TWD217060S - Enclosure system shelf of a substrate processing system - Google Patents

Enclosure system shelf of a substrate processing system Download PDF

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Publication number
TWD217060S
TWD217060S TW109306791F TW109306791F TWD217060S TW D217060 S TWD217060 S TW D217060S TW 109306791 F TW109306791 F TW 109306791F TW 109306791 F TW109306791 F TW 109306791F TW D217060 S TWD217060 S TW D217060S
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TW
Taiwan
Prior art keywords
substrate processing
shelf
enclosure
processing system
design
Prior art date
Application number
TW109306791F
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Chinese (zh)
Inventor
亞倫 格林
尼可拉斯麥可 博甘茲
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD217060S publication Critical patent/TWD217060S/en

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Abstract

【物品用途】;本設計所請求之基板處理裝置的外殼系統擱板係用於基板處理裝置的外殼系統。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。[Use of article]; The shelf system of the substrate processing device requested by this design is used for the shell system of the substrate processing device. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

基板處理裝置的外殼系統擱板 Housing System Shelves for Substrate Handling Units

本設計所請求之基板處理裝置的外殼系統擱板係用於基板處理裝置的外殼系統。 The housing system shelf of the substrate processing apparatus required by this design is used for the housing system of the substrate processing apparatus.

圖式所揭露之虛線部分，為本案不主張設計之部分。 The dotted line part disclosed in the drawings is the part that does not claim design in this case.

TW109306791F 2020-06-02 2020-12-02 Enclosure system shelf of a substrate processing system TWD217060S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/736,743 USD954769S1 (en) 2020-06-02 2020-06-02 Enclosure system shelf
US29/736,743 2020-06-02

Publications (1)

Publication Number Publication Date
TWD217060S true TWD217060S (en) 2022-02-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW109306791F TWD217060S (en) 2020-06-02 2020-12-02 Enclosure system shelf of a substrate processing system

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US (1) USD954769S1 (en)
JP (1) JP1700378S (en)
TW (1) TWD217060S (en)

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TWD227852S (en) 2022-08-04 2023-10-01 美商應用材料股份有限公司 Grounding ring of a process kit for semiconductor substrate processing
TWD228654S (en) 2022-08-04 2023-11-21 美商應用材料股份有限公司 Deposition ring of a process kit for semiconductor substrate processing

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD227852S (en) 2022-08-04 2023-10-01 美商應用材料股份有限公司 Grounding ring of a process kit for semiconductor substrate processing
TWD228654S (en) 2022-08-04 2023-11-21 美商應用材料股份有限公司 Deposition ring of a process kit for semiconductor substrate processing

Also Published As

Publication number Publication date
JP1700378S (en) 2021-11-22
USD954769S1 (en) 2022-06-14

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