KR20160123248A - 깨끗한/더러운 기판 핸들링을 위한 엔드 이펙터 어셈블리 - Google Patents

깨끗한/더러운 기판 핸들링을 위한 엔드 이펙터 어셈블리 Download PDF

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Publication number
KR20160123248A
KR20160123248A KR1020160045620A KR20160045620A KR20160123248A KR 20160123248 A KR20160123248 A KR 20160123248A KR 1020160045620 A KR1020160045620 A KR 1020160045620A KR 20160045620 A KR20160045620 A KR 20160045620A KR 20160123248 A KR20160123248 A KR 20160123248A
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KR
South Korea
Prior art keywords
substrate support
support pad
substrate
height
pad
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Ceased
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KR1020160045620A
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English (en)
Korean (ko)
Inventor
로즈 엠벌슨
브랜든 센
오스틴 엔고
매튜 제이. 로드닉
Original Assignee
램 리써치 코포레이션
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Publication of KR20160123248A publication Critical patent/KR20160123248A/ko
Priority to KR1020230132163A priority Critical patent/KR20230145013A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
KR1020160045620A 2015-04-15 2016-04-14 깨끗한/더러운 기판 핸들링을 위한 엔드 이펙터 어셈블리 Ceased KR20160123248A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020230132163A KR20230145013A (ko) 2015-04-15 2023-10-05 깨끗한/더러운 기판 핸들링을 위한 엔드 이펙터 어셈블리

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/687,506 US9779977B2 (en) 2015-04-15 2015-04-15 End effector assembly for clean/dirty substrate handling
US14/687,506 2015-04-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020230132163A Division KR20230145013A (ko) 2015-04-15 2023-10-05 깨끗한/더러운 기판 핸들링을 위한 엔드 이펙터 어셈블리

Publications (1)

Publication Number Publication Date
KR20160123248A true KR20160123248A (ko) 2016-10-25

Family

ID=57128876

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020160045620A Ceased KR20160123248A (ko) 2015-04-15 2016-04-14 깨끗한/더러운 기판 핸들링을 위한 엔드 이펙터 어셈블리
KR1020230132163A Ceased KR20230145013A (ko) 2015-04-15 2023-10-05 깨끗한/더러운 기판 핸들링을 위한 엔드 이펙터 어셈블리

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020230132163A Ceased KR20230145013A (ko) 2015-04-15 2023-10-05 깨끗한/더러운 기판 핸들링을 위한 엔드 이펙터 어셈블리

Country Status (4)

Country Link
US (2) US9779977B2 (enExample)
JP (1) JP2016208018A (enExample)
KR (2) KR20160123248A (enExample)
TW (1) TWI693989B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6630591B2 (ja) * 2016-02-26 2020-01-15 川崎重工業株式会社 基板把持ハンド及び基板搬送装置
KR102397110B1 (ko) 2016-06-13 2022-05-12 도쿄엘렉트론가부시키가이샤 기판 반송 장치 및 기판 반송 방법
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
JP7740921B2 (ja) * 2020-08-17 2025-09-17 東京エレクトロン株式会社 搬送装置およびエンドエフェクタ
TWI744078B (zh) * 2020-11-06 2021-10-21 三和技研股份有限公司 控制複數承接件間距之機械手臂
US11958751B2 (en) * 2022-06-27 2024-04-16 Saudi Arabian Oil Company Method of synthesizing materials integrating supernatant recycle
US11970403B2 (en) * 2022-06-27 2024-04-30 Saudi Arabian Oil Company Method of zeolite synthesis including pH-modified water-soluble oxidized disulfide oil composition

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687531A (ja) * 1992-09-09 1994-03-29 Hitachi Ltd 受け渡し治具および装置
JP3143770B2 (ja) 1994-10-07 2001-03-07 東京エレクトロン株式会社 基板搬送装置
US5700046A (en) 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
WO2000014772A1 (de) * 1998-09-02 2000-03-16 Tec-Sem Ag Vorrichtung und verfahren zum handhaben von einzelnen wafern
JP2002299405A (ja) * 2001-03-29 2002-10-11 Dainippon Screen Mfg Co Ltd 基板搬送装置
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US20090101067A1 (en) 2005-07-08 2009-04-23 Bonora Anthony C Method and apparatus for wafer support
JP4976811B2 (ja) * 2006-10-30 2012-07-18 東京エレクトロン株式会社 基板処理システム、基板搬送装置、基板搬送方法、および記録媒体
US9437469B2 (en) 2007-04-27 2016-09-06 Brooks Automation, Inc. Inertial wafer centering end effector and transport apparatus
KR101534357B1 (ko) * 2009-03-31 2015-07-06 도쿄엘렉트론가부시키가이샤 기판 지지 장치 및 기판 지지 방법
JP5141707B2 (ja) * 2010-03-24 2013-02-13 株式会社安川電機 被処理体の支持機構、支持方法およびそれを備えた搬送システム
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
KR20130137043A (ko) * 2011-04-15 2013-12-13 다즈모 가부시키가이샤 웨이퍼 교환 장치 및 웨이퍼 지지용 핸드
US8864202B1 (en) * 2013-04-12 2014-10-21 Varian Semiconductor Equipment Associates, Inc. Spring retained end effector contact pad
US20160155658A1 (en) * 2014-12-02 2016-06-02 Macronix International Co., Ltd. Semiconductor wafer holder and wafer carrying tool using the same

Also Published As

Publication number Publication date
KR20230145013A (ko) 2023-10-17
US9779977B2 (en) 2017-10-03
JP2016208018A (ja) 2016-12-08
TWI693989B (zh) 2020-05-21
US20160303742A1 (en) 2016-10-20
US10707113B2 (en) 2020-07-07
TW201707897A (zh) 2017-03-01
US20180005865A1 (en) 2018-01-04

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