JP5241855B2 - Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ - Google Patents
Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ Download PDFInfo
- Publication number
- JP5241855B2 JP5241855B2 JP2010540956A JP2010540956A JP5241855B2 JP 5241855 B2 JP5241855 B2 JP 5241855B2 JP 2010540956 A JP2010540956 A JP 2010540956A JP 2010540956 A JP2010540956 A JP 2010540956A JP 5241855 B2 JP5241855 B2 JP 5241855B2
- Authority
- JP
- Japan
- Prior art keywords
- fragment
- group iii
- gan
- wafer
- iii nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 150000004767 nitrides Chemical class 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 69
- 238000000137 annealing Methods 0.000 claims description 56
- 239000012634 fragment Substances 0.000 claims description 43
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 34
- 239000012535 impurity Substances 0.000 claims description 31
- 239000013078 crystal Substances 0.000 claims description 29
- 239000000356 contaminant Substances 0.000 claims description 20
- 229910021529 ammonia Inorganic materials 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910001385 heavy metal Inorganic materials 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 229910052708 sodium Inorganic materials 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052744 lithium Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 230000005693 optoelectronics Effects 0.000 claims description 6
- 229910052700 potassium Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 58
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 27
- 229910002601 GaN Inorganic materials 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 16
- 239000007789 gas Substances 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 238000010494 dissociation reaction Methods 0.000 description 12
- 230000005593 dissociations Effects 0.000 description 12
- 238000000354 decomposition reaction Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 8
- 229910052783 alkali metal Inorganic materials 0.000 description 7
- 150000001340 alkali metals Chemical class 0.000 description 7
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 6
- 150000001342 alkaline earth metals Chemical class 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 235000015097 nutrients Nutrition 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007716 flux method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000001963 growth medium Substances 0.000 description 1
- 238000001534 heteroepitaxy Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/02—Heat treatment
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
- C30B7/10—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
- C30B7/10—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes
- C30B7/105—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes using ammonia as solvent, i.e. ammonothermal processes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6711708P | 2008-02-25 | 2008-02-25 | |
| US61/067,117 | 2008-02-25 | ||
| PCT/US2009/035140 WO2009108700A1 (en) | 2008-02-25 | 2009-02-25 | Method for producing group iii nitride wafers and group iii nitride wafers |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013028632A Division JP5657042B2 (ja) | 2008-02-25 | 2013-02-18 | Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011509231A JP2011509231A (ja) | 2011-03-24 |
| JP2011509231A5 JP2011509231A5 (enExample) | 2012-07-19 |
| JP5241855B2 true JP5241855B2 (ja) | 2013-07-17 |
Family
ID=40602704
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010540956A Active JP5241855B2 (ja) | 2008-02-25 | 2009-02-25 | Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ |
| JP2013028632A Active JP5657042B2 (ja) | 2008-02-25 | 2013-02-18 | Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013028632A Active JP5657042B2 (ja) | 2008-02-25 | 2013-02-18 | Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9803293B2 (enExample) |
| EP (1) | EP2245218B1 (enExample) |
| JP (2) | JP5241855B2 (enExample) |
| TW (1) | TWI487817B (enExample) |
| WO (1) | WO2009108700A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013126945A (ja) * | 2008-02-25 | 2013-06-27 | Sixpoint Materials Inc | Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ |
| US8764903B2 (en) | 2009-05-05 | 2014-07-01 | Sixpoint Materials, Inc. | Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride |
| US9985102B2 (en) | 2008-06-04 | 2018-05-29 | Sixpoint Materials, Inc. | Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth |
| US10087548B2 (en) | 2006-04-07 | 2018-10-02 | Sixpoint Materials, Inc. | High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2045374A3 (en) * | 2007-10-05 | 2011-02-16 | Sumitomo Electric Industries, Ltd. | Method of manufacturing a GaN substrate and a GaN epitaxial wafer |
| JP5377521B2 (ja) | 2008-06-12 | 2013-12-25 | シックスポイント マテリアルズ, インコーポレイテッド | Iii族窒化物ウェハーを試験する方法および試験データを伴うiii族窒化物ウェハー |
| WO2010045567A1 (en) * | 2008-10-16 | 2010-04-22 | Sixpoint Materials, Inc. | Reactor design for growing group iii nitride crystals and method of growing group iii nitride crystals |
| US8852341B2 (en) | 2008-11-24 | 2014-10-07 | Sixpoint Materials, Inc. | Methods for producing GaN nutrient for ammonothermal growth |
| CN101760772B (zh) * | 2009-12-30 | 2012-01-11 | 苏州纳维科技有限公司 | 一种用于氨热法生长氮化物的反应装置 |
| JP6444249B2 (ja) * | 2015-04-15 | 2018-12-26 | 株式会社ディスコ | ウエーハの生成方法 |
| JP6451563B2 (ja) * | 2015-09-08 | 2019-01-16 | 株式会社豊田中央研究所 | 窒化ガリウム結晶及びその製造方法、並びに、結晶成長装置 |
| JP2017088430A (ja) * | 2015-11-05 | 2017-05-25 | 三菱化学株式会社 | GaNウエハ |
| CN116695239B (zh) * | 2023-04-14 | 2025-07-04 | 珠海庞纳微半导体科技有限公司 | 一种氮化铝薄膜的制备方法及基于氮化铝薄膜的器件 |
Family Cites Families (126)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2962838A (en) * | 1957-05-20 | 1960-12-06 | Union Carbide Corp | Method for making synthetic unicrystalline bodies |
| JPS5749520B2 (enExample) | 1974-02-04 | 1982-10-22 | ||
| US4396529A (en) | 1978-11-13 | 1983-08-02 | Nordson Corporation | Method and apparatus for producing a foam from a viscous liquid |
| EP0173764B1 (en) | 1984-08-31 | 1989-12-13 | Gakei Electric Works Co., Ltd. | Single crystal growing method and apparatus |
| US5679152A (en) * | 1994-01-27 | 1997-10-21 | Advanced Technology Materials, Inc. | Method of making a single crystals Ga*N article |
| JP3735921B2 (ja) * | 1996-02-07 | 2006-01-18 | 三菱ウェルファーマ株式会社 | GPIb・脂質複合体およびその用途 |
| JPH10125753A (ja) | 1996-09-02 | 1998-05-15 | Murata Mfg Co Ltd | 半導体のキャリア濃度測定方法、半導体デバイス製造方法及び半導体ウエハ |
| JPH10125653A (ja) | 1996-10-17 | 1998-05-15 | Fujitsu Ltd | 半導体装置の製造方法 |
| US6309595B1 (en) | 1997-04-30 | 2001-10-30 | The Altalgroup, Inc | Titanium crystal and titanium |
| DE69842052D1 (de) | 1997-10-30 | 2011-01-27 | Sumitomo Electric Industries | Gan einkristall-substrat und herstellungsmethode |
| US5942148A (en) * | 1997-12-24 | 1999-08-24 | Preston; Kenneth G. | Nitride compacts |
| WO1999066565A1 (en) * | 1998-06-18 | 1999-12-23 | University Of Florida | Method and apparatus for producing group-iii nitrides |
| JP3592553B2 (ja) * | 1998-10-15 | 2004-11-24 | 株式会社東芝 | 窒化ガリウム系半導体装置 |
| WO2000033388A1 (en) * | 1998-11-24 | 2000-06-08 | Massachusetts Institute Of Technology | METHOD OF PRODUCING DEVICE QUALITY (Al)InGaP ALLOYS ON LATTICE-MISMATCHED SUBSTRATES |
| US6177057B1 (en) | 1999-02-09 | 2001-01-23 | The United States Of America As Represented By The Secretary Of The Navy | Process for preparing bulk cubic gallium nitride |
| US6190629B1 (en) | 1999-04-16 | 2001-02-20 | Cbl Technologies, Inc. | Organic acid scrubber and methods |
| US6326313B1 (en) * | 1999-04-21 | 2001-12-04 | Advanced Micro Devices | Method and apparatus for partial drain during a nitride strip process step |
| US6406540B1 (en) * | 1999-04-27 | 2002-06-18 | The United States Of America As Represented By The Secretary Of The Air Force | Process and apparatus for the growth of nitride materials |
| US6117213A (en) * | 1999-05-07 | 2000-09-12 | Cbl Technologies, Inc. | Particle trap apparatus and methods |
| US6562124B1 (en) | 1999-06-02 | 2003-05-13 | Technologies And Devices International, Inc. | Method of manufacturing GaN ingots |
| JP4145437B2 (ja) | 1999-09-28 | 2008-09-03 | 住友電気工業株式会社 | 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板 |
| US6398867B1 (en) * | 1999-10-06 | 2002-06-04 | General Electric Company | Crystalline gallium nitride and method for forming crystalline gallium nitride |
| US6441393B2 (en) * | 1999-11-17 | 2002-08-27 | Lumileds Lighting U.S., Llc | Semiconductor devices with selectively doped III-V nitride layers |
| JP4627830B2 (ja) | 1999-12-20 | 2011-02-09 | 株式会社フルヤ金属 | 超臨界水酸化分解処理装置の反応容器及び反応容器の製造方法 |
| US6596079B1 (en) * | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
| JP2001345268A (ja) * | 2000-05-31 | 2001-12-14 | Matsushita Electric Ind Co Ltd | 半導体製造装置及び半導体の製造方法 |
| JP3968968B2 (ja) | 2000-07-10 | 2007-08-29 | 住友電気工業株式会社 | 単結晶GaN基板の製造方法 |
| JP4374156B2 (ja) * | 2000-09-01 | 2009-12-02 | 日本碍子株式会社 | Iii−v族窒化物膜の製造装置及び製造方法 |
| WO2002021604A1 (en) * | 2000-09-08 | 2002-03-14 | Sharp Kabushiki Kaisha | Nitride semiconductor light-emitting device and optical device including the same |
| US7053413B2 (en) * | 2000-10-23 | 2006-05-30 | General Electric Company | Homoepitaxial gallium-nitride-based light emitting device and method for producing |
| AU2002219978A1 (en) * | 2000-11-30 | 2002-06-11 | Kyma Technologies, Inc. | Method and apparatus for producing miiin columns and miiin materials grown thereon |
| JP2002217118A (ja) | 2001-01-22 | 2002-08-02 | Japan Pionics Co Ltd | 窒化ガリウム膜半導体の製造装置、排ガス浄化装置、及び製造設備 |
| EP2400046A1 (en) * | 2001-03-30 | 2011-12-28 | Technologies and Devices International Inc. | Method and apparatus for growing submicron group III nitride structures utilizing HVPE techniques |
| US7160388B2 (en) * | 2001-06-06 | 2007-01-09 | Nichia Corporation | Process and apparatus for obtaining bulk monocrystalline gallium-containing nitride |
| US6860948B1 (en) * | 2003-09-05 | 2005-03-01 | Haynes International, Inc. | Age-hardenable, corrosion resistant Ni—Cr—Mo alloys |
| US20060011135A1 (en) | 2001-07-06 | 2006-01-19 | Dmitriev Vladimir A | HVPE apparatus for simultaneously producing multiple wafers during a single epitaxial growth run |
| US7501023B2 (en) * | 2001-07-06 | 2009-03-10 | Technologies And Devices, International, Inc. | Method and apparatus for fabricating crack-free Group III nitride semiconductor materials |
| US20070032046A1 (en) | 2001-07-06 | 2007-02-08 | Dmitriev Vladimir A | Method for simultaneously producing multiple wafers during a single epitaxial growth run and semiconductor structure grown thereby |
| US7169227B2 (en) * | 2001-08-01 | 2007-01-30 | Crystal Photonics, Incorporated | Method for making free-standing AIGaN wafer, wafer produced thereby, and associated methods and devices using the wafer |
| US7105865B2 (en) * | 2001-09-19 | 2006-09-12 | Sumitomo Electric Industries, Ltd. | AlxInyGa1−x−yN mixture crystal substrate |
| CA2464083C (en) | 2001-10-26 | 2011-08-02 | Ammono Sp. Z O.O. | Substrate for epitaxy |
| JP4131101B2 (ja) | 2001-11-28 | 2008-08-13 | 日亜化学工業株式会社 | 窒化物半導体素子の製造方法 |
| US7017514B1 (en) * | 2001-12-03 | 2006-03-28 | Novellus Systems, Inc. | Method and apparatus for plasma optimization in water processing |
| JP4513264B2 (ja) | 2002-02-22 | 2010-07-28 | 三菱化学株式会社 | 窒化物単結晶の製造方法 |
| US7063741B2 (en) * | 2002-03-27 | 2006-06-20 | General Electric Company | High pressure high temperature growth of crystalline group III metal nitrides |
| JP3803788B2 (ja) * | 2002-04-09 | 2006-08-02 | 農工大ティー・エル・オー株式会社 | Al系III−V族化合物半導体の気相成長方法、Al系III−V族化合物半導体の製造方法ならびに製造装置 |
| WO2003098757A1 (en) * | 2002-05-17 | 2003-11-27 | Ammono Sp.Zo.O. | Light emitting element structure having nitride bulk single crystal layer |
| US7335262B2 (en) * | 2002-05-17 | 2008-02-26 | Ammono Sp. Z O.O. | Apparatus for obtaining a bulk single crystal using supercritical ammonia |
| US7601441B2 (en) * | 2002-06-24 | 2009-10-13 | Cree, Inc. | One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer |
| US7316747B2 (en) * | 2002-06-24 | 2008-01-08 | Cree, Inc. | Seeded single crystal silicon carbide growth and resulting crystals |
| EP1518009B1 (en) | 2002-06-26 | 2013-07-17 | Ammono S.A. | Process for obtaining of bulk monocrystalline gallium-containing nitride |
| KR101030068B1 (ko) * | 2002-07-08 | 2011-04-19 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자 |
| JP3821229B2 (ja) | 2002-12-09 | 2006-09-13 | ソニー株式会社 | オーディオ信号の再生方法および再生装置 |
| EP1576210B1 (en) * | 2002-12-11 | 2010-02-10 | AMMONO Sp. z o.o. | A substrate for epitaxy and a method of preparing the same |
| TWI334890B (en) | 2002-12-11 | 2010-12-21 | Ammono Sp Zoo | Process for obtaining bulk mono-crystalline gallium-containing nitride, eliminating impurities from the obtained crystal and manufacturing substrates made of bulk mono-crystalline gallium-containing nitride |
| US7638815B2 (en) * | 2002-12-27 | 2009-12-29 | Momentive Performance Materials Inc. | Crystalline composition, wafer, and semi-conductor structure |
| WO2004061923A1 (en) * | 2002-12-27 | 2004-07-22 | General Electric Company | Gallium nitride crystal, homoepitaxial gallium-nitride-based devices and method for producing same |
| US7786503B2 (en) * | 2002-12-27 | 2010-08-31 | Momentive Performance Materials Inc. | Gallium nitride crystals and wafers and method of making |
| US7859008B2 (en) * | 2002-12-27 | 2010-12-28 | Momentive Performance Materials Inc. | Crystalline composition, wafer, device, and associated method |
| US7098487B2 (en) * | 2002-12-27 | 2006-08-29 | General Electric Company | Gallium nitride crystal and method of making same |
| JP2004284876A (ja) | 2003-03-20 | 2004-10-14 | Rikogaku Shinkokai | 不純物含有窒化ガリウム粉体およびその製造方法 |
| JP2004342845A (ja) * | 2003-05-15 | 2004-12-02 | Kobe Steel Ltd | 微細構造体の洗浄装置 |
| US7309534B2 (en) * | 2003-05-29 | 2007-12-18 | Matsushita Electric Industrial Co., Ltd. | Group III nitride crystals usable as group III nitride substrate, method of manufacturing the same, and semiconductor device including the same |
| JP4433696B2 (ja) | 2003-06-17 | 2010-03-17 | 三菱化学株式会社 | 窒化物結晶の製造方法 |
| JP2005011973A (ja) | 2003-06-18 | 2005-01-13 | Japan Science & Technology Agency | 希土類−鉄−ホウ素系磁石及びその製造方法 |
| US7170095B2 (en) * | 2003-07-11 | 2007-01-30 | Cree Inc. | Semi-insulating GaN and method of making the same |
| US7125801B2 (en) * | 2003-08-06 | 2006-10-24 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing Group III nitride crystal substrate, etchant used in the method, Group III nitride crystal substrate, and semiconductor device including the same |
| JP2005069454A (ja) * | 2003-08-28 | 2005-03-17 | Toyota Motor Corp | ガス供給装置 |
| WO2005034301A1 (ja) * | 2003-09-25 | 2005-04-14 | Matsushita Electric Industrial Co., Ltd. | 窒化物半導体素子およびその製造方法 |
| JP2005119893A (ja) | 2003-10-14 | 2005-05-12 | Matsushita Electric Ind Co Ltd | 無機組成物およびその製造方法並びにそれを用いたiii族元素窒化物の製造方法。 |
| US7009215B2 (en) * | 2003-10-24 | 2006-03-07 | General Electric Company | Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates |
| JP2005191530A (ja) * | 2003-12-03 | 2005-07-14 | Sumitomo Electric Ind Ltd | 発光装置 |
| CN100466178C (zh) * | 2003-12-26 | 2009-03-04 | 松下电器产业株式会社 | Iii族氮化物晶体的制造方法以及由此得到的iii族氮化物晶体与应用该晶体的iii族氮化物晶体基板 |
| JP4304276B2 (ja) | 2004-03-31 | 2009-07-29 | 独立行政法人産業技術総合研究所 | 高圧装置の効率的な断熱方法及び装置 |
| ATE418806T1 (de) * | 2004-04-02 | 2009-01-15 | Nichia Corp | Nitrid-halbleiterlaservorrichtung |
| JP4790607B2 (ja) * | 2004-04-27 | 2011-10-12 | パナソニック株式会社 | Iii族元素窒化物結晶製造装置およびiii族元素窒化物結晶製造方法 |
| US7432142B2 (en) * | 2004-05-20 | 2008-10-07 | Cree, Inc. | Methods of fabricating nitride-based transistors having regrown ohmic contact regions |
| US7303632B2 (en) * | 2004-05-26 | 2007-12-04 | Cree, Inc. | Vapor assisted growth of gallium nitride |
| US7858996B2 (en) * | 2006-02-17 | 2010-12-28 | The Regents Of The University Of California | Method for growth of semipolar (Al,In,Ga,B)N optoelectronic devices |
| AU2005252111A1 (en) | 2004-06-11 | 2005-12-22 | Takeda Pharmaceutical Company Limited | Highly selective novel amidation method |
| WO2005121415A1 (en) | 2004-06-11 | 2005-12-22 | Ammono Sp. Z O.O. | Bulk mono-crystalline gallium-containing nitride and its application |
| JP2006069827A (ja) | 2004-08-31 | 2006-03-16 | Kyocera Kinseki Corp | 人工水晶の製造方法 |
| PL371405A1 (pl) * | 2004-11-26 | 2006-05-29 | Ammono Sp.Z O.O. | Sposób wytwarzania objętościowych monokryształów metodą wzrostu na zarodku |
| JP4276627B2 (ja) | 2005-01-12 | 2009-06-10 | ソルボサーマル結晶成長技術研究組合 | 単結晶育成用圧力容器およびその製造方法 |
| US7704324B2 (en) * | 2005-01-25 | 2010-04-27 | General Electric Company | Apparatus for processing materials in supercritical fluids and methods thereof |
| CN101137774B (zh) | 2005-03-14 | 2012-03-21 | 日本碍子株式会社 | 易氧化性或易吸湿性物质的容器以及易氧化性或易吸湿性物质的加热和加压处理方法 |
| US7316746B2 (en) * | 2005-03-18 | 2008-01-08 | General Electric Company | Crystals for a semiconductor radiation detector and method for making the crystals |
| US20060210800A1 (en) * | 2005-03-21 | 2006-09-21 | Irene Spitsberg | Environmental barrier layer for silcon-containing substrate and process for preparing same |
| US8101498B2 (en) * | 2005-04-21 | 2012-01-24 | Pinnington Thomas Henry | Bonded intermediate substrate and method of making same |
| KR100700082B1 (ko) * | 2005-06-14 | 2007-03-28 | 주식회사 실트론 | 결정 성장된 잉곳의 품질평가 방법 |
| EP1739213B1 (de) * | 2005-07-01 | 2011-04-13 | Freiberger Compound Materials GmbH | Vorrichtung und Verfahren zum Tempern von III-V-Wafern sowie getemperte III-V-Halbleitereinkristallwafer |
| EP1917382A4 (en) | 2005-07-08 | 2009-09-02 | Univ California | METHOD FOR GROWING GROUP III NITRIDE CRYSTALS IN SUPERCRITICAL AMMONIA USING AUTOCLAVE |
| US8101020B2 (en) * | 2005-10-14 | 2012-01-24 | Ricoh Company, Ltd. | Crystal growth apparatus and manufacturing method of group III nitride crystal |
| KR20070042594A (ko) | 2005-10-19 | 2007-04-24 | 삼성코닝 주식회사 | 편평한 측면을 갖는 a면 질화물 반도체 단결정 기판 |
| EP1977029B1 (en) | 2005-12-20 | 2020-07-22 | SLT Technologies, Inc. | Crystalline composition |
| JP2007197302A (ja) * | 2005-12-28 | 2007-08-09 | Sumitomo Electric Ind Ltd | Iii族窒化物結晶の製造方法および製造装置 |
| JP5896442B2 (ja) * | 2006-01-20 | 2016-03-30 | 国立研究開発法人科学技術振興機構 | Iii族窒化物膜の成長方法 |
| JP5454829B2 (ja) | 2006-03-06 | 2014-03-26 | 三菱化学株式会社 | 超臨界溶媒を用いた結晶製造方法および結晶製造装置 |
| JP5454828B2 (ja) | 2006-03-06 | 2014-03-26 | 三菱化学株式会社 | 超臨界溶媒を用いた結晶製造方法および結晶製造装置 |
| JP4968708B2 (ja) | 2006-03-06 | 2012-07-04 | 日本碍子株式会社 | 窒化物単結晶の製造方法 |
| TWI299896B (en) | 2006-03-16 | 2008-08-11 | Advanced Semiconductor Eng | Method for forming metal bumps |
| WO2007111962A2 (en) | 2006-03-22 | 2007-10-04 | The Procter & Gamble Company | Aerosol product comprising a foaming concentrate composition comprising particulate materials |
| WO2007122866A1 (ja) | 2006-03-23 | 2007-11-01 | Ngk Insulators, Ltd. | 単結晶の製造方法 |
| JP5382900B2 (ja) | 2006-03-29 | 2014-01-08 | 公益財団法人鉄道総合技術研究所 | 液状化による地中構造物の浮き上がり防止方法 |
| KR20090029697A (ko) | 2006-04-07 | 2009-03-23 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 초임계 암모니아 내에서 넓은 표면적 질화 갈륨 결정을 성장시키는 방법 및 넓은 표면적 질화 갈륨 결정 |
| US8764903B2 (en) | 2009-05-05 | 2014-07-01 | Sixpoint Materials, Inc. | Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride |
| JP2007290921A (ja) | 2006-04-26 | 2007-11-08 | Mitsubishi Chemicals Corp | 窒化物単結晶の製造方法、窒化物単結晶、およびデバイス |
| JP2009536605A (ja) | 2006-05-08 | 2009-10-15 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | アルミニウムを含むiii族窒化物半導体化合物の成長方法及び材料。 |
| WO2007149487A2 (en) | 2006-06-21 | 2007-12-27 | The Regents Of The University Of California | Opto-electronic and electronic devices using n-face or m-plane gan substrate prepared with ammonothermal growth |
| JP4462251B2 (ja) * | 2006-08-17 | 2010-05-12 | 日立電線株式会社 | Iii−v族窒化物系半導体基板及びiii−v族窒化物系発光素子 |
| JP5129527B2 (ja) | 2006-10-02 | 2013-01-30 | 株式会社リコー | 結晶製造方法及び基板製造方法 |
| EP2092093A4 (en) | 2006-10-25 | 2017-06-14 | The Regents of The University of California | Method for growing group iii-nitride crystals in a mixture of supercritical ammonia and nitrogen, and group iii-nitride crystals grown thereby |
| US20080111144A1 (en) * | 2006-11-15 | 2008-05-15 | The Regents Of The University Of California | LIGHT EMITTING DIODE AND LASER DIODE USING N-FACE GaN, InN, AND AlN AND THEIR ALLOYS |
| KR101353334B1 (ko) | 2006-11-22 | 2014-02-18 | 소이텍 | 갈륨 질화물 증착에서의 반응 가스 감소 |
| JP2008127252A (ja) | 2006-11-22 | 2008-06-05 | Hitachi Cable Ltd | 窒化物半導体インゴット及びこれから得られる窒化物半導体基板並びに窒化物半導体インゴットの製造方法 |
| EP2066496B1 (en) | 2006-11-22 | 2013-04-10 | Soitec | Equipment for high volume manufacture of group iii-v semiconductor materials |
| US7749325B2 (en) * | 2007-01-22 | 2010-07-06 | Sumitomo Electric Industries, Ltd. | Method of producing gallium nitride (GaN) independent substrate, method of producing GaN crystal body, and method of producing GaN substrate |
| JP2009017163A (ja) | 2007-07-04 | 2009-01-22 | Panasonic Corp | 映像表示装置 |
| US20100213576A1 (en) * | 2007-10-09 | 2010-08-26 | Panasonic Corporation | Method for producing group iii nitride crystal substrate, group iii nitride crystal substrate, and semiconductor device using group iii nitride crystal substrate |
| TW200923536A (en) * | 2007-11-23 | 2009-06-01 | Acrosense Technology Co Ltd | High transmittance touch panel |
| EP2245218B1 (en) | 2008-02-25 | 2019-06-19 | SixPoint Materials, Inc. | Method for producing group iii nitride wafers and group iii nitride wafers |
| EP2291551B1 (en) * | 2008-06-04 | 2018-04-25 | SixPoint Materials, Inc. | High-pressure vessel for growing group iii nitride crystals and method of growing group iii nitride crystals using high-pressure vessel and group iii nitride crystal |
| EP2281076A1 (en) | 2008-06-04 | 2011-02-09 | Sixpoint Materials, Inc. | Methods for producing improved crystallinty group iii-nitride crystals from initial group iii-nitride seed by ammonothermal growth |
| JP5377521B2 (ja) | 2008-06-12 | 2013-12-25 | シックスポイント マテリアルズ, インコーポレイテッド | Iii族窒化物ウェハーを試験する方法および試験データを伴うiii族窒化物ウェハー |
| WO2010045567A1 (en) | 2008-10-16 | 2010-04-22 | Sixpoint Materials, Inc. | Reactor design for growing group iii nitride crystals and method of growing group iii nitride crystals |
| US8852341B2 (en) * | 2008-11-24 | 2014-10-07 | Sixpoint Materials, Inc. | Methods for producing GaN nutrient for ammonothermal growth |
-
2009
- 2009-02-25 EP EP09714025.5A patent/EP2245218B1/en active Active
- 2009-02-25 JP JP2010540956A patent/JP5241855B2/ja active Active
- 2009-02-25 WO PCT/US2009/035140 patent/WO2009108700A1/en not_active Ceased
- 2009-02-25 US US12/392,960 patent/US9803293B2/en active Active
- 2009-02-25 TW TW098106029A patent/TWI487817B/zh active
-
2013
- 2013-02-18 JP JP2013028632A patent/JP5657042B2/ja active Active
-
2017
- 2017-03-07 US US15/452,700 patent/US20170175295A1/en not_active Abandoned
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9441311B2 (en) | 2006-04-07 | 2016-09-13 | Sixpoint Materials, Inc. | Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride |
| US10087548B2 (en) | 2006-04-07 | 2018-10-02 | Sixpoint Materials, Inc. | High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal |
| JP2013126945A (ja) * | 2008-02-25 | 2013-06-27 | Sixpoint Materials Inc | Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ |
| US9803293B2 (en) | 2008-02-25 | 2017-10-31 | Sixpoint Materials, Inc. | Method for producing group III-nitride wafers and group III-nitride wafers |
| US9985102B2 (en) | 2008-06-04 | 2018-05-29 | Sixpoint Materials, Inc. | Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth |
| US8764903B2 (en) | 2009-05-05 | 2014-07-01 | Sixpoint Materials, Inc. | Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013126945A (ja) | 2013-06-27 |
| JP5657042B2 (ja) | 2015-01-21 |
| US20090256240A1 (en) | 2009-10-15 |
| US9803293B2 (en) | 2017-10-31 |
| US20170175295A1 (en) | 2017-06-22 |
| EP2245218B1 (en) | 2019-06-19 |
| WO2009108700A1 (en) | 2009-09-03 |
| JP2011509231A (ja) | 2011-03-24 |
| TW200942655A (en) | 2009-10-16 |
| TWI487817B (zh) | 2015-06-11 |
| EP2245218A1 (en) | 2010-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5241855B2 (ja) | Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ | |
| US8435879B2 (en) | Method for making group III nitride articles | |
| US8148801B2 (en) | Nitride crystal with removable surface layer and methods of manufacture | |
| TWI429797B (zh) | 第 iii 族氮化物半導體結晶基板及半導體元件 | |
| KR101454978B1 (ko) | SiC 단결정 웨이퍼와 그 제조 방법 | |
| JP5560528B2 (ja) | Iii族窒化物単結晶インゴットの製造方法、及びiii族窒化物単結晶基板の製造方法 | |
| US11828002B2 (en) | Large, UV-transparent aluminum nitride single crystals | |
| WO2010005914A1 (en) | High quality large area bulk non-polar or semipolar gallium based substrates and methods | |
| JP6526811B2 (ja) | Iii族窒化物結晶を加工する方法 | |
| US20090294775A1 (en) | Hexagonal wurtzite type epitaxial layer possessing a low alkali-metal concentration and method of creating the same | |
| WO2009090840A1 (ja) | 窒化ガリウムの結晶成長方法および窒化ガリウム基板の製造方法 | |
| JP7769846B2 (ja) | 半導体基板の製造方法、半導体基板、及び、成長層におけるクラックの発生を抑制する方法 | |
| JP7758908B2 (ja) | 半導体基板の製造方法、半導体基板、及び、成長層を形成する方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120604 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120814 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120816 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121115 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20121122 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121213 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20121220 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130115 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130122 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130218 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130318 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130402 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160412 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5241855 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |