JP2015515760A - Escの接着剤の浸食を防止するための方法及び装置 - Google Patents
Escの接着剤の浸食を防止するための方法及び装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
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- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
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- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
Abstract
Description
本発明の実施形態は、接合材によって接合され、熱的及び/又は化学的安定性を高めた複合構造体に関する。特に、本発明の実施形態は、接合材によって接合された2以上のコンポーネントを有する静電チャックに関する。
半導体処理チャンバは、所望の特性を達成するために、多くの場合、2以上のコンポーネントを接合材で共に接合することによって形成されたパーツを含む。例えば、処理中に基板を支持し固定するために使用される静電チャックは、通常、熱伝導性の接合材により金属ベースに結合した誘電体パックを含む。接合材は、熱伝導性及び/又は電気絶縁性を提供しながら、異なるコンポーネント間の確実な接続を提供する。しかしながら、接合材は、特に、処理が高温で行われる場合に、又は過酷な化学的環境で行われる場合に、処理に悪影響を与える可能性がある。例えば、プラズマに曝露された場合、静電チャック内の接合材は浸食し、処理チャンバ内で粒子汚染を引き起こす粒子を生成する可能性がある。
Claims (15)
- 処理チャンバ内で使用するための装置であって、
第1面を有する第1コンポーネントと、
第2面を有する第2コンポーネントであって、第2面は第1コンポーネントの第1面と対向している第2コンポーネントと、
第1面と第2面の間に配置され、第1コンポーネントと第2コンポーネントを接合する接合材と、
処理チャンバ内で接合材を浸食から防止するための保護要素を含む装置。 - 保護要素は、接合材を囲む保護シールを含む請求項1記載の装置。
- 保護シールは、第1コンポーネントと第2コンポーネントの間の界面に形成された凹部内に配置されている請求項2記載の装置。
- 保護要素は、接合材を覆う第1コンポーネントから延びる保護構造を含む請求項1記載の装置。
- 保護要素は、接合材中にシリコンフィラーを含む請求項1記載の装置。
- 処理チャンバ用の静電チャックであって、
上で基板を支持するように構成された上面と、上面と反対側の下面を有するチャック本体と、
チャック本体の下面に面する上面を有するチャックベースと、
チャック本体の下面とチャックベースの上面を接合する接合材と、
静電チャックの外部の環境に接合材の視線の露出を防止するように配置された保護要素を含む静電チャック。 - 保護要素は、チャック本体の下面とチャックベースの上面の間に配置され、接合材を囲む保護シールを含む、請求項6記載の静電チャック。
- 保護シールは、チャックベースとチャック本体の間に形成された凹部内に配置される請求項7記載の静電チャック。
- 凹部は、チャック本体の下面と、チャックベースの上面に形成された段差によって画定される請求項8記載の静電チャック。
- 凹部は、チャック本体の上面と、チャックベースの下面に形成された段差によって画定される請求項8記載の静電チャック。
- 凹部は、チャック本体の下面に形成された第1段差と、チャックベースの上面に形成された第2段差によって画定される請求項8記載の静電チャック。
- 保護要素は、チャック本体及びチャックベースを貫通して形成されたリフトピン孔の周囲に配置された3以上の保護シールを更に含む請求項7記載の静電チャック。
- 保護要素は、チャック本体とチャックベースのうちの少なくとも1つの中に形成された保護構造を含み、接合材を覆う請求項6記載の静電チャック。
- 保護構造は、チャックベースに向かってチャック本体の下面から延び、接合材の縁部領域を囲む連続リップを含む請求項13記載の静電チャック。
- 保護要素は、接合材内に配置された耐食性フィラーを含む請求項6記載の静電チャック。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201261638908P | 2012-04-26 | 2012-04-26 | |
US61/638,908 | 2012-04-26 | ||
PCT/US2012/056617 WO2013162641A1 (en) | 2012-04-26 | 2012-09-21 | Methods and apparatus toward preventing esc bonding adhesive erosion |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017138734A Division JP2017208562A (ja) | 2012-04-26 | 2017-07-18 | Escの接着剤の浸食を防止するための方法及び装置 |
Publications (3)
Publication Number | Publication Date |
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JP2015515760A true JP2015515760A (ja) | 2015-05-28 |
JP2015515760A5 JP2015515760A5 (ja) | 2015-11-05 |
JP6180510B2 JP6180510B2 (ja) | 2017-08-16 |
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JP2015508932A Active JP6180510B2 (ja) | 2012-04-26 | 2012-09-21 | Escの接着剤の浸食を防止するための方法及び装置 |
JP2017138734A Pending JP2017208562A (ja) | 2012-04-26 | 2017-07-18 | Escの接着剤の浸食を防止するための方法及び装置 |
Family Applications After (1)
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JP2017138734A Pending JP2017208562A (ja) | 2012-04-26 | 2017-07-18 | Escの接着剤の浸食を防止するための方法及び装置 |
Country Status (6)
Country | Link |
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US (2) | US8982530B2 (ja) |
JP (2) | JP6180510B2 (ja) |
KR (4) | KR20190124348A (ja) |
CN (2) | CN104247003B (ja) |
TW (1) | TWI578436B (ja) |
WO (1) | WO2013162641A1 (ja) |
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JP2018014491A (ja) * | 2016-07-01 | 2018-01-25 | ラム リサーチ コーポレーションLam Research Corporation | 粒子性能および金属性能の改善のためのescセラミック側壁の加工 |
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JP2023081419A (ja) * | 2021-12-01 | 2023-06-13 | 三菱電線工業株式会社 | 保護リング、それを備えた接着面保護構造、及び接着面保護方法 |
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WO2013162641A1 (en) | 2013-10-31 |
CN107527854A (zh) | 2017-12-29 |
US8982530B2 (en) | 2015-03-17 |
US20130286530A1 (en) | 2013-10-31 |
KR20220146554A (ko) | 2022-11-01 |
CN104247003B (zh) | 2018-06-15 |
KR20190124348A (ko) | 2019-11-04 |
JP6180510B2 (ja) | 2017-08-16 |
CN104247003A (zh) | 2014-12-24 |
JP2017208562A (ja) | 2017-11-24 |
TWI578436B (zh) | 2017-04-11 |
TW201344837A (zh) | 2013-11-01 |
US20150183187A1 (en) | 2015-07-02 |
KR20150013627A (ko) | 2015-02-05 |
KR20170109690A (ko) | 2017-09-29 |
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