JP2011518395A - 配列接続された電子装置の液体浸漬冷却用ケース及びラックシステム - Google Patents
配列接続された電子装置の液体浸漬冷却用ケース及びラックシステム Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/0206—Heat exchangers immersed in a large body of liquid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/007—Auxiliary supports for elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/067—Hermetically-sealed casings containing a dielectric fluid
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
・3MTM(登録商標)NOVECTM(登録商標)のような加工流体、
・鉱油
・シリコーン油
・大豆系油を含む天然エステル系油
・合成エステル系油
が挙げられるが、これらに限定されない。これらの誘電性流体の多くは、コンピュータ部品の火を消す能力も有している。誘電性及び難燃性の流体にコンピュータ部品を浸漬することにより、コンピュータ部品の故障による発火の可能性を最小限に抑える。より高い沸点とともにより大きな伝熱能力を有する他の誘電性流体を用いることができる。これらの冷却液が、システムに含まれる部品によって生成される熱の量に対処するのに十分な高い伝熱能力を有している場合は、状況を変える必要はない。
・一般的な冷凍システムの場合と同様にコンプレッサ
・ペルチェ効果冷却
・ファンまたは他の通風機構を用いたラジエータ面の能動空冷
・出来る限り大きい範囲の熱伝導熱交換面を低い周囲温度にさらすことによる受動冷却
といった幾つかの手段の内の1つによって実現することができる。放熱または熱回収装置は、回収した熱を周囲環境の暖房に用いる熱回収装置であってもよい。例えば、熱回収装置は、回収した熱を建物の暖房に用いる建物または部屋暖房システムの一部であってもよい。熱回収装置の例としてはインフロアヒーター(in-floor heater)や地熱発電が挙げられるが、これらに限定されない。
Claims (20)
- 配列された複数のサーバーコンピュータケースであって、それぞれが
液密内部空間の範囲を定める蓋を含む複数の壁と、
前記内部空間に配置されたサーバーロジックボードと、
前記サーバーロジックボードに配置された複数の発熱コンピュータ部品と、
前記内部空間内に配置され、前記複数の発熱コンピュータ部品が浸漬される誘電性冷却液と、
前記壁の1つを通って伸び、前記サーバーロジックボード上の前記コンピュータ部品に電気的に接続された封止電気コネクタとを備えたサーバーコンピュータケースと、
前記複数のサーバーコンピュータケースの配列が並べられたラックシステムとを備える液体浸漬冷却サーバーコンピュータアレイ。 - 前記複数のサーバーコンピュータケースは、前記ラックシステムで水平に配列されている、または垂直に配列されている請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記サーバーコンピュータケースは、前記ラックシステムから個別に取り外しが可能である請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記サーバーコンピュータケースのそれぞれは、液体流入口と液体流出口とを備え、前記液体流入口と前記液体流出口のそれぞれは、前記液体流入口及び前記液体流出口を介した液体の流れを制御する急速着脱式バルブを備え、
前記ラックシステムは、前記ケースのそれぞれが前記ラックシステムに設置された時に、前記ケースのそれぞれの前記液体流入口と係合する流入口マニホールドと、前記液体流出口と係合する流出口マニホールドとを備え、前記流入口マニホールドと前記流出口マニホールドのそれぞれは急速着脱式バルブを備える、請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。 - 前記ラックシステムは複数の入出力コネクタを備え、前記封止電気コネクタは前記入出力コネクタと係合するように配置されている請求項4に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記ラックシステムは、前記ケースの前記ラックシステムへの設置を導くトラック機構を備える請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記ケースを前記ラックシステムに固定するロック機構をさらに備える請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記ラックシステムは、液体貯蔵タンクと、ポンプと、放熱装置とを備える請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記封止電気コネクタは、前記蓋を通って伸びており、前記蓋は脱着可能に前記ケースに接続されている請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記配列は、放熱装置または熱回収装置を備える冷媒液システムに接続されている請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記サーバーロジックボードに配置された前記発熱コンピュータ部品の1つの上に配置された分散プレナムをさらに備える請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記分散プレナムに覆われ、前記発熱コンピュータ部品の1つに接続されたヒートシンクをさらに備える請求項11に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 前記ケースと連通した液体冷媒流路を備え、前記液体冷媒流路は、前記流路を流れる液体冷媒を冷却する水冷ループと熱交換関係にある請求項1に記載の液体浸漬冷却サーバーコンピュータアレイ。
- 液密内部空間の範囲を定める筐体と、
前記筐体の壁にある液体流入口であって、前記液体流入口を介した液体の流れを制御する急速接続式バルブを備える液体流入口と、
前記筐体の壁にある液体流出口であって、前記液体流出口を介した液体の流れを制御する急速接続式バルブを備える液体流出口と、
前記筐体の前記内部空間に配置され、発熱電子装置が配置された回路基板と、
前記筐体の壁を通って伸び、前記回路基板の前記電子装置に電気的に接続された封止入出力コネクタとを備える液体冷却電子アレイ用ケース。 - 前記液体流入口及び前記液体流出口は、前記筐体の後壁または前記筐体の底壁にある請求項14に記載のケース。
- 前記発熱電子装置は、サーバー電子機器、電力またはバッテリー装置、メモリ記憶装置、ルーター、通信電子機器、またはプロセッサを含む請求項14に記載のケース。
- 前記封止入出力コネクタは、前記筐体の後壁または前記筐体の上壁を通って伸びている請求項14に記載のケース。
- 前記内部空間内に配置された複数の回路基板を備える請求項16に記載のケース。
- 前記回路基板に配置された前記発熱装置の1つの上に配置された分散プレナムをさらに備える請求項16に記載のケース。
- 前記分散プレナムに覆われ、前記発熱装置の1つに接続されたヒートシンクをさらに備える請求項19に記載のケース。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US4654008P | 2008-04-21 | 2008-04-21 | |
US61/046,540 | 2008-04-21 | ||
US8593408P | 2008-08-04 | 2008-08-04 | |
US61/085,934 | 2008-08-04 | ||
PCT/US2009/039086 WO2009131810A2 (en) | 2008-04-21 | 2009-04-01 | A case and rack system for liquid submersion cooling of electronic devices connected in an array |
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JP2011518395A true JP2011518395A (ja) | 2011-06-23 |
JP4903295B2 JP4903295B2 (ja) | 2012-03-28 |
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US (9) | US7905106B2 (ja) |
EP (1) | EP2271971B1 (ja) |
JP (1) | JP4903295B2 (ja) |
KR (1) | KR101115711B1 (ja) |
CN (1) | CN102037426B (ja) |
TW (1) | TWI559843B (ja) |
WO (1) | WO2009131810A2 (ja) |
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Also Published As
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EP2271971A2 (en) | 2011-01-12 |
KR20110004857A (ko) | 2011-01-14 |
US20110134604A1 (en) | 2011-06-09 |
TWI559843B (zh) | 2016-11-21 |
US20100246118A1 (en) | 2010-09-30 |
US7911793B2 (en) | 2011-03-22 |
US8654529B2 (en) | 2014-02-18 |
WO2009131810A2 (en) | 2009-10-29 |
US20130081790A1 (en) | 2013-04-04 |
CN102037426B (zh) | 2014-08-06 |
US20120075797A1 (en) | 2012-03-29 |
EP2271971B1 (en) | 2015-05-27 |
US8467189B2 (en) | 2013-06-18 |
US20130081791A1 (en) | 2013-04-04 |
WO2009131810A3 (en) | 2009-12-30 |
US9176547B2 (en) | 2015-11-03 |
US7905106B2 (en) | 2011-03-15 |
US20090260777A1 (en) | 2009-10-22 |
US9223360B2 (en) | 2015-12-29 |
US8089764B2 (en) | 2012-01-03 |
EP2271971A4 (en) | 2012-08-01 |
KR101115711B1 (ko) | 2012-06-13 |
US20130081792A1 (en) | 2013-04-04 |
US9086859B2 (en) | 2015-07-21 |
US20130083479A1 (en) | 2013-04-04 |
US9128681B2 (en) | 2015-09-08 |
US20130094146A1 (en) | 2013-04-18 |
CN102037426A (zh) | 2011-04-27 |
JP4903295B2 (ja) | 2012-03-28 |
TW200950687A (en) | 2009-12-01 |
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