JP6790855B2 - 液浸冷却装置、液浸冷却システム及び電子装置の冷却方法 - Google Patents
液浸冷却装置、液浸冷却システム及び電子装置の冷却方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
図1は、第1の実施形態に係る液浸冷却装置及び液浸冷却システムを示す模式図である。また、図2は、冷却装置及び水冷ジャケットを示す模式図である。ここでは、電子装置がサーバの場合について説明している。
図5は、第2の実施形態に係る液浸冷却システムを示す模式図である。図5において、図1と同一物には同一符号を付している。
Claims (9)
- 複数の発熱部品を含む電子装置を冷却する液浸冷却装置において、
液体の第1の冷媒で内部の一部が満たされるとともに、前記複数の発熱部品のうち、第1の発熱部品以外の発熱部品を前記第1の冷媒中に浸す筐体と、
前記筐体の内部に配置された前記第1の発熱部品に接して設けられ、前記第1の発熱部品を冷却する液冷ジャケットと、
第1の配管を介して前記液冷ジャケットから送出された第2の冷媒の熱を放熱することにより、前記第2の冷媒を冷却する第1の冷却装置と、
前記第1の冷却装置が冷却した第2の冷媒を第2の配管を介して前記液冷ジャケットへ送出する第1のポンプと
を有することを特徴とする液浸冷却装置。 - 前記液浸冷却装置はさらに、
第3の配管を介して前記筐体の内部から送出された第1の冷媒の熱を熱交換することにより、前記第1の冷媒を冷却する第2の冷却装置と、
前記第2の冷却装置が冷却した第1の冷媒を第4の配管を介して前記筐体の内部へ送出する第2のポンプと
を有することを特徴とする請求項1に記載の液浸冷却装置。 - 前記液浸冷却装置はさらに、
前記筐体の内部に配置され、前記第1の発熱部品が前記第1の冷媒に浸漬しないように支持する支持部材を有する
ことを特徴とする請求項1又は2に記載の液浸冷却装置。 - 前記液浸冷却装置はさらに、
前記筐体の内部に配置され、前記第1の冷媒を撹拌するファンを有することを特徴とする請求項1乃至3のいずれか1項に記載の液浸冷却装置。 - 前記第1の冷媒は、前記第2の冷媒よりも沸点が低いことを特徴とする請求項1乃至4のいずれか1項に記載の液浸冷却装置。
- 前記第1の発熱部品は、前記複数の発熱部品のうち、最も発熱量が大きい発熱部品であることを特徴とする請求項1乃至5のいずれか1項に記載の液浸冷却装置。
- 前記第1の発熱部品は、演算処理装置であることを特徴とする請求項6に記載の液浸冷却装置。
- 複数の発熱部品を含む電子装置と、前記電子装置を冷却する液浸冷却装置とを有する液浸冷却システムにおいて、
前記液浸冷却装置は、
液体の第1の冷媒で内部の一部が満たされるとともに、前記複数の発熱部品のうち、第1の発熱部品以外の発熱部品を前記第1の冷媒中に浸す筐体と、
前記筐体の内部に配置された前記第1の発熱部品に接して設けられ、前記第1の発熱部品を冷却する液冷ジャケットと、
第1の配管を介して前記液冷ジャケットから送出された第2の冷媒の熱を放熱することにより、前記第2の冷媒を冷却する冷却装置と、
前記冷却装置が冷却した第2の冷媒を第2の配管を介して前記液冷ジャケットへ送出する第1のポンプと
を有することを特徴とする液浸冷却システム。 - 液体の第1の冷媒で内部の一部が満たされるとともに、複数の発熱部品のうち、第1の発熱部品以外の発熱部品を前記第1の冷媒中に浸す筐体を有する液浸冷却装置を用いた電子装置の冷却方法において、
前記液浸冷却装置に含まれ、前記筐体の内部に配置された前記第1の発熱部品に接して設けられた液冷ジャケットが、前記第1の発熱部品を冷却し、
前記液浸冷却装置が有する冷却装置が、第1の配管を介して前記液冷ジャケットから送出された第2の冷媒の熱を放熱することにより、前記第2の冷媒を冷却し、
前記液浸冷却装置が有するポンプが、前記冷却装置が冷却した第2の冷媒を第2の配管を介して前記液冷ジャケットへ送出する
ことを特徴とする電子装置の冷却方法。
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JP2017006613A JP6790855B2 (ja) | 2017-01-18 | 2017-01-18 | 液浸冷却装置、液浸冷却システム及び電子装置の冷却方法 |
PCT/JP2018/000121 WO2018135327A1 (ja) | 2017-01-18 | 2018-01-05 | 液浸冷却装置、液浸冷却システム及び電子装置の冷却方法 |
US16/437,847 US10888032B2 (en) | 2017-01-18 | 2019-06-11 | Apparatus for liquid immersion cooling, system for liquid immersion cooling, and method of cooling electronic device |
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Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019048864A1 (en) | 2017-09-06 | 2019-03-14 | Iceotope Limited | THERMAL DISSIPATOR, THERMAL DISSIPATOR ARRANGEMENT AND MODULE FOR IMMERSION COOLING IN A LIQUID |
JP7151276B2 (ja) * | 2018-08-28 | 2022-10-12 | 富士通株式会社 | 冷却制御装置、冷却制御方法及び冷却制御プログラム |
GB201916771D0 (en) * | 2019-11-18 | 2020-01-01 | Iceotope Group Ltd | Heat sink for liquid cooling |
EP3973752A1 (en) * | 2019-05-21 | 2022-03-30 | Iceotope Group Limited | Cooling system for electronic modules |
GB2584991B (en) * | 2019-05-21 | 2022-01-26 | Iceotope Group Ltd | Cold plate |
US11490546B2 (en) | 2019-05-21 | 2022-11-01 | Iceotope Group Limited | Cooling system for electronic modules |
CN112020265B (zh) * | 2019-05-31 | 2022-06-28 | 华为技术有限公司 | 一种散热装置及处理器 |
GB201916763D0 (en) * | 2019-11-18 | 2020-01-01 | Iceotope Group Ltd | Nozzle arrangement and cooling module |
US10959352B1 (en) * | 2020-01-03 | 2021-03-23 | Quanta Computer Inc. | Cooling system with floating cold plate with single pipes |
JP2022030744A (ja) * | 2020-08-07 | 2022-02-18 | ダイキン工業株式会社 | 液浸冷却装置 |
US20210185850A1 (en) * | 2021-02-25 | 2021-06-17 | Intel Corporation | Hybrid liquid cooling |
EP4068932A1 (en) * | 2021-04-01 | 2022-10-05 | Ovh | Rack system with both immersion and forced liquid convection cooling |
US11924998B2 (en) * | 2021-04-01 | 2024-03-05 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
US11729950B2 (en) | 2021-04-01 | 2023-08-15 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
US20220322570A1 (en) * | 2021-04-01 | 2022-10-06 | Ovh | Systems and methods for autonomously activable redundant cooling of a heat generating component |
EP4068048A1 (en) * | 2021-04-01 | 2022-10-05 | Ovh | Systems and methods for autonomously activable redundant cooling of a heat generating component |
CN115209675A (zh) * | 2021-04-14 | 2022-10-18 | 台达电子工业股份有限公司 | 沉浸式冷却系统 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59136997A (ja) | 1983-01-27 | 1984-08-06 | 富士通株式会社 | 電源の冷却方法 |
EP0456508A3 (en) * | 1990-05-11 | 1993-01-20 | Fujitsu Limited | Immersion cooling coolant and electronic device using this coolant |
JP2989976B2 (ja) * | 1992-12-01 | 1999-12-13 | 甲府日本電気株式会社 | 回路冷却器 |
JPH09283677A (ja) * | 1996-04-10 | 1997-10-31 | Fuji Electric Co Ltd | 電力用半導体装置の冷却装置 |
US7092254B1 (en) * | 2004-08-06 | 2006-08-15 | Apple Computer, Inc. | Cooling system for electronic devices utilizing fluid flow and agitation |
US7307841B2 (en) * | 2005-07-28 | 2007-12-11 | Delphi Technologies, Inc. | Electronic package and method of cooling electronics |
US7905106B2 (en) * | 2008-04-21 | 2011-03-15 | Hardcore Computer, Inc. | Case and rack system for liquid submersion cooling of electronic devices connected in an array |
MY156969A (en) * | 2008-08-11 | 2016-04-15 | Green Revolution Cooling Inc | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
JP5332411B2 (ja) * | 2008-09-01 | 2013-11-06 | 株式会社明電舎 | パルス電源の冷却装置 |
US7885070B2 (en) * | 2008-10-23 | 2011-02-08 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
US8559173B2 (en) * | 2010-03-15 | 2013-10-15 | Panasonic Corporation | Electronic apparatus provided with cooling structure |
US8345423B2 (en) * | 2010-06-29 | 2013-01-01 | International Business Machines Corporation | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
CN103189708B (zh) * | 2010-11-01 | 2015-04-01 | 富士通株式会社 | 环形热管以及利用该环形热管的电子设备 |
JP5017473B1 (ja) * | 2011-03-16 | 2012-09-05 | 株式会社東芝 | テレビジョン受像機および電子機器 |
US9429369B2 (en) * | 2011-09-06 | 2016-08-30 | Asia Vital Components Co., Ltd. | Thermal module structure |
JP5853072B1 (ja) | 2014-08-25 | 2016-02-09 | 株式会社ExaScaler | 電子機器の冷却システム |
US10123454B2 (en) * | 2015-03-30 | 2018-11-06 | Exascaler Inc. | Electronic-device cooling system |
WO2016157397A1 (ja) * | 2015-03-30 | 2016-10-06 | 株式会社ExaScaler | 電子機器の冷却システム |
WO2017037860A1 (ja) * | 2015-08-31 | 2017-03-09 | 株式会社ExaScaler | 電子機器の冷却システム |
US9622379B1 (en) * | 2015-10-29 | 2017-04-11 | International Business Machines Corporation | Drawer-level immersion-cooling with hinged, liquid-cooled heat sink |
JP6720752B2 (ja) | 2016-07-25 | 2020-07-08 | 富士通株式会社 | 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法 |
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