JP2017183701A5 - - Google Patents
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- JP2017183701A5 JP2017183701A5 JP2017006322A JP2017006322A JP2017183701A5 JP 2017183701 A5 JP2017183701 A5 JP 2017183701A5 JP 2017006322 A JP2017006322 A JP 2017006322A JP 2017006322 A JP2017006322 A JP 2017006322A JP 2017183701 A5 JP2017183701 A5 JP 2017183701A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- edge ring
- inner portion
- substrate support
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 92
- 238000000034 method Methods 0.000 claims description 23
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662314659P | 2016-03-29 | 2016-03-29 | |
| US62/314,659 | 2016-03-29 | ||
| US15/403,786 US11011353B2 (en) | 2016-03-29 | 2017-01-11 | Systems and methods for performing edge ring characterization |
| US15/403,786 | 2017-01-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017183701A JP2017183701A (ja) | 2017-10-05 |
| JP2017183701A5 true JP2017183701A5 (enExample) | 2020-03-19 |
| JP6976686B2 JP6976686B2 (ja) | 2021-12-08 |
Family
ID=59959706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017006322A Active JP6976686B2 (ja) | 2016-03-29 | 2017-01-18 | エッジリング特性評価を実行するためのシステムおよび方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11011353B2 (enExample) |
| JP (1) | JP6976686B2 (enExample) |
| KR (1) | KR20170113014A (enExample) |
| CN (2) | CN107240541B (enExample) |
| TW (1) | TWI774652B (enExample) |
Families Citing this family (54)
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| US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
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| US10825659B2 (en) | 2016-01-07 | 2020-11-03 | Lam Research Corporation | Substrate processing chamber including multiple gas injection points and dual injector |
| KR102689380B1 (ko) | 2016-01-26 | 2024-07-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 에지 링 리프팅 솔루션 |
| CN116110846A (zh) | 2016-01-26 | 2023-05-12 | 应用材料公司 | 晶片边缘环升降解决方案 |
| US10651015B2 (en) | 2016-02-12 | 2020-05-12 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
| US10699878B2 (en) | 2016-02-12 | 2020-06-30 | Lam Research Corporation | Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring |
| US10410832B2 (en) | 2016-08-19 | 2019-09-10 | Lam Research Corporation | Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment |
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| US11512393B2 (en) * | 2018-11-29 | 2022-11-29 | Lam Research Corporation | Dynamic sheath control with edge ring lift |
| JP2020115499A (ja) * | 2019-01-17 | 2020-07-30 | 東京エレクトロン株式会社 | プラズマ処理装置、及びリング部材の位置ずれ測定方法 |
| CN113785387B (zh) * | 2019-03-04 | 2025-05-09 | 朗姆研究公司 | 用于衬底传送机械手自动校正的器具 |
| KR20210126783A (ko) * | 2019-03-06 | 2021-10-20 | 램 리써치 코포레이션 | 기판 프로세싱 시스템을 위한 조정가능한 에지 링의 두께를 측정하기 위한 측정 시스템 |
| US11279032B2 (en) | 2019-04-11 | 2022-03-22 | Applied Materials, Inc. | Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots |
| US11101115B2 (en) | 2019-04-19 | 2021-08-24 | Applied Materials, Inc. | Ring removal from processing chamber |
| US12009236B2 (en) | 2019-04-22 | 2024-06-11 | Applied Materials, Inc. | Sensors and system for in-situ edge ring erosion monitor |
| US12165905B2 (en) | 2019-05-20 | 2024-12-10 | Applied Materials, Inc. | Process kit enclosure system |
| US10964584B2 (en) | 2019-05-20 | 2021-03-30 | Applied Materials, Inc. | Process kit ring adaptor |
| US11913777B2 (en) * | 2019-06-11 | 2024-02-27 | Applied Materials, Inc. | Detector for process kit ring wear |
| US11626305B2 (en) | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| KR102689653B1 (ko) | 2019-06-26 | 2024-07-31 | 삼성전자주식회사 | 센서 모듈 및 이를 구비하는 식각 장치 |
| CN112216646A (zh) * | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | 基板支撑组件及包括其的基板处理装置 |
| US11211269B2 (en) | 2019-07-19 | 2021-12-28 | Applied Materials, Inc. | Multi-object capable loadlock system |
| CN112701027B (zh) * | 2019-10-22 | 2024-09-17 | 夏泰鑫半导体(青岛)有限公司 | 等离子体处理装置及边缘环的更换方法 |
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| JP7263225B2 (ja) * | 2019-12-12 | 2023-04-24 | 東京エレクトロン株式会社 | 搬送するシステム及び方法 |
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| KR102822822B1 (ko) * | 2020-02-25 | 2025-06-19 | 에스케이하이닉스 주식회사 | 에지링 모니터링 장치, 에지링 관리 시스템 및 방법 |
| CN111341698B (zh) * | 2020-03-09 | 2022-07-26 | 苏州能讯高能半导体有限公司 | 一种刻蚀设备 |
| US12027397B2 (en) | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
| US12486120B2 (en) | 2020-03-23 | 2025-12-02 | Applied Materials, Inc. | Substrate processing system carrier |
| JP7466686B2 (ja) | 2020-03-23 | 2024-04-12 | ラム リサーチ コーポレーション | 基板処理システムにおける中間リング腐食補償 |
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| USD980176S1 (en) | 2020-06-02 | 2023-03-07 | Applied Materials, Inc. | Substrate processing system carrier |
| US12159795B2 (en) | 2021-03-08 | 2024-12-03 | Applied Materials, Inc. | Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall |
| US20240429089A1 (en) * | 2023-06-21 | 2024-12-26 | Applied Materials, Inc. | Adjustable edge ring tilt for edge of wafer skew compensation |
| CN117352434A (zh) * | 2023-10-27 | 2024-01-05 | 北京北方华创微电子装备有限公司 | 一种传输腔室、半导体工艺设备及拆装工装 |
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| JP6204869B2 (ja) | 2014-04-09 | 2017-09-27 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
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| US11605546B2 (en) | 2015-01-16 | 2023-03-14 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| US10438833B2 (en) * | 2016-02-16 | 2019-10-08 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
| US10312121B2 (en) * | 2016-03-29 | 2019-06-04 | Lam Research Corporation | Systems and methods for aligning measurement device in substrate processing systems |
-
2017
- 2017-01-11 US US15/403,786 patent/US11011353B2/en active Active
- 2017-01-16 TW TW106101332A patent/TWI774652B/zh active
- 2017-01-17 CN CN201710036188.9A patent/CN107240541B/zh active Active
- 2017-01-17 KR KR1020170007917A patent/KR20170113014A/ko not_active Ceased
- 2017-01-17 CN CN201910856579.4A patent/CN110767525B/zh active Active
- 2017-01-18 JP JP2017006322A patent/JP6976686B2/ja active Active
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