TWI736311B - Base plate anti-warping fixing device - Google Patents
Base plate anti-warping fixing device Download PDFInfo
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Abstract
一種基板防翹曲固定裝置,其包含有一用於承放半導體基板的主體,該主體內部設有多層隔板,每一層隔板可提供一半導體基板放置,在相對可放入半導體基板的一側設有一輔助治具,該輔助治具包含有一蓋體,該蓋體對應於該主體的一端設有多個舌板,使用時,該些舌板配合該些隔板對半導體基板夾持固定,並利用前述兩者產生一迫緊的作用力,在烘烤製程與退熱製程中,能保持半導體基板的平整性與防止翹曲,進而提高產品良率。 A substrate anti-warping fixing device includes a main body for holding a semiconductor substrate. The main body is provided with multiple partitions. Each partition can provide a semiconductor substrate to be placed on the side opposite to the semiconductor substrate. An auxiliary jig is provided. The auxiliary jig includes a cover, and one end of the cover corresponding to the main body is provided with a plurality of tongue plates. When in use, the tongue plates cooperate with the partitions to clamp and fix the semiconductor substrate, Using the aforementioned two to generate a pressing force, the flatness of the semiconductor substrate can be maintained and warping can be prevented during the baking process and the heat-relieving process, thereby improving the product yield.
Description
本發明關於半導體設備,特別係指一種基板防翹曲固定裝置,在半導體之基板進入烤箱烘乾時,能穩定的夾持基板,防止變形進而增加產量的設備。The present invention relates to semiconductor equipment, and in particular refers to a substrate anti-warping fixing device that can stably clamp the substrate when the semiconductor substrate enters the oven for drying, preventing deformation and increasing output.
目前運用在基板封裝的防翹曲治具如圖1所示,主要由一盒體100,該盒體100內部具有一容室101,在容室101內設有多個對稱設置的隔板102,將基板103放置於該些隔板102上,送入一烤箱進行烘乾,去除基板103的水分。The anti-warping jig currently used in substrate packaging is shown in FIG. , Place the
如圖2所示,但是基板103在烘烤時,有時會因水蒸氣或者受熱不平均等原因造成基板103變形,而變形時基板就會從隔板102脫落,而壓在下方的基板103上,造成產量低、良率差的問題。As shown in Figure 2, when the
為了解決前述的問題,如圖2所示,目前業者的解決手段是將基板103間隔至少一到二格隔板102的距離,避免變形的基板103壓到下方的基板103;但是以這種手段,基板封裝的防翹曲治具能夠放入基板103的數量就大幅減少,導致產量下滑。In order to solve the aforementioned problems, as shown in FIG. 2, the current solution by the industry is to space the
如何改善習用結構的缺失,是相關業者積極研發,並想盡快克服的目標。How to improve the lack of customary structure is a goal that the relevant industry actively develops and wants to overcome as soon as possible.
本發明之主要目的即是提供一種基板防翹曲固定裝置,在主體的另一側設置一輔助治具,當基板放入主體後,利用該輔助治具夾持住基板,使基板不會從主體的隔板脫落,大幅增加治具的穩定性。The main purpose of the present invention is to provide a substrate anti-warping fixing device. An auxiliary jig is provided on the other side of the main body. After the substrate is put into the main body, the auxiliary jig is used to clamp the substrate so that the substrate will not be removed from the main body. The partition of the main body falls off, which greatly increases the stability of the fixture.
本發明之次要目的即是提供一種基板防翹曲固定裝置,利用輔助治具能控制基板變形與脫落,進一步提高良率與產量。The secondary objective of the present invention is to provide an anti-warping fixing device for the substrate, which can control the deformation and shedding of the substrate by using an auxiliary jig, and further improve the yield and output.
可以達到上述目的之結構者,主要包含有:一主體,該主體的內側具有一容室,該容室的左右兩側設置多組對稱的隔板,前述的隔板每一層皆可放置一半導體基板;其特徵在於:The structure that can achieve the above-mentioned purpose mainly includes: a main body with a chamber inside the main body, and a plurality of symmetrical partitions are arranged on the left and right sides of the chamber, and each layer of the aforementioned partitions can hold a semiconductor Substrate; characterized by:
該主體具有一用於放入該半導體基板的第一端以及一用於組裝一輔助治具的第二端;The main body has a first end for inserting the semiconductor substrate and a second end for assembling an auxiliary jig;
前述的第二端設有供該輔助治具組裝的連接部;The aforementioned second end is provided with a connecting portion for assembling the auxiliary jig;
該輔助治具包含有:一蓋體、一活動推板、一定位塊與一彈性體;The auxiliary fixture includes: a cover, a movable push plate, a positioning block and an elastic body;
前述的蓋體用於封閉該第二端,該蓋體具有一直立面,該直立面上設有數個貫穿口,該蓋體與該第二端連接的一側設置多個對稱的舌板,該些舌板恰可抵靠在該些隔板上方,當該些隔板放置有該些半導體基板時,藉由該些舌板壓住該些半導體基板,使該些半導體基板被該蓋體的舌板下壓夾持定位;The aforementioned cover body is used to close the second end, the cover body has a straight surface, the vertical surface is provided with a plurality of through openings, and a side of the cover body connected to the second end is provided with a plurality of symmetrical tongue plates, The tongue plates can just abut against the partitions. When the partitions are placed with the semiconductor substrates, the tongue plates press the semiconductor substrates so that the semiconductor substrates are covered by the cover. The tongue plate is pressed down and clamped and positioned;
該定位塊係透過數個結合栓固定在該第二端的連接部,該活動推塊係套合在該定位塊下方,並且該活動推塊設有一活動穿口,利用該活動穿口讓該活動推塊以該定位塊為起點產生線性滑動位移,該彈性體則連接在該活動推塊與該定位塊之間,當該活動推塊推動後利用該彈性體將前述的活動推塊自動復位,又,該活動推塊與該蓋體之間設有一連接斜面,利用該活動推塊的連接斜面當作止擋的承靠面,透過上述的結構將該主體與該輔助治具組合一體。The positioning block is fixed to the connecting part of the second end through a plurality of coupling bolts, the movable push block is sleeved under the positioning block, and the movable push block is provided with a movable through hole, and the movable through hole is used to allow the movable The push block generates linear sliding displacement with the positioning block as the starting point, and the elastic body is connected between the movable push block and the positioning block. When the movable push block is pushed, the elastic body is used to automatically reset the aforementioned movable push block. In addition, a connecting inclined surface is provided between the movable push block and the cover body, and the connecting inclined surface of the movable push block is used as a bearing surface for the stop, and the main body and the auxiliary jig are combined into one body through the above-mentioned structure.
在本發明的實施例中,該蓋體的左右兩側設有一扣合部,該主體的兩側設有對應二該扣合部的扣合槽,藉由二該扣合部組合在二該扣合槽,達到該蓋體對該主體卡扣固定。In the embodiment of the present invention, the left and right sides of the cover body are provided with a buckling part, and both sides of the main body are provided with buckling grooves corresponding to the two buckling parts. The buckling groove achieves that the cover body is buckled and fixed to the main body.
在本發明的實施例中,該活動推塊的中央設有一凸緣,該彈性體係組裝在該凸緣與該定位塊之間。In the embodiment of the present invention, a flange is provided in the center of the movable push block, and the elastic system is assembled between the flange and the positioning block.
在本發明的實施例中,該定位塊是一T型結構。In the embodiment of the present invention, the positioning block is a T-shaped structure.
在本發明的實施例中,該彈性體是一壓縮彈簧。In an embodiment of the present invention, the elastic body is a compression spring.
除了上述的結構外,本發明的第二實施例的結構如下:In addition to the above-mentioned structure, the structure of the second embodiment of the present invention is as follows:
一主體,該主體的內側具有一容室,該容室的左右兩側設置多組對稱的隔板,前述的隔板每一層皆可放置一半導體基板;其特徵在於:A main body, the inner side of the main body has a chamber, and a plurality of sets of symmetrical partitions are arranged on the left and right sides of the chamber, and each layer of the aforementioned partitions can hold a semiconductor substrate; it is characterized in that:
該主體具有一用於放入該半導體基板的第一端以及一用於組裝一輔助治具的第二端;The main body has a first end for inserting the semiconductor substrate and a second end for assembling an auxiliary jig;
該輔助治具包含有:一蓋體與至少一鎖扣裝置;The auxiliary fixture includes: a cover and at least one locking device;
前述的蓋體用於封閉該第二端,該蓋體具有一直立面,該直立面上設有數個貫穿口,該蓋體與該第二端連接的一側設置多個對稱的舌板,該些舌板恰可抵靠在該些隔板上方,當該些隔板放置有該些半導體基板時,藉由該些舌板壓住該些半導體基板,使該些半導體基板被該蓋體的舌板下壓夾持定位;The aforementioned cover body is used to close the second end, the cover body has a straight surface, the vertical surface is provided with a plurality of through openings, and a side of the cover body connected to the second end is provided with a plurality of symmetrical tongue plates, The tongue plates can just abut against the partitions. When the partitions are placed with the semiconductor substrates, the tongue plates press the semiconductor substrates so that the semiconductor substrates are covered by the cover. The tongue plate is pressed down and clamped and positioned;
前述的鎖扣裝置係包含一扣合件與一勾扣件,該勾扣件係安裝在前述的第二端,該扣合件係安裝在該蓋體的上端,該勾扣件勾接在該扣合件,使得該主體與該輔助治具的蓋體結合一體。The aforementioned locking device includes a fastener and a hook fastener, the hook fastener is installed at the aforementioned second end, the fastener is installed on the upper end of the cover, the hook fastener is hooked on The buckle makes the main body and the cover of the auxiliary jig integrated into one body.
前述的鎖扣裝置是一搭接式彈簧扣。The aforementioned locking device is a lap spring buckle.
前述的鎖扣裝置是一掛勾式環扣。The aforementioned locking device is a hook type ring buckle.
前述的鎖扣裝置是一C型夾扣。The aforementioned locking device is a C-shaped clip.
透過上述之結構,本發明可以提供的功效簡述如下:Through the above structure, the effects that the present invention can provide are briefly described as follows:
1.透過該主體的隔板與該蓋體的舌板夾持住半導體基板,利用該隔板與該舌板在半導體基板產生一迫緊的作用力,在烘烤製程與退熱製程中,能保持半導體基板的平整性與防止翹曲,進而提高產品良率。1. The semiconductor substrate is clamped by the partition plate of the main body and the tongue plate of the cover, and the partition plate and the tongue plate are used to generate a pressing force on the semiconductor substrate. Maintain the flatness of the semiconductor substrate and prevent warping, thereby increasing the product yield.
2.由於半導體基板被隔板與舌板夾持而不會脫落,因此,在每一層隔板上皆可放置半導體基板,因此能充分使用主體的空間,大幅提升產量。2. Since the semiconductor substrate is clamped by the partition plate and the tongue plate without falling off, the semiconductor substrate can be placed on each layer of the partition plate, so that the space of the main body can be fully used, and the output can be greatly improved.
3.本發明的結構成本低,在簡單改裝後即可投入生產線上使用,能為業者提升獲利。3. The structure of the present invention is low in cost, can be put into production line use after simple modification, and can increase profits for the industry.
實施例一Example one
請參閱圖3到圖10,本發明基板防翹曲固定裝置之第一實施例,其結構包含有:一主體10與一輔助治具20所構成。Please refer to FIG. 3 to FIG. 10, the first embodiment of the substrate anti-warping fixing device of the present invention includes a
該主體10的內側具有一容室11,該容室11的左右兩側設置多組對稱的隔板12,前述的隔板12每一層皆可放置一半導體基板30,進一步的,該主體10具有一用於放入該半導體基板30的第一端13以及一用於組裝該輔助治具20的第二端14,該第二端14則設有提供該輔助治具20組裝的連接部15。The inner side of the
如圖4所示,該輔助治具20包含有:一蓋體21、一活動推板22、一定位塊23與一彈性體24。As shown in FIG. 4, the
如圖4所示,前述的蓋體21用於封閉該第二端14,該蓋體21具有一直立面211,該直立面211上設有數個貫穿口212,該蓋體21與該第二端14連接的一側設置多個對稱的舌板213,該些舌板213恰可抵靠在該些隔板12上方,當該些隔板12放置有該些半導體基板30時,藉由該些舌板213壓住該些半導體基板30,使該些半導體基板30被該蓋體21的舌板213下壓夾持定位。As shown in FIG. 4, the
為了增加主體10與蓋體21的結合性,如圖1、圖2、圖5所示,該蓋體21的左右兩側設有一扣合部214,該主體10的兩側設有對應二該扣合部214的扣合槽16,藉由二該扣合部214組合在二該扣合槽16,達到該蓋體21對該主體10卡扣固定,讓兩者結合性更好。In order to increase the combination of the
如圖3、圖4、圖6、圖8、圖9所示,該定位塊23是一類似T型的結構,該定位塊23係透過數個結合栓固定在該第二端14的連接部15,該活動推塊22係套合在該定位塊23下方,並且該活動推塊22設有一活動穿口221,利用該活動穿口221讓該活動推塊22以該定位塊23為起點產生線性滑動位移,該彈性體24是一壓縮彈簧,該彈性體24則連接在該活動推塊22與該定位塊23之間,當該活動推塊22推動後利用該彈性體24將前述的活動推塊22自動復位,又,該活動推塊22與該蓋體21之間設有一連接斜面222,利用該活動推塊22的連接斜面222當作止擋的承靠面,透過上述的結構將該主體10與該輔助治具20組合一體。As shown in Figures 3, 4, 6, 8, and 9, the
如圖7所示,該活動推塊22的中央設有一凸緣223,該彈性體24係組裝在該凸緣223與該定位塊23之間。As shown in FIG. 7, the center of the
如圖8至圖10所示,透過上述的結構,該些半導體基板30從第一端13逐一放入每一層的隔板12,接著該輔助治具20的蓋體21組合在該主體10,利用該活動推塊22與該定位塊23配合下,將該蓋體21加以定位,利用該蓋體21所設置的舌板213與該主體10所設置的隔板12夾持住該些半導體基板30,利用該隔板12與該舌板213對該些半導體基板30產生一迫緊的作用力,在烘烤製程與退熱製程中水蒸氣從該蓋體的貫穿口212散溢,能保持半導體基板30的平整性與防止翹曲,進而提高產品良率。As shown in FIGS. 8 to 10, through the above structure, the
此外,由於半導體基板30被隔板12與舌板213夾持而不會脫落,因此,在每一層隔板12上皆可放置半導體基板30,因此能充分使用主體10的空間,大幅提升產量。In addition, since the
再者,本發明的結構成本低,在簡單改裝後即可投入生產線上使用,能為業者提升獲利。Furthermore, the structure of the present invention is low in cost, and can be put into production line use after simple modification, which can increase profits for the industry.
實施例二Example two
請參閱圖11,在第二實施例的結構,基本上與圖3至圖10類似,差異僅在於輔助治具的結合方式有所不同,其結構包含有:一主體40,該主體40的內側具有一容室41,該容室41的左右兩側設置多組對稱的隔板42,前述的隔板42每一層皆可放置一半導體基板60;該主體40具有一用於放入該半導體基板60的第一端43以及一用於組裝一輔助治具50的第二端44。Please refer to FIG. 11. The structure of the second embodiment is basically similar to that of FIGS. 3 to 10, except that the combination of the auxiliary fixture is different. The structure includes: a
如圖11所示,該輔助治具50包含有:一蓋體51與至少一鎖扣裝置52;前述的蓋體51用於封閉該第二端44,該蓋體51具有一直立面511,該直立面511上設有數個貫穿口512,該蓋體51與該第二端44連接的一側設置多個對稱的舌板513,該些舌板513恰可抵靠在該些隔板42上方,當該些隔板42放置有該些半導體基板60時,藉由該些舌板513壓住該些半導體基板60,使該些半導體基板60被該蓋體51的舌板513下壓夾持定位。As shown in FIG. 11, the
如圖11所示,前述的鎖扣裝置52在圖面所示為一搭接式彈簧扣,係包含一扣合件521與一勾扣件522,該勾扣件522係安裝在前述的第二端44,該扣合件521係安裝在該蓋體51的上端,該勾扣件521勾接在該扣合件522,使得該主體40與該輔助治具50的蓋體51結合一體。As shown in FIG. 11, the
透過上述的技術,利用鎖扣裝置52將該蓋體51與該主體40結合,同樣的該些半導體基板60從第一端43逐一放入每一層的隔板42,接著該輔助治具50的蓋體51組合在該主體40,利用該鎖扣裝置52之扣合件521與勾扣件522配合下,將該蓋體51加以定位,利用該蓋體51所設置的舌板513與該主體40所設置的隔板42夾持住該些半導體基板60,利用該隔板42與該舌板513對該些半導體基板60產生一迫緊的作用力,在烘烤製程與退熱製程中水蒸氣從該蓋體的貫穿口512散溢,能保持半導體基板60的平整性與防止翹曲,進而提高產品良率。Through the above-mentioned technology, the
此外,該鎖扣裝置52選用圖11的搭接式彈簧扣外,也能選用掛勾式環扣、或者選用C型夾扣,上述的扣件都能達到將主體40與蓋體51結合一體的功效。In addition, in addition to the lap spring buckle shown in FIG. 11, the locking
綜上所述,本發明結構均未曾見於諸書刊或公開使用,誠符合發明專利申請要件,懇請 鈞局明鑑,早日准予專利,至為感禱。To sum up, the structure of the present invention has never been seen in books and periodicals or used publicly, and sincerely meets the requirements of an invention patent application. I sincerely ask Jun Bureau to approve the patent as soon as possible. I really pray.
「習知」 100:盒體 101:容室 102:隔板 103:基板 「本發明」 實施例一 10:主體 11:容室 12:隔板 13:第一端 14:第二端 15:連接部 16:扣合槽 20:輔助治具 21:蓋體 211:直立面 212:貫穿口 213:舌板 214:扣合部 22:活動推板 221:活動穿口 222:連接斜面 223:凸緣 23:定位塊 24:彈性體 30:半導體基板 實施例二 40:主體 41:容室 42:隔板 43:第一端 44:第二端 50:輔助治具 51:蓋體 511:直立面 512:貫穿口 513:舌板 52:鎖扣裝置 521:扣合件 522:勾扣件 60:半導體基板 "Learning" 100: box body 101: Room 102: partition 103: Substrate "this invention" Example one 10: main body 11: Room 12: Partition 13: first end 14: second end 15: Connection part 16: buckle groove 20: auxiliary fixture 21: Lid 211: Upright 212: Penetration 213: Tongue Board 214: Fastening part 22: Activity push plate 221: Activity Wearing Mouth 222: connecting slope 223: Flange 23: positioning block 24: Elastomer 30: Semiconductor substrate Example two 40: main body 41: Room 42: partition 43: first end 44: second end 50: auxiliary fixture 51: Lid 511: Upright 512: Penetration 513: Tongue Board 52: Locking device 521: Fastener 522: Hook fastener 60: Semiconductor substrate
圖1係習用結構圖。 圖2係習用結構使用狀態圖。 圖3係本發明第一實施例之結構立體圖。 圖4係本發明之結構分解圖。 圖5是本發明的俯視圖。 圖6是圖3的A部分放大圖。 圖7是圖3的B部分放大圖。 圖8是圖5的C部分剖面圖。 圖9是圖8的D部分放大圖。 圖10是本發明的使用狀態圖。 圖11是本發明第二實施例的結構圖。 Figure 1 is a conventional structural diagram. Figure 2 is a state diagram of the conventional structure in use. Fig. 3 is a perspective view of the structure of the first embodiment of the present invention. Figure 4 is an exploded view of the structure of the present invention. Fig. 5 is a plan view of the present invention. Fig. 6 is an enlarged view of part A of Fig. 3. Fig. 7 is an enlarged view of part B of Fig. 3. Fig. 8 is a cross-sectional view of part C of Fig. 5. Fig. 9 is an enlarged view of part D in Fig. 8. Fig. 10 is a diagram of the state of use of the present invention. Fig. 11 is a structural diagram of a second embodiment of the present invention.
10:主體 10: main body
12:隔板 12: Partition
13:第一端 13: first end
20:輔助治具 20: auxiliary fixture
21:蓋體 21: Lid
211:直立面 211: Upright
212:貫穿口 212: Penetration
214:扣合部 214: Fastening part
22:活動推板 22: Activity push plate
23:定位塊 23: positioning block
24:彈性體 24: Elastomer
Claims (9)
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Citations (5)
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---|---|---|---|---|
TW200739793A (en) * | 2005-12-28 | 2007-10-16 | Tokyo Electron Ltd | Vertical boat and vertical heat processing apparatus for semiconductor process |
CN103745948A (en) * | 2013-12-24 | 2014-04-23 | 颀中科技(苏州)有限公司 | Crystal boat |
TW201511168A (en) * | 2013-06-18 | 2015-03-16 | Entegris Inc | Front opening wafer container with weight ballast |
US20170287758A1 (en) * | 2014-09-26 | 2017-10-05 | Miraial Co., Ltd | Substrate storing container |
TWM604059U (en) * | 2020-06-04 | 2020-11-11 | 應陞國際有限公司 | Anti-warpage fixing device for substrate |
-
2020
- 2020-06-04 TW TW109118864A patent/TWI736311B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200739793A (en) * | 2005-12-28 | 2007-10-16 | Tokyo Electron Ltd | Vertical boat and vertical heat processing apparatus for semiconductor process |
TW201511168A (en) * | 2013-06-18 | 2015-03-16 | Entegris Inc | Front opening wafer container with weight ballast |
CN103745948A (en) * | 2013-12-24 | 2014-04-23 | 颀中科技(苏州)有限公司 | Crystal boat |
US20170287758A1 (en) * | 2014-09-26 | 2017-10-05 | Miraial Co., Ltd | Substrate storing container |
TWM604059U (en) * | 2020-06-04 | 2020-11-11 | 應陞國際有限公司 | Anti-warpage fixing device for substrate |
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