TW200738090A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
TW200738090A
TW200738090A TW095123798A TW95123798A TW200738090A TW 200738090 A TW200738090 A TW 200738090A TW 095123798 A TW095123798 A TW 095123798A TW 95123798 A TW95123798 A TW 95123798A TW 200738090 A TW200738090 A TW 200738090A
Authority
TW
Taiwan
Prior art keywords
resist layer
solder resist
conductor circuit
solder
wiring board
Prior art date
Application number
TW095123798A
Other languages
English (en)
Other versions
TWI309543B (zh
Inventor
Yoichiro Kawamura
Shigeki Sawa
Katsuhiko Tanno
Hironori Tanaka
Naoaki Fujii
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW200738090A publication Critical patent/TW200738090A/zh
Application granted granted Critical
Publication of TWI309543B publication Critical patent/TWI309543B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01038—Strontium [Sr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01088—Radium [Ra]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
TW095123798A 2005-06-30 2006-06-30 Printed wiring board TW200738090A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005192862 2005-06-30

Publications (2)

Publication Number Publication Date
TW200738090A true TW200738090A (en) 2007-10-01
TWI309543B TWI309543B (zh) 2009-05-01

Family

ID=37604518

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123798A TW200738090A (en) 2005-06-30 2006-06-30 Printed wiring board

Country Status (7)

Country Link
US (3) US7714233B2 (zh)
EP (1) EP1887845A4 (zh)
JP (1) JP5021472B2 (zh)
KR (1) KR100905686B1 (zh)
CN (2) CN101868120A (zh)
TW (1) TW200738090A (zh)
WO (1) WO2007004657A1 (zh)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101826496B (zh) * 2005-05-23 2015-03-18 揖斐电株式会社 印刷线路板及其制造方法
CN101854771A (zh) * 2005-06-30 2010-10-06 揖斐电株式会社 印刷线路板
WO2007004657A1 (ja) * 2005-06-30 2007-01-11 Ibiden Co., Ltd. プリント配線板
TW200746964A (en) * 2006-01-27 2007-12-16 Ibiden Co Ltd Method of manufacturing printed wiring board
WO2007086551A1 (ja) 2006-01-27 2007-08-02 Ibiden Co., Ltd. プリント配線板及びプリント配線板の製造方法
US7969005B2 (en) * 2007-04-27 2011-06-28 Sanyo Electric Co., Ltd. Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
JP5101169B2 (ja) * 2007-05-30 2012-12-19 新光電気工業株式会社 配線基板とその製造方法
US7982137B2 (en) * 2007-06-27 2011-07-19 Hamilton Sundstrand Corporation Circuit board with an attached die and intermediate interposer
US9941245B2 (en) * 2007-09-25 2018-04-10 Intel Corporation Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate
TWI463582B (zh) * 2007-09-25 2014-12-01 Ngk Spark Plug Co 具有焊接凸塊之配線基板的製造方法
US8502398B2 (en) * 2007-10-05 2013-08-06 Shinko Electric Industries Co., Ltd. Wiring board, semiconductor apparatus and method of manufacturing them
KR100965341B1 (ko) * 2007-12-20 2010-06-22 삼성전기주식회사 인쇄회로기판의 제조방법
KR100992181B1 (ko) 2007-12-26 2010-11-04 삼성전기주식회사 패키지용 기판 및 그 제조방법
US9345148B2 (en) 2008-03-25 2016-05-17 Stats Chippac, Ltd. Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
US7759137B2 (en) * 2008-03-25 2010-07-20 Stats Chippac, Ltd. Flip chip interconnection structure with bump on partial pad and method thereof
TWI363585B (en) * 2008-04-02 2012-05-01 Advanced Semiconductor Eng Method for manufacturing a substrate having embedded component therein
CN101683001B (zh) * 2008-05-30 2012-01-04 揖斐电株式会社 焊锡球搭载方法
US8471154B1 (en) * 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
US20110195223A1 (en) * 2010-02-11 2011-08-11 Qualcomm Incorporated Asymmetric Front/Back Solder Mask
JP5290215B2 (ja) * 2010-02-15 2013-09-18 ルネサスエレクトロニクス株式会社 半導体装置、半導体パッケージ、インタポーザ、及びインタポーザの製造方法
JP5623308B2 (ja) * 2010-02-26 2014-11-12 日本特殊陶業株式会社 多層配線基板及びその製造方法
US20120160542A1 (en) * 2010-12-22 2012-06-28 Oluwafemi Olufemi B Crosstalk reduction on microstrip routing
JP2012169591A (ja) 2011-01-24 2012-09-06 Ngk Spark Plug Co Ltd 多層配線基板
US8643154B2 (en) * 2011-01-31 2014-02-04 Ibiden Co., Ltd. Semiconductor mounting device having multiple substrates connected via bumps
US8692129B2 (en) * 2011-03-31 2014-04-08 Ibiden Co., Ltd. Package-substrate-mounting printed wiring board and method for manufacturing the same
KR101936451B1 (ko) * 2011-05-09 2019-01-08 엔테그리스, 아이엔씨. 미세다공성 막 층들 및 나노섬유 층을 포함하는 다공성 복합막
US8653658B2 (en) 2011-11-30 2014-02-18 Taiwan Semiconductor Manufacturing Company, Ltd. Planarized bumps for underfill control
CN102543930A (zh) * 2012-02-03 2012-07-04 昆山美微电子科技有限公司 电铸晶圆凸块
JP5502139B2 (ja) * 2012-05-16 2014-05-28 日本特殊陶業株式会社 配線基板
US8970035B2 (en) 2012-08-31 2015-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structures for semiconductor package
US9673131B2 (en) 2013-04-09 2017-06-06 Intel Corporation Integrated circuit package assemblies including a glass solder mask layer
KR101734425B1 (ko) 2013-09-24 2017-05-11 주식회사 엘지화학 드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체
JP6320066B2 (ja) * 2014-02-13 2018-05-09 イビデン株式会社 ボール搭載用マスクおよびボール搭載装置
JP2016012002A (ja) * 2014-06-27 2016-01-21 日立化成株式会社 感光性樹脂組成物の硬化物、それに用いる感光性樹脂組成物及び半導体装置搭載用基板の製造方法、半導体装置の製造方法
JP5882510B2 (ja) 2014-06-30 2016-03-09 太陽インキ製造株式会社 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
JP6329027B2 (ja) * 2014-08-04 2018-05-23 ミネベアミツミ株式会社 フレキシブルプリント基板
CN104185360B (zh) * 2014-08-18 2017-05-24 深圳市华星光电技术有限公司 一种印刷电路板及其设计方法
JP2016076533A (ja) * 2014-10-03 2016-05-12 イビデン株式会社 バンプ付きプリント配線板およびその製造方法
JP6230520B2 (ja) * 2014-10-29 2017-11-15 キヤノン株式会社 プリント回路板及び電子機器
US10269758B2 (en) * 2015-12-24 2019-04-23 Intel Corporation Systems and processes for measuring thickness values of semiconductor substrates
JP6175205B1 (ja) * 2017-02-01 2017-08-02 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物
JP6949550B2 (ja) 2017-05-17 2021-10-13 日本発條株式会社 ディスク装置用サスペンションの配線部材
JP6199524B1 (ja) * 2017-07-03 2017-09-20 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物
JP6199525B1 (ja) * 2017-07-03 2017-09-20 太陽インキ製造株式会社 感光性フィルム、感光性フィルム積層体およびそれらを用いて形成された硬化物
JP2019140174A (ja) * 2018-02-07 2019-08-22 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
CN109688720B (zh) * 2018-12-30 2020-09-01 北京康普锡威科技有限公司 预制焊料的pcb板的制备方法及pcb板
CN114585175B (zh) * 2022-04-29 2022-07-15 广东科翔电子科技股份有限公司 一种Mini-LED焊盘加高方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245357B2 (ja) 1982-06-25 1990-10-09 Hitachi Ltd Kibannosetsuzokukozo
US5118027A (en) * 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
JPH05121411A (ja) 1991-10-25 1993-05-18 Rohm Co Ltd 電子部品における接続用バンプの形成方法
US5329423A (en) 1993-04-13 1994-07-12 Scholz Kenneth D Compressive bump-and-socket interconnection scheme for integrated circuits
JPH1140908A (ja) 1997-07-22 1999-02-12 Ibiden Co Ltd プリント配線板
JPH1174403A (ja) * 1997-08-28 1999-03-16 Mitsubishi Electric Corp 半導体装置
US6046910A (en) * 1998-03-18 2000-04-04 Motorola, Inc. Microelectronic assembly having slidable contacts and method for manufacturing the assembly
JP2000022039A (ja) * 1998-07-06 2000-01-21 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
WO2000010369A1 (fr) 1998-08-10 2000-02-24 Fujitsu Limited Realisation de bossages de soudure, methode de montage d'un dispositif electronique et structure de montage pour ce dispositif
JP3213292B2 (ja) * 1999-07-12 2001-10-02 ソニーケミカル株式会社 多層基板、及びモジュール
TW434856B (en) * 2000-05-15 2001-05-16 Siliconware Precision Industries Co Ltd Manufacturing method for high coplanarity solder ball array of ball grid array integrated circuit package
CN1196392C (zh) * 2000-07-31 2005-04-06 日本特殊陶业株式会社 布线基板及其制造方法
US6563210B2 (en) * 2000-12-19 2003-05-13 Intel Corporation Parallel plane substrate
US6822170B2 (en) * 2000-12-26 2004-11-23 Ngk Spark Plug Co., Ltd. Embedding resin and wiring substrate using the same
JP5004378B2 (ja) * 2001-01-10 2012-08-22 イビデン株式会社 多層プリント配線板
JP4587571B2 (ja) 2001-01-12 2010-11-24 イビデン株式会社 多層プリント配線板の製造方法
JP2002290030A (ja) * 2001-03-23 2002-10-04 Ngk Spark Plug Co Ltd 配線基板
JP3595283B2 (ja) * 2001-06-27 2004-12-02 日本特殊陶業株式会社 配線基板及びその製造方法
DE10138042A1 (de) 2001-08-08 2002-11-21 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zu seiner Herstellung
JP3910387B2 (ja) 2001-08-24 2007-04-25 新光電気工業株式会社 半導体パッケージ及びその製造方法並びに半導体装置
US6753480B2 (en) 2001-10-12 2004-06-22 Ultratera Corporation Printed circuit board having permanent solder mask
TW557521B (en) * 2002-01-16 2003-10-11 Via Tech Inc Integrated circuit package and its manufacturing process
JP2003218272A (ja) * 2002-01-25 2003-07-31 Sony Corp 高周波モジュール及びその製造方法
JP3819806B2 (ja) 2002-05-17 2006-09-13 富士通株式会社 バンプ電極付き電子部品およびその製造方法
JP4209178B2 (ja) 2002-11-26 2009-01-14 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2004179578A (ja) * 2002-11-29 2004-06-24 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2004207370A (ja) * 2002-12-24 2004-07-22 Cmk Corp プリント配線板の製造方法
JP4006699B2 (ja) * 2003-04-22 2007-11-14 日立金属株式会社 微小ボール搭載用マスクおよび微小ボールの搭載方法
JP4094982B2 (ja) 2003-04-15 2008-06-04 ハリマ化成株式会社 はんだ析出方法およびはんだバンプ形成方法
KR100834591B1 (ko) * 2003-05-19 2008-06-02 다이니폰 인사츠 가부시키가이샤 양면 배선기판과, 양면 배선기판 제조방법 및 다층배선기판
KR100520961B1 (ko) 2003-05-30 2005-10-17 엘지전자 주식회사 인쇄회로기판의 제조방법
TWI222687B (en) * 2003-08-14 2004-10-21 Advanced Semiconductor Eng Semiconductor chip with bumps and method for manufacturing the same
TWI335195B (en) * 2003-12-16 2010-12-21 Ngk Spark Plug Co Multilayer wiring board
JP4860113B2 (ja) * 2003-12-26 2012-01-25 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP4387231B2 (ja) 2004-03-31 2009-12-16 新光電気工業株式会社 キャパシタ実装配線基板及びその製造方法
TWI240389B (en) * 2004-05-06 2005-09-21 Advanced Semiconductor Eng High-density layout substrate for flip-chip package
CN100367491C (zh) * 2004-05-28 2008-02-06 日本特殊陶业株式会社 中间基板
US7626829B2 (en) * 2004-10-27 2009-12-01 Ibiden Co., Ltd. Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board
JP2006216713A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
TWI414218B (zh) * 2005-02-09 2013-11-01 Ngk Spark Plug Co 配線基板及配線基板內建用之電容器
US7183652B2 (en) * 2005-04-27 2007-02-27 Infineon Technologies Ag Electronic component and electronic configuration
CN101826496B (zh) 2005-05-23 2015-03-18 揖斐电株式会社 印刷线路板及其制造方法
WO2007004657A1 (ja) * 2005-06-30 2007-01-11 Ibiden Co., Ltd. プリント配線板
CN101854771A (zh) 2005-06-30 2010-10-06 揖斐电株式会社 印刷线路板
JP4838068B2 (ja) * 2005-09-01 2011-12-14 日本特殊陶業株式会社 配線基板
CN101283631B (zh) * 2005-12-20 2010-06-09 揖斐电株式会社 印刷线路板的制造方法

Also Published As

Publication number Publication date
CN101171894A (zh) 2008-04-30
JP5021472B2 (ja) 2012-09-05
EP1887845A4 (en) 2010-08-11
JPWO2007004657A1 (ja) 2009-01-29
CN101171894B (zh) 2010-05-19
US20110061232A1 (en) 2011-03-17
KR100905686B1 (ko) 2009-07-03
US7714233B2 (en) 2010-05-11
US20100155129A1 (en) 2010-06-24
US8003897B2 (en) 2011-08-23
TWI309543B (zh) 2009-05-01
KR20070116966A (ko) 2007-12-11
EP1887845A1 (en) 2008-02-13
CN101868120A (zh) 2010-10-20
US8832935B2 (en) 2014-09-16
WO2007004657A1 (ja) 2007-01-11
US20070096327A1 (en) 2007-05-03

Similar Documents

Publication Publication Date Title
TW200738090A (en) Printed wiring board
TW200718298A (en) Printed wiring board
US8390116B1 (en) Flip chip bump structure and fabrication method
US7005750B2 (en) Substrate with reinforced contact pad structure
KR100832651B1 (ko) 인쇄회로기판
TW200706076A (en) Printed wiring board
EP1705972A4 (en) MULTILAYER CONDUCTOR PLATE
EP1566993A4 (en) PRINTED CIRCUIT BOARD, MULTILAYER WIRING PANEL, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING MULTILAYER WIRING PANEL
GB2441265A (en) Method for manufacturing a circuit board structure, and a circuit board structure
EP1915040A3 (en) Printed wiring board and printed wiring board manufacturing method
JP2010272681A (ja) 配線基板および半導体装置
TW200609585A (en) Printed circuit board and display device using the same
KR20160120011A (ko) 인쇄회로기판, 그 제조방법, 및 전자부품 모듈
KR20100054979A (ko) 패키지 온 패키지 기판
JP2006222386A5 (zh)
US7952182B2 (en) Semiconductor device with package to package connection
JP2013065811A (ja) プリント回路基板及びその製造方法
US8889994B2 (en) Single-layered printed circuit board and manufacturing method thereof
US8530754B2 (en) Printed circuit board having adaptable wiring lines and method for manufacturing the same
EP1519412A3 (en) Method of mounting wafer on printed wiring substrate
TW200618219A (en) Fcbga package structure
TW200505317A (en) Wiring board member for forming multilayer printed circuit board, method for producing the same, and multilayer printed circuit board
JP2001053409A (ja) チップ実装モジュール
JP2001257445A (ja) プリント配線板
JP7336258B2 (ja) プリント配線板およびその製造方法