JP5113054B2 - デバイスの酸素および水分劣化を抑制する方法および得られるデバイス - Google Patents
デバイスの酸素および水分劣化を抑制する方法および得られるデバイス Download PDFInfo
- Publication number
- JP5113054B2 JP5113054B2 JP2008526984A JP2008526984A JP5113054B2 JP 5113054 B2 JP5113054 B2 JP 5113054B2 JP 2008526984 A JP2008526984 A JP 2008526984A JP 2008526984 A JP2008526984 A JP 2008526984A JP 5113054 B2 JP5113054 B2 JP 5113054B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- llt
- glass
- tin fluorophosphate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/23—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron
- C03C3/247—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron containing fluorine and phosphorus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Glass Compositions (AREA)
- Laminated Bodies (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/207,691 | 2005-08-18 | ||
| US11/207,691 US20070040501A1 (en) | 2005-08-18 | 2005-08-18 | Method for inhibiting oxygen and moisture degradation of a device and the resulting device |
| PCT/US2006/030670 WO2007021627A1 (en) | 2005-08-18 | 2006-08-09 | Method for inhibiting oxygen and moisture degradation of a device and the resulting device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009505371A JP2009505371A (ja) | 2009-02-05 |
| JP2009505371A5 JP2009505371A5 (enExample) | 2009-09-24 |
| JP5113054B2 true JP5113054B2 (ja) | 2013-01-09 |
Family
ID=37460166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008526984A Expired - Fee Related JP5113054B2 (ja) | 2005-08-18 | 2006-08-09 | デバイスの酸素および水分劣化を抑制する方法および得られるデバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20070040501A1 (enExample) |
| EP (1) | EP1929559B1 (enExample) |
| JP (1) | JP5113054B2 (enExample) |
| KR (1) | KR101353226B1 (enExample) |
| CN (1) | CN101243562A (enExample) |
| TW (1) | TWI360904B (enExample) |
| WO (1) | WO2007021627A1 (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080206589A1 (en) * | 2007-02-28 | 2008-08-28 | Bruce Gardiner Aitken | Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device |
| US7722929B2 (en) | 2005-08-18 | 2010-05-25 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
| US7829147B2 (en) * | 2005-08-18 | 2010-11-09 | Corning Incorporated | Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device |
| EP2180078B1 (en) * | 2005-08-25 | 2013-12-11 | Asahi Glass Company, Limited | Base with glass film |
| BRPI0714886B8 (pt) | 2006-07-10 | 2021-05-25 | Paion Uk Ltd | sais de benzodiazepina, seus usos e seus processos de preparação, e composição farmacêutica |
| US20080048178A1 (en) | 2006-08-24 | 2008-02-28 | Bruce Gardiner Aitken | Tin phosphate barrier film, method, and apparatus |
| EP2121872B1 (en) * | 2007-03-19 | 2015-12-09 | Nanosys, Inc. | Methods for encapsulating nanocrystals |
| US20100155749A1 (en) * | 2007-03-19 | 2010-06-24 | Nanosys, Inc. | Light-emitting diode (led) devices comprising nanocrystals |
| US20100110728A1 (en) | 2007-03-19 | 2010-05-06 | Nanosys, Inc. | Light-emitting diode (led) devices comprising nanocrystals |
| US20080290798A1 (en) * | 2007-05-22 | 2008-11-27 | Mark Alejandro Quesada | LLT barrier layer for top emission display device, method and apparatus |
| US8343575B2 (en) | 2008-12-30 | 2013-01-01 | Nanosys, Inc. | Methods for encapsulating nanocrystals and resulting compositions |
| US10214686B2 (en) | 2008-12-30 | 2019-02-26 | Nanosys, Inc. | Methods for encapsulating nanocrystals and resulting compositions |
| US11198270B2 (en) | 2008-12-30 | 2021-12-14 | Nanosys, Inc. | Quantum dot films, lighting devices, and lighting methods |
| US9799914B2 (en) | 2009-01-29 | 2017-10-24 | Corning Incorporated | Barrier layer for thin film battery |
| US8084380B2 (en) * | 2009-02-27 | 2011-12-27 | Corning Incorporated | Transition metal doped Sn phosphate glass |
| US8563113B2 (en) | 2010-04-20 | 2013-10-22 | Corning Incorporated | Multi-laminate hermetic barriers and related structures and methods of hermetic sealing |
| US20120028011A1 (en) | 2010-07-27 | 2012-02-02 | Chong Pyung An | Self-passivating mechanically stable hermetic thin film |
| US10158057B2 (en) | 2010-10-28 | 2018-12-18 | Corning Incorporated | LED lighting devices |
| EP2450039A1 (en) | 2010-11-08 | 2012-05-09 | PAION UK Ltd. | Dosing regimen for sedation with CNS 7056 (Remimazolam) |
| KR20200039806A (ko) | 2010-11-10 | 2020-04-16 | 나노시스, 인크. | 양자 도트 필름들, 조명 디바이스들, 및 조명 방법들 |
| KR101931177B1 (ko) * | 2012-03-02 | 2018-12-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR101347541B1 (ko) * | 2012-03-02 | 2014-01-06 | 삼성디스플레이 주식회사 | 유기 발광 장치의 제조 방법 |
| KR101503401B1 (ko) * | 2012-03-05 | 2015-03-17 | 삼성디스플레이 주식회사 | 유기 발광 장치의 제조 방법 |
| KR101333138B1 (ko) | 2012-03-05 | 2013-11-26 | 삼성디스플레이 주식회사 | 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치 |
| KR102000709B1 (ko) * | 2012-08-31 | 2019-09-30 | 삼성디스플레이 주식회사 | 디스플레이 패널의 제조방법 |
| US10017849B2 (en) | 2012-11-29 | 2018-07-10 | Corning Incorporated | High rate deposition systems and processes for forming hermetic barrier layers |
| US9666763B2 (en) | 2012-11-30 | 2017-05-30 | Corning Incorporated | Glass sealing with transparent materials having transient absorption properties |
| KR101434367B1 (ko) | 2012-12-14 | 2014-08-27 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
| JP6186377B2 (ja) | 2012-12-18 | 2017-08-23 | パイオニア株式会社 | 発光装置 |
| US8754434B1 (en) | 2013-01-28 | 2014-06-17 | Corning Incorporated | Flexible hermetic thin film with light extraction layer |
| AR094963A1 (es) | 2013-03-04 | 2015-09-09 | Ono Pharmaceutical Co | Reacción de oxidación excelente en el índice de conversión |
| KR20140120541A (ko) * | 2013-04-03 | 2014-10-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| KR102072805B1 (ko) | 2013-04-15 | 2020-02-04 | 삼성디스플레이 주식회사 | 유기발광표시장치 및 그의 제조방법 |
| KR102072806B1 (ko) | 2013-04-18 | 2020-03-03 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 이의 제조 방법 |
| KR101444065B1 (ko) | 2013-04-26 | 2014-09-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| KR101563203B1 (ko) | 2013-04-30 | 2015-10-27 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| WO2017156048A1 (en) * | 2016-03-10 | 2017-09-14 | Corning Incorporated | Sealed devices comprising transparent laser weld regions |
| CN105377783B (zh) | 2013-05-10 | 2019-03-08 | 康宁股份有限公司 | 采用低熔融玻璃或薄吸收膜对透明玻璃片进行激光焊接 |
| KR102093391B1 (ko) | 2013-07-12 | 2020-03-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| KR20150007865A (ko) | 2013-07-12 | 2015-01-21 | 삼성디스플레이 주식회사 | 스퍼터링 타겟의 제조 방법, 그 방법으로 제조된 스퍼터링 타겟 및 그 스퍼터링 타겟을 이용하여 유기 발광 표시 장치를 제조하는 방법 |
| KR102093392B1 (ko) | 2013-07-25 | 2020-03-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
| KR102096053B1 (ko) | 2013-07-25 | 2020-04-02 | 삼성디스플레이 주식회사 | 유기발광표시장치의 제조방법 |
| KR20150012540A (ko) * | 2013-07-25 | 2015-02-04 | 삼성디스플레이 주식회사 | 유기발광표시장치의 제조방법. |
| KR102120896B1 (ko) | 2013-07-25 | 2020-06-10 | 삼성디스플레이 주식회사 | 대향 타겟 스퍼터링 장치를 이용한 유기발광표시장치 및 그 제조방법 |
| KR102085319B1 (ko) * | 2013-07-30 | 2020-03-06 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 이의 제조 방법 |
| KR20150016780A (ko) | 2013-08-05 | 2015-02-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| KR20150143966A (ko) | 2014-06-13 | 2015-12-24 | 삼성디스플레이 주식회사 | 표시 장치 제조 방법 |
| KR102278605B1 (ko) | 2014-09-25 | 2021-07-19 | 삼성디스플레이 주식회사 | 저온 점도변화 조성물, 표시 장치 및 이의 제조 방법 |
| CN105336878A (zh) * | 2015-09-29 | 2016-02-17 | 北京维信诺光电技术有限公司 | 一种oled显示器件及其封装工艺 |
| US10647608B2 (en) * | 2016-01-08 | 2020-05-12 | Yej Glass Co., Ltd. | Fluorinated tin-based glass frit and method for manufacturing same |
| KR20190069840A (ko) | 2017-12-12 | 2019-06-20 | 이수후 | 풀 용기 |
| CN109994643B (zh) | 2018-01-02 | 2021-02-02 | 京东方科技集团股份有限公司 | 有机发光二极管器件及其制造方法、显示基板、显示装置 |
| US10811330B1 (en) | 2018-02-02 | 2020-10-20 | Verily Life Sciences Llc | Miniaturized electronic devices and related methods |
| CN109390498A (zh) * | 2018-11-29 | 2019-02-26 | 云谷(固安)科技有限公司 | 显示面板及其制备方法 |
| KR200493125Y1 (ko) | 2020-03-16 | 2021-02-03 | 이수후 | 풀 용기 |
Family Cites Families (211)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1615506A (en) | 1925-12-08 | 1927-01-25 | George G Felt | Cap attachment for fountain pens |
| US3622439A (en) | 1968-05-23 | 1971-11-23 | Tee Pak Inc | Oxygen impermeable film laminate |
| US3932693A (en) | 1970-10-19 | 1976-01-13 | Continental Can Company, Inc. | Laminated packaging film having low vapor and gas permeability |
| US3720097A (en) * | 1971-01-21 | 1973-03-13 | Univ Pennsylvania | Apparatus and method for measuring mammalian blood viscosity |
| US3795976A (en) * | 1972-10-16 | 1974-03-12 | Hitachi Ltd | Method of producing semiconductor device |
| US3828960A (en) | 1972-11-10 | 1974-08-13 | Dow Chemical Co | Heat insulating container having plastic walls retaining vacuum |
| DE2431917A1 (de) * | 1974-07-03 | 1976-01-22 | Bbc Brown Boveri & Cie | Glaspassiviertes halbleiterbauelement fuer hohe leistungen und verfahren zu seiner herstellung |
| US4040874A (en) * | 1975-08-04 | 1977-08-09 | General Electric Company | Semiconductor element having a polymeric protective coating and glass coating overlay |
| US4077588A (en) | 1975-09-15 | 1978-03-07 | Hurst Gerald L | Permanently buoyant balloon |
| JPS5626395A (en) * | 1979-08-10 | 1981-03-13 | Fujitsu Ltd | El display unit |
| US4314031A (en) * | 1980-06-17 | 1982-02-02 | Corning Glass Works | Tin-phosphorus oxyfluoride glasses |
| US4374391A (en) | 1980-09-24 | 1983-02-15 | Bell Telephone Laboratories, Incorporated | Device fabrication procedure |
| US4702963A (en) | 1981-04-03 | 1987-10-27 | Optical Coating Laboratory, Inc. | Flexible polymer film with vapor impermeable coating |
| DE3201482A1 (de) | 1982-01-20 | 1983-09-08 | Bayer Ag, 5090 Leverkusen | Mehrschichten-flaechengebilde |
| US4379070A (en) * | 1982-04-26 | 1983-04-05 | Corning Glass Works | Tin-phosphorus oxyfluoride glass containing aromatic organic compound |
| DE3334845A1 (de) | 1983-09-27 | 1985-04-11 | Dow Chemical Handels- und Vertriebsgesellschaft mbH, 2610 Stade | Ueberzugszusammensetzung und ihre verwendung zur herstellung von sauerstoffdichten beschichtungen auf kunststoffgegenstaenden |
| JPS60161146A (ja) | 1984-01-31 | 1985-08-22 | 株式会社クラレ | 耐屈曲疲労に優れたフレキシブルな気体遮断性積層包装材よりなるバッグインボックス内容器の構成材 |
| FI73923C (fi) | 1985-11-27 | 1991-01-01 | Wihuri Oy | Polyamidhaltig maongskiktsfilm. |
| JP2632673B2 (ja) | 1986-09-14 | 1997-07-23 | 東洋紡績 株式会社 | 液晶表示パネル用電極基板 |
| US4908272A (en) | 1987-04-27 | 1990-03-13 | Mitsubishi Gas Chemical Company, Inc. | Gas-barrier multilayered structure |
| AU616736B2 (en) | 1988-03-03 | 1991-11-07 | Asahi Glass Company Limited | Amorphous oxide film and article having such film thereon |
| US4859513A (en) | 1988-05-09 | 1989-08-22 | International Paper Company | Oxygen impermeable leak free container |
| EP0394519B1 (en) | 1989-04-26 | 1994-02-02 | Fujimori Kogyo Co., Ltd. | Liquid crystal display panel incorporating an optical phase shifting substrate |
| CA2027031A1 (en) * | 1989-10-18 | 1991-04-19 | Loren A. Haluska | Hermetic substrate coatings in an inert gas atmosphere |
| US5792550A (en) | 1989-10-24 | 1998-08-11 | Flex Products, Inc. | Barrier film having high colorless transparency and method |
| US5183684A (en) | 1989-11-20 | 1993-02-02 | Dow Corning Corporation | Single and multilayer coatings containing aluminum nitride |
| JP2936276B2 (ja) * | 1990-02-27 | 1999-08-23 | 日本真空技術株式会社 | 透明導電膜の製造方法およびその製造装置 |
| US5084356A (en) | 1990-04-20 | 1992-01-28 | E. I. Du Pont De Nemours And Company | Film coated with glass barrier layer with metal dopant |
| US6524698B1 (en) | 1990-09-27 | 2003-02-25 | Helmuth Schmoock | Fluid impermeable foil |
| US5089446A (en) | 1990-10-09 | 1992-02-18 | Corning Incorporated | Sealing materials and glasses |
| US5110668A (en) | 1990-12-21 | 1992-05-05 | General Electric Company | Flexible laminate having copolyetherester adhesive |
| SE468635B (sv) | 1991-01-09 | 1993-02-22 | Tetra Alfa Holdings | Foerpackningsmaterial jaemte anvaendning av materialet foer framstaellning av behaallare med goda syrgastaethetsegenskaper |
| SE502397C2 (sv) | 1991-05-03 | 1995-10-16 | Tetra Laval Holdings & Finance | Förpackningslaminat med goda förseglings- och barriäregenskaper samt av förpackningslaminatet framställda förpackningsbehållare |
| DE4123127C2 (de) | 1991-07-12 | 1996-06-20 | Hoechst Ag | Mehrschichtenverbundfolie mit verbesserter Gasbarrierewirkung |
| JP3158667B2 (ja) | 1991-08-01 | 2001-04-23 | セイコーエプソン株式会社 | 液晶表示素子の製造方法及び液晶表示素子の再生方法 |
| US5211995A (en) | 1991-09-30 | 1993-05-18 | Manfred R. Kuehnle | Method of protecting an organic surface by deposition of an inorganic refractory coating thereon |
| CA2123809A1 (en) | 1991-12-18 | 1993-06-24 | Debra L. Wilfong | Multilayered barrier structures |
| US5306533A (en) | 1992-04-27 | 1994-04-26 | Combibloc, Inc. | Oxygen barrier container |
| NZ248674A (en) | 1992-09-18 | 1996-03-26 | Grace W R & Co | Heat-shrinkable multilayer film comprising a layer of propylene polymer or copolymer and hydrocarbon resin, and outer layers of various other polymers |
| US5462779A (en) | 1992-10-02 | 1995-10-31 | Consorzio Ce.Te.V. Centro Tecnologie Del Vuoto | Thin film multilayer structure as permeation barrier on plastic film |
| US5641559A (en) | 1992-10-23 | 1997-06-24 | Toyo Seikan Kaisha, Ltd. | Gas-tight laminated plastic film containing polymer of organosilicic compound |
| EP0638939A3 (en) | 1993-07-19 | 1997-08-20 | Matsushita Electric Industrial Co Ltd | Solar cell with a layer of glass with a low melting point. |
| US5567488A (en) | 1993-09-16 | 1996-10-22 | The Dow Chemical Company | Multilayer barrier film for transdermal drug delivery system and ostomy applications |
| EP0646611B1 (en) | 1993-09-30 | 1999-01-27 | Toppan Printing Co., Ltd. | Gas barrier laminated material |
| US6403176B1 (en) | 1993-12-08 | 2002-06-11 | Andre Patouraux | Packaging laminate for bags |
| US5668663A (en) * | 1994-05-05 | 1997-09-16 | Donnelly Corporation | Electrochromic mirrors and devices |
| US5625729A (en) | 1994-08-12 | 1997-04-29 | Brown; Thomas G. | Optoelectronic device for coupling between an external optical wave and a local optical wave for optical modulators and detectors |
| EP0701897B1 (en) | 1994-09-16 | 2001-04-18 | Cryovac, Inc. | Thermoplastic multilayer film for use in packaging water |
| EP0705757A1 (en) | 1994-10-07 | 1996-04-10 | Rhone-Poulenc Inc. | Lighter than air balloons |
| DE4438359C2 (de) | 1994-10-27 | 2001-10-04 | Schott Glas | Behälter aus Kunststoff mit einer Sperrbeschichtung |
| DE69630829T2 (de) | 1995-02-02 | 2004-09-23 | Teijin Ltd. | Transparentes leitfähiges Flächenmaterial |
| EP0744285B1 (en) | 1995-05-24 | 1999-12-15 | Cryovac, Inc. | Multilayer oxygen barrier packaging film |
| US6211560B1 (en) * | 1995-06-16 | 2001-04-03 | The United States Of America As Represented By The Secretary Of The Air Force | Voltage tunable schottky diode photoemissive infrared detector |
| EP0868363B1 (en) | 1995-12-20 | 2003-11-26 | Tetra Laval Holdings & Finance SA | Method of producing a laminated packaging material |
| TW434301B (en) | 1996-01-30 | 2001-05-16 | Becton Dickinson Co | Non-ideal barrier coating composition comprising organic and inorganic materials |
| CA2200829C (en) | 1996-03-25 | 2006-02-21 | Toru Hanada | Liquid crystal display element with a transparent electrode substrate, and the transparent electrode substrate |
| GB2318680B (en) * | 1996-10-24 | 2001-11-07 | Univ Surrey | Optoelectronic semiconductor devices |
| US6294420B1 (en) * | 1997-01-31 | 2001-09-25 | Texas Instruments Incorporated | Integrated circuit capacitor |
| FR2759755B1 (fr) | 1997-02-17 | 1999-04-02 | Atochem Elf Sa | Membrane elastique impermeable aux gaz et accumulateur hydropneumatique equipe de cette membrane |
| JP3334558B2 (ja) * | 1997-04-23 | 2002-10-15 | 富士レビオ株式会社 | 酵素免疫測定方法及び試験片 |
| US6074717A (en) | 1997-07-29 | 2000-06-13 | Dayco Products, Inc. | Flexible hose having an aluminum barrier layer to prevent ingestion of oxygen |
| JP3900617B2 (ja) * | 1997-09-17 | 2007-04-04 | カシオ計算機株式会社 | 発光素子及び発光素子用の保護材料 |
| JP3906325B2 (ja) | 1997-10-09 | 2007-04-18 | テトラ ラバル ホールデイングス アンド ファイナンス エス エイ | 気体及び芳香バリア特性を備える包装積層体 |
| KR100247935B1 (ko) * | 1997-10-22 | 2000-03-15 | 윤종용 | 오산화 이탄탈륨 유전체막을 갖는 커패시터 형성방법 |
| KR19990061716A (ko) * | 1997-12-31 | 1999-07-26 | 윤종용 | 비스(디알킬말레이미드) 유도체 및 이로부터 형성된 광통신용 폴리에테르이미드 |
| JP3636914B2 (ja) * | 1998-02-16 | 2005-04-06 | 株式会社日鉱マテリアルズ | 高抵抗透明導電膜及び高抵抗透明導電膜の製造方法並びに高抵抗透明導電膜形成用スパッタリングターゲット |
| JP3845853B2 (ja) * | 1998-04-06 | 2006-11-15 | 日本電気硝子株式会社 | ホウリン酸スズ系ガラス及び封着材料 |
| US6465101B1 (en) | 1998-04-28 | 2002-10-15 | General Electric Company | Multilayer plastic articles |
| US6683094B2 (en) * | 1998-07-02 | 2004-01-27 | Aventis Pharmaceuticals Inc. | Antihistaminic piperidine derivatives and intermediates for the preparation thereof |
| WO2000005069A1 (en) | 1998-07-24 | 2000-02-03 | Japan Polyolefins Co., Ltd. | Gas barrier laminate, process for producing the same, and paper container made using the laminate |
| US6146225A (en) | 1998-07-30 | 2000-11-14 | Agilent Technologies, Inc. | Transparent, flexible permeability barrier for organic electroluminescent devices |
| US6635989B1 (en) * | 1998-08-03 | 2003-10-21 | E. I. Du Pont De Nemours And Company | Encapsulation of polymer-based solid state devices with inorganic materials |
| JP2000109726A (ja) | 1998-09-30 | 2000-04-18 | Dow Corning Toray Silicone Co Ltd | ガスバリア用組成物および樹脂成形体 |
| US6249014B1 (en) * | 1998-10-01 | 2001-06-19 | Ramtron International Corporation | Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices |
| JP3802244B2 (ja) | 1998-10-02 | 2006-07-26 | 三洋化成工業株式会社 | 燃料油用清浄剤及び燃料油組成物 |
| US6271150B1 (en) | 1998-11-30 | 2001-08-07 | North Carolina State University | Methods of raising reflow temperature of glass alloys by thermal treatment in steam, and microelectronic structures formed thereby |
| US6268695B1 (en) * | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| US6321571B1 (en) * | 1998-12-21 | 2001-11-27 | Corning Incorporated | Method of making glass structures for flat panel displays |
| DE19920002A1 (de) | 1999-05-03 | 2000-11-09 | Sms Demag Ag | Gichtverschluß für Schachtöfen, insbesondere Hochöfen mit einem Guteinlauftrichter |
| US6355125B1 (en) * | 1999-03-26 | 2002-03-12 | Agfa-Gevaert | Method for making an electric or electronic module comprising a glass laminate |
| HUP0200536A2 (en) * | 1999-04-28 | 2002-06-29 | Du Pont | Electroluminescent display, photo sensor and method for improving oxygen and moisture resistance of an organic electronic device |
| EP1060875A3 (de) | 1999-06-15 | 2001-12-12 | Alcan Technology & Management AG | Sterilisierbare Verbundfolie |
| JP4950400B2 (ja) | 1999-07-09 | 2012-06-13 | インスティチュート オブ マテリアルズ リサーチ アンド エンジニアリング | デバイスを封入するためのラミネート |
| US6083313A (en) | 1999-07-27 | 2000-07-04 | Advanced Refractory Technologies, Inc. | Hardcoats for flat panel display substrates |
| JP3951514B2 (ja) | 1999-08-11 | 2007-08-01 | 日本電気硝子株式会社 | シリカリン酸スズ系ガラス及び封着材料 |
| US6660409B1 (en) | 1999-09-16 | 2003-12-09 | Panasonic Communications Co., Ltd | Electronic device and process for producing the same |
| TW432689B (en) * | 1999-10-18 | 2001-05-01 | Taiwan Semiconductor Mfg | Fabricating method of stacked capacitor |
| US6413645B1 (en) * | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
| US6866901B2 (en) * | 1999-10-25 | 2005-03-15 | Vitex Systems, Inc. | Method for edge sealing barrier films |
| US6623861B2 (en) | 2001-04-16 | 2003-09-23 | Battelle Memorial Institute | Multilayer plastic substrates |
| US7198832B2 (en) | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
| EP1096568A3 (en) * | 1999-10-28 | 2007-10-24 | Sony Corporation | Display apparatus and method for fabricating the same |
| US6244441B1 (en) | 1999-11-10 | 2001-06-12 | Cryovac, Inc. | Heat sealable barrier film for fluid fillable packaging cushions and cushions made therefrom |
| US6530477B1 (en) | 1999-11-10 | 2003-03-11 | Joseph G. Martorano | Flexible packaging for maintaining the efficacy of chemicals |
| US6961490B2 (en) * | 2000-01-27 | 2005-11-01 | Unaxis-Balzers Aktiengesellschaft | Waveguide plate and process for its production and microtitre plate |
| JP3536763B2 (ja) * | 2000-02-04 | 2004-06-14 | 日本電気株式会社 | 封止装置 |
| WO2001065167A1 (en) | 2000-03-02 | 2001-09-07 | Pearl Technology Holdings, Llc | Inflatable structure for supporting an article of manufacture |
| US20010038894A1 (en) * | 2000-03-14 | 2001-11-08 | Minoru Komada | Gas barrier film |
| US6805998B2 (en) | 2000-03-24 | 2004-10-19 | Cymbet Corporation | Method and apparatus for integrated-battery devices |
| US6777871B2 (en) * | 2000-03-31 | 2004-08-17 | General Electric Company | Organic electroluminescent devices with enhanced light extraction |
| US6657232B2 (en) * | 2000-04-17 | 2003-12-02 | Virginia Commonwealth University | Defect reduction in GaN and related materials |
| US6492026B1 (en) | 2000-04-20 | 2002-12-10 | Battelle Memorial Institute | Smoothing and barrier layers on high Tg substrates |
| US6870207B2 (en) * | 2000-04-24 | 2005-03-22 | The University Of Connecticut | III-V charge coupled device suitable for visible, near and far infra-red detection |
| AU2001259540A1 (en) | 2000-05-04 | 2001-11-12 | Pearl Technology Holdings, Llc | Inflatable organic light emitting diode toys |
| US6193379B1 (en) * | 2000-06-09 | 2001-02-27 | Gentex Corporation | Electrochromic assembly including at least one polymeric substrate |
| AU5400501A (en) | 2000-06-27 | 2002-01-03 | Canon Kabushiki Kaisha | Photovoltaic element, producing method therefor, and solar cell modules |
| DE10039366A1 (de) | 2000-08-11 | 2002-02-21 | Mitsubishi Polyester Film Gmbh | Mindestens dreischichtige transparente Polyesterfolie, Verfahren zu ihrer Herstellung und ihre Verwendung |
| DE10047043A1 (de) | 2000-09-22 | 2002-04-11 | Wolff Walsrode Ag | Folienlaminate als Hochbarrierefolien und deren Verwendung in Vakuumisolierpaneelen |
| JP2002187231A (ja) * | 2000-10-13 | 2002-07-02 | Dainippon Printing Co Ltd | バリア性フィルムおよびその製造法 |
| US7142296B2 (en) * | 2000-10-30 | 2006-11-28 | Sru Biosystems, Inc. | Method and apparatus for detecting biomolecular interactions |
| US6503421B1 (en) | 2000-11-01 | 2003-01-07 | Corning Incorporated | All polymer process compatible optical polymer material |
| EP1207572A1 (en) | 2000-11-15 | 2002-05-22 | Dr. Sugnaux Consulting | Mesoporous electrodes for electrochemical cells and their production method |
| JP4848583B2 (ja) | 2000-11-21 | 2011-12-28 | 大日本印刷株式会社 | ハードコート層を有するフィルムの製造方法 |
| EP1401731A2 (en) | 2000-11-29 | 2004-03-31 | American Aerogel Corporation | Insulated barriers and methods for producing same |
| US6608360B2 (en) * | 2000-12-15 | 2003-08-19 | University Of Houston | One-chip micro-integrated optoelectronic sensor |
| US6461681B2 (en) * | 2001-01-08 | 2002-10-08 | Hewlett-Packard Company | Method of treating a surface of a polyimide |
| JP4272819B2 (ja) | 2001-01-10 | 2009-06-03 | キヤノン株式会社 | 有機発光素子 |
| EP1409584B1 (en) * | 2001-02-13 | 2010-01-20 | GLS Corporation | Removable seal of essentially gas-impermeable thermoplastic elastomer |
| US6849171B2 (en) * | 2001-03-05 | 2005-02-01 | Fuji Xerox Co., Ltd. | Light waveguide forming method, electrolyte solution, light waveguide forming apparatus and light waveguide |
| US6664137B2 (en) * | 2001-03-29 | 2003-12-16 | Universal Display Corporation | Methods and structures for reducing lateral diffusion through cooperative barrier layers |
| US6630980B2 (en) | 2001-04-17 | 2003-10-07 | General Electric Company | Transparent flexible barrier for liquid crystal display devices and method of making the same |
| US6864435B2 (en) | 2001-04-25 | 2005-03-08 | Alien Technology Corporation | Electrical contacts for flexible displays |
| US6774300B2 (en) * | 2001-04-27 | 2004-08-10 | Adrena, Inc. | Apparatus and method for photovoltaic energy production based on internal charge emission in a solid-state heterostructure |
| WO2002091064A2 (en) | 2001-05-04 | 2002-11-14 | General Atomics | O2 and h2o barrier material |
| TW570876B (en) | 2001-05-11 | 2004-01-11 | Toyo Seikan Kaisha Ltd | Silicon oxide film |
| JP3678361B2 (ja) * | 2001-06-08 | 2005-08-03 | 大日本印刷株式会社 | ガスバリアフィルム |
| DE10130666A1 (de) | 2001-06-28 | 2003-01-23 | Applied Films Gmbh & Co Kg | Softcoat |
| CA2352567A1 (en) | 2001-07-06 | 2003-01-06 | Mohamed Latreche | Translucent material displaying ultra-low transport of gases and vapors, and method for its production |
| JP2003020235A (ja) | 2001-07-06 | 2003-01-24 | Otsuka Ohmi Ceramics Co Ltd | 立体模様付きガラス板の製造方法 |
| US6664730B2 (en) * | 2001-07-09 | 2003-12-16 | Universal Display Corporation | Electrode structure of el device |
| FI117622B (fi) | 2001-07-13 | 2006-12-29 | Stora Enso Oyj | Polymeeripinnoitteinen kuumasaumattava pakkausmateriaali, sen valmistusmenetelmä sekä sen käyttö suljettuun pakkaukseen |
| KR100413450B1 (ko) * | 2001-07-20 | 2003-12-31 | 엘지전자 주식회사 | 표시소자의 보호막 구조 |
| CN1317421C (zh) | 2001-08-20 | 2007-05-23 | 诺华等离子公司 | 气体和蒸气低渗透性的涂层 |
| US6806145B2 (en) * | 2001-08-31 | 2004-10-19 | Asm International, N.V. | Low temperature method of forming a gate stack with a high k layer deposited over an interfacial oxide layer |
| US6734370B2 (en) | 2001-09-07 | 2004-05-11 | Irvine Sensors Corporation | Multilayer modules with flexible substrates |
| TW508808B (en) * | 2001-09-14 | 2002-11-01 | Winbond Electronics Corp | Stacked type capacitor structure and its manufacturing method |
| JP2003109775A (ja) * | 2001-09-28 | 2003-04-11 | Sony Corp | 有機電界発光素子 |
| FR2830206B1 (fr) | 2001-09-28 | 2004-07-23 | Corning Inc | Dispositif microfluidique et sa fabrication |
| JP2003128720A (ja) | 2001-10-19 | 2003-05-08 | Sunallomer Ltd | オレフィン重合用固体助触媒成分、オレフィン重合用触媒およびイオン含有化合物 |
| KR100768182B1 (ko) * | 2001-10-26 | 2007-10-17 | 삼성에스디아이 주식회사 | 유기 전자 발광 소자와 그 제조방법 |
| US6888305B2 (en) * | 2001-11-06 | 2005-05-03 | Universal Display Corporation | Encapsulation structure that acts as a multilayer mirror |
| JP2003142579A (ja) * | 2001-11-07 | 2003-05-16 | Hitachi Ltd | 半導体装置の製造方法および半導体装置 |
| US6486549B1 (en) * | 2001-11-10 | 2002-11-26 | Bridge Semiconductor Corporation | Semiconductor module with encapsulant base |
| SG114514A1 (en) | 2001-11-28 | 2005-09-28 | Univ Singapore | Organic light emitting diode (oled) |
| JP2005513738A (ja) * | 2001-12-20 | 2005-05-12 | アイファイア テクノロジー コーポレーション | エレクトロルミネセンスディスプレイの安定化電極 |
| US6936131B2 (en) * | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| KR100845557B1 (ko) * | 2002-02-20 | 2008-07-10 | 삼성전자주식회사 | 액티브 매트릭스형 유기전계발광 표시장치 및 그 제조방법 |
| US6876143B2 (en) * | 2002-11-19 | 2005-04-05 | John James Daniels | Organic light active devices and methods for fabricating the same |
| JP2003275575A (ja) | 2002-03-22 | 2003-09-30 | Nippon Sheet Glass Co Ltd | マイクロ化学システム用チップ部材のチャネル形成方法、及び該形成方法によってチャネルが形成されたマイクロ化学システム用チップ部材 |
| US6891330B2 (en) * | 2002-03-29 | 2005-05-10 | General Electric Company | Mechanically flexible organic electroluminescent device with directional light emission |
| US20030183915A1 (en) | 2002-04-02 | 2003-10-02 | Motorola, Inc. | Encapsulated organic semiconductor device and method |
| US20030188685A1 (en) | 2002-04-08 | 2003-10-09 | Applied Materials, Inc. | Laser drilled surfaces for substrate processing chambers |
| KR100537611B1 (ko) * | 2002-04-10 | 2005-12-19 | 삼성에스디아이 주식회사 | 유기 전계 발광소자 및 그 제조방법 |
| US6835950B2 (en) * | 2002-04-12 | 2004-12-28 | Universal Display Corporation | Organic electronic devices with pressure sensitive adhesive layer |
| US7268486B2 (en) * | 2002-04-15 | 2007-09-11 | Schott Ag | Hermetic encapsulation of organic, electro-optical elements |
| US20030203210A1 (en) * | 2002-04-30 | 2003-10-30 | Vitex Systems, Inc. | Barrier coatings and methods of making same |
| US6949389B2 (en) * | 2002-05-02 | 2005-09-27 | Osram Opto Semiconductors Gmbh | Encapsulation for organic light emitting diodes devices |
| US6655788B1 (en) * | 2002-05-17 | 2003-12-02 | Viztec Inc. | Composite structure for enhanced flexibility of electro-optic displays with sliding layers |
| US6743524B2 (en) | 2002-05-23 | 2004-06-01 | General Electric Company | Barrier layer for an article and method of making said barrier layer by expanding thermal plasma |
| JP2004010843A (ja) | 2002-06-11 | 2004-01-15 | Idemitsu Petrochem Co Ltd | ポリ乳酸樹脂組成物 |
| US20040033379A1 (en) | 2002-06-12 | 2004-02-19 | Avery Dennison Corporation | Low permeability materials and coatings |
| JP4093347B2 (ja) | 2002-06-19 | 2008-06-04 | Agcテクノグラス株式会社 | 点火プラグ用封着ガラスおよび点火プラグ |
| JP4045870B2 (ja) | 2002-06-20 | 2008-02-13 | 富士ゼロックス株式会社 | 光学素子作製方法、これに用いる電着液および光学素子製造装置 |
| US7107592B2 (en) * | 2002-07-25 | 2006-09-12 | Sun Microsystems, Inc. | Method, system, and program for making objects available for access to a client over a network |
| US20040043138A1 (en) | 2002-08-21 | 2004-03-04 | Ramesh Jagannathan | Solid state lighting using compressed fluid coatings |
| JP2004095953A (ja) * | 2002-09-02 | 2004-03-25 | Canon Inc | 窒化シリコンの堆積膜形成方法 |
| FR2843899A1 (fr) * | 2002-09-03 | 2004-03-05 | Corning Inc | Depot d'un film sur un substrat |
| US7224116B2 (en) * | 2002-09-11 | 2007-05-29 | Osram Opto Semiconductors Gmbh | Encapsulation of active electronic devices |
| US20040229051A1 (en) | 2003-05-15 | 2004-11-18 | General Electric Company | Multilayer coating package on flexible substrates for electro-optical devices |
| US7015640B2 (en) * | 2002-09-11 | 2006-03-21 | General Electric Company | Diffusion barrier coatings having graded compositions and devices incorporating the same |
| US7193364B2 (en) * | 2002-09-12 | 2007-03-20 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Encapsulation for organic devices |
| JP2004111059A (ja) * | 2002-09-13 | 2004-04-08 | Sony Corp | 表示装置 |
| GB2421117B (en) * | 2002-09-17 | 2006-09-27 | Dainippon Printing Co Ltd | Method of manufacturing a light emitting display panel and a light emitting diplay panel |
| US7138293B2 (en) * | 2002-10-04 | 2006-11-21 | Dalsa Semiconductor Inc. | Wafer level packaging technique for microdevices |
| ITMI20022159A1 (it) | 2002-10-11 | 2004-04-12 | Tecno Coating Engineering S R L | Pellicola multistrato termoretraibile avente barriera all'ossigeno ed al vapore acqueo, una migliorata resistenza meccanica e buone caratteristiche ottiche e ridotto effetto curling. |
| US7015639B2 (en) * | 2002-10-22 | 2006-03-21 | Osram Opto Semiconductors Gmbh | Electroluminescent devices and method of making transparent cathodes |
| US6878620B2 (en) * | 2002-11-12 | 2005-04-12 | Applied Materials, Inc. | Side wall passivation films for damascene cu/low k electronic devices |
| DK1420041T3 (da) | 2002-11-18 | 2010-08-09 | Icopal As | Fleksibelt foliemateriale |
| US7256427B2 (en) * | 2002-11-19 | 2007-08-14 | Articulated Technologies, Llc | Organic light active devices with particulated light active material in a carrier matrix |
| KR20050065680A (ko) | 2002-11-19 | 2005-06-29 | 다니엘즈 존 | 유기 및 무기 광 활성 장치들 |
| US20040100176A1 (en) * | 2002-11-21 | 2004-05-27 | Osram Opto Semiconductors Gmbh | Organic electronic device that filters colors |
| DE10256629B3 (de) * | 2002-12-03 | 2004-02-19 | Schott Glas | Vorzugsweise Pb- und As-freie optische Gläser mit Tg ≦ 500°C und deren Verwendung |
| US7086918B2 (en) * | 2002-12-11 | 2006-08-08 | Applied Materials, Inc. | Low temperature process for passivation applications |
| US6975067B2 (en) * | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
| US6787453B2 (en) * | 2002-12-23 | 2004-09-07 | Intel Corporation | Barrier film integrity on porous low k dielectrics by application of a hydrocarbon plasma treatment |
| US7372069B2 (en) * | 2003-01-14 | 2008-05-13 | Osram Opto Semiconductors Gmbh | Interface for UV-curable adhesives |
| US20040151934A1 (en) * | 2003-01-27 | 2004-08-05 | Schwark Dwight W. | Oxygen scavenging film with high slip properties |
| US20040157426A1 (en) * | 2003-02-07 | 2004-08-12 | Luc Ouellet | Fabrication of advanced silicon-based MEMS devices |
| JP4255844B2 (ja) * | 2003-02-24 | 2009-04-15 | ソニー株式会社 | 有機発光表示装置およびその製造方法 |
| JP2006519473A (ja) | 2003-03-04 | 2006-08-24 | ダウ・コーニング・コーポレイション | 有機発光ダイオード |
| EP1466997B1 (en) * | 2003-03-10 | 2012-02-22 | OSRAM Opto Semiconductors GmbH | Method for forming and arrangement of barrier layers on a polymeric substrate |
| US7018713B2 (en) * | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
| US7514149B2 (en) | 2003-04-04 | 2009-04-07 | Corning Incorporated | High-strength laminated sheet for optical applications |
| US7202602B2 (en) * | 2003-04-08 | 2007-04-10 | Organic Lighting Technologies Llc | Metal seal packaging for organic light emitting diode device |
| US6888172B2 (en) * | 2003-04-11 | 2005-05-03 | Eastman Kodak Company | Apparatus and method for encapsulating an OLED formed on a flexible substrate |
| US20040206953A1 (en) * | 2003-04-16 | 2004-10-21 | Robert Morena | Hermetically sealed glass package and method of fabrication |
| US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
| CN1791989A (zh) | 2003-05-16 | 2006-06-21 | 纳幕尔杜邦公司 | 通过原子层沉积形成的塑料基材阻挡层膜 |
| US20040234797A1 (en) | 2003-05-23 | 2004-11-25 | Cryovac, Inc. | Oxygen scavenging film with antifog properties |
| US7535017B2 (en) | 2003-05-30 | 2009-05-19 | Osram Opto Semiconductors Gmbh | Flexible multilayer packaging material and electronic devices with the packaging material |
| US20050051763A1 (en) | 2003-09-05 | 2005-03-10 | Helicon Research, L.L.C. | Nanophase multilayer barrier and process |
| JP2005174726A (ja) * | 2003-12-11 | 2005-06-30 | Tohoku Pioneer Corp | 有機el素子及びその形成方法 |
| JP4617933B2 (ja) | 2004-03-25 | 2011-01-26 | 旭硝子株式会社 | 軟化点が低いガラスを被覆したフィルム |
| JP2005285659A (ja) * | 2004-03-30 | 2005-10-13 | Toyota Industries Corp | 有機el装置及びその製造方法 |
| US20050241815A1 (en) | 2004-04-30 | 2005-11-03 | Philippe Caze | High thermal efficiency glass microfluidic channels and method for forming the same |
| JP2005322464A (ja) * | 2004-05-07 | 2005-11-17 | Canon Inc | 有機el素子 |
| JP4543777B2 (ja) | 2004-06-24 | 2010-09-15 | コニカミノルタビジネステクノロジーズ株式会社 | 穿孔処理装置及び画像形成装置 |
| US20060087230A1 (en) | 2004-10-22 | 2006-04-27 | Eastman Kodak Company | Desiccant film in top-emitting OLED |
| US20080206589A1 (en) | 2007-02-28 | 2008-08-28 | Bruce Gardiner Aitken | Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device |
| US7722929B2 (en) | 2005-08-18 | 2010-05-25 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
| EP2180078B1 (en) | 2005-08-25 | 2013-12-11 | Asahi Glass Company, Limited | Base with glass film |
-
2005
- 2005-08-18 US US11/207,691 patent/US20070040501A1/en not_active Abandoned
-
2006
- 2006-08-09 EP EP06800857.2A patent/EP1929559B1/en not_active Ceased
- 2006-08-09 JP JP2008526984A patent/JP5113054B2/ja not_active Expired - Fee Related
- 2006-08-09 KR KR1020087006506A patent/KR101353226B1/ko not_active Expired - Fee Related
- 2006-08-09 WO PCT/US2006/030670 patent/WO2007021627A1/en not_active Ceased
- 2006-08-09 CN CN200680030038.7A patent/CN101243562A/zh active Pending
- 2006-08-17 TW TW095130327A patent/TWI360904B/zh not_active IP Right Cessation
-
2014
- 2014-03-24 US US14/223,380 patent/US9050622B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007021627A1 (en) | 2007-02-22 |
| EP1929559A1 (en) | 2008-06-11 |
| US20070040501A1 (en) | 2007-02-22 |
| EP1929559B1 (en) | 2015-07-15 |
| TWI360904B (en) | 2012-03-21 |
| CN101243562A (zh) | 2008-08-13 |
| US9050622B2 (en) | 2015-06-09 |
| US20140234542A1 (en) | 2014-08-21 |
| KR101353226B1 (ko) | 2014-01-17 |
| JP2009505371A (ja) | 2009-02-05 |
| TW200719503A (en) | 2007-05-16 |
| KR20080045217A (ko) | 2008-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009505371A (ja) | デバイスの酸素および水分劣化を抑制する方法および得られるデバイス | |
| CN101542771B (zh) | 具有薄膜阻隔的挠性基板 | |
| TWI388039B (zh) | 密封技術及密閉性地密封元件 | |
| US8304990B2 (en) | Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device | |
| TWI472078B (zh) | 使用含亞錫離子的無機材料密閉性密封裝置的低溫燒結 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090806 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090806 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091105 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110628 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110928 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20111006 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111125 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120918 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121011 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151019 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5113054 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |