ATE459986T1 - Verfahren für die herstellung eigekapselten organischen elektronischen vorrichtungen - Google Patents

Verfahren für die herstellung eigekapselten organischen elektronischen vorrichtungen

Info

Publication number
ATE459986T1
ATE459986T1 AT00989200T AT00989200T ATE459986T1 AT E459986 T1 ATE459986 T1 AT E459986T1 AT 00989200 T AT00989200 T AT 00989200T AT 00989200 T AT00989200 T AT 00989200T AT E459986 T1 ATE459986 T1 AT E459986T1
Authority
AT
Austria
Prior art keywords
electronic devices
organic electronic
adhesive
encapsulated organic
producing encapsulated
Prior art date
Application number
AT00989200T
Other languages
German (de)
English (en)
Inventor
Fred B Mccormick
Paul F Baude
George D Vernstrom
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE459986T1 publication Critical patent/ATE459986T1/de

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Bipolar Transistors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Details Of Resistors (AREA)
AT00989200T 2000-07-12 2000-11-15 Verfahren für die herstellung eigekapselten organischen elektronischen vorrichtungen ATE459986T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/614,993 US6867539B1 (en) 2000-07-12 2000-07-12 Encapsulated organic electronic devices and method for making same
PCT/US2000/031393 WO2002005361A1 (en) 2000-07-12 2000-11-15 Encapsulated organic electronic devices and method for making same

Publications (1)

Publication Number Publication Date
ATE459986T1 true ATE459986T1 (de) 2010-03-15

Family

ID=24463553

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00989200T ATE459986T1 (de) 2000-07-12 2000-11-15 Verfahren für die herstellung eigekapselten organischen elektronischen vorrichtungen

Country Status (8)

Country Link
US (3) US6867539B1 (enExample)
EP (1) EP1299913B1 (enExample)
JP (1) JP4699676B2 (enExample)
KR (2) KR100828062B1 (enExample)
AT (1) ATE459986T1 (enExample)
AU (1) AU2001225741A1 (enExample)
DE (1) DE60043946D1 (enExample)
WO (1) WO2002005361A1 (enExample)

Families Citing this family (155)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US20100330748A1 (en) * 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US20070196682A1 (en) * 1999-10-25 2007-08-23 Visser Robert J Three dimensional multilayer barrier and method of making
US20090191342A1 (en) * 1999-10-25 2009-07-30 Vitex Systems, Inc. Method for edge sealing barrier films
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
JP2002009149A (ja) * 2000-06-20 2002-01-11 Toshiba Corp 半導体装置およびその製造方法
KR100394028B1 (ko) * 2000-12-28 2003-08-06 엘지.필립스 엘시디 주식회사 액정표시장치 및 그 제조방법
DE10043204A1 (de) 2000-09-01 2002-04-04 Siemens Ag Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung
DE10061299A1 (de) 2000-12-08 2002-06-27 Siemens Ag Vorrichtung zur Feststellung und/oder Weiterleitung zumindest eines Umwelteinflusses, Herstellungsverfahren und Verwendung dazu
DE10061297C2 (de) 2000-12-08 2003-05-28 Siemens Ag Verfahren zur Sturkturierung eines OFETs
DE10105914C1 (de) 2001-02-09 2002-10-10 Siemens Ag Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung
JP2002344011A (ja) * 2001-05-15 2002-11-29 Sony Corp 表示素子及びこれを用いた表示装置
DE10134132A1 (de) * 2001-07-13 2003-01-30 Siemens Ag Vorrichtung und Verfahren zum kontinuierlichen Drucken von organischen Leuchtdioden
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
US20090208754A1 (en) * 2001-09-28 2009-08-20 Vitex Systems, Inc. Method for edge sealing barrier films
DE10151036A1 (de) 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
DE10151440C1 (de) 2001-10-18 2003-02-06 Siemens Ag Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung
US6946676B2 (en) 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
TWI264121B (en) 2001-11-30 2006-10-11 Semiconductor Energy Lab A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device
DE10160732A1 (de) 2001-12-11 2003-06-26 Siemens Ag Organischer Feld-Effekt-Transistor mit verschobener Schwellwertspannung und Verwendung dazu
US6953735B2 (en) 2001-12-28 2005-10-11 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating a semiconductor device by transferring a layer to a support with curvature
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
DE10212640B4 (de) 2002-03-21 2004-02-05 Siemens Ag Logische Bauteile aus organischen Feldeffekttransistoren
US20070251570A1 (en) * 2002-03-29 2007-11-01 Konarka Technologies, Inc. Photovoltaic cells utilizing mesh electrodes
US6835950B2 (en) 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US6897474B2 (en) 2002-04-12 2005-05-24 Universal Display Corporation Protected organic electronic devices and methods for making the same
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) * 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US6949389B2 (en) * 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
DE10318187B4 (de) * 2002-05-02 2010-03-18 Osram Opto Semiconductors Gmbh Verkapselungsverfahren für organische Leuchtdiodenbauelemente
JP2004047387A (ja) * 2002-07-15 2004-02-12 Fuji Electric Holdings Co Ltd 有機多色発光表示素子およびその製造方法
ATE355566T1 (de) 2002-08-23 2006-03-15 Polyic Gmbh & Co Kg Organisches bauelement zum überspannungsschutz und dazugehörige schaltung
CN1726604A (zh) * 2002-11-05 2006-01-25 波尔伊克两合公司 具有高分辨率结构的有机电子元件及其制造方法
DE10253154A1 (de) 2002-11-14 2004-05-27 Siemens Ag Messgerät zur Bestimmung eines Analyten in einer Flüssigkeitsprobe
ATE354182T1 (de) 2002-11-19 2007-03-15 Polyic Gmbh & Co Kg Organische elektronische schaltung mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
DE10302149A1 (de) 2003-01-21 2005-08-25 Siemens Ag Verwendung leitfähiger Carbon-black/Graphit-Mischungen für die Herstellung von low-cost Elektronik
DE502004003677D1 (de) * 2003-01-21 2007-06-14 Polyic Gmbh & Co Kg Organisches elektronikbauteil und verfahren zur herstellung organischer elektronik
JP5350587B2 (ja) * 2003-03-24 2013-11-27 メルク パテント ゲーエムベーハー メッシュ電極を備える光電セル
US7648925B2 (en) * 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7510913B2 (en) * 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7344901B2 (en) 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7535017B2 (en) * 2003-05-30 2009-05-19 Osram Opto Semiconductors Gmbh Flexible multilayer packaging material and electronic devices with the packaging material
JP4820536B2 (ja) 2003-06-25 2011-11-24 彬雄 谷口 有機エレクトロルミネッセンス素子の製造方法
US7002292B2 (en) * 2003-07-22 2006-02-21 E. I. Du Pont De Nemours And Company Organic electronic device
DE10339036A1 (de) 2003-08-25 2005-03-31 Siemens Ag Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu
US6998648B2 (en) 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
DE10340644B4 (de) 2003-09-03 2010-10-07 Polyic Gmbh & Co. Kg Mechanische Steuerelemente für organische Polymerelektronik
US7052355B2 (en) * 2003-10-30 2006-05-30 General Electric Company Organic electro-optic device and method for making the same
US20050093437A1 (en) * 2003-10-31 2005-05-05 Ouyang Michael X. OLED structures with strain relief, antireflection and barrier layers
US7271534B2 (en) * 2003-11-04 2007-09-18 3M Innovative Properties Company Segmented organic light emitting device
US7432124B2 (en) * 2003-11-04 2008-10-07 3M Innovative Properties Company Method of making an organic light emitting device
US7279063B2 (en) * 2004-01-16 2007-10-09 Eastman Kodak Company Method of making an OLED display device with enhanced optical and mechanical properties
US7135352B2 (en) * 2004-02-26 2006-11-14 Eastman Kodak Company Method of fabricating a cover plate bonded over an encapsulated OLEDs
US20050196525A1 (en) * 2004-03-03 2005-09-08 Eastman Kodak Company Cutting and delivering cut OLED donor sheets
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
KR20070015590A (ko) * 2004-04-22 2007-02-05 오스람 옵토 세미컨덕터스 게엠베하 유기 전자 부품용 캡슐, 그의 제조 방법 및 용도
DE102004024461A1 (de) * 2004-05-14 2005-12-01 Konarka Technologies, Inc., Lowell Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauelements mit zumindest einer aktiven organischen Schicht
FR2871651A1 (fr) * 2004-06-09 2005-12-16 Thomson Licensing Sa Capot en verre et boitier d'encapsulation de composants electroniques dote d'un tel capot
US20050282307A1 (en) * 2004-06-21 2005-12-22 Daniels John J Particulate for organic and inorganic light active devices and methods for fabricating the same
US7033850B2 (en) * 2004-06-30 2006-04-25 Eastman Kodak Company Roll-to-sheet manufacture of OLED materials
KR100700000B1 (ko) * 2004-10-19 2007-03-26 삼성에스디아이 주식회사 표시장치와 그 제조방법
KR100721562B1 (ko) * 2004-12-03 2007-05-23 삼성에스디아이 주식회사 마그네슘-칼슘 막인 캐소드를 구비하는 유기전계발광소자및 그의 제조방법
EP1684366A1 (en) * 2005-01-25 2006-07-26 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Electronic device comprising an electronic component and encapsulation members
DE102005009820A1 (de) 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe mit organischen Logik-Schaltelementen
US8080277B2 (en) * 2005-03-18 2011-12-20 Konica Minolta Holdings, Inc. Method of forming organic compound layer, method of manufacturing organic EL element and organic EL element
US20070224464A1 (en) * 2005-03-21 2007-09-27 Srini Balasubramanian Dye-sensitized photovoltaic cells
DE102005022039B4 (de) * 2005-05-09 2008-11-13 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines verkapselten Elektronikbauteils
JP2006318776A (ja) * 2005-05-13 2006-11-24 Fuji Photo Film Co Ltd 有機エレクトロルミネッセンス表示装置
WO2007020214A2 (de) * 2005-08-17 2007-02-22 Siemens Aktiengesellschaft Verfahren und vorrichtung zur herstellung eines organischen bauteils
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US8574661B2 (en) * 2005-09-20 2013-11-05 Konica Minolta Holdings, Inc. Process for producing organic electroluminescent element and organic electroluminescent display device
US20070096646A1 (en) * 2005-10-28 2007-05-03 Van Nice Harold L Electroluminescent displays
US7621794B2 (en) * 2005-11-09 2009-11-24 International Display Systems, Inc. Method of encapsulating an organic light-emitting device
US7597603B2 (en) 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
US7537504B2 (en) 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
KR100733768B1 (ko) 2005-12-09 2007-07-02 (주)에스티아이 필름패턴 형성수단을 구비한 기판 인캡슐레이션 장치 및방법
US20070200489A1 (en) * 2006-02-01 2007-08-30 Poon Hak F Large area organic electronic devices and methods of fabricating the same
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
US8017220B2 (en) 2006-10-04 2011-09-13 Corning Incorporated Electronic device and method of making
US8084938B2 (en) * 2006-12-26 2011-12-27 Sharp Kabushiki Kaisha Organic electroluminescent panel, organic electroluminescent display, organic electroluminescent lighting device, and production methods thereof
US20100068542A1 (en) * 2006-12-29 2010-03-18 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid films
EP2139616B1 (en) * 2007-04-02 2018-08-29 Merck Patent GmbH Novel electrode
CN101663773A (zh) * 2007-04-20 2010-03-03 皇家飞利浦电子股份有限公司 通过汽相沉积方法结合真空层压来制备有机发光二极管
US8846169B2 (en) * 2007-12-28 2014-09-30 3M Innovative Properties Company Flexible encapsulating film systems
CN101909873B (zh) * 2007-12-28 2016-10-19 3M创新有限公司 用于阳光控制及其它用途的红外线反射膜
US20100009588A1 (en) * 2008-03-03 2010-01-14 Ray Robert B Method of manufacturing lighted signs from electroluminescent panels
WO2009134697A2 (en) * 2008-04-30 2009-11-05 Applied Materials, Inc. Roll to roll oled production system
JP2009272208A (ja) * 2008-05-09 2009-11-19 Dainippon Screen Mfg Co Ltd マスク部材貼付装置および塗布システム
US9481927B2 (en) * 2008-06-30 2016-11-01 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid barrier films
EP2144290A1 (en) * 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same
US9184410B2 (en) * 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) * 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
JP5326098B2 (ja) * 2009-02-05 2013-10-30 シャープ株式会社 基板表面の封止装置と有機elパネルの製造方法
JP5541872B2 (ja) * 2009-02-26 2014-07-09 パナソニック株式会社 面状発光装置および照明器具
FI123170B (fi) * 2009-05-26 2012-11-30 Beneq Oy Järjestely substraatin käsittelemiseksi sekä asennusalusta substraattia varten
JPWO2011027815A1 (ja) * 2009-09-04 2013-02-04 株式会社スリーボンド 有機el素子封止部材
EP2292339A1 (en) * 2009-09-07 2011-03-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Coating method and coating apparatus
TWI423718B (zh) * 2009-10-21 2014-01-11 Au Optronics Corp 有機電致發光裝置及具有此有機電致發光裝置的電子裝置
KR101267534B1 (ko) * 2009-10-30 2013-05-23 엘지디스플레이 주식회사 유기전계발광소자의 제조방법
JP5652405B2 (ja) * 2009-12-11 2015-01-14 コニカミノルタ株式会社 有機el素子の製造方法
US8753711B2 (en) * 2009-12-18 2014-06-17 General Electric Company Edge sealing method using barrier coatings
US8590338B2 (en) * 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
WO2011096923A1 (en) * 2010-02-03 2011-08-11 Universal Display Corporation Organic light emitting device with conducting cover
JP2012043689A (ja) * 2010-08-20 2012-03-01 Toshiba Tec Corp 有機el装置の製造方法
JP2012164581A (ja) * 2011-02-08 2012-08-30 Nitto Denko Corp 有機エレクトロルミネッセンス素子の製法
CN102681709B (zh) * 2011-03-17 2016-01-27 宸鸿光电科技股份有限公司 触控显示设备及其制造方法
DE102011076750A1 (de) * 2011-05-31 2012-12-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
CN103548169A (zh) * 2011-06-30 2014-01-29 海洋王照明科技股份有限公司 顶发射柔性有机电致发光器件及其制备方法
WO2013000164A1 (zh) * 2011-06-30 2013-01-03 海洋王照明科技股份有限公司 顶发射有机电致发光二极管及其制备方法
TWI612123B (zh) * 2012-02-03 2018-01-21 Lg化學股份有限公司 黏合膜
US9711392B2 (en) * 2012-07-25 2017-07-18 Infineon Technologies Ag Field emission devices and methods of making thereof
KR101408603B1 (ko) * 2012-08-02 2014-06-17 주식회사 엘지화학 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
WO2014021687A1 (ko) * 2012-08-02 2014-02-06 주식회사 엘지화학 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
US20150213990A1 (en) * 2012-08-08 2015-07-30 3M Innovative Properties Company Barrier film constructions and methods of making same
EP2885130A4 (en) * 2012-08-16 2016-06-29 3M Innovative Properties Co METHOD FOR PRODUCING BARRIER ARRANGEMENTS
EP2890653B1 (en) 2012-08-30 2016-08-24 Corning Incorporated Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit
KR20150079493A (ko) * 2012-10-29 2015-07-08 닛토덴코 가부시키가이샤 롤투롤 방식을 이용한 유기 일렉트로루미네센스 패널의 제조 방법
US8912018B2 (en) * 2012-12-17 2014-12-16 Universal Display Corporation Manufacturing flexible organic electronic devices
US9142777B2 (en) * 2013-01-08 2015-09-22 OLEDWorks LLC Apparatus and method for making OLED lighting device
KR20140091346A (ko) * 2013-01-11 2014-07-21 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR102309244B1 (ko) 2013-02-20 2021-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN104051667A (zh) * 2013-03-15 2014-09-17 海洋王照明科技股份有限公司 有机电致发光器件及其封装方法
CN104051357B (zh) * 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
KR20140140188A (ko) * 2013-05-28 2014-12-09 삼성디스플레이 주식회사 도너기판 및 이의 제조방법 및 이를 이용한 전사패턴 형성방법
JP6204081B2 (ja) * 2013-06-19 2017-09-27 株式会社小糸製作所 車両用灯具
JP6341999B2 (ja) * 2013-09-30 2018-06-13 エルジー ディスプレイ カンパニー リミテッド 有機発光素子およびその製造方法
JP6342487B2 (ja) * 2013-09-30 2018-06-13 エルジー ディスプレイ カンパニー リミテッド 有機電子装置の製造方法
CN103682045B (zh) * 2013-12-04 2016-09-14 北京国联万众半导体科技有限公司 一种led封装杯体的加工方法及相应模具
WO2015087192A1 (en) 2013-12-12 2015-06-18 Semiconductor Energy Laboratory Co., Ltd. Peeling method and peeling apparatus
KR101402355B1 (ko) 2014-01-16 2014-06-02 (주)휴넷플러스 유기 전자 소자 및 이의 제조방법
CN106134288B (zh) * 2014-03-19 2018-01-02 琳得科株式会社 电子元件封装用层叠片以及电子器件的制造方法
US20150372251A1 (en) * 2014-06-19 2015-12-24 Toshishige Fujii Electric element package
DE102014223367A1 (de) * 2014-11-17 2016-05-19 Osram Oled Gmbh Organische Leuchtiode, organisches Leuchtmodul und Verfahren zur Herstellung einer organischen Leuchtiode
US10084135B2 (en) * 2014-11-27 2018-09-25 Industrial Technology Research Institute Illumination device and method of fabricating an illumination device
US10562055B2 (en) * 2015-02-20 2020-02-18 Si-Ware Systems Selective step coverage for micro-fabricated structures
CN104701353A (zh) * 2015-03-27 2015-06-10 京东方科技集团股份有限公司 有机发光显示面板和显示装置
CN104934550A (zh) * 2015-05-07 2015-09-23 京东方科技集团股份有限公司 Oled器件的封装结构、封装方法以及电子设备
DE102016109204A1 (de) * 2016-05-19 2017-11-23 Osram Oled Gmbh Organisches, lichtemittierendes bauelement und verfahren zum herstellen desselben
JP2018041565A (ja) * 2016-09-05 2018-03-15 株式会社ジャパンディスプレイ 表示装置
CN109644531B (zh) * 2016-09-28 2021-02-12 夏普株式会社 有机el显示装置及其制造方法
DE102016122688B4 (de) * 2016-11-24 2025-10-23 Pictiva Displays International Limited Verfahren zur Herstellung einer organischen Leuchtdiode und organische Leuchtdiode
JP2020518107A (ja) 2017-04-26 2020-06-18 オーティーアイ ルミオニクス インコーポレーテッドOti Lumionics Inc. 表面上のコーティングをパターン化する方法およびパターン化されたコーティングを含むデバイス
US11236249B2 (en) * 2017-11-14 2022-02-01 Agfa-Gevaert Nv Method of manufacturing a conductive pattern
US12069938B2 (en) 2019-05-08 2024-08-20 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
CN114303184A (zh) * 2019-08-30 2022-04-08 华为技术有限公司 显示屏和终端设备
JP6858912B2 (ja) * 2019-10-09 2021-04-14 日東電工株式会社 フレキシブル画像表示装置およびそれに用いる光学積層体
WO2021131218A1 (ja) * 2019-12-27 2021-07-01 日東電工株式会社 フレキシブル画像表示装置およびそれに用いる光学積層体
US12113279B2 (en) 2020-09-22 2024-10-08 Oti Lumionics Inc. Device incorporating an IR signal transmissive region
CA3240373A1 (en) 2020-12-07 2022-06-16 Michael HELANDER Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating
DE102023136903A1 (de) 2023-12-30 2025-07-03 Heliatek Gmbh Optoelektronisches Bauelement mit einem Versiegelungsmaterial in einem Randbereich zwischen einer vorderen Beschichtung und einer hinteren Beschichtung

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3376177A (en) * 1964-05-04 1968-04-02 Sylvania Electric Prod Process for the manufacture of electroluminescent lamps
USRE29284E (en) * 1966-09-06 1977-06-28 Rockwell International Corporation Process for forming interconnections in a multilayer circuit board
US3621321A (en) 1969-10-28 1971-11-16 Canadian Patents Dev Electroluminescent device with light emitting aromatic, hydrocarbon material
US4015166A (en) * 1972-09-06 1977-03-29 Matsushita Electric Industrial Co., Ltd. X-Y matrix type electroluminescent display panel
US3995299A (en) 1974-10-15 1976-11-30 The Secretary Of State For Industry In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Radiation sources
GB1559850A (en) * 1975-12-23 1980-01-30 Smiths Industries Ltd Electroluminescent display devices
US4818576A (en) * 1980-02-20 1989-04-04 Flexcon Co., Inc. Silicone releases, laminates and methods
JPS6229091A (ja) * 1985-07-31 1987-02-07 ホ−ヤ株式会社 El素子の封止方法
US5184969A (en) * 1988-05-31 1993-02-09 Electroluminscent Technologies Corporation Electroluminescent lamp and method for producing the same
US4862827A (en) 1988-06-28 1989-09-05 Wacker-Chemie Gmbh Apparatus for coating semiconductor components on a dielectric film
US4913930A (en) 1988-06-28 1990-04-03 Wacker Silicones Corporation Method for coating semiconductor components on a dielectric film
US5189405A (en) 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
US5055076A (en) * 1989-03-09 1991-10-08 Stanley Electric Co., Ltd. Electroluminescent panel and method of manufacturing the same
US5112882A (en) 1989-09-06 1992-05-12 Minnesota Mining And Manufacturing Company Radiation curable polyolefin pressure sensitive adhesive
US5131877A (en) * 1989-10-12 1992-07-21 Alps Electric Co., Ltd. Electroluminescent device
US5061549A (en) 1990-03-20 1991-10-29 Shores A Andrew Substrate attach adhesive film, application method and devices incorporating the same
US5061657A (en) 1990-07-18 1991-10-29 The United States Of America As Represented By The Secretary Of The Navy Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer
US5201976A (en) * 1991-05-06 1993-04-13 Morgan Adhesives Company Method of producing a continuous label web
EP0569827A2 (en) * 1992-05-11 1993-11-18 Idemitsu Kosan Company Limited Organic electroluminescence device
US5652067A (en) 1992-09-10 1997-07-29 Toppan Printing Co., Ltd. Organic electroluminescent device
US5744557A (en) 1993-06-16 1998-04-28 Minnesota Mining And Manufacturing Company Energy-curable cyanate/ethylenically unsaturated compositions
US5362421A (en) 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US6218774B1 (en) * 1993-06-30 2001-04-17 Edward J. A. Pope Photoluminescent/electroluminescent display screen
ATE218398T1 (de) 1993-10-04 2002-06-15 3M Innovative Properties Co Verfahren zur herstellung einer acrylatbeschichtung
JPH07282975A (ja) 1994-04-14 1995-10-27 Matsushita Electric Ind Co Ltd 有機el素子及びその製造方法
JP3585524B2 (ja) * 1994-04-20 2004-11-04 大日本印刷株式会社 有機薄膜el素子の製造方法
US5637176A (en) * 1994-06-16 1997-06-10 Fry's Metals, Inc. Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials
US5818168A (en) * 1994-09-07 1998-10-06 Hitachi, Ltd. Gas discharge display panel having communicable main and auxiliary discharge spaces and manufacturing method therefor
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
US5593794A (en) 1995-01-23 1997-01-14 Duracell Inc. Moisture barrier composite film of silicon nitride and fluorocarbon polymer and its use with an on-cell tester for an electrochemical cell
US5804917A (en) * 1995-01-31 1998-09-08 Futaba Denshi Kogyo K.K. Organic electroluminescent display device and method for manufacturing same
US5552547A (en) * 1995-02-13 1996-09-03 Shi; Song Q. Organometallic complexes with built-in fluorescent dyes for use in light emitting devices
US5786664A (en) 1995-03-27 1998-07-28 Youmin Liu Double-sided electroluminescent device
DE69622034T2 (de) 1995-04-18 2003-01-30 Cambridge Display Technology Ltd., Cambridge Herstellung von organischen elektrolumineszenten vorrichtungen
US5641611A (en) 1995-08-21 1997-06-24 Motorola Method of fabricating organic LED matrices
US5686360A (en) 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US5811177A (en) 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
JP3947226B2 (ja) 1996-01-16 2007-07-18 デュレル・コーポレーション ロールコーティングされたelパネル
WO1997031508A1 (en) 1996-02-26 1997-08-28 Idemitsu Kosan Co., Ltd. Organic electroluminescent element and method for manufacturing the same
KR100453427B1 (ko) * 1996-02-26 2005-02-28 이데미쓰 고산 가부시키가이샤 유기전자발광소자및그의제조방법
DE69635929D1 (de) 1996-05-16 2006-05-11 Minnesota Mining & Mfg Klebstoffzusammensetzungen und methoden zu ihrer verwendung
US5734225A (en) 1996-07-10 1998-03-31 International Business Machines Corporation Encapsulation of organic light emitting devices using siloxane or siloxane derivatives
DE69615410T2 (de) 1996-07-10 2002-06-20 International Business Machines Corp., Armonk Siloxan und siloxanderivate als einkapslungsmaterial für lichtemittierende organische bauelemente
US5998085A (en) 1996-07-23 1999-12-07 3M Innovative Properties Process for preparing high resolution emissive arrays and corresponding articles
US5682066A (en) 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
US5844363A (en) 1997-01-23 1998-12-01 The Trustees Of Princeton Univ. Vacuum deposited, non-polymeric flexible organic light emitting devices
JPH1057214A (ja) 1996-08-22 1998-03-03 Hagiwara Kogyo Kk 健康枕
US5948552A (en) 1996-08-27 1999-09-07 Hewlett-Packard Company Heat-resistant organic electroluminescent device
JP2760347B2 (ja) 1996-09-27 1998-05-28 日本電気株式会社 有機薄膜電界発光素子およびその製造方法
US5895228A (en) 1996-11-14 1999-04-20 International Business Machines Corporation Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives
US5821692A (en) 1996-11-26 1998-10-13 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package
US6219113B1 (en) * 1996-12-17 2001-04-17 Matsushita Electric Industrial Co., Ltd. Method and apparatus for driving an active matrix display panel
KR100195175B1 (ko) 1996-12-23 1999-06-15 손욱 유기전자발광소자 유기박막용 도너필름, 이를 이용한 유기전자발광소자의 제조방법 및 그 방법에 따라 제조된 유기전자발광소자
JPH10183112A (ja) 1996-12-27 1998-07-14 Sony Corp 電界発光素子
US5904961A (en) 1997-01-24 1999-05-18 Eastman Kodak Company Method of depositing organic layers in organic light emitting devices
US5739545A (en) 1997-02-04 1998-04-14 International Business Machines Corporation Organic light emitting diodes having transparent cathode structures
JP3234523B2 (ja) 1997-02-07 2001-12-04 エスエムシー株式会社 恒温冷媒液循環装置
US6049167A (en) * 1997-02-17 2000-04-11 Tdk Corporation Organic electroluminescent display device, and method and system for making the same
US5874804A (en) 1997-03-03 1999-02-23 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package and method of fabrication
JPH10261486A (ja) * 1997-03-19 1998-09-29 Idemitsu Kosan Co Ltd 有機el発光装置の製造方法
TW393785B (en) * 1997-09-19 2000-06-11 Siemens Ag Method to produce many semiconductor-bodies
ATE219725T1 (de) 1997-10-24 2002-07-15 Agfa Gevaert Verbundscheibe mit einem dünnen borosilikatglassubstrat als eine bildende schicht
JPH11144864A (ja) * 1997-11-13 1999-05-28 Mitsubishi Chemical Corp 有機電界発光素子及びその製造方法
DE69941200D1 (de) * 1998-01-09 2009-09-17 Sony Corp Elektrolumineszente Vorrichtung und Herstellungsverfahren
JP3092584B2 (ja) * 1998-03-23 2000-09-25 日本電気株式会社 有機エレクトロルミネッセンス素子
JPH11273855A (ja) * 1998-03-25 1999-10-08 Tdk Corp 有機el表示器
JP3757613B2 (ja) * 1998-04-16 2006-03-22 住友化学株式会社 パターン化された有機薄膜の製造方法、パターン化された有機薄膜を含む有機エレクトロルミネッセンス素子およびその製造方法
GB9808221D0 (en) * 1998-04-17 1998-06-17 Sharp Kk Liquid crystal device manufacturing methods
ATE220936T1 (de) * 1998-05-13 2002-08-15 Cygnus Therapeutic Systems Sammelvorrichtungen für transdermale probennahmesysteme
JP2000003783A (ja) * 1998-06-12 2000-01-07 Tdk Corp 有機el表示装置
US6111357A (en) * 1998-07-09 2000-08-29 Eastman Kodak Company Organic electroluminescent display panel having a cover with radiation-cured perimeter seal
JP3692844B2 (ja) * 1998-07-24 2005-09-07 セイコーエプソン株式会社 電界発光素子、及び電子機器
US6146225A (en) 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
JP2000173766A (ja) * 1998-09-30 2000-06-23 Sanyo Electric Co Ltd 表示装置
CA2353506A1 (en) 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
EP1145338B1 (en) 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Environmental barrier material for organic light emitting device and method of making
US6247986B1 (en) * 1998-12-23 2001-06-19 3M Innovative Properties Company Method for precise molding and alignment of structures on a substrate using a stretchable mold
JP2000208252A (ja) 1999-01-14 2000-07-28 Tdk Corp 有機el素子
US6114088A (en) 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
DE60003281T2 (de) 1999-01-15 2004-05-06 3M Innovative Properties Co., Saint Paul Thermisches Übertragungsverfahren.
JP2001118679A (ja) * 1999-10-18 2001-04-27 Toyota Motor Corp 有機el素子の製造方法
US6569674B1 (en) * 1999-12-15 2003-05-27 Amersham Biosciences Ab Method and apparatus for performing biological reactions on a substrate surface

Also Published As

Publication number Publication date
WO2002005361A1 (en) 2002-01-17
EP1299913A1 (en) 2003-04-09
JP4699676B2 (ja) 2011-06-15
AU2001225741A1 (en) 2002-01-21
KR20070061596A (ko) 2007-06-13
EP1299913B1 (en) 2010-03-03
US6867539B1 (en) 2005-03-15
KR100828062B1 (ko) 2008-05-09
KR20030031116A (ko) 2003-04-18
JP2004503066A (ja) 2004-01-29
DE60043946D1 (de) 2010-04-15
US20110177637A1 (en) 2011-07-21
US20050129841A1 (en) 2005-06-16
US8657985B2 (en) 2014-02-25

Similar Documents

Publication Publication Date Title
ATE459986T1 (de) Verfahren für die herstellung eigekapselten organischen elektronischen vorrichtungen
EP1191823A4 (en) EL ORGANIC DEVICE AND METHOD OF MANUFACTURE
ATE469442T1 (de) Strukturierung von elektrischen funktionsschichten mittels einer transferfolie und strukturierung des klebers
TW200520609A (en) Mask, method for manufacturing thereof, method for manufacturing organic electroluminescent device, and organic electroluminescent device
DE602004010719D1 (de) Verfahren zur Herstellung einer elektrolumineszenten Vorrichtung
ATE365974T1 (de) Verfahren zur herstellung von organischen optoelektronischen und elektronischen bauteilen sowie dadurch erhaltene bauteile
ATE490889T1 (de) Fahrzeugverglasung
TW200511893A (en) Method of manufacturing organic electroluminescent display device and organic electroluminescent display device, and display device equipped with organic electroluminescent display device
TW200501216A (en) Organic semiconductor device and method of manufacture of same
ATE519230T1 (de) Verfahren zur herstellung von elektrisch verbundenen optoelektrischen halbleitervorrichtungen
WO2004107467A3 (de) VERFAHREN ZUR HERSTELLUNG VON OLEDs
DE602009000259D1 (de) Verfahren zur Herstellung einer Funktionsschicht
FI20031201L (fi) Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
DE50306538D1 (de) Organische elektronische schaltung mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu
EP1526584A3 (en) Photosensitive semiconductor nanocrystals, photosensitive composition comprising semiconductor nanocrystals and method for forming semiconductor nanocrystal pattern using the same
WO2004088728A3 (en) Method of manufacturing a flexible electronic device and flexible device
WO2006036297A3 (en) Organic electroluminescence device and method of production of same
WO2003095358A3 (en) Method of forming manofluidic channels
ATE383733T1 (de) Elektrolumineszenzbauelemente und verfahren zur herstellung von elektrolumineszenzbauelementen mit einem farbwandlungselement
DE50210653D1 (de) Verfahren zur herstellung von elektronischen bauelementen
TW200708181A (en) Organic electroluminescent display panel and fabricatiing method thereof
DE602004005685D1 (de) Verfahren zur herstellung einer elektronischen anordung
TW200711178A (en) Light-emitting element and manufacturing method thereof
ATE519223T1 (de) Verfahren zur herstellung mehrerer halbleiteranordnungen und trägersubstrat
TW200717896A (en) Light-emitting device and method of manufacturing light-emitting device

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties