JP5021472B2 - プリント配線板の製造方法 - Google Patents

プリント配線板の製造方法 Download PDF

Info

Publication number
JP5021472B2
JP5021472B2 JP2007524083A JP2007524083A JP5021472B2 JP 5021472 B2 JP5021472 B2 JP 5021472B2 JP 2007524083 A JP2007524083 A JP 2007524083A JP 2007524083 A JP2007524083 A JP 2007524083A JP 5021472 B2 JP5021472 B2 JP 5021472B2
Authority
JP
Japan
Prior art keywords
solder
wiring board
printed wiring
ball
resist layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007524083A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2007004657A1 (ja
Inventor
洋一郎 川村
茂樹 澤
克彦 丹野
宏徳 田中
直明 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP2007524083A priority Critical patent/JP5021472B2/ja
Publication of JPWO2007004657A1 publication Critical patent/JPWO2007004657A1/ja
Application granted granted Critical
Publication of JP5021472B2 publication Critical patent/JP5021472B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
JP2007524083A 2005-06-30 2006-06-28 プリント配線板の製造方法 Active JP5021472B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007524083A JP5021472B2 (ja) 2005-06-30 2006-06-28 プリント配線板の製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005192862 2005-06-30
JP2005192862 2005-06-30
PCT/JP2006/313342 WO2007004657A1 (ja) 2005-06-30 2006-06-28 プリント配線板
JP2007524083A JP5021472B2 (ja) 2005-06-30 2006-06-28 プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2007004657A1 JPWO2007004657A1 (ja) 2009-01-29
JP5021472B2 true JP5021472B2 (ja) 2012-09-05

Family

ID=37604518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007524083A Active JP5021472B2 (ja) 2005-06-30 2006-06-28 プリント配線板の製造方法

Country Status (7)

Country Link
US (3) US7714233B2 (enExample)
EP (1) EP1887845A4 (enExample)
JP (1) JP5021472B2 (enExample)
KR (1) KR100905686B1 (enExample)
CN (2) CN101868120A (enExample)
TW (1) TW200738090A (enExample)
WO (1) WO2007004657A1 (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100025597A (ko) * 2005-05-23 2010-03-09 이비덴 가부시키가이샤 프린트 배선판
CN101868120A (zh) * 2005-06-30 2010-10-20 揖斐电株式会社 印刷线路板及其制造方法
CN101854771A (zh) 2005-06-30 2010-10-06 揖斐电株式会社 印刷线路板
CN101888747B (zh) * 2006-01-27 2012-09-05 揖斐电株式会社 印刷线路板的制造方法
TW200746964A (en) * 2006-01-27 2007-12-16 Ibiden Co Ltd Method of manufacturing printed wiring board
US7969005B2 (en) * 2007-04-27 2011-06-28 Sanyo Electric Co., Ltd. Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
JP5101169B2 (ja) 2007-05-30 2012-12-19 新光電気工業株式会社 配線基板とその製造方法
US7982137B2 (en) * 2007-06-27 2011-07-19 Hamilton Sundstrand Corporation Circuit board with an attached die and intermediate interposer
TWI463582B (zh) * 2007-09-25 2014-12-01 Ngk Spark Plug Co 具有焊接凸塊之配線基板的製造方法
US9941245B2 (en) * 2007-09-25 2018-04-10 Intel Corporation Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate
KR101551898B1 (ko) 2007-10-05 2015-09-09 신꼬오덴기 고교 가부시키가이샤 배선 기판, 반도체 장치 및 이들의 제조 방법
KR100965341B1 (ko) * 2007-12-20 2010-06-22 삼성전기주식회사 인쇄회로기판의 제조방법
KR100992181B1 (ko) 2007-12-26 2010-11-04 삼성전기주식회사 패키지용 기판 및 그 제조방법
US7759137B2 (en) * 2008-03-25 2010-07-20 Stats Chippac, Ltd. Flip chip interconnection structure with bump on partial pad and method thereof
US9345148B2 (en) 2008-03-25 2016-05-17 Stats Chippac, Ltd. Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
TWI363585B (en) * 2008-04-02 2012-05-01 Advanced Semiconductor Eng Method for manufacturing a substrate having embedded component therein
CN101683001B (zh) * 2008-05-30 2012-01-04 揖斐电株式会社 焊锡球搭载方法
US8471154B1 (en) * 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
US20110195223A1 (en) * 2010-02-11 2011-08-11 Qualcomm Incorporated Asymmetric Front/Back Solder Mask
JP5290215B2 (ja) * 2010-02-15 2013-09-18 ルネサスエレクトロニクス株式会社 半導体装置、半導体パッケージ、インタポーザ、及びインタポーザの製造方法
JP5623308B2 (ja) * 2010-02-26 2014-11-12 日本特殊陶業株式会社 多層配線基板及びその製造方法
US20120160542A1 (en) * 2010-12-22 2012-06-28 Oluwafemi Olufemi B Crosstalk reduction on microstrip routing
JP2012169591A (ja) * 2011-01-24 2012-09-06 Ngk Spark Plug Co Ltd 多層配線基板
US8643154B2 (en) 2011-01-31 2014-02-04 Ibiden Co., Ltd. Semiconductor mounting device having multiple substrates connected via bumps
US8692129B2 (en) * 2011-03-31 2014-04-08 Ibiden Co., Ltd. Package-substrate-mounting printed wiring board and method for manufacturing the same
JP6030639B2 (ja) * 2011-05-09 2016-11-24 インテグリス・インコーポレーテッド 微多孔質膜層およびナノ繊維層を含む多孔質複合膜
US8653658B2 (en) 2011-11-30 2014-02-18 Taiwan Semiconductor Manufacturing Company, Ltd. Planarized bumps for underfill control
CN102543930A (zh) * 2012-02-03 2012-07-04 昆山美微电子科技有限公司 电铸晶圆凸块
JP5502139B2 (ja) * 2012-05-16 2014-05-28 日本特殊陶業株式会社 配線基板
TWI536508B (zh) * 2012-08-24 2016-06-01 日本特殊陶業股份有限公司 Wiring board
US8970035B2 (en) 2012-08-31 2015-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structures for semiconductor package
US9673131B2 (en) 2013-04-09 2017-06-06 Intel Corporation Integrated circuit package assemblies including a glass solder mask layer
KR101734425B1 (ko) * 2013-09-24 2017-05-11 주식회사 엘지화학 드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체
JP6320066B2 (ja) * 2014-02-13 2018-05-09 イビデン株式会社 ボール搭載用マスクおよびボール搭載装置
JP2016012002A (ja) * 2014-06-27 2016-01-21 日立化成株式会社 感光性樹脂組成物の硬化物、それに用いる感光性樹脂組成物及び半導体装置搭載用基板の製造方法、半導体装置の製造方法
JP5882510B2 (ja) * 2014-06-30 2016-03-09 太陽インキ製造株式会社 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
JP6329027B2 (ja) * 2014-08-04 2018-05-23 ミネベアミツミ株式会社 フレキシブルプリント基板
CN104185360B (zh) * 2014-08-18 2017-05-24 深圳市华星光电技术有限公司 一种印刷电路板及其设计方法
JP2016076533A (ja) * 2014-10-03 2016-05-12 イビデン株式会社 バンプ付きプリント配線板およびその製造方法
JP6230520B2 (ja) * 2014-10-29 2017-11-15 キヤノン株式会社 プリント回路板及び電子機器
US10269758B2 (en) * 2015-12-24 2019-04-23 Intel Corporation Systems and processes for measuring thickness values of semiconductor substrates
JP6175205B1 (ja) * 2017-02-01 2017-08-02 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物
JP6949550B2 (ja) * 2017-05-17 2021-10-13 日本発條株式会社 ディスク装置用サスペンションの配線部材
JP6199524B1 (ja) * 2017-07-03 2017-09-20 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物
JP6199525B1 (ja) * 2017-07-03 2017-09-20 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物
JP2019140174A (ja) * 2018-02-07 2019-08-22 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
CN109688720B (zh) * 2018-12-30 2020-09-01 北京康普锡威科技有限公司 预制焊料的pcb板的制备方法及pcb板
US11004819B2 (en) * 2019-09-27 2021-05-11 International Business Machines Corporation Prevention of bridging between solder joints
CN116801482B (zh) * 2022-03-18 2024-05-10 华为技术有限公司 电路板组件及其加工方法、电子设备
CN114585175B (zh) * 2022-04-29 2022-07-15 广东科翔电子科技股份有限公司 一种Mini-LED焊盘加高方法
CN117751692A (zh) * 2022-05-31 2024-03-22 京东方科技集团股份有限公司 布线基板及制备方法、背板、显示装置
US20240038716A1 (en) * 2022-07-26 2024-02-01 Western Digital Technologies, Inc. System and method for depositing underfill material

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208778A (ja) * 2001-01-10 2002-07-26 Ibiden Co Ltd 多層プリント配線板
JP2004179578A (ja) * 2002-11-29 2004-06-24 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2004207370A (ja) * 2002-12-24 2004-07-22 Cmk Corp プリント配線板の製造方法
JP2004319676A (ja) * 2003-04-15 2004-11-11 Harima Chem Inc はんだ析出方法およびはんだバンプ形成方法
JP2004327536A (ja) * 2003-04-22 2004-11-18 Hitachi Metals Ltd 微小ボール搭載用マスクおよび微小ボールの搭載方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245357B2 (ja) 1982-06-25 1990-10-09 Hitachi Ltd Kibannosetsuzokukozo
US5118027A (en) * 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
JPH05121411A (ja) 1991-10-25 1993-05-18 Rohm Co Ltd 電子部品における接続用バンプの形成方法
US5329423A (en) 1993-04-13 1994-07-12 Scholz Kenneth D Compressive bump-and-socket interconnection scheme for integrated circuits
JPH1140908A (ja) 1997-07-22 1999-02-12 Ibiden Co Ltd プリント配線板
JPH1174403A (ja) * 1997-08-28 1999-03-16 Mitsubishi Electric Corp 半導体装置
US6046910A (en) * 1998-03-18 2000-04-04 Motorola, Inc. Microelectronic assembly having slidable contacts and method for manufacturing the assembly
JP2000022039A (ja) * 1998-07-06 2000-01-21 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
WO2000010369A1 (en) 1998-08-10 2000-02-24 Fujitsu Limited Method of forming solder bump, method of mounting electronic device, and mounting structure of electronic device
JP3213292B2 (ja) * 1999-07-12 2001-10-02 ソニーケミカル株式会社 多層基板、及びモジュール
TW434856B (en) * 2000-05-15 2001-05-16 Siliconware Precision Industries Co Ltd Manufacturing method for high coplanarity solder ball array of ball grid array integrated circuit package
CN1196392C (zh) * 2000-07-31 2005-04-06 日本特殊陶业株式会社 布线基板及其制造方法
US6563210B2 (en) * 2000-12-19 2003-05-13 Intel Corporation Parallel plane substrate
US6822170B2 (en) * 2000-12-26 2004-11-23 Ngk Spark Plug Co., Ltd. Embedding resin and wiring substrate using the same
JP4587571B2 (ja) 2001-01-12 2010-11-24 イビデン株式会社 多層プリント配線板の製造方法
JP2002290030A (ja) * 2001-03-23 2002-10-04 Ngk Spark Plug Co Ltd 配線基板
JP3595283B2 (ja) * 2001-06-27 2004-12-02 日本特殊陶業株式会社 配線基板及びその製造方法
DE10138042A1 (de) 2001-08-08 2002-11-21 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zu seiner Herstellung
JP3910387B2 (ja) 2001-08-24 2007-04-25 新光電気工業株式会社 半導体パッケージ及びその製造方法並びに半導体装置
US6753480B2 (en) * 2001-10-12 2004-06-22 Ultratera Corporation Printed circuit board having permanent solder mask
TW557521B (en) * 2002-01-16 2003-10-11 Via Tech Inc Integrated circuit package and its manufacturing process
JP2003218272A (ja) * 2002-01-25 2003-07-31 Sony Corp 高周波モジュール及びその製造方法
JP3819806B2 (ja) * 2002-05-17 2006-09-13 富士通株式会社 バンプ電極付き電子部品およびその製造方法
JP4209178B2 (ja) 2002-11-26 2009-01-14 新光電気工業株式会社 電子部品実装構造及びその製造方法
WO2004103039A1 (ja) * 2003-05-19 2004-11-25 Dai Nippon Printing Co., Ltd. 両面配線基板および両面配線基板の製造方法並びに多層配線基板
KR100520961B1 (ko) 2003-05-30 2005-10-17 엘지전자 주식회사 인쇄회로기판의 제조방법
TWI222687B (en) * 2003-08-14 2004-10-21 Advanced Semiconductor Eng Semiconductor chip with bumps and method for manufacturing the same
TWI335195B (en) * 2003-12-16 2010-12-21 Ngk Spark Plug Co Multilayer wiring board
JP4860113B2 (ja) * 2003-12-26 2012-01-25 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP4387231B2 (ja) * 2004-03-31 2009-12-16 新光電気工業株式会社 キャパシタ実装配線基板及びその製造方法
TWI240389B (en) 2004-05-06 2005-09-21 Advanced Semiconductor Eng High-density layout substrate for flip-chip package
CN100367491C (zh) * 2004-05-28 2008-02-06 日本特殊陶业株式会社 中间基板
US7626829B2 (en) * 2004-10-27 2009-12-01 Ibiden Co., Ltd. Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board
JP2006216713A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
TWI414218B (zh) * 2005-02-09 2013-11-01 日本特殊陶業股份有限公司 配線基板及配線基板內建用之電容器
US7183652B2 (en) * 2005-04-27 2007-02-27 Infineon Technologies Ag Electronic component and electronic configuration
KR20100025597A (ko) 2005-05-23 2010-03-09 이비덴 가부시키가이샤 프린트 배선판
CN101854771A (zh) 2005-06-30 2010-10-06 揖斐电株式会社 印刷线路板
CN101868120A (zh) * 2005-06-30 2010-10-20 揖斐电株式会社 印刷线路板及其制造方法
JP4838068B2 (ja) * 2005-09-01 2011-12-14 日本特殊陶業株式会社 配線基板
TW200810646A (en) * 2005-12-20 2008-02-16 Ibiden Co Ltd Method for manufacturing printed wiring board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208778A (ja) * 2001-01-10 2002-07-26 Ibiden Co Ltd 多層プリント配線板
JP2004179578A (ja) * 2002-11-29 2004-06-24 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2004207370A (ja) * 2002-12-24 2004-07-22 Cmk Corp プリント配線板の製造方法
JP2004319676A (ja) * 2003-04-15 2004-11-11 Harima Chem Inc はんだ析出方法およびはんだバンプ形成方法
JP2004327536A (ja) * 2003-04-22 2004-11-18 Hitachi Metals Ltd 微小ボール搭載用マスクおよび微小ボールの搭載方法

Also Published As

Publication number Publication date
EP1887845A1 (en) 2008-02-13
TWI309543B (enExample) 2009-05-01
CN101868120A (zh) 2010-10-20
WO2007004657A1 (ja) 2007-01-11
JPWO2007004657A1 (ja) 2009-01-29
TW200738090A (en) 2007-10-01
US20110061232A1 (en) 2011-03-17
KR20070116966A (ko) 2007-12-11
KR100905686B1 (ko) 2009-07-03
US8832935B2 (en) 2014-09-16
US8003897B2 (en) 2011-08-23
CN101171894B (zh) 2010-05-19
US7714233B2 (en) 2010-05-11
US20070096327A1 (en) 2007-05-03
EP1887845A4 (en) 2010-08-11
CN101171894A (zh) 2008-04-30
US20100155129A1 (en) 2010-06-24

Similar Documents

Publication Publication Date Title
JP5021472B2 (ja) プリント配線板の製造方法
JP5021473B2 (ja) プリント配線板の製造方法
JP4647007B2 (ja) 半田ボール搭載装置
KR20080017431A (ko) 프린트 배선판 및 프린트 배선판의 제조 방법
US7886955B2 (en) Solder ball mounting device
JP4592762B2 (ja) 半田ボール搭載方法及び半田ボール搭載装置
JP4118283B2 (ja) 半田ボール搭載方法及び半田ボール搭載装置
WO2007072875A1 (ja) プリント配線板の製造方法
JP4118286B2 (ja) 半田ボール搭載方法
JP4118285B2 (ja) 半田ボール搭載装置及び半田ボール搭載方法
JP4118284B2 (ja) 半田ボール搭載装置及び半田ボール搭載方法
JP2014049567A (ja) 半田ボール搭載装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090519

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110607

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110808

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20111108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120208

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20120215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120515

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120517

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20120517

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120612

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120614

R150 Certificate of patent or registration of utility model

Ref document number: 5021472

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150622

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250