KR101353226B1 - 장치에 대한 산소 및 습기 분해의 억제방법 및 이에 따른장치 - Google Patents

장치에 대한 산소 및 습기 분해의 억제방법 및 이에 따른장치 Download PDF

Info

Publication number
KR101353226B1
KR101353226B1 KR1020087006506A KR20087006506A KR101353226B1 KR 101353226 B1 KR101353226 B1 KR 101353226B1 KR 1020087006506 A KR1020087006506 A KR 1020087006506A KR 20087006506 A KR20087006506 A KR 20087006506A KR 101353226 B1 KR101353226 B1 KR 101353226B1
Authority
KR
South Korea
Prior art keywords
glass
llt
delete delete
liquidus temperature
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020087006506A
Other languages
English (en)
Korean (ko)
Other versions
KR20080045217A (ko
Inventor
부르스 가드너 에이킨
마크 앨런 루이스
마크 알레한드로 퀘세다
Original Assignee
코닝 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닝 인코포레이티드 filed Critical 코닝 인코포레이티드
Publication of KR20080045217A publication Critical patent/KR20080045217A/ko
Application granted granted Critical
Publication of KR101353226B1 publication Critical patent/KR101353226B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/23—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron
    • C03C3/247—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron containing fluorine and phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Glass Compositions (AREA)
  • Laminated Bodies (AREA)
  • Surface Treatment Of Glass (AREA)
KR1020087006506A 2005-08-18 2006-08-09 장치에 대한 산소 및 습기 분해의 억제방법 및 이에 따른장치 Expired - Fee Related KR101353226B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/207,691 2005-08-18
US11/207,691 US20070040501A1 (en) 2005-08-18 2005-08-18 Method for inhibiting oxygen and moisture degradation of a device and the resulting device
PCT/US2006/030670 WO2007021627A1 (en) 2005-08-18 2006-08-09 Method for inhibiting oxygen and moisture degradation of a device and the resulting device

Publications (2)

Publication Number Publication Date
KR20080045217A KR20080045217A (ko) 2008-05-22
KR101353226B1 true KR101353226B1 (ko) 2014-01-17

Family

ID=37460166

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087006506A Expired - Fee Related KR101353226B1 (ko) 2005-08-18 2006-08-09 장치에 대한 산소 및 습기 분해의 억제방법 및 이에 따른장치

Country Status (7)

Country Link
US (2) US20070040501A1 (enExample)
EP (1) EP1929559B1 (enExample)
JP (1) JP5113054B2 (enExample)
KR (1) KR101353226B1 (enExample)
CN (1) CN101243562A (enExample)
TW (1) TWI360904B (enExample)
WO (1) WO2007021627A1 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080206589A1 (en) * 2007-02-28 2008-08-28 Bruce Gardiner Aitken Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7829147B2 (en) * 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
EP2180078B1 (en) * 2005-08-25 2013-12-11 Asahi Glass Company, Limited Base with glass film
BRPI0714886B8 (pt) 2006-07-10 2021-05-25 Paion Uk Ltd sais de benzodiazepina, seus usos e seus processos de preparação, e composição farmacêutica
US20080048178A1 (en) 2006-08-24 2008-02-28 Bruce Gardiner Aitken Tin phosphate barrier film, method, and apparatus
EP2121872B1 (en) * 2007-03-19 2015-12-09 Nanosys, Inc. Methods for encapsulating nanocrystals
US20100155749A1 (en) * 2007-03-19 2010-06-24 Nanosys, Inc. Light-emitting diode (led) devices comprising nanocrystals
US20100110728A1 (en) 2007-03-19 2010-05-06 Nanosys, Inc. Light-emitting diode (led) devices comprising nanocrystals
US20080290798A1 (en) * 2007-05-22 2008-11-27 Mark Alejandro Quesada LLT barrier layer for top emission display device, method and apparatus
US8343575B2 (en) 2008-12-30 2013-01-01 Nanosys, Inc. Methods for encapsulating nanocrystals and resulting compositions
US10214686B2 (en) 2008-12-30 2019-02-26 Nanosys, Inc. Methods for encapsulating nanocrystals and resulting compositions
US11198270B2 (en) 2008-12-30 2021-12-14 Nanosys, Inc. Quantum dot films, lighting devices, and lighting methods
US9799914B2 (en) 2009-01-29 2017-10-24 Corning Incorporated Barrier layer for thin film battery
US8084380B2 (en) * 2009-02-27 2011-12-27 Corning Incorporated Transition metal doped Sn phosphate glass
US8563113B2 (en) 2010-04-20 2013-10-22 Corning Incorporated Multi-laminate hermetic barriers and related structures and methods of hermetic sealing
US20120028011A1 (en) 2010-07-27 2012-02-02 Chong Pyung An Self-passivating mechanically stable hermetic thin film
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices
EP2450039A1 (en) 2010-11-08 2012-05-09 PAION UK Ltd. Dosing regimen for sedation with CNS 7056 (Remimazolam)
KR20200039806A (ko) 2010-11-10 2020-04-16 나노시스, 인크. 양자 도트 필름들, 조명 디바이스들, 및 조명 방법들
KR101931177B1 (ko) * 2012-03-02 2018-12-21 삼성디스플레이 주식회사 유기 발광 표시 장치
KR101347541B1 (ko) * 2012-03-02 2014-01-06 삼성디스플레이 주식회사 유기 발광 장치의 제조 방법
KR101503401B1 (ko) * 2012-03-05 2015-03-17 삼성디스플레이 주식회사 유기 발광 장치의 제조 방법
KR101333138B1 (ko) 2012-03-05 2013-11-26 삼성디스플레이 주식회사 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치
KR102000709B1 (ko) * 2012-08-31 2019-09-30 삼성디스플레이 주식회사 디스플레이 패널의 제조방법
US10017849B2 (en) 2012-11-29 2018-07-10 Corning Incorporated High rate deposition systems and processes for forming hermetic barrier layers
US9666763B2 (en) 2012-11-30 2017-05-30 Corning Incorporated Glass sealing with transparent materials having transient absorption properties
KR101434367B1 (ko) 2012-12-14 2014-08-27 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
JP6186377B2 (ja) 2012-12-18 2017-08-23 パイオニア株式会社 発光装置
US8754434B1 (en) 2013-01-28 2014-06-17 Corning Incorporated Flexible hermetic thin film with light extraction layer
AR094963A1 (es) 2013-03-04 2015-09-09 Ono Pharmaceutical Co Reacción de oxidación excelente en el índice de conversión
KR20140120541A (ko) * 2013-04-03 2014-10-14 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102072805B1 (ko) 2013-04-15 2020-02-04 삼성디스플레이 주식회사 유기발광표시장치 및 그의 제조방법
KR102072806B1 (ko) 2013-04-18 2020-03-03 삼성디스플레이 주식회사 유기 발광 디스플레이 장치 및 이의 제조 방법
KR101444065B1 (ko) 2013-04-26 2014-09-26 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR101563203B1 (ko) 2013-04-30 2015-10-27 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
WO2017156048A1 (en) * 2016-03-10 2017-09-14 Corning Incorporated Sealed devices comprising transparent laser weld regions
CN105377783B (zh) 2013-05-10 2019-03-08 康宁股份有限公司 采用低熔融玻璃或薄吸收膜对透明玻璃片进行激光焊接
KR102093391B1 (ko) 2013-07-12 2020-03-26 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20150007865A (ko) 2013-07-12 2015-01-21 삼성디스플레이 주식회사 스퍼터링 타겟의 제조 방법, 그 방법으로 제조된 스퍼터링 타겟 및 그 스퍼터링 타겟을 이용하여 유기 발광 표시 장치를 제조하는 방법
KR102093392B1 (ko) 2013-07-25 2020-03-26 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
KR102096053B1 (ko) 2013-07-25 2020-04-02 삼성디스플레이 주식회사 유기발광표시장치의 제조방법
KR20150012540A (ko) * 2013-07-25 2015-02-04 삼성디스플레이 주식회사 유기발광표시장치의 제조방법.
KR102120896B1 (ko) 2013-07-25 2020-06-10 삼성디스플레이 주식회사 대향 타겟 스퍼터링 장치를 이용한 유기발광표시장치 및 그 제조방법
KR102085319B1 (ko) * 2013-07-30 2020-03-06 삼성디스플레이 주식회사 유기 발광 디스플레이 장치 및 이의 제조 방법
KR20150016780A (ko) 2013-08-05 2015-02-13 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20150143966A (ko) 2014-06-13 2015-12-24 삼성디스플레이 주식회사 표시 장치 제조 방법
KR102278605B1 (ko) 2014-09-25 2021-07-19 삼성디스플레이 주식회사 저온 점도변화 조성물, 표시 장치 및 이의 제조 방법
CN105336878A (zh) * 2015-09-29 2016-02-17 北京维信诺光电技术有限公司 一种oled显示器件及其封装工艺
US10647608B2 (en) * 2016-01-08 2020-05-12 Yej Glass Co., Ltd. Fluorinated tin-based glass frit and method for manufacturing same
KR20190069840A (ko) 2017-12-12 2019-06-20 이수후 풀 용기
CN109994643B (zh) 2018-01-02 2021-02-02 京东方科技集团股份有限公司 有机发光二极管器件及其制造方法、显示基板、显示装置
US10811330B1 (en) 2018-02-02 2020-10-20 Verily Life Sciences Llc Miniaturized electronic devices and related methods
CN109390498A (zh) * 2018-11-29 2019-02-26 云谷(固安)科技有限公司 显示面板及其制备方法
KR200493125Y1 (ko) 2020-03-16 2021-02-03 이수후 풀 용기

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040113542A1 (en) 2002-12-11 2004-06-17 Applied Materials, Inc. Low temperature process for passivation applications

Family Cites Families (210)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1615506A (en) 1925-12-08 1927-01-25 George G Felt Cap attachment for fountain pens
US3622439A (en) 1968-05-23 1971-11-23 Tee Pak Inc Oxygen impermeable film laminate
US3932693A (en) 1970-10-19 1976-01-13 Continental Can Company, Inc. Laminated packaging film having low vapor and gas permeability
US3720097A (en) * 1971-01-21 1973-03-13 Univ Pennsylvania Apparatus and method for measuring mammalian blood viscosity
US3795976A (en) * 1972-10-16 1974-03-12 Hitachi Ltd Method of producing semiconductor device
US3828960A (en) 1972-11-10 1974-08-13 Dow Chemical Co Heat insulating container having plastic walls retaining vacuum
DE2431917A1 (de) * 1974-07-03 1976-01-22 Bbc Brown Boveri & Cie Glaspassiviertes halbleiterbauelement fuer hohe leistungen und verfahren zu seiner herstellung
US4040874A (en) * 1975-08-04 1977-08-09 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
US4077588A (en) 1975-09-15 1978-03-07 Hurst Gerald L Permanently buoyant balloon
JPS5626395A (en) * 1979-08-10 1981-03-13 Fujitsu Ltd El display unit
US4314031A (en) * 1980-06-17 1982-02-02 Corning Glass Works Tin-phosphorus oxyfluoride glasses
US4374391A (en) 1980-09-24 1983-02-15 Bell Telephone Laboratories, Incorporated Device fabrication procedure
US4702963A (en) 1981-04-03 1987-10-27 Optical Coating Laboratory, Inc. Flexible polymer film with vapor impermeable coating
DE3201482A1 (de) 1982-01-20 1983-09-08 Bayer Ag, 5090 Leverkusen Mehrschichten-flaechengebilde
US4379070A (en) * 1982-04-26 1983-04-05 Corning Glass Works Tin-phosphorus oxyfluoride glass containing aromatic organic compound
DE3334845A1 (de) 1983-09-27 1985-04-11 Dow Chemical Handels- und Vertriebsgesellschaft mbH, 2610 Stade Ueberzugszusammensetzung und ihre verwendung zur herstellung von sauerstoffdichten beschichtungen auf kunststoffgegenstaenden
JPS60161146A (ja) 1984-01-31 1985-08-22 株式会社クラレ 耐屈曲疲労に優れたフレキシブルな気体遮断性積層包装材よりなるバッグインボックス内容器の構成材
FI73923C (fi) 1985-11-27 1991-01-01 Wihuri Oy Polyamidhaltig maongskiktsfilm.
JP2632673B2 (ja) 1986-09-14 1997-07-23 東洋紡績 株式会社 液晶表示パネル用電極基板
US4908272A (en) 1987-04-27 1990-03-13 Mitsubishi Gas Chemical Company, Inc. Gas-barrier multilayered structure
AU616736B2 (en) 1988-03-03 1991-11-07 Asahi Glass Company Limited Amorphous oxide film and article having such film thereon
US4859513A (en) 1988-05-09 1989-08-22 International Paper Company Oxygen impermeable leak free container
EP0394519B1 (en) 1989-04-26 1994-02-02 Fujimori Kogyo Co., Ltd. Liquid crystal display panel incorporating an optical phase shifting substrate
CA2027031A1 (en) * 1989-10-18 1991-04-19 Loren A. Haluska Hermetic substrate coatings in an inert gas atmosphere
US5792550A (en) 1989-10-24 1998-08-11 Flex Products, Inc. Barrier film having high colorless transparency and method
US5183684A (en) 1989-11-20 1993-02-02 Dow Corning Corporation Single and multilayer coatings containing aluminum nitride
JP2936276B2 (ja) * 1990-02-27 1999-08-23 日本真空技術株式会社 透明導電膜の製造方法およびその製造装置
US5084356A (en) 1990-04-20 1992-01-28 E. I. Du Pont De Nemours And Company Film coated with glass barrier layer with metal dopant
US6524698B1 (en) 1990-09-27 2003-02-25 Helmuth Schmoock Fluid impermeable foil
US5089446A (en) 1990-10-09 1992-02-18 Corning Incorporated Sealing materials and glasses
US5110668A (en) 1990-12-21 1992-05-05 General Electric Company Flexible laminate having copolyetherester adhesive
SE468635B (sv) 1991-01-09 1993-02-22 Tetra Alfa Holdings Foerpackningsmaterial jaemte anvaendning av materialet foer framstaellning av behaallare med goda syrgastaethetsegenskaper
SE502397C2 (sv) 1991-05-03 1995-10-16 Tetra Laval Holdings & Finance Förpackningslaminat med goda förseglings- och barriäregenskaper samt av förpackningslaminatet framställda förpackningsbehållare
DE4123127C2 (de) 1991-07-12 1996-06-20 Hoechst Ag Mehrschichtenverbundfolie mit verbesserter Gasbarrierewirkung
JP3158667B2 (ja) 1991-08-01 2001-04-23 セイコーエプソン株式会社 液晶表示素子の製造方法及び液晶表示素子の再生方法
US5211995A (en) 1991-09-30 1993-05-18 Manfred R. Kuehnle Method of protecting an organic surface by deposition of an inorganic refractory coating thereon
CA2123809A1 (en) 1991-12-18 1993-06-24 Debra L. Wilfong Multilayered barrier structures
US5306533A (en) 1992-04-27 1994-04-26 Combibloc, Inc. Oxygen barrier container
NZ248674A (en) 1992-09-18 1996-03-26 Grace W R & Co Heat-shrinkable multilayer film comprising a layer of propylene polymer or copolymer and hydrocarbon resin, and outer layers of various other polymers
US5462779A (en) 1992-10-02 1995-10-31 Consorzio Ce.Te.V. Centro Tecnologie Del Vuoto Thin film multilayer structure as permeation barrier on plastic film
US5641559A (en) 1992-10-23 1997-06-24 Toyo Seikan Kaisha, Ltd. Gas-tight laminated plastic film containing polymer of organosilicic compound
EP0638939A3 (en) 1993-07-19 1997-08-20 Matsushita Electric Industrial Co Ltd Solar cell with a layer of glass with a low melting point.
US5567488A (en) 1993-09-16 1996-10-22 The Dow Chemical Company Multilayer barrier film for transdermal drug delivery system and ostomy applications
EP0646611B1 (en) 1993-09-30 1999-01-27 Toppan Printing Co., Ltd. Gas barrier laminated material
US6403176B1 (en) 1993-12-08 2002-06-11 Andre Patouraux Packaging laminate for bags
US5668663A (en) * 1994-05-05 1997-09-16 Donnelly Corporation Electrochromic mirrors and devices
US5625729A (en) 1994-08-12 1997-04-29 Brown; Thomas G. Optoelectronic device for coupling between an external optical wave and a local optical wave for optical modulators and detectors
EP0701897B1 (en) 1994-09-16 2001-04-18 Cryovac, Inc. Thermoplastic multilayer film for use in packaging water
EP0705757A1 (en) 1994-10-07 1996-04-10 Rhone-Poulenc Inc. Lighter than air balloons
DE4438359C2 (de) 1994-10-27 2001-10-04 Schott Glas Behälter aus Kunststoff mit einer Sperrbeschichtung
DE69630829T2 (de) 1995-02-02 2004-09-23 Teijin Ltd. Transparentes leitfähiges Flächenmaterial
EP0744285B1 (en) 1995-05-24 1999-12-15 Cryovac, Inc. Multilayer oxygen barrier packaging film
US6211560B1 (en) * 1995-06-16 2001-04-03 The United States Of America As Represented By The Secretary Of The Air Force Voltage tunable schottky diode photoemissive infrared detector
EP0868363B1 (en) 1995-12-20 2003-11-26 Tetra Laval Holdings & Finance SA Method of producing a laminated packaging material
TW434301B (en) 1996-01-30 2001-05-16 Becton Dickinson Co Non-ideal barrier coating composition comprising organic and inorganic materials
CA2200829C (en) 1996-03-25 2006-02-21 Toru Hanada Liquid crystal display element with a transparent electrode substrate, and the transparent electrode substrate
GB2318680B (en) * 1996-10-24 2001-11-07 Univ Surrey Optoelectronic semiconductor devices
US6294420B1 (en) * 1997-01-31 2001-09-25 Texas Instruments Incorporated Integrated circuit capacitor
FR2759755B1 (fr) 1997-02-17 1999-04-02 Atochem Elf Sa Membrane elastique impermeable aux gaz et accumulateur hydropneumatique equipe de cette membrane
JP3334558B2 (ja) * 1997-04-23 2002-10-15 富士レビオ株式会社 酵素免疫測定方法及び試験片
US6074717A (en) 1997-07-29 2000-06-13 Dayco Products, Inc. Flexible hose having an aluminum barrier layer to prevent ingestion of oxygen
JP3900617B2 (ja) * 1997-09-17 2007-04-04 カシオ計算機株式会社 発光素子及び発光素子用の保護材料
JP3906325B2 (ja) 1997-10-09 2007-04-18 テトラ ラバル ホールデイングス アンド ファイナンス エス エイ 気体及び芳香バリア特性を備える包装積層体
KR100247935B1 (ko) * 1997-10-22 2000-03-15 윤종용 오산화 이탄탈륨 유전체막을 갖는 커패시터 형성방법
KR19990061716A (ko) * 1997-12-31 1999-07-26 윤종용 비스(디알킬말레이미드) 유도체 및 이로부터 형성된 광통신용 폴리에테르이미드
JP3636914B2 (ja) * 1998-02-16 2005-04-06 株式会社日鉱マテリアルズ 高抵抗透明導電膜及び高抵抗透明導電膜の製造方法並びに高抵抗透明導電膜形成用スパッタリングターゲット
JP3845853B2 (ja) * 1998-04-06 2006-11-15 日本電気硝子株式会社 ホウリン酸スズ系ガラス及び封着材料
US6465101B1 (en) 1998-04-28 2002-10-15 General Electric Company Multilayer plastic articles
US6683094B2 (en) * 1998-07-02 2004-01-27 Aventis Pharmaceuticals Inc. Antihistaminic piperidine derivatives and intermediates for the preparation thereof
WO2000005069A1 (en) 1998-07-24 2000-02-03 Japan Polyolefins Co., Ltd. Gas barrier laminate, process for producing the same, and paper container made using the laminate
US6146225A (en) 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
US6635989B1 (en) * 1998-08-03 2003-10-21 E. I. Du Pont De Nemours And Company Encapsulation of polymer-based solid state devices with inorganic materials
JP2000109726A (ja) 1998-09-30 2000-04-18 Dow Corning Toray Silicone Co Ltd ガスバリア用組成物および樹脂成形体
US6249014B1 (en) * 1998-10-01 2001-06-19 Ramtron International Corporation Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices
JP3802244B2 (ja) 1998-10-02 2006-07-26 三洋化成工業株式会社 燃料油用清浄剤及び燃料油組成物
US6271150B1 (en) 1998-11-30 2001-08-07 North Carolina State University Methods of raising reflow temperature of glass alloys by thermal treatment in steam, and microelectronic structures formed thereby
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6321571B1 (en) * 1998-12-21 2001-11-27 Corning Incorporated Method of making glass structures for flat panel displays
DE19920002A1 (de) 1999-05-03 2000-11-09 Sms Demag Ag Gichtverschluß für Schachtöfen, insbesondere Hochöfen mit einem Guteinlauftrichter
US6355125B1 (en) * 1999-03-26 2002-03-12 Agfa-Gevaert Method for making an electric or electronic module comprising a glass laminate
HUP0200536A2 (en) * 1999-04-28 2002-06-29 Du Pont Electroluminescent display, photo sensor and method for improving oxygen and moisture resistance of an organic electronic device
EP1060875A3 (de) 1999-06-15 2001-12-12 Alcan Technology & Management AG Sterilisierbare Verbundfolie
JP4950400B2 (ja) 1999-07-09 2012-06-13 インスティチュート オブ マテリアルズ リサーチ アンド エンジニアリング デバイスを封入するためのラミネート
US6083313A (en) 1999-07-27 2000-07-04 Advanced Refractory Technologies, Inc. Hardcoats for flat panel display substrates
JP3951514B2 (ja) 1999-08-11 2007-08-01 日本電気硝子株式会社 シリカリン酸スズ系ガラス及び封着材料
US6660409B1 (en) 1999-09-16 2003-12-09 Panasonic Communications Co., Ltd Electronic device and process for producing the same
TW432689B (en) * 1999-10-18 2001-05-01 Taiwan Semiconductor Mfg Fabricating method of stacked capacitor
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6866901B2 (en) * 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
EP1096568A3 (en) * 1999-10-28 2007-10-24 Sony Corporation Display apparatus and method for fabricating the same
US6244441B1 (en) 1999-11-10 2001-06-12 Cryovac, Inc. Heat sealable barrier film for fluid fillable packaging cushions and cushions made therefrom
US6530477B1 (en) 1999-11-10 2003-03-11 Joseph G. Martorano Flexible packaging for maintaining the efficacy of chemicals
US6961490B2 (en) * 2000-01-27 2005-11-01 Unaxis-Balzers Aktiengesellschaft Waveguide plate and process for its production and microtitre plate
JP3536763B2 (ja) * 2000-02-04 2004-06-14 日本電気株式会社 封止装置
WO2001065167A1 (en) 2000-03-02 2001-09-07 Pearl Technology Holdings, Llc Inflatable structure for supporting an article of manufacture
US20010038894A1 (en) * 2000-03-14 2001-11-08 Minoru Komada Gas barrier film
US6805998B2 (en) 2000-03-24 2004-10-19 Cymbet Corporation Method and apparatus for integrated-battery devices
US6777871B2 (en) * 2000-03-31 2004-08-17 General Electric Company Organic electroluminescent devices with enhanced light extraction
US6657232B2 (en) * 2000-04-17 2003-12-02 Virginia Commonwealth University Defect reduction in GaN and related materials
US6492026B1 (en) 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
US6870207B2 (en) * 2000-04-24 2005-03-22 The University Of Connecticut III-V charge coupled device suitable for visible, near and far infra-red detection
AU2001259540A1 (en) 2000-05-04 2001-11-12 Pearl Technology Holdings, Llc Inflatable organic light emitting diode toys
US6193379B1 (en) * 2000-06-09 2001-02-27 Gentex Corporation Electrochromic assembly including at least one polymeric substrate
AU5400501A (en) 2000-06-27 2002-01-03 Canon Kabushiki Kaisha Photovoltaic element, producing method therefor, and solar cell modules
DE10039366A1 (de) 2000-08-11 2002-02-21 Mitsubishi Polyester Film Gmbh Mindestens dreischichtige transparente Polyesterfolie, Verfahren zu ihrer Herstellung und ihre Verwendung
DE10047043A1 (de) 2000-09-22 2002-04-11 Wolff Walsrode Ag Folienlaminate als Hochbarrierefolien und deren Verwendung in Vakuumisolierpaneelen
JP2002187231A (ja) * 2000-10-13 2002-07-02 Dainippon Printing Co Ltd バリア性フィルムおよびその製造法
US7142296B2 (en) * 2000-10-30 2006-11-28 Sru Biosystems, Inc. Method and apparatus for detecting biomolecular interactions
US6503421B1 (en) 2000-11-01 2003-01-07 Corning Incorporated All polymer process compatible optical polymer material
EP1207572A1 (en) 2000-11-15 2002-05-22 Dr. Sugnaux Consulting Mesoporous electrodes for electrochemical cells and their production method
JP4848583B2 (ja) 2000-11-21 2011-12-28 大日本印刷株式会社 ハードコート層を有するフィルムの製造方法
EP1401731A2 (en) 2000-11-29 2004-03-31 American Aerogel Corporation Insulated barriers and methods for producing same
US6608360B2 (en) * 2000-12-15 2003-08-19 University Of Houston One-chip micro-integrated optoelectronic sensor
US6461681B2 (en) * 2001-01-08 2002-10-08 Hewlett-Packard Company Method of treating a surface of a polyimide
JP4272819B2 (ja) 2001-01-10 2009-06-03 キヤノン株式会社 有機発光素子
EP1409584B1 (en) * 2001-02-13 2010-01-20 GLS Corporation Removable seal of essentially gas-impermeable thermoplastic elastomer
US6849171B2 (en) * 2001-03-05 2005-02-01 Fuji Xerox Co., Ltd. Light waveguide forming method, electrolyte solution, light waveguide forming apparatus and light waveguide
US6664137B2 (en) * 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
US6630980B2 (en) 2001-04-17 2003-10-07 General Electric Company Transparent flexible barrier for liquid crystal display devices and method of making the same
US6864435B2 (en) 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
US6774300B2 (en) * 2001-04-27 2004-08-10 Adrena, Inc. Apparatus and method for photovoltaic energy production based on internal charge emission in a solid-state heterostructure
WO2002091064A2 (en) 2001-05-04 2002-11-14 General Atomics O2 and h2o barrier material
TW570876B (en) 2001-05-11 2004-01-11 Toyo Seikan Kaisha Ltd Silicon oxide film
JP3678361B2 (ja) * 2001-06-08 2005-08-03 大日本印刷株式会社 ガスバリアフィルム
DE10130666A1 (de) 2001-06-28 2003-01-23 Applied Films Gmbh & Co Kg Softcoat
CA2352567A1 (en) 2001-07-06 2003-01-06 Mohamed Latreche Translucent material displaying ultra-low transport of gases and vapors, and method for its production
JP2003020235A (ja) 2001-07-06 2003-01-24 Otsuka Ohmi Ceramics Co Ltd 立体模様付きガラス板の製造方法
US6664730B2 (en) * 2001-07-09 2003-12-16 Universal Display Corporation Electrode structure of el device
FI117622B (fi) 2001-07-13 2006-12-29 Stora Enso Oyj Polymeeripinnoitteinen kuumasaumattava pakkausmateriaali, sen valmistusmenetelmä sekä sen käyttö suljettuun pakkaukseen
KR100413450B1 (ko) * 2001-07-20 2003-12-31 엘지전자 주식회사 표시소자의 보호막 구조
CN1317421C (zh) 2001-08-20 2007-05-23 诺华等离子公司 气体和蒸气低渗透性的涂层
US6806145B2 (en) * 2001-08-31 2004-10-19 Asm International, N.V. Low temperature method of forming a gate stack with a high k layer deposited over an interfacial oxide layer
US6734370B2 (en) 2001-09-07 2004-05-11 Irvine Sensors Corporation Multilayer modules with flexible substrates
TW508808B (en) * 2001-09-14 2002-11-01 Winbond Electronics Corp Stacked type capacitor structure and its manufacturing method
JP2003109775A (ja) * 2001-09-28 2003-04-11 Sony Corp 有機電界発光素子
FR2830206B1 (fr) 2001-09-28 2004-07-23 Corning Inc Dispositif microfluidique et sa fabrication
JP2003128720A (ja) 2001-10-19 2003-05-08 Sunallomer Ltd オレフィン重合用固体助触媒成分、オレフィン重合用触媒およびイオン含有化合物
KR100768182B1 (ko) * 2001-10-26 2007-10-17 삼성에스디아이 주식회사 유기 전자 발광 소자와 그 제조방법
US6888305B2 (en) * 2001-11-06 2005-05-03 Universal Display Corporation Encapsulation structure that acts as a multilayer mirror
JP2003142579A (ja) * 2001-11-07 2003-05-16 Hitachi Ltd 半導体装置の製造方法および半導体装置
US6486549B1 (en) * 2001-11-10 2002-11-26 Bridge Semiconductor Corporation Semiconductor module with encapsulant base
SG114514A1 (en) 2001-11-28 2005-09-28 Univ Singapore Organic light emitting diode (oled)
JP2005513738A (ja) * 2001-12-20 2005-05-12 アイファイア テクノロジー コーポレーション エレクトロルミネセンスディスプレイの安定化電極
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
KR100845557B1 (ko) * 2002-02-20 2008-07-10 삼성전자주식회사 액티브 매트릭스형 유기전계발광 표시장치 및 그 제조방법
US6876143B2 (en) * 2002-11-19 2005-04-05 John James Daniels Organic light active devices and methods for fabricating the same
JP2003275575A (ja) 2002-03-22 2003-09-30 Nippon Sheet Glass Co Ltd マイクロ化学システム用チップ部材のチャネル形成方法、及び該形成方法によってチャネルが形成されたマイクロ化学システム用チップ部材
US6891330B2 (en) * 2002-03-29 2005-05-10 General Electric Company Mechanically flexible organic electroluminescent device with directional light emission
US20030183915A1 (en) 2002-04-02 2003-10-02 Motorola, Inc. Encapsulated organic semiconductor device and method
US20030188685A1 (en) 2002-04-08 2003-10-09 Applied Materials, Inc. Laser drilled surfaces for substrate processing chambers
KR100537611B1 (ko) * 2002-04-10 2005-12-19 삼성에스디아이 주식회사 유기 전계 발광소자 및 그 제조방법
US6835950B2 (en) * 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US7268486B2 (en) * 2002-04-15 2007-09-11 Schott Ag Hermetic encapsulation of organic, electro-optical elements
US20030203210A1 (en) * 2002-04-30 2003-10-30 Vitex Systems, Inc. Barrier coatings and methods of making same
US6949389B2 (en) * 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
US6655788B1 (en) * 2002-05-17 2003-12-02 Viztec Inc. Composite structure for enhanced flexibility of electro-optic displays with sliding layers
US6743524B2 (en) 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
JP2004010843A (ja) 2002-06-11 2004-01-15 Idemitsu Petrochem Co Ltd ポリ乳酸樹脂組成物
US20040033379A1 (en) 2002-06-12 2004-02-19 Avery Dennison Corporation Low permeability materials and coatings
JP4093347B2 (ja) 2002-06-19 2008-06-04 Agcテクノグラス株式会社 点火プラグ用封着ガラスおよび点火プラグ
JP4045870B2 (ja) 2002-06-20 2008-02-13 富士ゼロックス株式会社 光学素子作製方法、これに用いる電着液および光学素子製造装置
US7107592B2 (en) * 2002-07-25 2006-09-12 Sun Microsystems, Inc. Method, system, and program for making objects available for access to a client over a network
US20040043138A1 (en) 2002-08-21 2004-03-04 Ramesh Jagannathan Solid state lighting using compressed fluid coatings
JP2004095953A (ja) * 2002-09-02 2004-03-25 Canon Inc 窒化シリコンの堆積膜形成方法
FR2843899A1 (fr) * 2002-09-03 2004-03-05 Corning Inc Depot d'un film sur un substrat
US7224116B2 (en) * 2002-09-11 2007-05-29 Osram Opto Semiconductors Gmbh Encapsulation of active electronic devices
US20040229051A1 (en) 2003-05-15 2004-11-18 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
US7015640B2 (en) * 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US7193364B2 (en) * 2002-09-12 2007-03-20 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Encapsulation for organic devices
JP2004111059A (ja) * 2002-09-13 2004-04-08 Sony Corp 表示装置
GB2421117B (en) * 2002-09-17 2006-09-27 Dainippon Printing Co Ltd Method of manufacturing a light emitting display panel and a light emitting diplay panel
US7138293B2 (en) * 2002-10-04 2006-11-21 Dalsa Semiconductor Inc. Wafer level packaging technique for microdevices
ITMI20022159A1 (it) 2002-10-11 2004-04-12 Tecno Coating Engineering S R L Pellicola multistrato termoretraibile avente barriera all'ossigeno ed al vapore acqueo, una migliorata resistenza meccanica e buone caratteristiche ottiche e ridotto effetto curling.
US7015639B2 (en) * 2002-10-22 2006-03-21 Osram Opto Semiconductors Gmbh Electroluminescent devices and method of making transparent cathodes
US6878620B2 (en) * 2002-11-12 2005-04-12 Applied Materials, Inc. Side wall passivation films for damascene cu/low k electronic devices
DK1420041T3 (da) 2002-11-18 2010-08-09 Icopal As Fleksibelt foliemateriale
US7256427B2 (en) * 2002-11-19 2007-08-14 Articulated Technologies, Llc Organic light active devices with particulated light active material in a carrier matrix
KR20050065680A (ko) 2002-11-19 2005-06-29 다니엘즈 존 유기 및 무기 광 활성 장치들
US20040100176A1 (en) * 2002-11-21 2004-05-27 Osram Opto Semiconductors Gmbh Organic electronic device that filters colors
DE10256629B3 (de) * 2002-12-03 2004-02-19 Schott Glas Vorzugsweise Pb- und As-freie optische Gläser mit Tg ≦ 500°C und deren Verwendung
US6975067B2 (en) * 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US6787453B2 (en) * 2002-12-23 2004-09-07 Intel Corporation Barrier film integrity on porous low k dielectrics by application of a hydrocarbon plasma treatment
US7372069B2 (en) * 2003-01-14 2008-05-13 Osram Opto Semiconductors Gmbh Interface for UV-curable adhesives
US20040151934A1 (en) * 2003-01-27 2004-08-05 Schwark Dwight W. Oxygen scavenging film with high slip properties
US20040157426A1 (en) * 2003-02-07 2004-08-12 Luc Ouellet Fabrication of advanced silicon-based MEMS devices
JP4255844B2 (ja) * 2003-02-24 2009-04-15 ソニー株式会社 有機発光表示装置およびその製造方法
JP2006519473A (ja) 2003-03-04 2006-08-24 ダウ・コーニング・コーポレイション 有機発光ダイオード
EP1466997B1 (en) * 2003-03-10 2012-02-22 OSRAM Opto Semiconductors GmbH Method for forming and arrangement of barrier layers on a polymeric substrate
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7514149B2 (en) 2003-04-04 2009-04-07 Corning Incorporated High-strength laminated sheet for optical applications
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
US6888172B2 (en) * 2003-04-11 2005-05-03 Eastman Kodak Company Apparatus and method for encapsulating an OLED formed on a flexible substrate
US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
CN1791989A (zh) 2003-05-16 2006-06-21 纳幕尔杜邦公司 通过原子层沉积形成的塑料基材阻挡层膜
US20040234797A1 (en) 2003-05-23 2004-11-25 Cryovac, Inc. Oxygen scavenging film with antifog properties
US7535017B2 (en) 2003-05-30 2009-05-19 Osram Opto Semiconductors Gmbh Flexible multilayer packaging material and electronic devices with the packaging material
US20050051763A1 (en) 2003-09-05 2005-03-10 Helicon Research, L.L.C. Nanophase multilayer barrier and process
JP2005174726A (ja) * 2003-12-11 2005-06-30 Tohoku Pioneer Corp 有機el素子及びその形成方法
JP4617933B2 (ja) 2004-03-25 2011-01-26 旭硝子株式会社 軟化点が低いガラスを被覆したフィルム
JP2005285659A (ja) * 2004-03-30 2005-10-13 Toyota Industries Corp 有機el装置及びその製造方法
US20050241815A1 (en) 2004-04-30 2005-11-03 Philippe Caze High thermal efficiency glass microfluidic channels and method for forming the same
JP2005322464A (ja) * 2004-05-07 2005-11-17 Canon Inc 有機el素子
JP4543777B2 (ja) 2004-06-24 2010-09-15 コニカミノルタビジネステクノロジーズ株式会社 穿孔処理装置及び画像形成装置
US20060087230A1 (en) 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
US20080206589A1 (en) 2007-02-28 2008-08-28 Bruce Gardiner Aitken Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
EP2180078B1 (en) 2005-08-25 2013-12-11 Asahi Glass Company, Limited Base with glass film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040113542A1 (en) 2002-12-11 2004-06-17 Applied Materials, Inc. Low temperature process for passivation applications

Also Published As

Publication number Publication date
WO2007021627A1 (en) 2007-02-22
EP1929559A1 (en) 2008-06-11
JP5113054B2 (ja) 2013-01-09
US20070040501A1 (en) 2007-02-22
EP1929559B1 (en) 2015-07-15
TWI360904B (en) 2012-03-21
CN101243562A (zh) 2008-08-13
US9050622B2 (en) 2015-06-09
US20140234542A1 (en) 2014-08-21
JP2009505371A (ja) 2009-02-05
TW200719503A (en) 2007-05-16
KR20080045217A (ko) 2008-05-22

Similar Documents

Publication Publication Date Title
KR20080045217A (ko) 장치에 대한 산소 및 습기 분해의 억제방법 및 이에 따른장치
KR101603877B1 (ko) 박막 배리어를 갖는 플렉서블 기판
KR101265862B1 (ko) 밀봉 방법 및 기밀봉된 장치
US7829147B2 (en) Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
JP2008240150A (ja) スズ含有無機材料を使用した低焼結温度での密封シーリング
US20080290798A1 (en) LLT barrier layer for top emission display device, method and apparatus

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

J501 Disposition of invalidation of trial
PJ0501 Disposition of invalidation of trial

St.27 status event code: A-3-3-V10-V13-apl-PJ0501

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20161230

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20171228

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20181227

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20210114

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20210114

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000