JP2017216441A5 - - Google Patents

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JP2017216441A5
JP2017216441A5 JP2017094326A JP2017094326A JP2017216441A5 JP 2017216441 A5 JP2017216441 A5 JP 2017216441A5 JP 2017094326 A JP2017094326 A JP 2017094326A JP 2017094326 A JP2017094326 A JP 2017094326A JP 2017216441 A5 JP2017216441 A5 JP 2017216441A5
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layer
substrate support
base plate
adhesive layer
inner layer
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JP7063545B2 (ja
JP2017216441A (ja
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JP2017094326A 2016-05-18 2017-05-11 静電チャック接合のための永久二次浸食封じ込め Active JP7063545B2 (ja)

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JP2022069898A JP7401589B2 (ja) 2016-05-18 2022-04-21 静電チャック接合のための永久二次浸食封じ込め

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Application Number Priority Date Filing Date Title
US15/157,959 2016-05-18
US15/157,959 US10340171B2 (en) 2016-05-18 2016-05-18 Permanent secondary erosion containment for electrostatic chuck bonds

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JP2017216441A JP2017216441A (ja) 2017-12-07
JP2017216441A5 true JP2017216441A5 (enExample) 2020-07-09
JP7063545B2 JP7063545B2 (ja) 2022-05-09

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JP2022069898A Active JP7401589B2 (ja) 2016-05-18 2022-04-21 静電チャック接合のための永久二次浸食封じ込め

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US (2) US10340171B2 (enExample)
JP (2) JP7063545B2 (enExample)
KR (2) KR102426700B1 (enExample)
CN (2) CN117276170A (enExample)
TW (2) TWI744328B (enExample)

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