JP2016208018A5 - - Google Patents

Download PDF

Info

Publication number
JP2016208018A5
JP2016208018A5 JP2016077712A JP2016077712A JP2016208018A5 JP 2016208018 A5 JP2016208018 A5 JP 2016208018A5 JP 2016077712 A JP2016077712 A JP 2016077712A JP 2016077712 A JP2016077712 A JP 2016077712A JP 2016208018 A5 JP2016208018 A5 JP 2016208018A5
Authority
JP
Japan
Prior art keywords
substrate support
height
end effector
substrate
central axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016077712A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016208018A (ja
Filing date
Publication date
Priority claimed from US14/687,506 external-priority patent/US9779977B2/en
Application filed filed Critical
Publication of JP2016208018A publication Critical patent/JP2016208018A/ja
Publication of JP2016208018A5 publication Critical patent/JP2016208018A5/ja
Pending legal-status Critical Current

Links

Images

JP2016077712A 2015-04-15 2016-04-08 清浄な/汚れた基板のハンドリングのためのエンドエフェクタアセンブリ Pending JP2016208018A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/687,506 US9779977B2 (en) 2015-04-15 2015-04-15 End effector assembly for clean/dirty substrate handling
US14/687,506 2015-04-15

Publications (2)

Publication Number Publication Date
JP2016208018A JP2016208018A (ja) 2016-12-08
JP2016208018A5 true JP2016208018A5 (enExample) 2019-05-16

Family

ID=57128876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016077712A Pending JP2016208018A (ja) 2015-04-15 2016-04-08 清浄な/汚れた基板のハンドリングのためのエンドエフェクタアセンブリ

Country Status (4)

Country Link
US (2) US9779977B2 (enExample)
JP (1) JP2016208018A (enExample)
KR (2) KR20160123248A (enExample)
TW (1) TWI693989B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6630591B2 (ja) * 2016-02-26 2020-01-15 川崎重工業株式会社 基板把持ハンド及び基板搬送装置
KR102397110B1 (ko) 2016-06-13 2022-05-12 도쿄엘렉트론가부시키가이샤 기판 반송 장치 및 기판 반송 방법
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
JP7740921B2 (ja) * 2020-08-17 2025-09-17 東京エレクトロン株式会社 搬送装置およびエンドエフェクタ
TWI744078B (zh) * 2020-11-06 2021-10-21 三和技研股份有限公司 控制複數承接件間距之機械手臂
US11958751B2 (en) * 2022-06-27 2024-04-16 Saudi Arabian Oil Company Method of synthesizing materials integrating supernatant recycle
US11970403B2 (en) * 2022-06-27 2024-04-30 Saudi Arabian Oil Company Method of zeolite synthesis including pH-modified water-soluble oxidized disulfide oil composition

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687531A (ja) * 1992-09-09 1994-03-29 Hitachi Ltd 受け渡し治具および装置
JP3143770B2 (ja) 1994-10-07 2001-03-07 東京エレクトロン株式会社 基板搬送装置
US5700046A (en) 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
WO2000014772A1 (de) * 1998-09-02 2000-03-16 Tec-Sem Ag Vorrichtung und verfahren zum handhaben von einzelnen wafern
JP2002299405A (ja) * 2001-03-29 2002-10-11 Dainippon Screen Mfg Co Ltd 基板搬送装置
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US20090101067A1 (en) 2005-07-08 2009-04-23 Bonora Anthony C Method and apparatus for wafer support
JP4976811B2 (ja) * 2006-10-30 2012-07-18 東京エレクトロン株式会社 基板処理システム、基板搬送装置、基板搬送方法、および記録媒体
US9437469B2 (en) 2007-04-27 2016-09-06 Brooks Automation, Inc. Inertial wafer centering end effector and transport apparatus
KR101534357B1 (ko) * 2009-03-31 2015-07-06 도쿄엘렉트론가부시키가이샤 기판 지지 장치 및 기판 지지 방법
JP5141707B2 (ja) * 2010-03-24 2013-02-13 株式会社安川電機 被処理体の支持機構、支持方法およびそれを備えた搬送システム
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
KR20130137043A (ko) * 2011-04-15 2013-12-13 다즈모 가부시키가이샤 웨이퍼 교환 장치 및 웨이퍼 지지용 핸드
US8864202B1 (en) * 2013-04-12 2014-10-21 Varian Semiconductor Equipment Associates, Inc. Spring retained end effector contact pad
US20160155658A1 (en) * 2014-12-02 2016-06-02 Macronix International Co., Ltd. Semiconductor wafer holder and wafer carrying tool using the same

Similar Documents

Publication Publication Date Title
JP2016208018A5 (enExample)
SG10201808035YA (en) Moveable edge coupling ring for edge process control during semiconductor wafer processing
TWI724989B (zh) 對準載體環件的方法及機械臂
US11742224B2 (en) Substrate chuck and substrate bonding system including the same
EP3363044B1 (en) Substrate carrier system
US9410249B2 (en) Wafer releasing
TWI764803B (zh) 用於電漿處理系統中的載體板
JP2017216441A5 (enExample)
JP2017517877A5 (enExample)
CN108796466B (zh) 一种机械卡盘及半导体加工设备
TWI585867B (zh) A method of manufacturing a bonding table, a bonding apparatus and a bonded substrate
TWI689037B (zh) 夾具總成
US20170256436A1 (en) Wafer handling assembly
JP2017079329A5 (ja) ロードロックアセンブリ
TW201718737A (zh) 矽晶圓傳送用高摩擦及高順應性所需之高硬度材料粉末注入的彈性體
KR20230023061A (ko) 워크피스 처리를 위한 시스템 및 방법
CN109817560B (zh) 一种防止热传导的晶圆吸附装置
JP6838200B2 (ja) 垂直方向にオフセットされた水平方向に部分的に重なり合うフログレッグリンケージを含むデュアルブレードロボットおよびそれを含むシステムと方法
KR200483130Y1 (ko) 세그먼트화된 포커스 링 조립체
TW201737392A (zh) 晶圓承載組件
TWI680040B (zh) 利於轂部移除的多組件機器人轂部安裝盤
CN104916572A (zh) 一种承载装置及等离子体加工设备
US10373860B2 (en) Batch processing apparatus
CN109661614A (zh) 激光修复方法和激光修复设备
TWI702681B (zh) 晶圓傳輸裝置