CN106133874B - 用于快速冷却基板的方法与装置 - Google Patents

用于快速冷却基板的方法与装置 Download PDF

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Publication number
CN106133874B
CN106133874B CN201580015754.7A CN201580015754A CN106133874B CN 106133874 B CN106133874 B CN 106133874B CN 201580015754 A CN201580015754 A CN 201580015754A CN 106133874 B CN106133874 B CN 106133874B
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China
Prior art keywords
substrate
space
support
plate
substrate support
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CN201580015754.7A
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English (en)
Chinese (zh)
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CN106133874A (zh
Inventor
贾勒帕里·拉维
史蒂芬·V·桑索尼
希兰库玛·萨万戴亚
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
CN201580015754.7A 2014-04-11 2015-03-17 用于快速冷却基板的方法与装置 Active CN106133874B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/251,134 2014-04-11
US14/251,134 US9779971B2 (en) 2014-04-11 2014-04-11 Methods and apparatus for rapidly cooling a substrate
PCT/US2015/020905 WO2015156968A1 (en) 2014-04-11 2015-03-17 Methods and apparatus for rapidly cooling a substrate

Publications (2)

Publication Number Publication Date
CN106133874A CN106133874A (zh) 2016-11-16
CN106133874B true CN106133874B (zh) 2019-09-06

Family

ID=54265673

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580015754.7A Active CN106133874B (zh) 2014-04-11 2015-03-17 用于快速冷却基板的方法与装置

Country Status (7)

Country Link
US (2) US9779971B2 (enExample)
JP (1) JP6574442B2 (enExample)
KR (1) KR102350501B1 (enExample)
CN (1) CN106133874B (enExample)
SG (1) SG11201607363TA (enExample)
TW (1) TWI670386B (enExample)
WO (1) WO2015156968A1 (enExample)

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CN107112261A (zh) * 2014-12-11 2017-08-29 瑞士艾发科技 尤其用于基体的除气的设备和方法
JP6554387B2 (ja) * 2015-10-26 2019-07-31 東京エレクトロン株式会社 ロードロック装置における基板冷却方法、基板搬送方法、およびロードロック装置
US10325790B2 (en) * 2016-04-29 2019-06-18 Applied Materials, Inc. Methods and apparatus for correcting substrate deformity
US11201078B2 (en) * 2017-02-14 2021-12-14 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
JP6863780B2 (ja) * 2017-03-10 2021-04-21 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
US12469739B2 (en) 2017-10-27 2025-11-11 Applied Materials, Inc. Methods of operating a spatial deposition tool
TWI802439B (zh) * 2017-10-27 2023-05-11 美商應用材料股份有限公司 具有空間分離的單個晶圓處理環境
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
US11894255B2 (en) * 2019-07-30 2024-02-06 Applied Materials, Inc. Sheath and temperature control of process kit
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
KR20230035244A (ko) * 2020-07-13 2023-03-13 램 리써치 코포레이션 기판 프로세싱 챔버 내 시일 벤팅 (seal venting)
JP7285276B2 (ja) * 2021-03-25 2023-06-01 株式会社Kokusai Electric 冷却方法及び半導体装置の製造方法及び処理装置
US20230160101A1 (en) * 2021-11-19 2023-05-25 Applied Materials, Inc. Apparatus and methods for reducing substrate cool down time
KR20230085072A (ko) * 2021-12-06 2023-06-13 에이에스엠 아이피 홀딩 비.브이. 반도체 처리 툴용 반응물 증기 전달 시스템 및 방법

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CN1907897A (zh) * 2005-08-02 2007-02-07 应用材料公司 衬底支撑的加热和冷却
CN1919768A (zh) * 2005-08-16 2007-02-28 应用材料股份有限公司 可主动冷却的基板支撑件
CN101110381A (zh) * 2006-07-20 2008-01-23 应用材料股份有限公司 利用快速温度梯度控制处理衬底
US8033771B1 (en) * 2008-12-11 2011-10-11 Novellus Systems, Inc. Minimum contact area wafer clamping with gas flow for rapid wafer cooling
CN103370778A (zh) * 2011-01-27 2013-10-23 应用材料公司 具有加热器与快速温度变化的基板支撑件

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CN1907897A (zh) * 2005-08-02 2007-02-07 应用材料公司 衬底支撑的加热和冷却
CN1919768A (zh) * 2005-08-16 2007-02-28 应用材料股份有限公司 可主动冷却的基板支撑件
CN101110381A (zh) * 2006-07-20 2008-01-23 应用材料股份有限公司 利用快速温度梯度控制处理衬底
US8033771B1 (en) * 2008-12-11 2011-10-11 Novellus Systems, Inc. Minimum contact area wafer clamping with gas flow for rapid wafer cooling
CN103370778A (zh) * 2011-01-27 2013-10-23 应用材料公司 具有加热器与快速温度变化的基板支撑件

Also Published As

Publication number Publication date
KR20160138303A (ko) 2016-12-02
US9779971B2 (en) 2017-10-03
US20180025924A1 (en) 2018-01-25
TWI670386B (zh) 2019-09-01
US10312116B2 (en) 2019-06-04
WO2015156968A1 (en) 2015-10-15
CN106133874A (zh) 2016-11-16
KR102350501B1 (ko) 2022-01-11
US20150294886A1 (en) 2015-10-15
JP6574442B2 (ja) 2019-09-11
SG11201607363TA (en) 2016-10-28
TW201540860A (zh) 2015-11-01
JP2017517877A (ja) 2017-06-29

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