TWD215155S - Substrate processing system carrier - Google Patents

Substrate processing system carrier Download PDF

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Publication number
TWD215155S
TWD215155S TW109306788F TW109306788F TWD215155S TW D215155 S TWD215155 S TW D215155S TW 109306788 F TW109306788 F TW 109306788F TW 109306788 F TW109306788 F TW 109306788F TW D215155 S TWD215155 S TW D215155S
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TW
Taiwan
Prior art keywords
substrate processing
design
processing system
system carrier
usage
Prior art date
Application number
TW109306788F
Other languages
Chinese (zh)
Inventor
亞倫 格林
尼可拉斯麥可 博甘茲
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD215155S publication Critical patent/TWD215155S/en

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Abstract

【物品用途】;本設計請求具有視覺效果之用於基板處理系統的載具。;【設計說明】;參考圖顯示本設計之使用環境，其中所揭露之虛線部分，為本案不主張設計之部分。[Item Usage]; This design requires a vehicle with visual effects for substrate processing systems. ;[Design Description];The reference picture shows the usage environment of this design. The dotted line portion disclosed in it is the part of the design that is not recommended in this case.

Description

基板處理系統載具 Substrate processing system carrier

本設計請求具有視覺效果之用於基板處理系統的載具。 This design requests a carrier for the substrate processing system with visual effects.

參考圖顯示本設計之使用環境，其中所揭露之虛線部分，為本案不主張設計之部分。 The reference diagram shows the use environment of this design, and the dotted part disclosed therein is the part that is not recommended for design in this case.

TW109306788F 2020-06-02 2020-12-02 Substrate processing system carrier TWD215155S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/736,744 USD980176S1 (en) 2020-06-02 2020-06-02 Substrate processing system carrier
US29/736,744 2020-06-02

Publications (1)

Publication Number Publication Date
TWD215155S true TWD215155S (en) 2021-11-11

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ID=75967047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109306788F TWD215155S (en) 2020-06-02 2020-12-02 Substrate processing system carrier

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US (1) USD980176S1 (en)
JP (1) JP1686261S (en)
TW (1) TWD215155S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12027397B2 (en) * 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
JP3899570B2 (en) 1996-12-06 2007-03-28 株式会社日立ハイテクノロジーズ Substrate processing apparatus and liquid crystal panel manufacturing method
USD407073S (en) * 1997-12-24 1999-03-23 Applied Materials, Inc. Electrostatic chuck with improved spacing and charge migration reduction mask
US6199291B1 (en) 1998-07-29 2001-03-13 Sony Corporation Alignment fixture
JP3234576B2 (en) 1998-10-30 2001-12-04 アプライド マテリアルズ インコーポレイテッド Wafer support device in semiconductor manufacturing equipment
US7040487B2 (en) * 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
USD489739S1 (en) * 2002-12-20 2004-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US7792350B2 (en) 2003-11-10 2010-09-07 Brooks Automation, Inc. Wafer center finding
JP4559317B2 (en) 2005-07-21 2010-10-06 株式会社岡本工作機械製作所 Semiconductor substrate transfer method
US7727800B2 (en) 2005-12-12 2010-06-01 Asm Assembly Automation Ltd. High precision die bonding apparatus
US8690135B2 (en) 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
JP2009095783A (en) 2007-10-17 2009-05-07 Recs:Kk Liquid application apparatus
EP2212675A1 (en) 2007-11-09 2010-08-04 The Royal Institution For The Advancement Of Learning/McGill University Quantification of an absorber through a scattering medium
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
CN102326244B (en) 2009-01-11 2014-12-17 应用材料公司 Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
US8397739B2 (en) 2010-01-08 2013-03-19 Applied Materials, Inc. N-channel flow ratio controller calibration
USD684546S1 (en) * 2011-02-04 2013-06-18 Panasonic Corporation Electroluminescence module
EP2742526A4 (en) * 2011-08-12 2015-01-14 Entegris Inc Wafer carrier
US9579788B2 (en) 2012-02-10 2017-02-28 Ascent Ventures, Llc Automated testing and verification of a robotic system
US10842461B2 (en) 2012-06-21 2020-11-24 Globus Medical, Inc. Systems and methods of checking registrations for surgical systems
US9462732B2 (en) * 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
KR101597211B1 (en) 2014-08-05 2016-03-07 주식회사 엘지실트론 Apparatus and Method for Aligning Wafer
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US11605546B2 (en) 2015-01-16 2023-03-14 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US20170263478A1 (en) 2015-01-16 2017-09-14 Lam Research Corporation Detection System for Tunable/Replaceable Edge Coupling Ring
US10041868B2 (en) 2015-01-28 2018-08-07 Lam Research Corporation Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber
US10014198B2 (en) 2015-08-21 2018-07-03 Lam Research Corporation Wear detection of consumable part in semiconductor manufacturing equipment
US10062599B2 (en) 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US9881820B2 (en) 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US20170115657A1 (en) 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
US10124492B2 (en) 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US10985078B2 (en) 2015-11-06 2021-04-20 Lam Research Corporation Sensor and adjuster for a consumable
CN108369922B (en) 2016-01-26 2023-03-21 应用材料公司 Wafer edge ring lifting solution
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US10699878B2 (en) 2016-02-12 2020-06-30 Lam Research Corporation Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
US10438833B2 (en) 2016-02-16 2019-10-08 Lam Research Corporation Wafer lift ring system for wafer transfer
US11011353B2 (en) 2016-03-29 2021-05-18 Lam Research Corporation Systems and methods for performing edge ring characterization
US10312121B2 (en) 2016-03-29 2019-06-04 Lam Research Corporation Systems and methods for aligning measurement device in substrate processing systems
WO2017205708A1 (en) * 2016-05-26 2017-11-30 Entegris, Inc. Latching mechanism for a substrate container
JP6635888B2 (en) 2016-07-14 2020-01-29 東京エレクトロン株式会社 Plasma processing system
JP2018054500A (en) 2016-09-29 2018-04-05 東京エレクトロン株式会社 Position detection system and processing device
JP6812224B2 (en) 2016-12-08 2021-01-13 東京エレクトロン株式会社 Board processing equipment and mounting table
US9947517B1 (en) 2016-12-16 2018-04-17 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
US10553404B2 (en) 2017-02-01 2020-02-04 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
JP6812264B2 (en) 2017-02-16 2021-01-13 東京エレクトロン株式会社 Vacuum processing equipment and maintenance equipment
US11404249B2 (en) 2017-03-22 2022-08-02 Tokyo Electron Limited Substrate processing apparatus
JP6656200B2 (en) 2017-04-12 2020-03-04 東京エレクトロン株式会社 Position detection system and processing device
TWI843457B (en) 2017-04-26 2024-05-21 日商東京威力科創股份有限公司 Plasma processing apparatus
US11075105B2 (en) 2017-09-21 2021-07-27 Applied Materials, Inc. In-situ apparatus for semiconductor process module
US11247330B2 (en) 2018-10-19 2022-02-15 Asm Ip Holding B.V. Method for teaching a transportation position and alignment jig
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
US12027397B2 (en) * 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD954769S1 (en) * 2020-06-02 2022-06-14 Applied Materials, Inc. Enclosure system shelf

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USD980176S1 (en) 2023-03-07
JP1686261S (en) 2021-05-24

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