハー ウント シーオー．レーザー−ディスプレー−テクノロギー カーゲー カラー画像形成システム及びその使用方法
JPH11337777A (ja) * 1998-05-28 1999-12-10 Kyocera Corp 光素子実装用基板ならびに光素子実装構造
JP2002107584A (ja) * 2000-09-29 2002-04-10 Kyocera Corp 光部品実装用基板及びその製造方法並びに光モジュール
JP2004064013A (ja) * 2002-07-31 2004-02-26 Kinseki Ltd 電子部品用パッケ−ジのキャップ封止方法
JP2004258268A (ja) * 2003-02-25 2004-09-16 Tdk Corp 埋込型光部品及びその製造方法並びに埋込型光部品を用いた光回路
JP2008516525A (ja) * 2004-10-05 2008-05-15 トラツキング・テクノロジーズ・インコーポレーテツド 無線周波識別タグ及びその製造方法
JP2007328201A (ja) * 2006-06-08 2007-12-20 Nippon Telegr & Teleph Corp <Ntt> 光集積回路
JP2009003096A (ja) * 2007-06-20 2009-01-08 Sumitomo Bakelite Co Ltd 光導波路モジュール、光導波路モジュールの製造方法
JP2010016030A (ja) * 2008-07-01 2010-01-21 Omron Corp 電子部品
JP2011253951A (ja) * 2010-06-02 2011-12-15 Mitsubishi Electric Corp 電子部品パッケージおよびその製造方法

Also Published As

Publication number Publication date
US20220342140A1 (en) 2022-10-27
EP4040515A1 (en) 2022-08-10
CN114430809A (zh) 2022-05-03
WO2021065949A1 (ja) 2021-04-08
JP2023127591A (ja) 2023-09-13
EP4040515A4 (en) 2023-10-25

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