JP2023030013A - V字型シールバンドを有するセラミック静電チャック - Google Patents
V字型シールバンドを有するセラミック静電チャック Download PDFInfo
- Publication number
- JP2023030013A JP2023030013A JP2022199235A JP2022199235A JP2023030013A JP 2023030013 A JP2023030013 A JP 2023030013A JP 2022199235 A JP2022199235 A JP 2022199235A JP 2022199235 A JP2022199235 A JP 2022199235A JP 2023030013 A JP2023030013 A JP 2023030013A
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- seal band
- cooling plate
- substrate support
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000919 ceramic Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 43
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 238000007373 indentation Methods 0.000 claims abstract description 6
- 230000006866 deterioration Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 18
- 210000002381 plasma Anatomy 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- 239000007789 gas Substances 0.000 description 12
- 238000005336 cracking Methods 0.000 description 9
- 230000003628 erosive effect Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 229920006169 Perfluoroelastomer Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000013529 heat transfer fluid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- -1 perfluoro compounds Chemical class 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920006355 Tefzel Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229920006247 high-performance elastomer Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- CSJWOWRPMBXQLD-UHFFFAOYSA-N perfluoromethylvinylether group Chemical class FC(=C(C(F)(F)F)F)OC(=C(F)C(F)(F)F)F CSJWOWRPMBXQLD-UHFFFAOYSA-N 0.000 description 1
- 229920006260 polyaryletherketone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B47/00—Suction cups for attaching purposes; Equivalent means using adhesives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/021—Sealings between relatively-stationary surfaces with elastic packing
- F16J15/022—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/102—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/104—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
本明細書に記載の実装形態は、一般に半導体製造に係り、より詳細には高温半導体製造に適した基板支持アセンブリに関する。
ナノメートル以下のフィーチャを確実に製造することは、半導体デバイスの次世代超大規模集積回路(VLSI)及び超々大規模集積回路(ULSI)のための重要な技術的課題の1つである。しかしながら、回路技術の限界が押し進められるにつれて、VLSI及びULSI相互接続技術の寸法の縮小は処理能力に対するさらなる要求を課している。基板上にゲート構造を確実に形成することは、VLSI及びULSIの成功、及び個々の基板及びダイの回路密度及び品質を向上させるための継続的な努力にとって重要である。
Claims (1)
- 基板支持アセンブリであって、
ワークピース支持面と底面を有する静電チャックと、
上面を有する冷却プレートと、
静電チャックの底面と冷却プレートの上面とを固定する接合層であって、接合層は、
接着層と、
接着層を囲み、静電チャックと冷却プレートに接触し、リング状本体を有するシールバンドを含み、リング状本体は、
内面と
内面により接続され、内面から110°超の角度をなしている上面と底面と、
内部に形成されたインデントを有し、上面を底面に接続する外面を有する、基板支持アセンブリ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/361,365 US10943808B2 (en) | 2016-11-25 | 2016-11-25 | Ceramic electrostatic chuck having a V-shape seal band |
US15/361,365 | 2016-11-25 | ||
JP2019524432A JP7225093B2 (ja) | 2016-11-25 | 2017-09-26 | V字型シールバンドを有するセラミック静電チャック |
PCT/US2017/053470 WO2018097888A1 (en) | 2016-11-25 | 2017-09-26 | Ceramic electrostatic chuck having a v-shaped seal band |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019524432A Division JP7225093B2 (ja) | 2016-11-25 | 2017-09-26 | V字型シールバンドを有するセラミック静電チャック |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023030013A true JP2023030013A (ja) | 2023-03-07 |
Family
ID=62191168
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019524432A Active JP7225093B2 (ja) | 2016-11-25 | 2017-09-26 | V字型シールバンドを有するセラミック静電チャック |
JP2022199235A Pending JP2023030013A (ja) | 2016-11-25 | 2022-12-14 | V字型シールバンドを有するセラミック静電チャック |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019524432A Active JP7225093B2 (ja) | 2016-11-25 | 2017-09-26 | V字型シールバンドを有するセラミック静電チャック |
Country Status (6)
Country | Link |
---|---|
US (2) | US10943808B2 (ja) |
JP (2) | JP7225093B2 (ja) |
KR (2) | KR102471167B1 (ja) |
CN (2) | CN117267243A (ja) |
TW (2) | TWI786067B (ja) |
WO (1) | WO2018097888A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10943808B2 (en) * | 2016-11-25 | 2021-03-09 | Applied Materials, Inc. | Ceramic electrostatic chuck having a V-shape seal band |
CN116581081A (zh) * | 2017-09-29 | 2023-08-11 | 住友大阪水泥股份有限公司 | 静电卡盘装置 |
US11626310B2 (en) * | 2018-10-30 | 2023-04-11 | Toto Ltd. | Electrostatic chuck |
CN110289241B (zh) * | 2019-07-04 | 2022-03-22 | 北京北方华创微电子装备有限公司 | 静电卡盘及其制作方法、工艺腔室和半导体处理设备 |
KR20220035964A (ko) * | 2019-07-29 | 2022-03-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 개선된 고온 척킹을 갖는 반도체 기판 지지부들 |
KR102188261B1 (ko) * | 2019-08-02 | 2020-12-09 | 세미기어, 인코포레이션 | 기판 냉각 장치 및 방법 |
JP7319153B2 (ja) * | 2019-09-24 | 2023-08-01 | 日本特殊陶業株式会社 | 保持装置 |
JP7362400B2 (ja) * | 2019-10-01 | 2023-10-17 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
KR102344265B1 (ko) * | 2019-12-11 | 2021-12-27 | 세메스 주식회사 | 본딩 보호 부재 및 이를 구비하는 기판 처리 시스템 |
JP7445420B2 (ja) | 2019-12-23 | 2024-03-07 | 日本特殊陶業株式会社 | 半導体製造装置用部品 |
JP7386189B2 (ja) | 2021-01-15 | 2023-11-24 | 日本特殊陶業株式会社 | 複合部材、保持装置、および接着用構造体 |
TWI776380B (zh) * | 2021-01-29 | 2022-09-01 | 得立亞科技有限公司 | 用於靜電吸盤的介電材料貼合方法及其裝置 |
KR20240045368A (ko) * | 2021-09-02 | 2024-04-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 에지 아크 방전 완화를 위한 교체 가능한 정전 척 외부 링 |
WO2024059276A1 (en) * | 2022-09-16 | 2024-03-21 | Lam Research Corporation | Spring-loaded seal cover band for protecting a substrate support |
WO2024097077A1 (en) * | 2022-11-04 | 2024-05-10 | Lam Research Corporation | Electrostatic chuck e-seal with offset sealing surface |
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-
2016
- 2016-11-25 US US15/361,365 patent/US10943808B2/en active Active
-
2017
- 2017-09-26 CN CN202311219601.7A patent/CN117267243A/zh active Pending
- 2017-09-26 CN CN201780065037.4A patent/CN109844928B/zh active Active
- 2017-09-26 KR KR1020197018196A patent/KR102471167B1/ko active IP Right Grant
- 2017-09-26 WO PCT/US2017/053470 patent/WO2018097888A1/en active Application Filing
- 2017-09-26 JP JP2019524432A patent/JP7225093B2/ja active Active
- 2017-09-26 KR KR1020227040913A patent/KR102630741B1/ko active IP Right Grant
- 2017-10-16 TW TW106135236A patent/TWI786067B/zh active
- 2017-10-16 TW TW111143123A patent/TW202310235A/zh unknown
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2021
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- 2022-12-14 JP JP2022199235A patent/JP2023030013A/ja active Pending
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KR102471167B1 (ko) | 2022-11-24 |
TWI786067B (zh) | 2022-12-11 |
JP7225093B2 (ja) | 2023-02-20 |
TW201834108A (zh) | 2018-09-16 |
KR102630741B1 (ko) | 2024-01-29 |
JP2019537262A (ja) | 2019-12-19 |
US20210183680A1 (en) | 2021-06-17 |
KR20190078656A (ko) | 2019-07-04 |
US20180151402A1 (en) | 2018-05-31 |
KR20220162854A (ko) | 2022-12-08 |
CN109844928B (zh) | 2023-10-10 |
CN117267243A (zh) | 2023-12-22 |
CN109844928A (zh) | 2019-06-04 |
WO2018097888A1 (en) | 2018-05-31 |
US10943808B2 (en) | 2021-03-09 |
TW202310235A (zh) | 2023-03-01 |
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