JP3914239B2 - 配線基板および配線基板の製造方法 - Google Patents
配線基板および配線基板の製造方法 Download PDFInfo
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- JP3914239B2 JP3914239B2 JP2005073946A JP2005073946A JP3914239B2 JP 3914239 B2 JP3914239 B2 JP 3914239B2 JP 2005073946 A JP2005073946 A JP 2005073946A JP 2005073946 A JP2005073946 A JP 2005073946A JP 3914239 B2 JP3914239 B2 JP 3914239B2
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- wiring
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- insulating layer
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Description
101 コア基板
102,119,202,219 端子接続部
103,111,113,203 絶縁層
104,115 シード層
105,116,205,216,217,222 ビアプラグ
106,117,206,217,223,225 パターン配線
107,207 接続部
108,208 スタッドバンプ
109,209 半導体チップ
110,210 アンダーフィル
114 ビアホール
118,120,218,220 ソルダーレジスト層
121,221 ハンダバンプ
Claims (11)
- 半導体チップが内蔵された配線基板であって、
前記半導体チップが埋設される絶縁層と、
前記半導体チップの第1の側に形成され、該半導体チップに接続されるとともに第1の端子接続部に接続される第1のパターン配線と、
前記半導体チップの第2の側に形成され、該半導体チップに接続されるとともに第2の端子接続部に接続される第2のパターン配線と、
前記絶縁層に形成され、前記第1のパターン配線と前記第2のパターン配線を接続するビアプラグと、
前記絶縁層に形成される補強構造体と、を有し、
前記絶縁層は、前記第1のパターン配線および前記半導体チップを覆う絶縁層と、該絶縁層上に形成される別の絶縁層を含むように構成され、
前記補強構造体は、前記第1のパターン配線および前記半導体チップを覆う絶縁層上に設置されるとともに、前記別の絶縁層に埋設されていることを特徴とする配線基板。 - 前記補強構造体は、前記半導体チップと同一平面上に形成されることを特徴とする請求項1記載の配線基板。
- 前記補強構造体は、前記半導体チップを囲むように形成されることを特徴とする請求項1または2記載の配線基板。
- 前記第1の配線パターン、前記第2の配線パターン、および前記ビアプラグは、多層配線構造を構成することを特徴とする請求項1乃至3のうち、いずれか1項記載の配線基板。
- 前記補強構造体は、有機コア材料または金属材料よりなることを特徴とする請求項1乃至4のうち、いずれか1項記載の配線基板。
- 半導体チップが内蔵された配線基板の製造方法であって、
前記半導体チップに接続される第1のパターン配線と、該第1のパターン配線に接続される第1の端子接続部とを形成する工程と、
前記第1のパターン配線上に前記半導体チップを設置する工程と、
前記第1のパターン配線と前記半導体チップを覆う絶縁層を形成する工程と、
前記絶縁層上に補強構造体を設置する工程と、
前記絶縁層上に、前記補強構造体を埋設する別の絶縁層を形成する工程と、
前記絶縁層および前記別の絶縁層に、前記第1のパターン配線に接続されるビアプラグを形成する工程と、
前記ビアプラグに接続される第2のパターン配線と、該第2のパターン配線に接続される第2の端子接続部を形成する工程と、を有することを特徴とする配線基板の製造方法。 - 前記補強構造体は、前記半導体チップと同一平面上に設置されることを特徴とする請求項6記載の配線基板の製造方法。
- 前記第1のパターン配線は、コア基板上に形成され、当該コア基板を除去する工程をさらに有することを特徴とする請求項6または7記載の配線基板の製造方法。
- 前記コア基板は導電性の材料よりなり、前記第1の端子接続部は当該コア基板を電極にした電解メッキにより形成される部分を含むことを特徴とする請求項8記載の配線基板の製造方法。
- 前記半導体チップにはスタッドバンプが設置されており、当該スタッドバンプを介して当該半導体チップが前記第1のパターン配線に電気的に接続されることを特徴とする請求項6乃至9のうち、いずれか1項記載の配線基板の製造方法。
- 前記スタッドバンプと前記第1のパターン配線の間には、半田よりなる接続部が形成されていることを特徴とする請求項10記載の配線基板の製造方法。
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JP2005073946A JP3914239B2 (ja) | 2005-03-15 | 2005-03-15 | 配線基板および配線基板の製造方法 |
US11/372,916 US7884484B2 (en) | 2005-03-15 | 2006-03-10 | Wiring board and method of manufacturing the same |
KR1020060023432A KR20060101286A (ko) | 2005-03-15 | 2006-03-14 | 배선 기판과 그 제조 방법 |
TW095108709A TWI394503B (zh) | 2005-03-15 | 2006-03-15 | 佈線板及其製造方法 |
EP06005295A EP1703558A3 (en) | 2005-03-15 | 2006-03-15 | Wiring board with embedded semiconductor chip, embedded reinforcing member and method of manufacturing the same |
CN2006100598487A CN1835654B (zh) | 2005-03-15 | 2006-03-15 | 配线基板及其制造方法 |
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JP2005073946A JP3914239B2 (ja) | 2005-03-15 | 2005-03-15 | 配線基板および配線基板の製造方法 |
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KR (1) | KR20060101286A (ja) |
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- 2006-03-15 CN CN2006100598487A patent/CN1835654B/zh not_active Expired - Fee Related
- 2006-03-15 TW TW095108709A patent/TWI394503B/zh not_active IP Right Cessation
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EP1703558A2 (en) | 2006-09-20 |
KR20060101286A (ko) | 2006-09-22 |
CN1835654A (zh) | 2006-09-20 |
TWI394503B (zh) | 2013-04-21 |
EP1703558A3 (en) | 2010-01-20 |
TW200640326A (en) | 2006-11-16 |
CN1835654B (zh) | 2011-06-29 |
US20060208356A1 (en) | 2006-09-21 |
JP2006261246A (ja) | 2006-09-28 |
US7884484B2 (en) | 2011-02-08 |
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