JP4157146B2 - リソグラフィ装置及びデバイス製造方法 - Google Patents
リソグラフィ装置及びデバイス製造方法 Download PDFInfo
- Publication number
- JP4157146B2 JP4157146B2 JP2006545996A JP2006545996A JP4157146B2 JP 4157146 B2 JP4157146 B2 JP 4157146B2 JP 2006545996 A JP2006545996 A JP 2006545996A JP 2006545996 A JP2006545996 A JP 2006545996A JP 4157146 B2 JP4157146 B2 JP 4157146B2
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- Prior art keywords
- substrate
- immersion liquid
- barrier member
- projection system
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 133
- 239000007788 liquid Substances 0.000 claims description 110
- 230000004888 barrier function Effects 0.000 claims description 82
- 238000007654 immersion Methods 0.000 claims description 66
- 230000005855 radiation Effects 0.000 claims description 28
- 238000000059 patterning Methods 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011796 hollow space material Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/743,271 US7394521B2 (en) | 2003-12-23 | 2003-12-23 | Lithographic apparatus and device manufacturing method |
| PCT/EP2004/014282 WO2005064405A2 (en) | 2003-12-23 | 2004-12-15 | Lithographic apparatus and device manufacturing method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008062774A Division JP4526572B2 (ja) | 2003-12-23 | 2008-03-12 | リソグラフィ装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007515798A JP2007515798A (ja) | 2007-06-14 |
| JP2007515798A5 JP2007515798A5 (https=) | 2007-08-02 |
| JP4157146B2 true JP4157146B2 (ja) | 2008-09-24 |
Family
ID=34678626
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006545996A Expired - Fee Related JP4157146B2 (ja) | 2003-12-23 | 2004-12-15 | リソグラフィ装置及びデバイス製造方法 |
| JP2008062774A Expired - Fee Related JP4526572B2 (ja) | 2003-12-23 | 2008-03-12 | リソグラフィ装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008062774A Expired - Fee Related JP4526572B2 (ja) | 2003-12-23 | 2008-03-12 | リソグラフィ装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7394521B2 (https=) |
| EP (3) | EP1697799A2 (https=) |
| JP (2) | JP4157146B2 (https=) |
| KR (1) | KR100855337B1 (https=) |
| CN (2) | CN101872129B (https=) |
| TW (1) | TWI261151B (https=) |
| WO (1) | WO2005064405A2 (https=) |
Families Citing this family (218)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7372541B2 (en) | 2002-11-12 | 2008-05-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7110081B2 (en) * | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| SG121822A1 (en) * | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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| WO2004092830A2 (en) | 2003-04-11 | 2004-10-28 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3287848B1 (en) | 2018-11-07 |
| JP4526572B2 (ja) | 2010-08-18 |
| CN1898606A (zh) | 2007-01-17 |
| WO2005064405A3 (en) | 2006-03-09 |
| CN100507721C (zh) | 2009-07-01 |
| EP1697799A2 (en) | 2006-09-06 |
| EP3287848A1 (en) | 2018-02-28 |
| US7394521B2 (en) | 2008-07-01 |
| KR20060103271A (ko) | 2006-09-28 |
| CN101872129A (zh) | 2010-10-27 |
| US20050134815A1 (en) | 2005-06-23 |
| WO2005064405A2 (en) | 2005-07-14 |
| JP2007515798A (ja) | 2007-06-14 |
| TWI261151B (en) | 2006-09-01 |
| US7710541B2 (en) | 2010-05-04 |
| CN101872129B (zh) | 2013-01-23 |
| EP2259139B1 (en) | 2017-08-23 |
| US20080186459A1 (en) | 2008-08-07 |
| TW200534031A (en) | 2005-10-16 |
| KR100855337B1 (ko) | 2008-09-04 |
| EP2259139A1 (en) | 2010-12-08 |
| JP2008219020A (ja) | 2008-09-18 |
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