SG11201607363TA - Methods and apparatus for rapidly cooling a substrate - Google Patents

Methods and apparatus for rapidly cooling a substrate

Info

Publication number
SG11201607363TA
SG11201607363TA SG11201607363TA SG11201607363TA SG11201607363TA SG 11201607363T A SG11201607363T A SG 11201607363TA SG 11201607363T A SG11201607363T A SG 11201607363TA SG 11201607363T A SG11201607363T A SG 11201607363TA SG 11201607363T A SG11201607363T A SG 11201607363TA
Authority
SG
Singapore
Prior art keywords
substrate
methods
rapidly cooling
rapidly
cooling
Prior art date
Application number
SG11201607363TA
Other languages
English (en)
Inventor
Jallepally Ravi
Steven V Sansoni
Kirankumar Savandaiah
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201607363TA publication Critical patent/SG11201607363TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
SG11201607363TA 2014-04-11 2015-03-17 Methods and apparatus for rapidly cooling a substrate SG11201607363TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/251,134 US9779971B2 (en) 2014-04-11 2014-04-11 Methods and apparatus for rapidly cooling a substrate
PCT/US2015/020905 WO2015156968A1 (en) 2014-04-11 2015-03-17 Methods and apparatus for rapidly cooling a substrate

Publications (1)

Publication Number Publication Date
SG11201607363TA true SG11201607363TA (en) 2016-10-28

Family

ID=54265673

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201607363TA SG11201607363TA (en) 2014-04-11 2015-03-17 Methods and apparatus for rapidly cooling a substrate

Country Status (7)

Country Link
US (2) US9779971B2 (enExample)
JP (1) JP6574442B2 (enExample)
KR (1) KR102350501B1 (enExample)
CN (1) CN106133874B (enExample)
SG (1) SG11201607363TA (enExample)
TW (1) TWI670386B (enExample)
WO (1) WO2015156968A1 (enExample)

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CN107112261A (zh) * 2014-12-11 2017-08-29 瑞士艾发科技 尤其用于基体的除气的设备和方法
JP6554387B2 (ja) * 2015-10-26 2019-07-31 東京エレクトロン株式会社 ロードロック装置における基板冷却方法、基板搬送方法、およびロードロック装置
US10325790B2 (en) * 2016-04-29 2019-06-18 Applied Materials, Inc. Methods and apparatus for correcting substrate deformity
US11201078B2 (en) * 2017-02-14 2021-12-14 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
JP6863780B2 (ja) 2017-03-10 2021-04-21 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
TWI768849B (zh) * 2017-10-27 2022-06-21 美商應用材料股份有限公司 具有空間分離的單個晶圓處理環境
US12469739B2 (en) 2017-10-27 2025-11-11 Applied Materials, Inc. Methods of operating a spatial deposition tool
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
US11894255B2 (en) * 2019-07-30 2024-02-06 Applied Materials, Inc. Sheath and temperature control of process kit
KR20230035244A (ko) * 2020-07-13 2023-03-13 램 리써치 코포레이션 기판 프로세싱 챔버 내 시일 벤팅 (seal venting)
JP7285276B2 (ja) * 2021-03-25 2023-06-01 株式会社Kokusai Electric 冷却方法及び半導体装置の製造方法及び処理装置
TWI828245B (zh) * 2021-11-19 2024-01-01 美商應用材料股份有限公司 用於減少基板冷卻時間的設備及方法
KR20230085072A (ko) * 2021-12-06 2023-06-13 에이에스엠 아이피 홀딩 비.브이. 반도체 처리 툴용 반응물 증기 전달 시스템 및 방법

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JP3272458B2 (ja) * 1993-03-04 2002-04-08 株式会社日立国際電気 基板冷却装置及び基板冷却方法
JPH07254545A (ja) * 1994-03-15 1995-10-03 Oki Electric Ind Co Ltd 半導体基板の熱処理方法及びそのための装置
JP2971818B2 (ja) * 1996-09-24 1999-11-08 イートン コーポレーション ウエハー熱処理装置
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JP3476687B2 (ja) * 1998-09-21 2003-12-10 東京エレクトロン株式会社 プラズマ処理装置
US6183564B1 (en) 1998-11-12 2001-02-06 Tokyo Electron Limited Buffer chamber for integrating physical and chemical vapor deposition chambers together in a processing system
JP2003124134A (ja) * 2001-10-10 2003-04-25 Semiconductor Leading Edge Technologies Inc 加熱処理装置および加熱処理方法
JP3921234B2 (ja) * 2002-02-28 2007-05-30 キヤノンアネルバ株式会社 表面処理装置及びその製造方法
US6778762B1 (en) * 2002-04-17 2004-08-17 Novellus Systems, Inc. Sloped chamber top for substrate processing
US7429718B2 (en) * 2005-08-02 2008-09-30 Applied Materials, Inc. Heating and cooling of substrate support
US8709162B2 (en) * 2005-08-16 2014-04-29 Applied Materials, Inc. Active cooling substrate support
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JP5382744B2 (ja) 2009-06-24 2014-01-08 キヤノンアネルバ株式会社 真空加熱冷却装置および磁気抵抗素子の製造方法
KR20140034318A (ko) * 2009-09-28 2014-03-19 도쿄엘렉트론가부시키가이샤 피처리체의 냉각 방법, 냉각 장치 및 컴퓨터 판독 가능한 기억 매체
TW201135845A (en) * 2009-10-09 2011-10-16 Canon Anelva Corp Acuum heating and cooling apparatus
KR20120120102A (ko) * 2010-10-18 2012-11-01 가부시키가이샤 히다치 하이테크놀로지즈 진공처리장치 및 진공처리방법
JP2012089591A (ja) 2010-10-18 2012-05-10 Hitachi High-Technologies Corp 真空処理装置及び真空処理方法
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US9051649B2 (en) * 2013-03-11 2015-06-09 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor film deposition apparatus and method with improved heater cooling efficiency
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Also Published As

Publication number Publication date
TWI670386B (zh) 2019-09-01
JP6574442B2 (ja) 2019-09-11
CN106133874A (zh) 2016-11-16
CN106133874B (zh) 2019-09-06
WO2015156968A1 (en) 2015-10-15
US20180025924A1 (en) 2018-01-25
JP2017517877A (ja) 2017-06-29
US20150294886A1 (en) 2015-10-15
KR20160138303A (ko) 2016-12-02
US9779971B2 (en) 2017-10-03
KR102350501B1 (ko) 2022-01-11
TW201540860A (zh) 2015-11-01
US10312116B2 (en) 2019-06-04

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