JP5505307B2 - 機能素子内蔵基板及びその製造方法、並びに電子機器 - Google Patents
機能素子内蔵基板及びその製造方法、並びに電子機器 Download PDFInfo
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Description
本発明は、日本国特許出願:特願2008−259783号(2008年10月6日出願)の優先権主張に基づくものであり、同出願の全記載内容は引用をもって本書に組み込み記載されているものとする。
2 基材
3 導体配線層
4、4a、4b、4c 絶縁層
5 電極端子
6、6a、6c 補強材
7 ビア
10 機能素子1の縦又は横の長さ
11、11a、11c 開口部
12 導体配線層
13 接着層
100、200、300、400、500 機能素子内蔵基板
Claims (11)
- 基材上に、1つ以上の機能素子と、前記機能素子を埋設する絶縁層と、を備える機能素子内蔵基板であって、
前記絶縁層には、前記機能素子の側方において、基板全面に亘って補強材が埋設されており、
前記補強材は、前記機能素子の回路面の横又は縦の長さの10000分の1以上かつ10分の1以下の長さで前記機能素子の周縁部の少なくとも一部と重なっていることを特徴とする機能素子内蔵基板。 - 前記補強材は、前記機能素子の回路面の横又は縦の長さの10000分の1以上かつ100分の1以下の長さで前記機能素子の周縁部の少なくとも一部と重なっていることを特徴とする請求項1記載の機能素子内蔵基板。
- 前記補強材は、前記機能素子の回路面側及びその反対側の一方又は両方にて、前記機能素子の周縁部の一部と重なっていることを特徴とする請求項1又は2記載の機能素子内蔵基板。
- 前記補強材は、補強繊維を含むことを特徴とする請求項1乃至3のいずれか一に記載の機能素子内蔵基板。
- 前記補強繊維は、ガラスクロスからなることを特徴とする請求項4記載の機能素子内蔵基板。
- 前記補強材は、高弾性材または金属材からなり、前記機能素子に接触しないように配置されていることを特徴とする請求項1乃至3のいずれか一に記載の機能素子内蔵基板。
- 前記絶縁層上に前記機能素子と電気的に接続された導体配線層と、
前記機能素子の領域外において前記絶縁層及び前記補強材を貫通して配設されるとともに、前記導体配線層と前記基材における導体配線層を電気的に接続するビアと、
を備え、
前記補強材は、絶縁体よりなることを特徴とする請求項1乃至3のいずれか一に記載の機能素子内蔵基板。 - 請求項1乃至7のいずれか一に記載の機能素子内蔵基板を実装していることを特徴とする電子機器。
- 機能素子を基材上に搭載する工程と、
補強材を含む絶縁層において前記機能素子と対応する位置に開口部を形成する工程と、
前記開口部と前記機能素子を位置合わせして前記機能素子の回路面側から前記絶縁層を積層する工程と、
を含み、
前記補強材は、前記機能素子の回路面の横又は縦の長さの10000分の1以上かつ10分の1以下の長さで前記機能素子の周縁部の少なくとも一部と重なっていることを特徴とする機能素子内蔵基板の製造方法。 - 補強材を含む絶縁層において機能素子と対応する位置に開口部を形成する工程と、
前記機能素子よりも基材側に前記絶縁層を配置し、前記開口部と前記機能素子を位置合わせして、前記絶縁層を積層しつつ前記機能素子を基材上に搭載する工程と、
を含み、
前記補強材は、前記機能素子の回路面の横又は縦の長さの10000分の1以上かつ10分の1以下の長さで前記機能素子の周縁部の少なくとも一部と重なっていることを特徴とする機能素子内蔵基板の製造方法。 - 補強材を含む第1絶縁層において機能素子と対応する位置に第1開口部を形成する工程と、
補強材を含む第2絶縁層において機能素子と対応する位置に第2開口部を形成する工程と、
前記機能素子よりも基材側に前記第1絶縁層を配置し、前記第1開口部と前記機能素子を位置合わせして、前記第1絶縁層を積層しつつ前記機能素子を基材上に搭載する工程と、
前記第2開口部と前記機能素子を位置合わせして前記機能素子の回路面側から前記第2絶縁層を積層する工程と、
を含み、
前記補強材は、前記機能素子の回路面の横又は縦の長さの10000分の1以上かつ10分の1以下の長さで前記機能素子の周縁部の少なくとも一部と重なっていることを特徴とする機能素子内蔵基板の製造方法。
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JP2010532900A JP5505307B2 (ja) | 2008-10-06 | 2009-10-05 | 機能素子内蔵基板及びその製造方法、並びに電子機器 |
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JP2008259783 | 2008-10-06 | ||
JP2008259783 | 2008-10-06 | ||
JP2010532900A JP5505307B2 (ja) | 2008-10-06 | 2009-10-05 | 機能素子内蔵基板及びその製造方法、並びに電子機器 |
PCT/JP2009/067329 WO2010041621A1 (ja) | 2008-10-06 | 2009-10-05 | 機能素子内蔵基板及びその製造方法、並びに電子機器 |
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JP5505307B2 true JP5505307B2 (ja) | 2014-05-28 |
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JP2013211519A (ja) * | 2012-02-29 | 2013-10-10 | Ngk Spark Plug Co Ltd | 多層配線基板の製造方法 |
JPWO2014188493A1 (ja) * | 2013-05-20 | 2017-02-23 | 株式会社メイコー | 部品内蔵基板及びその製造方法 |
TWI604763B (zh) * | 2016-11-18 | 2017-11-01 | 同泰電子科技股份有限公司 | 軟硬複合板結構 |
KR101963293B1 (ko) | 2017-11-01 | 2019-03-28 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
CN111669893A (zh) * | 2019-03-06 | 2020-09-15 | 珠海方正科技高密电子有限公司 | 电路板及其制备方法 |
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JP2004087957A (ja) * | 2002-08-28 | 2004-03-18 | Fujitsu Ltd | 部品内蔵プリント配線板、およびその部品内蔵プリント配線板の製造方法 |
JP2006261246A (ja) * | 2005-03-15 | 2006-09-28 | Shinko Electric Ind Co Ltd | 配線基板および配線基板の製造方法 |
WO2007135737A1 (ja) * | 2006-05-24 | 2007-11-29 | Dai Nippon Printing Co., Ltd. | 部品内蔵配線板、部品内蔵配線板の製造方法 |
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2009
- 2009-10-05 JP JP2010532900A patent/JP5505307B2/ja not_active Expired - Fee Related
- 2009-10-05 WO PCT/JP2009/067329 patent/WO2010041621A1/ja active Application Filing
Patent Citations (5)
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JP2000349225A (ja) * | 1999-03-30 | 2000-12-15 | Ngk Spark Plug Co Ltd | コンデンサ付属配線基板、配線基板、及びコンデンサ |
JP2004087957A (ja) * | 2002-08-28 | 2004-03-18 | Fujitsu Ltd | 部品内蔵プリント配線板、およびその部品内蔵プリント配線板の製造方法 |
JP2006261246A (ja) * | 2005-03-15 | 2006-09-28 | Shinko Electric Ind Co Ltd | 配線基板および配線基板の製造方法 |
WO2007135737A1 (ja) * | 2006-05-24 | 2007-11-29 | Dai Nippon Printing Co., Ltd. | 部品内蔵配線板、部品内蔵配線板の製造方法 |
JP2008010555A (ja) * | 2006-06-28 | 2008-01-17 | Nec Toppan Circuit Solutions Inc | 配線基板及びその製造方法 |
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