JP2017517877A5 - - Google Patents

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Publication number
JP2017517877A5
JP2017517877A5 JP2016561693A JP2016561693A JP2017517877A5 JP 2017517877 A5 JP2017517877 A5 JP 2017517877A5 JP 2016561693 A JP2016561693 A JP 2016561693A JP 2016561693 A JP2016561693 A JP 2016561693A JP 2017517877 A5 JP2017517877 A5 JP 2017517877A5
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Japan
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substrate
support
volume
plate
cooling chamber
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JP2016561693A
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English (en)
Japanese (ja)
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JP6574442B2 (ja
JP2017517877A (ja
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Priority claimed from US14/251,134 external-priority patent/US9779971B2/en
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JP2016561693A 2014-04-11 2015-03-17 基板を急速に冷却する方法および装置 Active JP6574442B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/251,134 US9779971B2 (en) 2014-04-11 2014-04-11 Methods and apparatus for rapidly cooling a substrate
US14/251,134 2014-04-11
PCT/US2015/020905 WO2015156968A1 (en) 2014-04-11 2015-03-17 Methods and apparatus for rapidly cooling a substrate

Publications (3)

Publication Number Publication Date
JP2017517877A JP2017517877A (ja) 2017-06-29
JP2017517877A5 true JP2017517877A5 (enExample) 2018-04-26
JP6574442B2 JP6574442B2 (ja) 2019-09-11

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ID=54265673

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JP2016561693A Active JP6574442B2 (ja) 2014-04-11 2015-03-17 基板を急速に冷却する方法および装置

Country Status (7)

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US (2) US9779971B2 (enExample)
JP (1) JP6574442B2 (enExample)
KR (1) KR102350501B1 (enExample)
CN (1) CN106133874B (enExample)
SG (1) SG11201607363TA (enExample)
TW (1) TWI670386B (enExample)
WO (1) WO2015156968A1 (enExample)

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US10325790B2 (en) * 2016-04-29 2019-06-18 Applied Materials, Inc. Methods and apparatus for correcting substrate deformity
US11201078B2 (en) * 2017-02-14 2021-12-14 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
JP6863780B2 (ja) 2017-03-10 2021-04-21 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
US12469739B2 (en) 2017-10-27 2025-11-11 Applied Materials, Inc. Methods of operating a spatial deposition tool
TWI768849B (zh) 2017-10-27 2022-06-21 美商應用材料股份有限公司 具有空間分離的單個晶圓處理環境
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
US11894255B2 (en) * 2019-07-30 2024-02-06 Applied Materials, Inc. Sheath and temperature control of process kit
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
WO2022015512A1 (en) * 2020-07-13 2022-01-20 Lam Research Corporation Seal venting in a substrate processing chamber
JP7285276B2 (ja) * 2021-03-25 2023-06-01 株式会社Kokusai Electric 冷却方法及び半導体装置の製造方法及び処理装置
CN117836919A (zh) * 2021-11-19 2024-04-05 应用材料公司 用于减少基板冷却时间的设备及方法
KR20230085072A (ko) * 2021-12-06 2023-06-13 에이에스엠 아이피 홀딩 비.브이. 반도체 처리 툴용 반응물 증기 전달 시스템 및 방법

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JP3272458B2 (ja) * 1993-03-04 2002-04-08 株式会社日立国際電気 基板冷却装置及び基板冷却方法
JPH07254545A (ja) * 1994-03-15 1995-10-03 Oki Electric Ind Co Ltd 半導体基板の熱処理方法及びそのための装置
JP2971818B2 (ja) * 1996-09-24 1999-11-08 イートン コーポレーション ウエハー熱処理装置
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JP3921234B2 (ja) * 2002-02-28 2007-05-30 キヤノンアネルバ株式会社 表面処理装置及びその製造方法
US6778762B1 (en) * 2002-04-17 2004-08-17 Novellus Systems, Inc. Sloped chamber top for substrate processing
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WO2011037020A1 (ja) * 2009-09-28 2011-03-31 東京エレクトロン株式会社 被処理体の冷却方法、冷却装置及びコンピュータ読み取り可能な記憶媒体
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