|
US5749469A
(en)
*
|
1992-05-15 |
1998-05-12 |
Fluoroware, Inc. |
Wafer carrier
|
|
JP3899570B2
(ja)
|
1996-12-06 |
2007-03-28 |
株式会社日立ハイテクノロジーズ |
基板処理装置及び液晶パネルの製造方法
|
|
USD407073S
(en)
*
|
1997-12-24 |
1999-03-23 |
Applied Materials, Inc. |
Electrostatic chuck with improved spacing and charge migration reduction mask
|
|
US6199291B1
(en)
|
1998-07-29 |
2001-03-13 |
Sony Corporation |
Alignment fixture
|
|
JP3234576B2
(ja)
|
1998-10-30 |
2001-12-04 |
アプライド マテリアルズ インコーポレイテッド |
半導体製造装置におけるウェハ支持装置
|
|
US7040487B2
(en)
*
|
2001-07-14 |
2006-05-09 |
Entegris, Inc. |
Protective shipper
|
|
USD489739S1
(en)
*
|
2002-12-20 |
2004-05-11 |
Ngk Spark Plug Co., Ltd. |
Electrostatic chuck
|
|
US7792350B2
(en)
|
2003-11-10 |
2010-09-07 |
Brooks Automation, Inc. |
Wafer center finding
|
|
JP4559317B2
(ja)
|
2005-07-21 |
2010-10-06 |
株式会社岡本工作機械製作所 |
半導体基板の搬送方法
|
|
US7727800B2
(en)
|
2005-12-12 |
2010-06-01 |
Asm Assembly Automation Ltd. |
High precision die bonding apparatus
|
|
US8690135B2
(en)
|
2006-12-18 |
2014-04-08 |
Camtek Ltd. |
Chuck and a method for supporting an object
|
|
JP2009095783A
(ja)
|
2007-10-17 |
2009-05-07 |
Recs:Kk |
液塗布装置
|
|
EP2212675A1
(en)
|
2007-11-09 |
2010-08-04 |
The Royal Institution For The Advancement Of Learning/McGill University |
Quantification of an absorber through a scattering medium
|
|
USD616389S1
(en)
*
|
2008-10-20 |
2010-05-25 |
Ebara Corporation |
Vacuum contact pad
|
|
US8784033B2
(en)
|
2009-01-11 |
2014-07-22 |
Applied Materials, Inc. |
Robot systems, apparatus and methods for transporting substrates
|
|
US8397739B2
(en)
|
2010-01-08 |
2013-03-19 |
Applied Materials, Inc. |
N-channel flow ratio controller calibration
|
|
USD684546S1
(en)
*
|
2011-02-04 |
2013-06-18 |
Panasonic Corporation |
Electroluminescence module
|
|
WO2013025629A2
(en)
*
|
2011-08-12 |
2013-02-21 |
Entegris, Inc. |
Wafer carrier
|
|
US9579788B2
(en)
|
2012-02-10 |
2017-02-28 |
Ascent Ventures, Llc |
Automated testing and verification of a robotic system
|
|
US10842461B2
(en)
|
2012-06-21 |
2020-11-24 |
Globus Medical, Inc. |
Systems and methods of checking registrations for surgical systems
|
|
US9462732B2
(en)
*
|
2013-03-13 |
2016-10-04 |
Laird Technologies, Inc. |
Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
|
|
KR101597211B1
(ko)
|
2014-08-05 |
2016-03-07 |
주식회사 엘지실트론 |
웨이퍼 정렬 장치 및 방법
|
|
US10658222B2
(en)
|
2015-01-16 |
2020-05-19 |
Lam Research Corporation |
Moveable edge coupling ring for edge process control during semiconductor wafer processing
|
|
US11605546B2
(en)
|
2015-01-16 |
2023-03-14 |
Lam Research Corporation |
Moveable edge coupling ring for edge process control during semiconductor wafer processing
|
|
US20170263478A1
(en)
|
2015-01-16 |
2017-09-14 |
Lam Research Corporation |
Detection System for Tunable/Replaceable Edge Coupling Ring
|
|
US10041868B2
(en)
|
2015-01-28 |
2018-08-07 |
Lam Research Corporation |
Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber
|
|
US10014198B2
(en)
|
2015-08-21 |
2018-07-03 |
Lam Research Corporation |
Wear detection of consumable part in semiconductor manufacturing equipment
|
|
US9881820B2
(en)
|
2015-10-22 |
2018-01-30 |
Lam Research Corporation |
Front opening ring pod
|
|
US20170115657A1
(en)
|
2015-10-22 |
2017-04-27 |
Lam Research Corporation |
Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
|
|
US10062599B2
(en)
|
2015-10-22 |
2018-08-28 |
Lam Research Corporation |
Automated replacement of consumable parts using interfacing chambers
|
|
US10124492B2
(en)
|
2015-10-22 |
2018-11-13 |
Lam Research Corporation |
Automated replacement of consumable parts using end effectors interfacing with plasma processing system
|
|
US10985078B2
(en)
|
2015-11-06 |
2021-04-20 |
Lam Research Corporation |
Sensor and adjuster for a consumable
|
|
WO2017131927A1
(en)
|
2016-01-26 |
2017-08-03 |
Applied Materials, Inc. |
Wafer edge ring lifting solution
|
|
US10651015B2
(en)
|
2016-02-12 |
2020-05-12 |
Lam Research Corporation |
Variable depth edge ring for etch uniformity control
|
|
US10699878B2
(en)
|
2016-02-12 |
2020-06-30 |
Lam Research Corporation |
Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
|
|
US10438833B2
(en)
|
2016-02-16 |
2019-10-08 |
Lam Research Corporation |
Wafer lift ring system for wafer transfer
|
|
US11011353B2
(en)
|
2016-03-29 |
2021-05-18 |
Lam Research Corporation |
Systems and methods for performing edge ring characterization
|
|
US10312121B2
(en)
|
2016-03-29 |
2019-06-04 |
Lam Research Corporation |
Systems and methods for aligning measurement device in substrate processing systems
|
|
CN109463006B
(zh)
*
|
2016-05-26 |
2023-07-04 |
恩特格里斯公司 |
用于衬底容器的闩锁机构
|
|
JP6635888B2
(ja)
|
2016-07-14 |
2020-01-29 |
東京エレクトロン株式会社 |
プラズマ処理システム
|
|
JP2018054500A
(ja)
|
2016-09-29 |
2018-04-05 |
東京エレクトロン株式会社 |
位置検出システム及び処理装置
|
|
JP6812224B2
(ja)
|
2016-12-08 |
2021-01-13 |
東京エレクトロン株式会社 |
基板処理装置及び載置台
|
|
US9947517B1
(en)
|
2016-12-16 |
2018-04-17 |
Applied Materials, Inc. |
Adjustable extended electrode for edge uniformity control
|
|
US10553404B2
(en)
|
2017-02-01 |
2020-02-04 |
Applied Materials, Inc. |
Adjustable extended electrode for edge uniformity control
|
|
JP6812264B2
(ja)
|
2017-02-16 |
2021-01-13 |
東京エレクトロン株式会社 |
真空処理装置、及びメンテナンス装置
|
|
US11404249B2
(en)
|
2017-03-22 |
2022-08-02 |
Tokyo Electron Limited |
Substrate processing apparatus
|
|
JP6656200B2
(ja)
|
2017-04-12 |
2020-03-04 |
東京エレクトロン株式会社 |
位置検出システム及び処理装置
|
|
TW202341281A
(zh)
|
2017-04-26 |
2023-10-16 |
日商東京威力科創股份有限公司 |
電漿處理裝置
|
|
US11075105B2
(en)
|
2017-09-21 |
2021-07-27 |
Applied Materials, Inc. |
In-situ apparatus for semiconductor process module
|
|
US11247330B2
(en)
|
2018-10-19 |
2022-02-15 |
Asm Ip Holding B.V. |
Method for teaching a transportation position and alignment jig
|
|
USD908645S1
(en)
*
|
2019-08-26 |
2021-01-26 |
Applied Materials, Inc. |
Sputtering target for a physical vapor deposition chamber
|
|
US20210296149A1
(en)
*
|
2020-03-23 |
2021-09-23 |
Applied Materials, Inc. |
Enclosure system shelf
|
|
USD947802S1
(en)
*
|
2020-05-20 |
2022-04-05 |
Applied Materials, Inc. |
Replaceable substrate carrier interfacing film
|
|
USD954769S1
(en)
*
|
2020-06-02 |
2022-06-14 |
Applied Materials, Inc. |
Enclosure system shelf
|