JP2017216441A - 静電チャック接合のための永久二次浸食封じ込め - Google Patents
静電チャック接合のための永久二次浸食封じ込め Download PDFInfo
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Abstract
Description
Claims (20)
- 基板処理システムにおける基板支持体であって、
ベースプレートと、
基板を支持するために前記ベースプレート上に配置されたセラミック層と、
前記セラミック層と前記ベースプレートとの間に配置された接着層と、
前記セラミック層と前記ベースプレートとの間で、前記接着層の外周縁の周りに配置されたシールであって、
前記接着層に隣接して形成された内側層であって、第1の材料を含む内側層と、
前記内側層に隣接して、前記内側層が外側層と前記接着層との間にあるように形成された外側層であって、第2の材料を含む外側層と、
を有するシールと、
を備える基板支持体。 - 請求項1に記載の基板支持体であって、
前記第1の材料は、ポリマである、基板支持体。 - 請求項1に記載の基板支持体であって、
前記第1の材料は、シリコーンおよびエポキシのうちの少なくとも1つを含む、基板支持体。 - 請求項1に記載の基板支持体であって、
前記第2の材料は、テフロンである、基板支持体。 - 請求項1に記載の基板支持体であって、
前記外側層は、Oリングを含む、基板支持体。 - 請求項1に記載の基板支持体であって、
前記外側層は、前記第2の材料とは異なる第3の材料を含むコアを有する、基板支持体。 - 請求項6に記載の基板支持体であって、
前記第3の材料は、パーフルオロエラストマポリマである、基板支持体。 - 請求項6に記載の基板支持体であって、
前記第3の材料は、前記第2の材料よりも高い弾性を有する、基板支持体。 - 請求項1に記載の基板支持体であって、
前記第2の材料は、前記第1の材料よりも高い耐プラズマ性を有する、基板支持体。 - 請求項1に記載の基板支持体であって、
前記内側層は、前記接着層に直接隣接しており、前記外側層は、前記内側層から離間している、基板支持体。 - 請求項1に記載の基板支持体であって、
前記内側層の外面は、凹状である、基板支持体。 - 方法であって、
基板処理システムにおいて基板支持体のベースプレートの上に、基板を支持するためのセラミック層を配置することと、
前記セラミック層と前記ベースプレートとの間に接着層を配置することと、
前記セラミック層と前記ベースプレートとの間で、前記接着層の外周縁の周りにシールを配置することであって、
前記接着層に隣接して形成される内側層であって、第1の材料を含む内側層と、
前記内側層に隣接して、前記内側層が外側層と前記接着層との間にあるように形成される外側層であって、第2の材料を含む外側層と、を含むシールを配置することと、
を含む方法。 - 請求項12に記載の方法であって、
前記第1の材料は、ポリマである、方法。 - 請求項12に記載の方法であって、
前記第1の材料は、シリコーンおよびエポキシのうちの少なくとも1つを含む、方法。 - 請求項12に記載の方法であって、
前記第2の材料は、テフロンである、方法。 - 請求項12に記載の方法であって、
前記外側層は、Oリングを含む、方法。 - 請求項12に記載の方法であって、
前記外側層は、前記第2の材料とは異なる第3の材料を含むコアを有する、方法。 - 請求項17に記載の方法であって、
前記第3の材料は、パーフルオロエラストマポリマである、方法。 - 請求項17に記載の方法であって、
前記第3の材料は、前記第2の材料よりも高い弾性を有する、方法。 - 請求項12に記載の方法であって、
前記第2の材料は、前記第1の材料よりも高い耐プラズマ性を有する、方法。
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