JP2016522586A - Front open wafer container with heavy ballast - Google Patents

Abstract

An apparatus and method for providing a ballast system for adjusting the center of gravity of a standardized front open wafer container. As various embodiments of the present invention, a ballast system is presented that is short, requires no modification to the outer shell of the wafer container, and can be retrofitted to existing wafer transport containers. In some embodiments, these functions are implemented by attaching ballasts to the kinematic connecting plate of the wafer container. As one embodiment, the “lift” of the wafer container during the cleaning operation can be prevented by imposing a heavy load and obtaining a sufficient reaction force against the lifting force accompanying the cleaning of the wafer container. The ballast can be removed when shipping the wafer container to reduce the shipping cost.

Description

Related Applications This application claims the benefit of US Provisional Patent Application No. 61 / 83,572, filed Jun. 18, 2013, the entire disclosure of which is incorporated herein by reference.

FIELD OF DISCLOSURE The present invention is generally directed to wafer containers, and specifically to front-opening wafer containers with a weight ballast function.

BACKGROUND OF THE DISCLOSURE As the number of circuits per unit area in an integrated circuit increases, the problem of particulates associated with converting a semiconductor wafer to an integrated circuit becomes increasingly significant. The size of the particles that can destroy the circuit is getting smaller and approaching the molecular level. Particle control is necessary for the entire process of manufacturing, processing, transporting and storing semiconductor wafers. It is necessary to suppress or prevent the generation of particles due to the movement of the wafer in the transfer container when the wafer is inserted into and removed from the transfer container or during transport. The wafer container is cleaned to remove particulate matter that has accumulated during use. These containers need to be constructed so that any contamination problems associated with cleaning can be suppressed. Such problems include areas that do not dry immediately after contaminants introduced by the cleaning fluid in contact with the cleaning and metal components. Driven by economies of scale, the size of wafers used in semiconductor manufacturing facilities (“fabs”) continues to increase. At present, a number of facilities for processing 300 mm wafers and 450 mm wafers have been developed.

  300 mm diameter and 450 mm diameter wafers are transported and handled in a front opening type wafer container. In the interior, horizontal wafers are supported by a shelf and wafer restraint in a stacked state at intervals. The container is equipped with a kinematic coupling (coupling) at the bottom so that it can be accurately seated on a machine interface with a kinematic coupling projection that cooperates with it, and for a robot to grasp and transport the container Has a flange. The front opening type wafer container has a door disposed on the front surface thereof. The door is attached to the frame in a sealed state. The presence of the door and frame increases the weight of the forefront of the wafer container and creates a non-negligible moment that causes the wafer container to be pulled forward. In other words, even when the wafer container is fully loaded with wafers, the center of gravity of the wafer container is considerably ahead of the geometric center of the wafer container. Doors are opened and closed, and wafers are taken out and inserted by robots. It is essential that the front-opening wafer container is seated accurately, stably and reliably on the machine interface. The problem with seating accuracy and stability that can occur with a 300 mm wafer container is exacerbated because the 450 mm container increases the amount of plastic, thickens the walls, and becomes quite heavy. The weight of the increase corresponding to the door and door frame.

  The kinematic connecting part on the bottom is usually provided on the kinematic connecting plate, and has three grooves provided at corresponding positions so that the three round protrusions can be seated on the kinematic connecting part arranged in a triangle. The connecting plate can be placed in an accurate position. The central axis passes through the center of the square robot flange at the top of the container. This central axis also passes through the central positions of the three grooves provided at the corresponding positions and the three protrusions engaged with the grooves when the transport container is mounted. In some cases, the central axis extends longitudinally through wafers stacked in a gap in both 300 mm and 450 mm front open containers.

  Stability and optimality are achieved when the center of gravity of the wafer container is at or near the center axis corresponding to the center of the three protrusions of the kinematic connection and the center of the square robot flange at the top of the wafer container. This is advantageous for proper seating. For this reason, certain aspects of 300 mm and 450 mm containers have been standardized by an industry standard known as the SEMI standard published by the Semiconductor Manufacturing Equipment and Materials Association (“SEMI”). SEMI standards E158 and E159 stipulate that the center of gravity should be within a certain distance in the direction from the central axis of the robot flange toward the front of the central axis. This “front” is a direction toward the door of the wafer container. For example, the center of gravity for the 450 mm front opening unified pod (“FOUP”) is 29 mm forward from the central axis, and the 450 mm multi-purpose transport container (“MAC”) is 39 mm forward from the central axis. It is stipulated.

  A system that can be implemented on both new and existing wafer containers to adjust the position of the center of gravity of a front-opening wafer container would be welcomed if it joins the wafer container technology.

SUMMARY OF THE DISCLOSURE This application discloses various apparatus and methods that provide a ballast system for adjusting the center of gravity of a standardized front-open wafer container. As various embodiments of the present invention, a ballast system is presented that is short, requires no modification to the outer shell of the wafer container, and can be retrofitted to existing wafer transport containers. In some embodiments, these functions are realized by attaching ballast (bottom load) to the kinematic connecting plate of the wafer container. As one embodiment, the “lift” of the wafer container during the cleaning operation can be prevented by imposing a heavy load and obtaining a sufficient reaction force against the lifting force accompanying the cleaning of the wafer container.

  A front opening type wafer container for large diameter (for example, containing 300 mm diameter or 450 mm diameter wafers) is usually formed from an injection-molded polymer, and a door that opens the front part and the opening part is sealed. It has. Compared to the back structure of a wafer container, which basically has only a closed wall and a wafer restraint, the amount of polymer is reduced by the door frame with the front of the opening formed on the front of the wafer container and the door with the wafer restraint and latch mechanism. It increases considerably and therefore the weight also increases. The weight of the front surface due to the addition of the front polymer structure to the door and door frame is that the center of gravity of the wafer container moves sufficiently forward from the center of the wafer stack and the center of the kinematic coupling protrusions and grooves. Stability and optimal seating on the kinematic connecting projections are negatively affected. In addition, since the center of gravity moves forward with respect to the robot flange when it is shifted forward in this way, there arises a problem that the static load and the dynamic load are not uniform when the container is transported by the robot flange. there is a possibility.

  U.S. Patent Application Publication No. 2013/0032509 ("Yamagishi") of Yamagishi et al. Provides a heavy center of gravity position adjusting means at the rear of the wafer container main body such as the rear part of the back wall or side wall. Discloses a substrate storage container that restricts the inclination of the container toward the container lid side. In some forms of this mountain bank, it is necessary to expand the outer shape of the storage container. The other form is short (that is, does not expand the outer shape of the storage container), but the storage part must be changed so that it needs to be replaced. In addition, some forms of Yamagishi contain structural features that hinder the realization of other innovations in wafer container technology. For example, the special short form of the Yamagishi interferes with or affects the performance of various purification towers as disclosed in Burns et al. The use of may be substantially dismissed. Various embodiments of the present invention can address this mountainside shortcoming by providing a short ballast without the need to change the outer shell of the wafer container.

  In addition to the final center of gravity, there are other technical considerations when placing a load on the wafer container. For example, the ballast can also act against the forces resulting from the cleaning of the container. Front-opened wafer containers are typically cleaned by taking nitrogen or very dry air through a passage in the lower back of the container and exhausting it through a passage in the lower front. In some places of use, such as a conventional storage (stocker) used for long-term storage of wafer containers, the containers are not actively fixed by holding clamps. When the cleaning airflow is applied, an upward force is generated at the rear and front of the wafer container, but the force may be large enough to lift the wafer container, especially if the wafer container contains only a few wafers. is there.

  When ballast is added, the wafer container can be prevented from being lifted from the support table when the wafer container is cleaned. In extreme situations (eg, with a single wafer and a very large purge air flow), the weight may need to be greater than the weight of the ballast that is required just to keep the center of gravity within an acceptable range. .

  Structurally speaking, the wafer container according to various embodiments of the present invention is provided with a ballast made of a material having a higher density than the polymer forming the wall of the accommodating portion and the kinematic connecting plate, and the center of gravity is the wafer in the container. Shift towards the vertical stacking axis or near this vertical axis. The ballast can also be provided with an inert outer polymer surface. In one embodiment, the ballast is provided with a plate lying on the kinematic connecting plate at the bottom of the housing, and is firmly sandwiched between the kinematic connecting plate and the outer shell of the wafer container. In one embodiment, the ballast may be attached to the kinematic connecting plate with a spring-type fastener and sandwiched between the kinematic connecting plate and the receiving portion. The ballast plate may be configured as an elongated bar or plate extending in the lateral direction, and may be disposed on the rear side of the kinematic connecting plate and the rear side of the receiving portion. The ballast plate can also be formed of a high-density material that can supplement the structural strength of the polymer used in the kinematic connecting plate and the housing. In some embodiments, the ballast is constructed by wrapping a solid plate or elongated block made of a metallic material such as stainless steel, zinc, lead, other metals, or a weighted material, with a covering material. The covering material can also be provided, for example, by polymer powder coating.

  As one example, a ballast system for a wafer container includes a ballast having a plate-like portion having an outer periphery and a first core portion depending from the plate-like portion, and the first core portion includes a heavy material, It shall have a first outer surface of a shape and size that can be inserted into the kinematic connecting plate. The ballast may further include a second core portion depending from the plate-like portion, and the second core portion may have a second outer surface having a shape and a dimension that can be inserted into the kinematic connecting plate. The ballast may further include at least one rib depending from the plate-like portion, and the at least one rib portion may be disposed between the first core portion and the second core portion. The at least one rib may be provided with unevenness corresponding to the back side of the kinematic connecting portion of the kinematic connecting plate. As one embodiment, a contact portion for engaging with the kinematic connecting plate is formed on the first outer surface of the ballast on the first core portion side. The ballast may further be provided with a protrusion protruding beyond the outer periphery of the plate-like portion in order to couple with the kinematic connecting plate. A flange portion can also be formed in the first core portion by moving it closer to the inside than the outer periphery of the plate-like portion. The ballast can also be coated with a polymer material. The first core portion is provided with an engaging portion that engages with a holding portion of the kinematic connecting plate. In one embodiment, the engaging portion is a clip engaging portion having an introduction structure and a hooking surface.

  In various embodiments, the kinematic connecting plate is provided with a first receiving portion and a second receiving portion, and at least one of the first receiving portion and the second receiving portion is shaped and dimensioned to receive the ballast, and the kinematic The connecting plate is provided with a partition structure in which an opening that engages with the protruding portion is formed. The kinematic connecting plate may also be provided with a retaining clip that couples to the clip engaging portion.

  As a specific example, a ballast system for a wafer container includes a first housing portion having a first tank portion and a first lid portion that cooperate to form a first main compartment, and a first main compartment including a heavy material. It is assumed that a ballast including a first main weight body arranged inside is provided. The first housing part may be provided with a first outer surface having a shape and a dimension that can be inserted into the kinematic connecting plate. In one embodiment, the ballast includes a second housing part having a second tank part and a second lid part that cooperate to form a second main part, and a second main part disposed in the second main part. A weight body may be further provided, and an outer surface having a shape and a dimension capable of being inserted into the kinematic connecting plate may be provided in the second housing portion. In some embodiments, the first housing portion and the second housing portion are connected in a bridge structure. However, as another embodiment, the first housing portion and the second housing portion may be separate and independent ballasts. . The first housing part may be provided with a structure in which a flange part protruding in the lateral direction from the first tank part is formed. The ballast can further be provided with a contact portion depending from the flange portion. The first housing may further form a first auxiliary section that accommodates the secondary weight body. The first auxiliary section can be provided with irregularities corresponding to the back side of the kinematic connecting portion of the kinematic connecting plate. The ballast may be provided with a first engaging portion integrally formed on the outer surface of the first housing portion in order to engage with the holding portion of the kinematic connecting plate. The first engagement portion may be a clip engagement portion having an introduction structure and a hooking surface.

  As one embodiment, a gasket is disposed in the gap between the first tank portion and the first lid portion. A plurality of notches may be further formed in the housing portion, and a plurality of convex piece portions may be provided in the gasket portion so that each convex piece portion engages with a corresponding one of the plurality of notches. In one embodiment, the gasket is provided with a shim portion protruding between the first main weight body and the secondary weight body.

  As one example, the kinematic connecting plate is provided with a first receiving portion and a second receiving portion, and at least one of the first receiving portion and the second receiving portion is shaped and dimensioned to receive a ballast, The kinematic connecting plate is provided with a first holding clip to be coupled with the clip engaging portion. The ballast may be provided with a second engaging portion that engages with the second holding portion on the kinematic connecting plate. The second engaging portion can be integrally formed on the outer surface of the first housing portion. In one embodiment, the second engagement portion is a clip engagement portion having an introduction structure and a hooking surface. The second holding portion may be a second holding clip that is coupled to the second clip engaging portion. In one embodiment, the first retaining clip can be deflected in a first plane and the second retaining clip can be deflected in a second plane orthogonal to the first plane.

  In various embodiments, the kinematic connecting plate is made of a polymer. In some embodiments, the density of the heavy material of the ballast is at least twice and no more than 10 times the density of the polymer. In one embodiment, the density of the ballast is at least 2.5 times that of the polymer. In one embodiment, the density of the ballast is at least three times that of the polymer. In one embodiment, the density of the ballast is at least 3.5 times that of the polymer. In one embodiment, the density of the ballast is at least four times that of the polymer. In one embodiment, the density of the ballast is at least 4.5 times that of the polymer. In one embodiment, the density of the ballast is at least five times that of the polymer.

  In various embodiments, the weight of the ballast in the ballast system is at least 1 kgf and no more than 12 kgf. In one embodiment, the weight of the ballast is at least 4.5 kgf. In one embodiment, the weight of the ballast is at least 6 kgf. In one embodiment, the weight of the ballast is at least 10 kgf.

In some embodiments, the density of the weight material of the ballast system and at least 3000 kg / ^{m 3} or more and 14000kg / ^{m 3} or less. In one embodiment, the density of the heavy material is at least 4000 kg / m ³ . In one embodiment, the density of the heavy material is at least 6000 kg / m ³ .

  As one embodiment of the present invention, a system for purifying a wafer container has a back panel opposite to a door frame, and from the back panel to the door frame, a top panel and a bottom panel, and two opposing side surfaces. It shall include a front-opened wafer container having an outer shell connected by a panel and a door frame engaged in a sealed state with the door, and at least one purifying air supply port and at least one purifying exhaust port on the bottom panel of the outer shell. Form. A purification device is functionally connected to the at least one purification air supply port and the at least one purification exhaust port. A ballast is functionally coupled to the front-opening wafer container, and the weight of the ballast is set in advance to prevent the wafer container from being lifted while the purification device is operating at a predetermined flow rate. To do. The purification system can also include a kinematic coupling plate attached to the bottom surface of the outer shell and a ballast attached to the kinematic coupling plate. In one embodiment, the ballast is positioned near the back panel of the outer shell. In one embodiment, the purification device is a storage. In one embodiment, the weight of the ballast is set in advance to a weight sufficient to prevent the wafer container from being lifted when one wafer is contained in the wafer container.

Similarly, as an embodiment of the present invention, a method for fixing a wafer transfer container to a purification apparatus is disclosed. The method includes the following steps.
The process of providing ballast for use with wafer containers. The weight of the ballast is set to a predetermined weight suitable for holding the wafer container in a purification device that operates with a purification gas at a predetermined flow rate.
The process of providing a set of instructions written on a tangible medium. The set of instructions is an instruction including a procedure for attaching the ballast to the wafer container and a procedure for functionally connecting the wafer container after the ballast is attached to the purification apparatus.
As one embodiment, the procedure for attaching ballast to the wafer container during a set of instructions further includes the procedure for attaching ballast to the kinematic connecting plate of the wafer container. This method may further include the following steps.
A process of providing a replacement kinematic connecting plate having a structure capable of receiving ballast.
A set of instructions provided in the process of providing a set of instructions includes a procedure for removing an existing kinematic connecting plate from a wafer container, a procedure for attaching ballast to a replacement kinematic connecting plate, and a wafer container And a procedure for installing a replacement kinematic connecting plate on the board.
The weight of the ballast used in the process of providing the ballast can be set in advance to a weight sufficient to prevent the wafer container from being lifted when a single wafer is accommodated in the wafer container.

  As various embodiments of the present invention, a door having a rear panel opposed to a door frame and having an outer shell connecting the rear panel to the door frame by a top panel, a bottom panel, and two opposed side panels. Disclosed is a wafer container in which a door is sealed and engaged with a frame. The top panel of the outer shell can be functionally coupled with a vertical robot flange centered on a central axis. A kinematic connecting plate can also be functionally coupled to the bottom panel. A ballast is functionally coupled to the kinematic connecting plate near the back panel. The kinematic connecting plate is provided with at least one receiving portion having a shape and a dimension capable of receiving a ballast. As one embodiment, the ballast includes a plate-like portion having an outer peripheral surface and a first core portion depending from the plate-like portion. The first core portion includes a heavy material and is a kinematic connecting plate. The first outer surface is shaped and dimensioned so that it can be inserted into at least one receiving portion. The ballast may further include a second core portion depending from the plate-like portion, and the second core portion may have a second outer surface having a shape and a dimension that can be inserted into the kinematic connecting plate. In one embodiment, the ballast is disposed within a first main section that includes a first housing section having a first tank section and a first lid section that cooperate to form a first main section, and a heavy material. The first main weight body is provided, and the first housing portion has a first outer surface having a shape and a dimension that can be inserted into the first of at least one receiving portion of the kinematic connecting plate. The ballast of the wafer container includes a second housing portion having a second tank portion and a second lid portion that cooperate to form a second main compartment, a second main weight body disposed in the second main compartment, The second housing part has a second outer surface shaped and dimensioned to be inserted into the second of at least one receiving part of the kinematic connecting plate. As one embodiment, the center of gravity of the wafer container is moved to within 20 mm from the central axis by adding a ballast of the wafer container. In various embodiments, the wafer container is configured to hold a 450 mm wafer in a stack with a gap about a vertical axis.

As various embodiments of the present invention, a method including the following process for stabilizing a front-open wafer container is disclosed.
-The process of providing ballast to the first operator.
The process of providing instructions to the first operator on the tangible medium. The instruction is an instruction including a procedure of receiving a front opening type wafer container including a kinematic connecting plate from a first operator and a procedure of coupling a ballast to the kinematic connecting plate of the wafer container.
The procedure for connecting the ballast to the kinematic connecting plate during a set of instructions can also be configured as follows.
・ Procedure for removing the kinematic connecting plate from the outer shell of the wafer container.
・ Procedure for attaching ballast to kinematic connecting plate.
-Procedure for attaching the kinematic connecting plate with ballast to the outer shell of the wafer container.
The instructions can also include the following:
・ Procedure to remove ballast from kinematic connecting plate.
・ Procedure for returning the container to the first operator with the ballast removed.

  In some embodiments of the present invention, a weighted label plate can also be attached to the outside rear of the housing. This plate may be housed and covered in a polymer pocket having information such as textual information or barcodes, or may be an RFID tag. Such a weight member shifts the center of gravity rearward toward the weight plate.

  In some embodiments, the ballast portion is located in the center in the left-right direction and has a size that spans at least 50% of the width of the wafer container on the left and right. In some embodiments, the ballast portion is located in the center in the left-right direction and is sized to span at least 60% of the width of the wafer container on the left and right. In some embodiments, the ballast portion is located in the center in the left-right direction and is sized to span at least 65% of the width of the wafer container on the left and right.

  In a specific embodiment of the present invention, the ballast portion includes a heavy material made of metal, and a coating is provided to prevent the metal from being exposed. The covering material may be a polymer covering material formed by coating on a ballast material, or the ballast material may be coated with a polymer, for example, by powder coating, or the covering material may be closed by welding or a gasket such as an O-ring seal. The ballast may be encapsulated in the covering material by using. The covering material may be formed integrally with the outer shell or fixed to the outer shell, may be formed integrally with the kinematic connecting plate, or may be fixed, or may be sandwiched between them.

  In some embodiments, the wafer container may be convertible so that it can be used with or without a ballast section. In some embodiments, the container is shipped to a point of use, such as a manufacturing facility, where the container is attached to the machine interface by a kinematic coupling or transported by a robot flange. At the place of use, the ballast portion can be mounted for the purpose of securely mounting to the machine interface or the purpose of transporting safely by the robot flange. In some embodiments, the container is structured to easily receive the ballast. In some embodiments, the ballast can be easily removed. In some embodiments, such attachment and removal may be accomplished without the use of tools, for example, using spring-loaded fasteners or manual slide connections.

FIG. 1A is an exploded front perspective view of a front opening type wafer container as an embodiment of the present invention. FIG. 1B is a perspective view from the lower rear side of the front opening type wafer container in the assembled state of FIG. 1A as an embodiment of the present invention. FIG. 2A is a schematic view of the target area of the center of gravity of the 450 mm multipurpose transport container (MAC). FIG. 2B is a schematic diagram of the target area of the center of gravity of the 450 mm front opening type unified pod (FOUP). FIG. 3 is a partial rear perspective view of a kinematic connecting plate as an embodiment of the present invention. FIG. 4 is a partial front perspective view of a kinematic connecting plate as an embodiment of the present invention. FIG. 5 is a bottom perspective view of a solid ballast as an embodiment of the present invention. FIG. 6 is a bottom perspective view of a solid ballast with ribs as an embodiment of the present invention. FIG. 7 is a bottom perspective view of a heavy solid ballast as an embodiment of the present invention. FIG. 8 is a top perspective view of a heavy solid ballast as an embodiment of the present invention. FIG. 9 is a partial plan view of an assembly in which a heavy solid ballast is mounted on a kinematic connecting plate as an embodiment of the present invention. FIG. 10 is a composite sectional view of the assembly of FIG. 11A to 11D are schematic views of mounting a heavy solid ballast on a kinematic connecting plate as an embodiment of the present invention. FIG. 12A is an exploded front perspective view of an assembly type ballast as an embodiment of the present invention. 12B is a front perspective view of the assembled ballast of FIG. 12A. 13 is a partial perspective view of the lower front side of the assembly type ballast of FIG. 12B. FIG. 14 is a partial perspective view of the upper part of the front surface in the state where the assembly type ballast of FIG. FIG. 15A is an exploded front perspective view of an expandable assembling type ballast as an embodiment of the present invention. 15B is a front perspective view of the expandable assembling ballast of FIG. 15A. 16 is a perspective view of the lower front side of the expandable assembling ballast of FIG. 15B. FIG. 17 is a partial perspective view of the upper part of the front surface in a state where two sets of expandable assembling ballasts are mounted on a kinematic connecting plate as an embodiment of the present invention. 18 is a perspective view of the upper front of the expandable assembling ballast of FIG. 15B with the lid removed to reveal details of the gasket as an embodiment of the present invention. FIG. 19 is a partial cross-sectional view of FIG. FIG. 20 is a partially enlarged sectional view in the vicinity of the gasket of the expandable assembling ballast of FIG. 15B as an embodiment of the present invention. FIG. 21 is a rear bottom perspective view of a kinematic connecting plate on which a ballast as an embodiment of the present invention is mounted. FIG. 22 is a schematic view of a kit for retrofitting ballast to a wafer container as an embodiment of the present invention. FIG. 23 is a flowchart of a supply method for stabilizing a wafer container as an embodiment of the present invention. FIG. 24 is an elevational view of a wafer container in which a ballast as an embodiment of the present invention is attached to an external rear part. FIG. 25 is an exploded view of the ballast attached to the outer rear part of FIG. 24 as an embodiment of the present invention. FIG. 26 is a schematic view of a ballast wafer container coupled to a purification apparatus as an embodiment of the present invention.

DETAILED DESCRIPTION FIG. 1 shows a front open wafer container 30 with a ballast 32 as an embodiment of the present invention. The front-opening wafer container 30 includes an outer shell portion or accommodation portion 34 for accommodating three sets of kinematic coupling portions 42, a removable door 36, a robot flange 38, and a kinematic coupling plate 40. The outer shell portion 34 is detachable from a top panel 44 to which a robot flange 38 is attached, a bottom panel 46 to which a kinematic connecting plate 40 is attached, two opposing side panels 48 and a back panel 52. The door 36 is provided with a door frame 54 that can be functionally attached and detached, and the door frame 54 forms an opening 56 for taking in and out. In various embodiments, the ballast 32 is coupled to the kinematic coupling plate 40. In one embodiment, the ballast 32 is held (“sandwiched”) between the kinematic coupling plate 40 and the bottom panel 46 of the outer shell 34.

  The front-opening wafer container 30 is configured so that a plurality of wafers 57 can be transported with a space therebetween. During handling, the wafer container is suspended by a robot flange 38 centered on the central axis 58. Thus, the orthogonal coordinate system 60 can be defined in which the z coordinate axis coincides with the central axis 58, the x coordinate axis is orthogonal to the loading / unloading opening 56 and extends rearward 59, and the y coordinate axis is orthogonal to the x coordinate axis and the z coordinate axis. The so-called “upright posture” is a posture in which the central axis 58 and the z coordinate are substantially orthogonal. Only in this patent application, the origin of the orthogonal coordinate system 60 is assumed to be in the kinematic connecting plate 40.

  FIGS. 2A and 2B show schematic views showing target areas 61 and 62 at the center of gravity of 450 mm MAC and 450 mm FOUP, respectively. The target area 61 is specified by SEMI E159, and the target area 62 is specified by SEMI E158. The target area 61 in the case of 450 mm MAC is defined as a shape obtained by adding a semicircular part 61b to the front end part 61c of the target area 61 in the rectangular area 61a on the front 63 side of the z coordinate axis (that is, in the direction of “negative x axis”). ing. The maximum length of the target area 61 is 39 mm on the front side of the x coordinate. The radius of the semicircle is 17 mm, and the diameter portion of 34 mm is also the width of the rectangular region 61a.

  The target area 62 in the case of 450 mm FOUP is defined as a part of a circle 62 a centering on a point advanced 12 mm toward the front 63 side of the x coordinate. The circle 62a has a radius of 17 mm. By combining this radius and the center position of 12 mm, the maximum length is 29 mm on the front side of the x coordinate.

  3 and 4 show the rear part of the kinematic connecting plate 40 as an embodiment of the present invention. The kinematic connecting plate 40 includes at least one receiving portion 64 for receiving the ballast 32. As one embodiment, each receiving portion 64 includes a wall 66 protruding to the upper end 68 to the upper end 69 in a state where the front opening type wafer container 30 is in an upright position. Accordingly, each wall 66 extends between the kinematic connecting plate 40 and the bottom panel 46 of the outer shell 34. Each wall 66 at least partially surrounds an opening 70 formed in the kinematic connecting plate 40, which has a receiving shaft 72 perpendicular to the kinematic connecting plate 40. The wall 66 may be formed with an inner surface 74 facing the receiving portion shaft 72 and an outer surface 76 on the opposite side. In various embodiments, the kinematic connecting plate 40 is provided with one or more holding portions such as elastic protrusions and holding clips 78 that can be bent. The holding clip 78 is provided with a detent 80 having a tapered surface 82 projecting upward in the lateral direction (that is, in a direction toward the receiving portion shaft 72) and facing the receiving portion shaft 72 side. The ballast 32 can be connected to the kinematic connecting plate 40 or the bottom panel 46 of the outer shell 34 by using a fixture as required. In various embodiments, the kinematic coupling plate 40 is provided with a pair of receiving portions 64 that are mirror images of each other with respect to the xz plane.

  In various embodiments, the kinematic connecting plate 40 may be provided with a pair of secondary retaining clips 84 protruding upward 68. Each of the secondary retaining clips 84 can also be provided with a detent 86 having an upwardly tapered surface 88. The kinematic connecting plate 40 may be provided with a partition wall 90 adjacent to the rear end portion 92 of the kinematic connecting plate 40. A pair of openings 94 can also be formed in the partition wall 90. Each pair of openings 94 is centered about a corresponding opening axis 96 that is substantially parallel to the x-axis. Each opening 94 is formed by a peripheral edge 97 including an upper edge 98. In one embodiment, the openings 94 are arranged at equal distances across the xz plane. In one embodiment, the secondary retaining clip 84 is positioned near the opening 94 so that it can be reached through the opening 94.

  5 to 10 show various forms of the ballast 32 as embodiments of the present invention. Here, the ballast is collectively referred to by the reference number 32, and each form is referred to by adding a letter to the end of the reference number 32 (for example, 32b).

  FIG. 5 shows a solid ballast 32a. The solid ballast 32a includes a plate-like portion 122 and a pair of core portions 124 depending from the plate-like portion 122. The outer surface 121 is shaped and dimensioned so as to be mounted in the receiving portion 64 of the kinematic connecting plate 40. Form. The core portion 124 can be formed closer to the inner side than the outer peripheral surface 123 of the plate-like portion 122, and a flange portion 125 protruding beyond the core portion 124 in the xy plane can be formed. As one embodiment, the solid ballast 32a is provided with a pair of protrusions 126 protruding in the rearward direction 59 from the rear end 128 of the outer peripheral surface 123 of the plate-like portion 122 in the assembled state. Each protrusion 126 is characterized by having an upper surface 130. The solid ballast 32 a may be further provided with a plurality of contact portions 132 depending from the flange portion 125, which can be disposed close to the corner of the core portion 124.

  FIG. 6 shows a solid ballast 32b with ribs. The ribbed solid ballast 32b includes many of the same attributes as the solid ballast 32a indicated by the same reference number. Further, at least one rib 134 depending from the plate-like portion 122 is provided on the solid ballast 32b with ribs. The rib 134 has a leading edge 136. As one example, the leading edge 136 may be provided with irregularities corresponding to the back side 138 (FIG. 4) of the kinematic connecting portion 42 that is between the two core portions 124 in the assembled state.

  Functionally speaking, the ribs 134 can suppress warping of the plate-like portion 122 in the case of a specific manufacturing method. In the casting method, this rib can suppress warpage in both the semi-solidified state and the post-cast state. As one example, the irregular tip edge 136 allows the rib solid ballast 32b to be placed without touching or otherwise affecting the kinematic coupling 42. As another embodiment (not shown), the support of the kinematic coupling portion 42 can be partially borne by the uneven edge.

  7 to 10 show a heavy solid ballast 32c, which includes many of the same attributes as the solid ballasts 32a and 32b, and therefore is indicated by a reference number including the same numerals. Those skilled in the art will recognize that various aspects of the heavy solid ballast 32c can also be incorporated into the heavy solid ballast portions 32a, 32b. The significance of the heavy solid ballast 32c is to increase the weight obtained from the ballast 32 by increasing the bulk. Accordingly, various elements of the heavy solid ballast 32c, such as ribs 134 and protrusions 126, have increased thickness. In the embodiment illustrated as heavy solid ballast 32c, the “plurality of ribs” 134 are so thick that they are joined together (ie, there are no gaps).

  In various embodiments, a clip engagement portion 152 is provided on the ballast 32 as shown in FIG. 8 as a heavy solid ballast 32c. Each clip engaging portion 152 may be provided with an introduction structure 154 and a hooking surface 156. In the illustrated embodiment, the clip engaging portion 152 is disposed on the front surface 158 of the core portion 124 for engaging the retaining clip 78.

  9 and 10 show a composite sectional view 170 of a heavy solid ballast 32c fixed to one of the receiving portions 64 of the kinematic connecting plate 40. FIG. The composite cross-sectional view 170 shows a cross section of the retaining clip 78 and the clip engaging portion 152 at the first cross section 172, shows one cross section of the contact portion 132 at the second cross section 174, and protrudes at the third cross section 176. One section of the portion 126 and the partition wall 90 is shown.

  In the composite sectional view 170, the detent 80 of the holding clip 78 is engaged with the hooking surface 156 of the clip engaging portion 152. The contact portion 132 is exactly aligned with the upper end 69 of the wall 66. The protrusion 126 is inserted into the opening 94, and its upper surface 130 is in contact with the upper edge 98 of the peripheral edge 97 of the opening 94.

  Thus, the heavy solid ballast 32c is moved into the receiving portion 64 by the downward force FD1 exerted on the hooking surface 156 by the holding clip 78 and the downward force FD2 exerted by the upper edge 98 of the peripheral edge 97 of the opening 94 on the upper surface 130 of the protrusion 126. Retained. An upward reaction force FU exerted by the upper end 69 of the wall 66 acts on the contact portion 132 of the heavy solid ballast 32c.

  11A to 11D schematically show mounting of a heavy solid ballast 32c as an embodiment of the present invention. Dashed lines represent sections of the first, second, and third cross sections 172, 174, and 176 of FIGS. Specific structural details have been deleted or changed for clarity. For mounting, first, the projection 126 of the heavy solid ballast 32c is inserted from the opening 94 in a direction that forms an inclination angle θ with respect to the lateral direction (that is, with respect to the xy plane), and the rear surface 182 of each core 124 is a receiving portion. The state is in contact with or likely to contact 64 walls 66 (FIG. 11A).

  Next, the front end 184 of the core part 124 is pushed into the receiving part 64 with the insertion force FI, and the heavy solid ballast 32c is turned sideways (that is, the direction in which the plate-like part 122 is substantially parallel to the xy plane). Rotate. When the heavy solid ballast 32 c is rotated in this manner, the protrusion 126 hits the upper edge 98 of the peripheral edge 97 of the opening 94, and the rear surface 182 of each core portion 124 is pressed against the wall 66 of the receiving portion 64. In addition, the lower front corner 186 of the core portion 124 hits the tapered surface 82 of the detent 80 of the holding clip 78 and bends away from the receiving portion shaft 72 (FIG. 11B). As the insertion force FI continues to be applied, the introduction structure 154 slides on the surface of the detent 80, while the protrusion 126 remains in contact with the upper edge 98 of the peripheral edge 97 of the opening 94, and the rear surface 182 of the core 124 is The retaining clip 78 remains pressed against the wall 66 against the receiving portion 64 and remains bent in a direction away from the receiving portion shaft 72 (FIG. 11C).

  When the introduction structure 154 is slid to the back of the detent 80, the detent 80 comes to the position of the hooking surface 156 of the clip engaging portion 152, and the holding clip 78 snaps into place. The size of the heavy solid ballast 32c, the receiving portion 64 and the partition wall 90 is such that when the retaining clip 78 is just at the clip engaging portion 152, the contact site 132 is just at the upper end 69 of the wall 66, The protrusion 126 is sized so that the upper surface 130 of the protrusion 126 is located at the position of the upper edge 98 of the peripheral edge 97 of the opening 94 (FIG. 11D).

  In order to remove the heavy solid ballast 32c from the receiving portion 64, basically, the detent 80 is removed from the hooking surface 156 of the engaging portion 152 and the heavy solid ballast 32c is rotated in the reverse order of FIGS. 11D and 11A. Remove from part 64. The holding clip 78 can be detached by, for example, inserting a tool (not shown) for facilitating the operation between the detent 80 and the tapered surface 82 of the front surface 158 of the core portion 124 and prying it open. .

  FIGS. 9-11D show heavy solid ballast 32c and associated heavy solid ballast 32c, but any other ballast 32 having engaging portion 152 and protrusion 126, such as solid ballast 32a, 32c, may be used. Note that the same features and ideas can be applied.

  The solid ballast portions 32a to 32c are formed from a heavy material 178, and the heavy material can be made of a metal material such as stainless steel, zinc or a zinc-based alloy, lead, or powder metal. Heavy material 178 can be formed by a variety of methods including investment casting, metal injection molding, sand mold casting, powder metallurgy, forging, and can also machine ballasts as needed to achieve the desired tolerances. it can.

  In some embodiments, the solid ballasts 32a-32c are coated with an inert material such as various polymers commonly used in semiconductor wafer containers. In one embodiment, the coating is performed by a powder coating method. Considerations when choosing a coating include adhesion to solid materials (eg, adhesion to stainless steel), corrosion resistance, wear resistance, non-wetting / hydrophobic properties, low build thickness and repeatability, Such as the ability to completely cover the part (ie no fixture points). Examples of coatings with desirable properties of stainless steel include ENDURA 202P nickel base soaked with a fluoropolymer shell, ENDURA 311 M PFA, IMPREGLON T-60 PFA, Orion Industries ETFE (TEFZEL), Orion Industries ECTFE (HALAR), PARYLENE HT conformal coating, E-COAT.

  12A to 14 show an assembly type ballast 32d as an embodiment of the present invention. The prefabricated ballast 32d includes a pair of housing portions 202 that each include a main weight body 204 formed from heavy material 178. The heavy material 178 can include any of the above materials utilized for the solid ballasts 32a-32c. Further, if the covered housing portion 202 is used, these materials can take a granular shape such as a spherical shape, a pellet shape, or a shot shape.

  As one example, the two housing parts 202 are connected by a bridging structure 206 having an outer shape corresponding to the back surface 138 of the kinematic connecting part 42. Each housing part 202 is provided with a tank part 212 and a lid part 214 that cooperate to form a main section 215. As one embodiment, a gasket 216 is disposed in the gap between the tank portion 212 and the lid portion 214. The outer side 218 of each housing portion 202 can have many of the same aspects and components as the solid ballasts 32a-32c, and includes the same numbers (eg, flange portion 125, contact portion 132, clip engagement portion 152 and this). The introduction surface 154 and the hooking surface 156 are associated with each other.

  15A to 17 show an expandable assembling ballast 32e as an embodiment of the present invention. The expandable assembling ballast 32e includes many of the same modes and members as the assembling ballast 32d indicated by the same reference numeral. The expandable assembling ballast 32 e includes an expansion housing 220. In addition to the tank portion 212 and the main weight body 204, the expandable assembling ballast 32e is provided with an auxiliary compartment 222 that can accommodate at least one secondary weight body 224 in the expansion housing 220 of each expandable assembling ballast 32e. An auxiliary tank 221 is provided. The secondary weight can be formed from a heavy material 178. Further, the expandable assembling ballast 32e is provided with a lid 228 and a gasket 232 larger than the lid 214 and the gasket 216 of the assembling ballast 32d so that both the main section 215 and the auxiliary section 222 can be formed. As an example, the auxiliary section 222 may be configured to cover the kinematic coupling portion 42 when in the assembled state. In the illustrated embodiment, two secondary weight bodies 224A and 224B are accommodated in the auxiliary section 222.

  The compartments 215, 222 of the expandable assembling ballast 32e do not necessarily need to accommodate weights. The selection and combination of weight bodies can follow individual stabilization requirements. For example, the expandable assembling ballast 32e may include only the main weight body 204 and only one of the secondary weight bodies 224A and 224B. As another assembly, only the secondary weight bodies 224A and 224B are enclosed, and the main section 215 is left empty. In this way, the expandable assembling ballast 32e is a modular base for assembling the ballast.

  The expandable assembling ballast 32e can also be provided with a secondary clip engagement portion 234 having a protrusion 236 with a downwardly leading tapered surface 238. As one embodiment, the secondary clip engaging portion 234 is disposed in a recess 242 formed on the rear surface 244 of the expandable assembling ballast portion 32e (for example, in the auxiliary tank portion 221 as shown). The recessed portion 242 can be reached from at least one of the upper side, the bottom side, and the rear side of the expandable assembling ballast 32e.

  As an example, the assembled ballasts 32d and 32e are not connected to each other as shown in FIG. 17 as the assembled ballast 32e after mounting (that is, there is no cross-linking structure). Thus, in the illustrated embodiment, there are twin prefabricated ballasts 32e, each mirror image of each other with respect to the xz plane.

  When mounting, the expandable assembling ballast 32e is aligned with the shaft 72 of the receiving portion on the receiving portion 64 so that it can be inserted into the receiving portion 64 in a complementary manner. Next, the expandable assembling ballast 32e is inserted into the receiving portion 64 and pushed downward along the shaft 72 of the receiving portion. When the expandable assembling type ballast portion 32e is advanced downward, the introduction structure 154 of the clip engaging portion 152 is held on the tapered surface 82 of the holding clip 78, and the introduction tapered surface 238 of the secondary clip engaging portion 234 is secondarily held. The tapered surfaces 88 of the clips 84 are in contact with each other. The taper surfaces 82 and 84 slide on the surfaces of the introduction surfaces 154 and 238 and are snap-fitted into place to fix the expandable assembling ballast 32 e in the receiving portion 64.

  In one embodiment, the two retaining clips 78, 84 are orthogonal to each other. Similarly, the engaging portions 152 and 234 are orthogonal to each other. If comprised in this way, if lock operation | movement functions, the expandable assembly type ballast 32e can be actively hold | maintained about both the x direction and ay direction. That is, the holding clips 78 and 84 are configured to be bent when the expandable assembling ballast 32 e is disposed in the receiving portion 64, so that the holding clip 78 is A force is applied in the rearward direction (parallel to the x-axis), and the secondary retaining clip 84 applies a force in the lateral direction (parallel to the y-axis) with respect to the secondary engagement portion 234, and both of these forces are received by the receiving portion 64 Can be countered by a portion of the wall 66.

  18 to 20 show details of the gasket 232 of the expandable assembling ballast 32e as an embodiment of the present invention. Although the drawing and the accompanying discussion present one for the gasket 232 of the deployment assembly ballast 32e, the same principles can be applied to the assembly ballast 32d. A plurality of convex piece portions 252 projecting inward may be provided on the gasket. In the frame 254 of the housing 220 surrounding the tank portions 212 and 221, a plurality of notches 256 corresponding to the shape and arrangement of the convex piece portions 252 can be formed. As one example, the upward surface 259 of the frame 254 may be provided with a ridge having a triangular cross section that becomes the internal energy converging portion 257. Further, in some embodiments, a shim portion 258 that protrudes downward from the specific convex piece portion 252 between the weight bodies 204 and 224 and the housing 220 may be provided.

  The gasket 232 can also be stored in a gland 262 formed between the lid 228 and the tank 212. In one embodiment, the gland 262 forms a back corner 264 and the outer surface 218 of the housing portion 220 is narrower than the inner peripheral edge 266 (FIG. 20). The lid part 228 can be attached to the tank part 212 by a joining method such as ultrasonic welding.

  Functionally speaking, the weights 204, 224 are separated from the surroundings by the gasket 232 of the expandable assembling ballast 32e, and the solution can be prevented from entering the housing portions 202, 220 during the cleaning cycle. Since the internal energy converging unit 257 collects the generation of welding burrs during the ultrasonic welding operation, the burr is formed in the compartments 215 and 222 or between the internal energy converging unit 257 and the welded part formed at the gasket 232. Captured in between. The convex piece portion 252 meshes with the notch 256 at the time of assembly, and assists in positioning of the gasket 232. The shim portion 258 fills a tolerance gap between the weight bodies 204 and 224 and the housing 220, and can prevent or suppress rattling. The back corner 264 of the gland 262 compresses the gasket 232 in a sealed manner at the exterior 218 of the housing 220 while providing a relaxation of the compressed gasket 232 flow that prevents or inhibits outward expansion of the gasket 232. Make sure.

  For the prefabricated ballasts 32d, 32e, the housing portions 202, 220 can be formed from conventional polymers such as polycarbonate, nylon, fluoropolymer, and the like. As a manufacturing method for providing various features and modes of the exterior 218 described above for the housing portions 202 and 220, for example, an injection molding method may be mentioned. The weights 204, 224 have a simple two-dimensional shape (ie, contoured in the xy plane) to facilitate manufacturing in various methods including water jet, wire electrical discharge machining (EDM), powder metallurgy. and a uniform thickness in the z direction). The compartments 215 of the housing parts 202, 220 can be configured to fit these simple two-dimensional shapes.

  21 and Table 1 present various ballast 32 prediction effects for an embodiment of the present invention. An analytical model has been developed and the fully assembled 450mm multipurpose transport container (MAC) and the fully assembled 450mm front opening unified pod (FOUP) are empty (that is, no wafers are contained in the wafer container 30). The effect of the various configurations of the ballast 32 on the center of gravity was measured both in the state) and in the full state (ie, the wafer container was fully complemented with the wafer 57). The fully assembled MAC and FOUP as a model is a door frame 54 with a removable door 36 attached. This analysis is characterized in that each ballast 32 has a weight W centered on a straight line 272 located at a distance L parallel to the X axis from the central axis 58. The weight W is expressed in units of kgf, defined as the weight of 1 kilogram mass under standard gravity.

The center-of-gravity position obtained for two transport containers in an empty state and a full state is characterized by a position ΔX in a direction parallel to the x-axis from the central axis 58. Stainless steel casting 304 was a model of heavy material 178 for various ballasts 32. Further, a metal powder 316 stainless steel was used as a model of the expandable assembling ballast 32e. Here, the weight W includes any other structure that is a part of the ballast 32 in addition to the heavy material 178 (for example, in the case of the assembled ballasts 32d and 32e, the polymer material constituting the housing portions 202 and 220). It is the weight of the whole stabilization structure. Note that in the embodiment of the expandable assembling ballast 32e, the weight W includes two assembling ballasts (ie, two ballasts 32e, one in each receiving portion 64).

  For comparison, the modeled MAC assembly and FOUP assembly were analyzed for both empty and full states without the ballast 32, and the baseline position ΔX of the center of gravity without ballast compensation was evaluated. . According to the results shown in Table 1, when W = 0, the fully assembled FOUP is always outside the range of the ΔX limit value of 29 mm with SEMI E158, and when fully loaded, the fully assembled MAC is SEMI. E159 indicates that ΔX is outside the range of the allowable value of 39 mm.

  The results shown in Table 1 indicate that the fully assembled FOUP and MAC comply with the SEMI standard if any of the ballast examples used as analysis models is installed.

  FIG. 22 shows a retrofit kit 280 as an embodiment of the present invention. In this embodiment, one or more of the various ballasts 32 shown and described herein can be included in a retrofit kit 280 for retrofitting to an existing wafer container 30. As an example, the existing wafer container 30 is provided with accessories for accommodating the ballast 32 (for example, the kinematic connecting plate 40 having the receiving portion 64 having the holding clip 78), and the ballast 32 is immediately Procures as needed or later for installation. Further, if necessary, the kinematic connecting plate 40 having the above-mentioned various structural features for holding the ballast 32 is included in the retrofit kit 280, and the kinematic connecting plate 40 is used in the existing kinematics. Instead of the tick connecting plate, it can be configured so that it can be retrofitted by bonding to the wafer container 30. The retrofit kit 280 can also include an instruction 282 including the method described herein for mounting the kinematic connecting plate 40 and the ballast 32 on the wafer container 30 in whole or in part.

  When the ballast 32 and the wafer container 30 are retrofitted, for example, the fastener that attaches the kinematic connecting plate 40 to the wafer container 30 is loosened and removed, or the kinematic connecting plate 40 is opened and the bottom panel of the wafer transfer container 30 is removed. The kinematic connecting plate 40 is removed from the wafer container 30 by removing it from the friction connecting portion arranged at 46. Next, depending on which embodiment is used, for example, the ballast 32 is kinematically connected by the method described with reference to FIGS. 11A to 11D or the method described with reference to FIGS. Mount on the plate 30. Next, by attaching the kinematic connecting plate 40 to the bottom panel 46 of the wafer transfer container 30 with the ballast 32 mounted, the ballast 32 is “sandwiched” between the bottom panel 46 of the wafer container 30. To do.

  FIG. 23 is a flowchart showing a supply method 290 for stabilization as an embodiment of the present invention. The supply method 290 includes a shipping side (that is, an operator that supplies and supplies the wafer 57 by, for example, manufacturing the wafer 57 and ships it in the wafer container 30) and a receiving side (that is, the wafer container 30 and the wafer 57 therein) from the receiving side. Receiving business). The method 290 can be divided into two partial methods 290A, 290B. Partial method 290A is for performing on the shipping side, and partial method 290B is for performing on the receiving side.

  For partial method 290A, the shipping side ships wafer container 30 containing wafer 57 to the receiving side without ballast 32 (step 293). In some cases, the shipping side can attach the first ballast 32 to the wafer container 30 for the purpose of processing within itself (step 291) and remove it from the wafer container 30 before shipment (step 292). Please note that.

  For the partial method 290B, the receiving side receives the wafer container 30 and the wafer 57 from the shipping side (step 294), and attaches the second ballast 32 to the wafer container 30 for subsequent handling and processing of the wafer 57 (step 294). Step 296). As an example, the receiving side may remove the second ballast 32 (step 298) and return the wafer container 30 to the shipping side without the ballast 32 (step 299).

  As another example, the kinematic connecting plate 40 and the ballast 32 are provided as a unit. In this embodiment, the wafer container 30 is shipped without the ballast 32. The receiving side then removes the kinematic connecting plate 40 and supplies it as a unit, replacing it with the kinematic connecting plate 40 including the ballast 32. In another embodiment, the outer shell 34 of the wafer container 30 is shipped without the kinematic connecting plate 40 and the kinematic connecting plate 40 is mounted with the ballast 32 on the receiving side.

  From a functional point of view, if the ballast 32 for use on the receiving side is provided, the shipping cost can be reduced by shipping the wafer container 30 without the ballast 32. Further, the possibility of damage to the container due to the impact that may occur during transportation due to the weight applied to the ballast 32 is suppressed. By storing the ballast 32 on the receiving side and using it for another wafer container 30, it is possible to reduce the number of ballasts 32 required in the warehouse and further reduce the cost.

  24 and 25 show a ballast 300 attached to the outside as an embodiment of the present invention. The ballast 300 attached to the outside is selected so that the center of gravity COG can be shifted within the range of the specification of the applicable SEMI standard, and the size is determined. The ballast unit 300 can also be part of an accessory 350 in the form of a card or RFID board as shown. Generally, the portion of ballast 300 is constructed by coating ballast material 352 with an inert material such as various polymers commonly used in semiconductor wafer containers. The dressing may be a powder coating applied by conventional means, or the ballast material 352 may be hermetically sealed with a dressing 360 having a lid 362 sealed with an O-ring 370. An RFID capsule 366 can also be attached to the bracket 368 as part of the accessory 350. The accessory 350 can include an ID plate 372 on which information about the container and its contents is printed.

  FIG. 26 shows a weighting system 400 for fixing the wafer container 30 to the purification device 402 as an embodiment of the present invention. The wafer container 30 includes at least one purification air supply port 404 and at least one purification exhaust port 406, and each penetrates the bottom panel 46 of the outer shell 34 and is coupled to the purification device 402. The purification device 402 includes a kinematic coupling pin 412 and a purification port coupling portion 414 that are coupled to the wafer container 30 via the kinematic coupling plate 40. In one embodiment, the purification device is a storage (stocker). The vault is usually not equipped with an auxiliary presser. The wafer container 30 is characterized by having the center of the center of gravity COG at a distance ΔX from the central axis 58. The wafer container 30 may also include a ballast 32 as illustrated and described herein.

  In operation, the wafer container 30 is attached to the purification device 402, the kinematic coupling pin 412 is coupled to the kinematic coupling part 42, and the purification port coupling part 414 is connected to the purification ports 404 and 406 and passes through the wafer container 30. The path of the purified airflow 416 is created. Before starting to flow (in a state where the flow rate is zero), the reaction force FR acts on the wafer container 30 at the connection point between the kinematic connection pin 412 and the purification port connection 414. The reaction force FR in the state of zero flow rate is all positive (that is, it acts to maintain the contact state between the wafer container 30 and the purification device 402), and the weight WC of the wafer container 30 and the weight W of the ballast 32 Against.

  It is known that the purified air flow 416 generates a lifting force for the wafer container. Although this lifting force is mainly generated at the location of the purification air supply port 404, it is known that a lifting force is generated as a secondary at the location of the purification exhaust port 406 in a specific purification system. The lifting force generated by the purified air flow 416 is proportional to the flow rate, but somewhat depends on the purification coupling portion of the wafer container 30. Information relating flow rate and lifting force is usually available from the wafer transfer container supplier.

  Under certain circumstances, the lifting force generated from the purified airflow 416 may cause the reaction force FR to be negative at one or more kinematic connecting pins 412. Some purifying devices 402 include an auxiliary pressing tool such as a clamp hook to counter the negative reaction force FR. However, most other devices, such as storage, are not provided with an auxiliary presser. In addition, the storage has a tendency that the kinematic connecting pin 412 is provided in a portion having a small radius R as compared with other processing equipment, so even if the lifting force is small (that is, the flow rate of the purified airflow 416 is small). Also, a negative reaction force FR occurs.

  As one example, the size of the ballast 32 can be sized to resist the lifting of the wafer container 30 that can generate an extra lifting force. It should be noted that the weight condition of the ballast 32 to counter the lifting is often much higher than the weight condition to bring the center of gravity within the SEMI standard. Consider the ballasts 32a, 32e (discussed with reference to FIG. 21 and summarized in Table 1) located at a distance L of 171 mm from the modeled central axis 58. The calculated value of the minimum weight W required for the ballasts 32a and 32e in order to fit the FOUP embodiment within the ΔX of 29 mm requirement is about 1.2 kgf. However, if the radius R from the central axis 58 to the center of the kinematic connecting pin 412 is nominally 145 mm (typical in a warehouse), to counter the purified airflow 416 nominally 100 liters per minute (LPM) Assuming that there is only a small amount in the wafer transfer container (that is, only one wafer is contained), the weight W required for the ballasts 32a and 32e can be determined in advance to be about 2.4 kgf. This is twice the minimum weight W required to shift the center of gravity within the specified limits.

  As described above, when the ballasts 32 and 300 disclosed in the present application are used in the weighting system 400, the wafer container can be fixed to the purification apparatus without using an auxiliary pressing tool. The ballast 32 can be mounted using the retrofit kit 280 described above. As one example, a correlation between the weight W of the ballast 32 sufficient to prevent the wafer container from lifting and the flow rate corresponding to the operation for the purification air flow 416 of the purification device is predetermined, for example, It can also be provided in the form of a figure or formula. As one embodiment, the relationship between the predetermined weight W and the flow rate is determined based on an empty or almost empty wafer container 30 (for example, a wafer container containing one wafer). As one example, a ballast 32 having a weight W of a predetermined ballast 32 corresponding to a corresponding flow rate during operation may be provided as part of the retrofit kit 280.

  The following references mentioned above are hereby incorporated by reference in their entirety: Yamagishi et al., US Patent Application Publication No. 2013/0032509, Burns et al., WO 2011/072260, SEMI E159-0912, SEMI E158-0912, the rights of which are hereby jointly owned. Incorporation by reference is limited so as not to incorporate subject matter that is explicitly contrary to the disclosure herein. Further, the incorporation by reference of the above document limits the scope of claims included in the document so that it is not incorporated by reference into the present application. Further, incorporation by reference of the above documents is limited so that the definitions described in the documents are not incorporated by reference into the present application unless explicitly stated in the present application.

  In the above discussion, relative terms such as “up”, “down”, “front”, “rear”, “side”, “horizontal”, “vertical” and the like are used for convenience. Unless otherwise specified or easily inferred, these terms are not meant literally in all situations, but are interpreted as a description of the wafer container 30 in a “upright” position (as previously defined). Should. It should be noted that the descriptive terms relating to these directions and orientations have the following general relationship with the Cartesian coordinate system 60. “Up” is the direction corresponding to the positive direction of the z coordinate, “Lower” is the direction corresponding to the negative direction of the z coordinate axis, “Back” is the direction corresponding to the positive direction of the x coordinate, and “Front” is the negative direction of the x coordinate axis. The direction corresponding to the direction, “lateral” is the direction extending approximately along the y coordinate axis, “lateral” is the direction corresponding to the plane defined by the x coordinate axis and the y coordinate axis, and “vertical” is approximately along the z coordinate. It is an extending direction.

  Each of the additional drawings and methods disclosed herein may provide improved apparatus and methods for manufacturing and use, or may be used separately in combination with other features and methods. . Accordingly, the combinations of features and methods disclosed in this application in their broadest sense are not required to practice the invention, but instead are disclosed only to illustrate exemplary and preferred embodiments. .

  From reading the present disclosure, various modifications of the embodiments will be apparent to persons skilled in the art. For example, those skilled in the relevant technical field may appropriately combine the various features described for the various embodiments, disassemble and recombine with other features, use alone, or use in different combinations. It will be appreciated that it can be done. Similarly, all of the various features described above are exemplary embodiments and should not be construed as limiting the scope or spirit of the invention.

  Those skilled in the relevant art will recognize various embodiments that include fewer features than those described in the individual embodiments above. The embodiments described herein do not imply an exhaustive list of all combinations of various features. Thus, the examples are not mutually exclusive combinations of features, and those skilled in the art will understand, but the claims should include combinations of different individual features selected from different individual embodiments. You can also.

  References to “Examples”, “Disclosure”, “Invention”, “Examples of Invention”, “Disclosed Examples” and the like included in this application are the specifications of the patent application (text and drawings including claims). It does not admit that it is a prior art.

In interpreting the claims, the provisions of 35 U.S.C. 112 (f) apply unless the specific terms "step" and "means" are clearly stated in each claim. Intended not to.

Claims (71)

A ballast system for a wafer container,
A ballast having a plate-like portion having an outer periphery and a first core portion depending from the plate-like portion;
A ballast system characterized in that the first core includes a heavy material and has a first outer surface shaped and dimensioned to be inserted into a kinematic connecting plate. The ballast system according to claim 1, further comprising a second core part in which the ballast hangs from the plate-like part,
The second core portion has a second outer surface having a shape and size that can be inserted into the kinematic connecting plate. The ballast system of claim 2, further comprising at least one rib from which the ballast hangs from the plate-like portion,
The at least one rib portion is disposed between the first core portion and the second core portion.   4. The ballast system according to claim 3, wherein at least one rib is provided with irregularities corresponding to the back side of the kinematic connecting portion of the kinematic connecting plate.   2. The ballast system according to claim 1, wherein a contact portion for engaging with the kinematic connecting plate is formed on the first outer surface of the ballast at a position near the first core portion.   2. The ballast system according to claim 1, wherein the ballast further comprises a protrusion protruding beyond the outer periphery of the plate-like portion in order to couple with the kinematic connecting plate.   7. The ballast system according to claim 6, wherein the kinematic connecting plate is further provided with a first receiving portion and a second receiving portion, and at least one of the first receiving portion and the second receiving portion can receive the ballast. The kinematic connecting plate is provided with a partition wall structure in which an opening that can be engaged with the protrusion is formed.   2. The ballast system according to claim 1, wherein the flange portion is formed by moving the first core portion to the inside of the outer periphery of the plate-like portion.   2. The ballast system of claim 1, wherein the ballast includes a coating of a polymeric material.   10. The ballast system according to claim 9, wherein the coating is a powder coating.   2. The ballast system according to claim 1, wherein the first core portion includes an engaging portion that engages with a holding portion of the kinematic connecting plate.   11. The ballast system according to claim 10, wherein the engaging portion is a clip engaging portion having an introduction structure and a hooking surface.   13. The ballast system according to claim 12, further comprising a kinematic connecting plate having a first receiving part and a second receiving part, wherein at least one of the first receiving part and the second receiving part can receive the ballast. A ballast system having a shape and dimensions as described above, wherein the kinematic connecting plate includes a holding clip that is coupled to the clip engaging portion.   2. The ballast system according to claim 1, wherein the weight material of the ballast is made of metal.   15. The ballast system according to claim 14, wherein the heavy material is made of any one of stainless steel alloy, zinc, zinc alloy, lead, and metal powder. A ballast system for a wafer container,
A first housing part having a first tank part and a first lid part that cooperate to form a first main section;
A ballast having a first main weight body including a weight material disposed in the first main compartment;
A ballast system characterized in that the first housing part has a first outer surface shaped and dimensioned so that it can be inserted into the kinematic connecting plate. The ballast system of claim 16, comprising:
The ballast further includes a second housing portion having a second tank portion and a second lid portion that cooperate to form a second main compartment, and a second main weight body disposed in the second main compartment. And
A ballast system characterized in that the second housing part has a second outer surface shaped and dimensioned so that it can be inserted into the kinematic connecting plate.   18. The ballast system according to claim 17, wherein the first housing part and the second housing part are connected by a bridging structure.   19. The ballast system according to claim 18, wherein the bridge structure is provided with irregularities corresponding to the back side of the kinematic connecting portion of the kinematic connecting plate.   17. The ballast system according to claim 16, wherein the first housing part has a structure in which a flange part extending in the lateral direction from the first tank part is formed.   21. The ballast system according to claim 20, further comprising a contact portion where the ballast hangs from the flange portion.   17. The ballast system according to claim 16, wherein a gasket is disposed in a gap between the first tank portion and the first lid portion.   23. The ballast system according to claim 22, wherein a plurality of notches are formed in the housing portion, a plurality of convex piece portions are provided in the gasket portion, and each convex piece portion corresponds to a plurality of notches. A ballast system characterized by engaging one.   17. The ballast system according to claim 16, further comprising a first auxiliary section for accommodating the secondary weight body in the first housing.   25. The ballast system according to claim 24, wherein the gasket has a shim portion protruding between the first main weight body and the secondary weight body.   25. The ballast system according to claim 24, wherein the first auxiliary section is provided with irregularities corresponding to the back side of the kinematic connecting portion of the kinematic connecting plate.   17. The ballast system according to claim 16, wherein the ballast has a first engaging portion that engages with a holding portion of the kinematic connecting plate.   28. The ballast system according to claim 27, wherein the first engaging portion is integrally formed on the outer surface of the first housing portion.   28. The ballast system according to claim 27, wherein the first engagement portion is a clip engagement portion having an introduction structure and a hooking surface.   30. The ballast system according to claim 29, wherein a kinematic connecting plate having a first receiving portion and a second receiving portion is provided, and at least one of the first receiving portion and the second receiving portion is configured to receive the ballast. The ballast system is characterized in that the kinematic connecting plate includes a first holding clip coupled to the clip engaging portion.   31. The ballast system according to claim 30, wherein the ballast has a second engagement portion that engages with a second holding portion of the kinematic connecting plate.   32. The ballast system according to claim 31, wherein the second engaging portion is integrally formed on the outer surface of the first housing portion.   32. The ballast system according to claim 31, wherein the second engaging portion is a second clip engaging portion having an introduction structure and a hooking surface.   34. The ballast system according to claim 33, wherein the second holding portion is a second holding clip coupled to the second clip engaging portion.   35. The ballast system of claim 34, wherein the first retaining clip can be deflected in a first plane and the second retaining clip can be deflected in a second plane orthogonal to the first plane. What to do.   32. The ballast system according to claim 31, wherein the kinematic connecting plate is made of a polymer.   37. The ballast system of claim 36, wherein the density of the heavy material of the ballast is at least twice and no more than 10 times the density of the polymer.   38. The ballast system of claim 37, wherein the density of the ballast portion is at least 2.5 times the density of the polymer.   38. The ballast system of claim 37, wherein the density of the ballast portion is at least three times the density of the polymer.   38. The ballast system of claim 37, wherein the density of the ballast portion is at least 3.5 times the density of the polymer.   38. The ballast system of claim 37, wherein the density of the ballast portion is at least four times the density of the polymer.   38. The ballast system of claim 37, wherein the density of the ballast portion is at least 4.5 times the density of the polymer.   38. The ballast system of claim 37, wherein the density of the ballast portion is at least 5 times the density of the polymer.   37. The ballast system according to any one of claims 1 to 36, wherein the weight of the ballast is at least 1 kgf and not more than 12 kgf.   45. The ballast system of claim 44, wherein the weight of the ballast is at least 4.5 kgf.   45. The ballast system of claim 44, wherein the weight of the ballast is at least 6 kgf.   45. The ballast system of claim 44, wherein the weight of the ballast is at least 10 kgf. It is any ballast system of claim 36 claim 1, which is characterized in that the density of the weight material is at least 3000 kg / m ³ a and 14000kg / m ³ or less. 49. The ballast system of claim 48, wherein the density of heavy material is at least 4000 kg / m < ³ >. 49. The ballast system of claim 48, wherein the density of heavy material is at least 6000 kg / m < ³ >. A system for purifying a wafer container,
It has a back panel that faces the door frame, and has an outer shell that connects the back panel to the door frame with a top panel, a bottom panel, and two opposing side panels. Including an engaging front-opening wafer container;
At least one purified air supply port and at least one purified exhaust port are formed in the bottom panel of the outer shell,
A purification device is functionally coupled to the at least one purification inlet and at least one purification outlet,
A ballast is functionally coupled to the front-opening wafer container and the weight of this ballast is pre-adjusted to prevent the wafer container from lifting when the purifier is operating at the corresponding flow rate. It is characterized by a set weight.   52. The system of claim 51, further comprising a kinematic coupling plate connected to the bottom panel of the outer shell, wherein the ballast is attached to the kinematic coupling plate.   53. The system of claim 52, wherein the ballast is located near the back panel of the outer shell.   6. The system according to claim 5, wherein the purification device is a storage.   53. The system of claim 52, wherein the weight of the ballast is preset to a weight sufficient to prevent lifting of the wafer container when only one wafer is in the wafer container. Things to do. A method for fixing a wafer transfer container to a purification device,
The process includes providing a ballast for use in a wafer container, and the weight of this ballast is preset to a weight suitable for holding the wafer container in the purification device at a predetermined purification gas flow rate. ,
Providing a set of instructions written on the tangible medium, the set of instructions functionally includes attaching the ballast to the wafer container and the wafer container to the purifier after the ballast is installed. A method comprising the steps of combining.   57. The method of claim 56, wherein the procedure for attaching the ballast to the wafer container during the set of instructions is a procedure for attaching the ballast to the kinematic connecting plate of the wafer container. 57. The method of claim 56, further comprising providing a replacement kinematic coupling plate configured to receive ballast;
A set of instructions provided in the process of providing a set of instructions includes a procedure for removing an existing kinematic coupling plate from a wafer container, a procedure for mounting a ballast on a replacement kinematic coupling plate, and a wafer container. And a procedure for attaching a replacement kinematic connecting plate.   57. The method of claim 56, wherein the weight of the ballast used in the process of providing the ballast is sufficient to prevent lifting of the wafer container when only one wafer is in the wafer container. A method characterized by being preset.   60. The method according to any one of claims 56 to 59, wherein the purification device is a storage. A wafer container,
It has a back panel that faces the door frame, and has an outer shell that connects the back panel to the door frame with a top panel, a bottom panel, and two opposing side panels. Engaged,
A robot flange that is functionally connected to the top panel of the outer shell, the robot flange is centered on the center axis and perpendicular to the center axis.
A kinematic connecting plate is functionally coupled to the bottom panel,
The ballast is functionally coupled to the kinematic connecting plate near the back panel,
A wafer container, wherein the kinematic connecting plate is provided with at least one receiving portion having a shape and a dimension capable of receiving a ballast. 62. The wafer container of claim 61, wherein
A ballast having a plate-like portion having an outer periphery and a first core portion depending from the plate-like portion;
A wafer container characterized in that the first core portion includes a heavy material and has a first outer surface having a shape and a dimension that can be inserted into at least one receiving portion of the kinematic connecting plate. The wafer container of claim 62,
The ballast further includes a second core portion depending from the plate-like portion,
The second core portion has a second outer surface having a shape and a dimension that can be inserted into the kinematic connecting plate. 62. The wafer container of claim 61, wherein
A first housing part having a first tank part and a first lid part, the ballast cooperating to form a first main compartment, and a first main weight body including a weight material and disposed in the first main compartment; With
The first housing part has a first outer surface having a shape and a dimension that can be inserted into the first of at least one receiving part of the kinematic connecting plate. 65. The wafer container of claim 64, wherein
The ballast further includes a second housing portion having a second tank portion and a second lid portion that cooperate to form a second main compartment, and a second main weight body disposed in the second main compartment. ,
The second housing part has a second outer surface shaped and dimensioned to be inserted into the second of at least one receiving part of the kinematic connecting plate.   66. The wafer container according to claim 65, wherein the first housing part and the second housing part are connected by a bridging structure.   67. The wafer container according to claim 61, wherein when the ballast portion is added, the center of gravity of the wafer container moves within 20 mm from the central axis.   67. The wafer container according to any one of claims 61 to 66, wherein the wafer container is configured to hold 450 mm wafers stacked at intervals around a vertical axis. . A method for stabilizing a front open wafer container comprising:
Including providing a ballast to the first operator and providing instructions to the first operator on a tangible medium;
The method is characterized in that the instruction includes a procedure of receiving a front opening type wafer container including a kinematic connecting plate from a first operator and a step of connecting a ballast to the kinematic connecting plate of the wafer container.   70. The method of claim 69, wherein the step of connecting the ballast in the set of instructions to the kinematic connecting plate includes removing the kinematic connecting plate from the outer shell of the wafer container and attaching the ballast to the kinematic connecting plate. A method comprising: a step; and a step of attaching a kinematic connecting plate equipped with a ballast to an outer shell of a wafer container. 70. The method of claim 69 or claim 70, wherein the instructions are instructions further comprising a procedure for removing the ballast from the kinematic connecting plate and a procedure for the first operator to return the container from which the ballast has been removed. Feature method.

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