USD980176S1 - Substrate processing system carrier - Google Patents
Substrate processing system carrier Download PDFInfo
- Publication number
- USD980176S1 USD980176S1 US29/736,744 US202029736744F USD980176S US D980176 S1 USD980176 S1 US D980176S1 US 202029736744 F US202029736744 F US 202029736744F US D980176 S USD980176 S US D980176S
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- United States
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- processing system
- substrate processing
- system carrier
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The broken lines in the drawings illustrate environment that forms no part of the claimed design.
Claims (1)
- The ornamental design for a substrate processing system carrier, as substantially shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/736,744 USD980176S1 (en) | 2020-06-02 | 2020-06-02 | Substrate processing system carrier |
JPD2020-26013F JP1686261S (en) | 2020-06-02 | 2020-12-02 | |
TW109306788F TWD215155S (en) | 2020-06-02 | 2020-12-02 | Substrate processing system carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/736,744 USD980176S1 (en) | 2020-06-02 | 2020-06-02 | Substrate processing system carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
USD980176S1 true USD980176S1 (en) | 2023-03-07 |
Family
ID=75967047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/736,744 Active USD980176S1 (en) | 2020-06-02 | 2020-06-02 | Substrate processing system carrier |
Country Status (3)
Country | Link |
---|---|
US (1) | USD980176S1 (en) |
JP (1) | JP1686261S (en) |
TW (1) | TWD215155S (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210296149A1 (en) * | 2020-03-23 | 2021-09-23 | Applied Materials, Inc. | Enclosure system shelf |
Citations (54)
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JPH10165884A (en) | 1996-12-06 | 1998-06-23 | Hitachi Electron Eng Co Ltd | Rotational driving device for substrate |
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JP2009095783A (en) | 2007-10-17 | 2009-05-07 | Recs:Kk | Liquid application apparatus |
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US7792350B2 (en) | 2003-11-10 | 2010-09-07 | Brooks Automation, Inc. | Wafer center finding |
JP4559317B2 (en) | 2005-07-21 | 2010-10-06 | 株式会社岡本工作機械製作所 | Semiconductor substrate transfer method |
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US8397739B2 (en) | 2010-01-08 | 2013-03-19 | Applied Materials, Inc. | N-channel flow ratio controller calibration |
USD684546S1 (en) * | 2011-02-04 | 2013-06-18 | Panasonic Corporation | Electroluminescence module |
US8784033B2 (en) | 2009-01-11 | 2014-07-22 | Applied Materials, Inc. | Robot systems, apparatus and methods for transporting substrates |
US20150041353A1 (en) * | 2011-08-12 | 2015-02-12 | Entegris, Inc. | Wafer carrier |
KR20160016409A (en) | 2014-08-05 | 2016-02-15 | 주식회사 엘지실트론 | Apparatus and Method for Aligning Wafer |
US20160211166A1 (en) | 2015-01-16 | 2016-07-21 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
US20160211165A1 (en) | 2015-01-16 | 2016-07-21 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
US20160216185A1 (en) | 2015-01-28 | 2016-07-28 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
US9462732B2 (en) * | 2013-03-13 | 2016-10-04 | Laird Technologies, Inc. | Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features |
US20170053819A1 (en) | 2015-08-21 | 2017-02-23 | Lam Research Corporation | Wear detection of consumable part in semiconductor manufacturing equipment |
US9579788B2 (en) | 2012-02-10 | 2017-02-28 | Ascent Ventures, Llc | Automated testing and verification of a robotic system |
US20170113355A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Automated Replacement of Consumable Parts Using End Effectors Interfacing with Plasma Processing System |
US20170117172A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Automated Replacement of Consumable Parts Using Interfacing Chambers |
US20170115657A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
US20170119339A1 (en) | 2012-06-21 | 2017-05-04 | Globus Medical, Inc. | Systems and methods of checking registrations for surgical systems |
US20170133283A1 (en) | 2015-11-06 | 2017-05-11 | Lam Research Corporation | Sensor and adjuster for a consumable |
US20170213758A1 (en) | 2016-01-26 | 2017-07-27 | Applied Materials, Inc. | Wafer edge ring lifting solution |
US20170236743A1 (en) | 2016-02-16 | 2017-08-17 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
US20170236741A1 (en) | 2016-02-12 | 2017-08-17 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
US20170236688A1 (en) | 2016-02-12 | 2017-08-17 | Lam Research Corporation | Chamber memeber of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring |
US20170263478A1 (en) | 2015-01-16 | 2017-09-14 | Lam Research Corporation | Detection System for Tunable/Replaceable Edge Coupling Ring |
US20170287682A1 (en) | 2016-03-29 | 2017-10-05 | Lam Research Corporation | Systems and methods for performing edge ring characterization |
US20170287753A1 (en) | 2016-03-29 | 2017-10-05 | Lam Research Corporation | Systems and methods for aligning measurement device in substrate processing systems |
US20180019142A1 (en) | 2015-10-22 | 2018-01-18 | Lam Research Corporation | Front Opening Ring Pod |
US20180019107A1 (en) | 2016-07-14 | 2018-01-18 | Tokyo Electron Limited | Focus ring replacement method and plasma processing system |
US20180090354A1 (en) | 2016-09-29 | 2018-03-29 | Tokyo Electron Limited | Position detection system and processing apparatus |
US9947517B1 (en) | 2016-12-16 | 2018-04-17 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US20180166259A1 (en) | 2016-12-08 | 2018-06-14 | Tokyo Electron Limited | Mounting table and plasma processing apparatus |
US20180218933A1 (en) | 2017-02-01 | 2018-08-02 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US20180233328A1 (en) | 2017-02-16 | 2018-08-16 | Tokyo Electron Limited | Vacuum processing apparatus and maintenance apparatus |
US20180277416A1 (en) | 2017-03-22 | 2018-09-27 | Tokyo Electron Limited | Substrate processing apparatus |
US20180301322A1 (en) | 2017-04-12 | 2018-10-18 | Tokyo Electron Limited | Position detecting system and processing apparatus |
US20180315640A1 (en) | 2017-04-26 | 2018-11-01 | Tokyo Electron Limited | Plasma processing apparatus |
US20190088531A1 (en) | 2017-09-21 | 2019-03-21 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
US20200122320A1 (en) | 2018-10-19 | 2020-04-23 | Asm Ip Holding B.V. | Method for teaching a transportation position and alignment jig |
US20200211877A1 (en) * | 2016-05-26 | 2020-07-02 | Entegris, Inc. | Latching mechanism for a substrate container |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
US20210296149A1 (en) * | 2020-03-23 | 2021-09-23 | Applied Materials, Inc. | Enclosure system shelf |
USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD954769S1 (en) * | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
-
2020
- 2020-06-02 US US29/736,744 patent/USD980176S1/en active Active
- 2020-12-02 JP JPD2020-26013F patent/JP1686261S/ja active Active
- 2020-12-02 TW TW109306788F patent/TWD215155S/en unknown
Patent Citations (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5749469A (en) * | 1992-05-15 | 1998-05-12 | Fluoroware, Inc. | Wafer carrier |
JPH10165884A (en) | 1996-12-06 | 1998-06-23 | Hitachi Electron Eng Co Ltd | Rotational driving device for substrate |
USD407073S (en) * | 1997-12-24 | 1999-03-23 | Applied Materials, Inc. | Electrostatic chuck with improved spacing and charge migration reduction mask |
US6199291B1 (en) | 1998-07-29 | 2001-03-13 | Sony Corporation | Alignment fixture |
US6676759B1 (en) | 1998-10-30 | 2004-01-13 | Applied Materials, Inc. | Wafer support device in semiconductor manufacturing device |
US20030010657A1 (en) * | 2001-07-14 | 2003-01-16 | Michael Zabka | Protective shipper |
USD489739S1 (en) * | 2002-12-20 | 2004-05-11 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
US7792350B2 (en) | 2003-11-10 | 2010-09-07 | Brooks Automation, Inc. | Wafer center finding |
JP4559317B2 (en) | 2005-07-21 | 2010-10-06 | 株式会社岡本工作機械製作所 | Semiconductor substrate transfer method |
US20070134904A1 (en) | 2005-12-12 | 2007-06-14 | Asm Assembly Automation Ltd. | High precision die bonding apparatus |
US20100194015A1 (en) | 2006-12-18 | 2010-08-05 | Uri Vekstein | Chuck and a method for supporting an object |
JP2009095783A (en) | 2007-10-17 | 2009-05-07 | Recs:Kk | Liquid application apparatus |
US8384033B2 (en) | 2007-11-09 | 2013-02-26 | The Royal Institute For The Advancement Of Learning/Mcgill University | Quantification of an absorber through a scattering medium |
USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
US8784033B2 (en) | 2009-01-11 | 2014-07-22 | Applied Materials, Inc. | Robot systems, apparatus and methods for transporting substrates |
US9457464B2 (en) | 2009-01-11 | 2016-10-04 | Applied Materials, Inc. | Substrate processing systems and robot apparatus for transporting substrates in electronic device manufacturing |
US8397739B2 (en) | 2010-01-08 | 2013-03-19 | Applied Materials, Inc. | N-channel flow ratio controller calibration |
USD684546S1 (en) * | 2011-02-04 | 2013-06-18 | Panasonic Corporation | Electroluminescence module |
US20150041353A1 (en) * | 2011-08-12 | 2015-02-12 | Entegris, Inc. | Wafer carrier |
US9579788B2 (en) | 2012-02-10 | 2017-02-28 | Ascent Ventures, Llc | Automated testing and verification of a robotic system |
US20170119339A1 (en) | 2012-06-21 | 2017-05-04 | Globus Medical, Inc. | Systems and methods of checking registrations for surgical systems |
US9462732B2 (en) * | 2013-03-13 | 2016-10-04 | Laird Technologies, Inc. | Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features |
KR20160016409A (en) | 2014-08-05 | 2016-02-15 | 주식회사 엘지실트론 | Apparatus and Method for Aligning Wafer |
US20170263478A1 (en) | 2015-01-16 | 2017-09-14 | Lam Research Corporation | Detection System for Tunable/Replaceable Edge Coupling Ring |
US20160211166A1 (en) | 2015-01-16 | 2016-07-21 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
US20160211165A1 (en) | 2015-01-16 | 2016-07-21 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
US20160216185A1 (en) | 2015-01-28 | 2016-07-28 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
US10041868B2 (en) | 2015-01-28 | 2018-08-07 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
US10014198B2 (en) | 2015-08-21 | 2018-07-03 | Lam Research Corporation | Wear detection of consumable part in semiconductor manufacturing equipment |
US20170053819A1 (en) | 2015-08-21 | 2017-02-23 | Lam Research Corporation | Wear detection of consumable part in semiconductor manufacturing equipment |
US10062589B2 (en) | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Front opening ring pod |
US10062590B2 (en) | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Front opening ring pod |
US10124492B2 (en) | 2015-10-22 | 2018-11-13 | Lam Research Corporation | Automated replacement of consumable parts using end effectors interfacing with plasma processing system |
US20180068879A1 (en) | 2015-10-22 | 2018-03-08 | Lam Research Corporation | Front Opening Ring Pod |
US20170115657A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
US20170117172A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Automated Replacement of Consumable Parts Using Interfacing Chambers |
US10062599B2 (en) | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
US20180040492A1 (en) | 2015-10-22 | 2018-02-08 | Lam Research Corporation | Front Opening Ring Pod |
US20170330786A1 (en) | 2015-10-22 | 2017-11-16 | Lam Research Corporation | Automated Replacement of Consumable Parts Using Interfacing Chambers |
US20170334074A1 (en) | 2015-10-22 | 2017-11-23 | Lam Research Corporation | Automated Replacement of Consumable Parts Using End Effectors Interfacing with Plasma Processing System |
US20180019142A1 (en) | 2015-10-22 | 2018-01-18 | Lam Research Corporation | Front Opening Ring Pod |
US20170113355A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Automated Replacement of Consumable Parts Using End Effectors Interfacing with Plasma Processing System |
US9881820B2 (en) | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
US20180032062A1 (en) | 2015-10-22 | 2018-02-01 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
US20170133283A1 (en) | 2015-11-06 | 2017-05-11 | Lam Research Corporation | Sensor and adjuster for a consumable |
US20170213758A1 (en) | 2016-01-26 | 2017-07-27 | Applied Materials, Inc. | Wafer edge ring lifting solution |
US20170236741A1 (en) | 2016-02-12 | 2017-08-17 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
US20170236688A1 (en) | 2016-02-12 | 2017-08-17 | Lam Research Corporation | Chamber memeber of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring |
US20170236743A1 (en) | 2016-02-16 | 2017-08-17 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
US20170287753A1 (en) | 2016-03-29 | 2017-10-05 | Lam Research Corporation | Systems and methods for aligning measurement device in substrate processing systems |
US20170287682A1 (en) | 2016-03-29 | 2017-10-05 | Lam Research Corporation | Systems and methods for performing edge ring characterization |
US20200211877A1 (en) * | 2016-05-26 | 2020-07-02 | Entegris, Inc. | Latching mechanism for a substrate container |
US20180019107A1 (en) | 2016-07-14 | 2018-01-18 | Tokyo Electron Limited | Focus ring replacement method and plasma processing system |
US20180090354A1 (en) | 2016-09-29 | 2018-03-29 | Tokyo Electron Limited | Position detection system and processing apparatus |
US20180166259A1 (en) | 2016-12-08 | 2018-06-14 | Tokyo Electron Limited | Mounting table and plasma processing apparatus |
US20180315583A1 (en) | 2016-12-16 | 2018-11-01 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US9947517B1 (en) | 2016-12-16 | 2018-04-17 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US10103010B2 (en) | 2016-12-16 | 2018-10-16 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US20180218933A1 (en) | 2017-02-01 | 2018-08-02 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US20180233328A1 (en) | 2017-02-16 | 2018-08-16 | Tokyo Electron Limited | Vacuum processing apparatus and maintenance apparatus |
US20180277416A1 (en) | 2017-03-22 | 2018-09-27 | Tokyo Electron Limited | Substrate processing apparatus |
US20180301322A1 (en) | 2017-04-12 | 2018-10-18 | Tokyo Electron Limited | Position detecting system and processing apparatus |
US20180315640A1 (en) | 2017-04-26 | 2018-11-01 | Tokyo Electron Limited | Plasma processing apparatus |
US20190088531A1 (en) | 2017-09-21 | 2019-03-21 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
US20200122320A1 (en) | 2018-10-19 | 2020-04-23 | Asm Ip Holding B.V. | Method for teaching a transportation position and alignment jig |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
US20210296149A1 (en) * | 2020-03-23 | 2021-09-23 | Applied Materials, Inc. | Enclosure system shelf |
USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD954769S1 (en) * | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
Non-Patent Citations (3)
Title |
---|
Entegris F300 AutoPds, Wafer Carrier Clean, Secure wafer transport and optimum automation intergartion, https://www.entergris.com. |
Entegris Spectra Foup, Front opening unified pod platform with superior microenvironment control, https:/www.entegris.com/content/dam/shared-product-assets/wafer-processing/datasheet-spectra-foup-2413.pdf, Retrieved May 20, 2019. |
International Seach Report and Written Opinion dated Sep. 1, 2020, for application No. PCT/US2020/033774. |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210296149A1 (en) * | 2020-03-23 | 2021-09-23 | Applied Materials, Inc. | Enclosure system shelf |
Also Published As
Publication number | Publication date |
---|---|
TWD215155S (en) | 2021-11-11 |
JP1686261S (en) | 2021-05-24 |
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