JP4699676B2 - カプセル化された有機電子装置とその製造方法 - Google Patents

カプセル化された有機電子装置とその製造方法 Download PDF

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Publication number
JP4699676B2
JP4699676B2 JP2002509116A JP2002509116A JP4699676B2 JP 4699676 B2 JP4699676 B2 JP 4699676B2 JP 2002509116 A JP2002509116 A JP 2002509116A JP 2002509116 A JP2002509116 A JP 2002509116A JP 4699676 B2 JP4699676 B2 JP 4699676B2
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adhesive
oled
layer
liner
substrate
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Expired - Fee Related
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Japanese (ja)
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JP2004503066A5 (enExample
JP2004503066A (ja
Inventor
ビー． マコーミック，フレッド
エフ． ボード，ポール
ディー． バーンストロム，ジョージ
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Details Of Resistors (AREA)
  • Bipolar Transistors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
JP2002509116A 2000-07-12 2000-11-15 カプセル化された有機電子装置とその製造方法 Expired - Fee Related JP4699676B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/614,993 2000-07-12
US09/614,993 US6867539B1 (en) 2000-07-12 2000-07-12 Encapsulated organic electronic devices and method for making same
PCT/US2000/031393 WO2002005361A1 (en) 2000-07-12 2000-11-15 Encapsulated organic electronic devices and method for making same

Publications (3)

Publication Number Publication Date
JP2004503066A JP2004503066A (ja) 2004-01-29
JP2004503066A5 JP2004503066A5 (enExample) 2007-12-20
JP4699676B2 true JP4699676B2 (ja) 2011-06-15

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JP2002509116A Expired - Fee Related JP4699676B2 (ja) 2000-07-12 2000-11-15 カプセル化された有機電子装置とその製造方法

Country Status (8)

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US (3) US6867539B1 (enExample)
EP (1) EP1299913B1 (enExample)
JP (1) JP4699676B2 (enExample)
KR (2) KR20030031116A (enExample)
AT (1) ATE459986T1 (enExample)
AU (1) AU2001225741A1 (enExample)
DE (1) DE60043946D1 (enExample)
WO (1) WO2002005361A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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WO2014021687A1 (ko) * 2012-08-02 2014-02-06 주식회사 엘지화학 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
CN104685018A (zh) * 2012-08-02 2015-06-03 Lg化学株式会社 粘合膜和使用该粘合膜封装有机电子器件的方法
JP2018508375A (ja) * 2015-02-20 2018-03-29 シーウェア システムズＳｉ−Ｗａｒｅ Ｓｙｓｔｅｍｓ 微細加工構造のための選択的なステップカバレッジ

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