JP6217885B1 - 液浸槽および液浸槽を有する装置 - Google Patents
液浸槽および液浸槽を有する装置 Download PDFInfo
- Publication number
- JP6217885B1 JP6217885B1 JP2017528228A JP2017528228A JP6217885B1 JP 6217885 B1 JP6217885 B1 JP 6217885B1 JP 2017528228 A JP2017528228 A JP 2017528228A JP 2017528228 A JP2017528228 A JP 2017528228A JP 6217885 B1 JP6217885 B1 JP 6217885B1
- Authority
- JP
- Japan
- Prior art keywords
- tank body
- electronic device
- tank
- refrigerant
- fluorine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
- 電子機器を収容可能であり、フッ素系絶縁性冷媒で満たされる槽本体と、
前記槽本体の内壁面に設けられており、前記電子機器が固定される固定部と、を備え、
前記槽本体は、前記フッ素系絶縁性冷媒に浸漬された際の体積変化率が2%以下で且つ線膨張係数が15×10−5/K以下の樹脂材料で形成される、液浸槽。 - 前記固定部は、前記槽本体内で対向する2つの内壁面に設けられており、
前記電子機器は、前記2つの内壁面に設けられた前記固定部に固定される、
請求項1に記載の液浸槽。 - 前記槽本体の外壁面において横方向に形成されるリブを更に備える、
請求項1または2に記載の液浸槽。 - 前記槽本体は、前記電子機器を上方から挿抜可能な開口部を有しており、
前記固定部は、前記開口部に沿いに設けられる、
請求項1から3の何れか一項に記載の液浸槽。 - 電子機器と、
前記電子機器が収容されており、フッ素系絶縁性冷媒で満たされる槽本体、及び、前記槽本体の内壁面に設けられており、前記電子機器が固定される固定部を備えた液浸槽と、を有し、
前記槽本体は、前記フッ素系絶縁性冷媒に浸漬された際の体積変化率が2%以下で且つ線膨張係数が15×10−5/K以下の樹脂材料で形成される、
装置。 - 前記固定部は、前記槽本体内で対向する2つの内壁面に設けられており、
前記電子機器は、前記2つの内壁面に設けられた前記固定部に固定される、
請求項5に記載の液浸槽を有する装置。 - 前記槽本体の外壁面において横方向に形成されるリブを更に備える、
請求項5または6に記載の液浸槽を有する装置。 - 前記槽本体は、前記電子機器を上方から挿抜可能な開口部を有しており、
前記固定部は、前記開口部に沿いに設けられる、
請求項5から7の何れか一項に記載の液浸槽を有する装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/077527 WO2018051501A1 (ja) | 2016-09-16 | 2016-09-16 | 液浸槽および液浸槽を有する装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017178879A Division JP2018046281A (ja) | 2017-09-19 | 2017-09-19 | 液浸槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6217885B1 true JP6217885B1 (ja) | 2017-10-25 |
JPWO2018051501A1 JPWO2018051501A1 (ja) | 2018-09-13 |
Family
ID=60156755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017528228A Active JP6217885B1 (ja) | 2016-09-16 | 2016-09-16 | 液浸槽および液浸槽を有する装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10212849B2 (ja) |
JP (1) | JP6217885B1 (ja) |
WO (1) | WO2018051501A1 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6939034B2 (ja) * | 2017-04-05 | 2021-09-22 | 富士通株式会社 | 冷却システム、冷却装置、及び電子システム |
JP6888469B2 (ja) * | 2017-08-04 | 2021-06-16 | 富士通株式会社 | 情報処理装置 |
JP6628327B2 (ja) * | 2017-10-20 | 2020-01-08 | Necプラットフォームズ株式会社 | サーバ |
CN109757060B (zh) | 2017-11-03 | 2020-11-24 | 阿里巴巴集团控股有限公司 | 冷却设备 |
CN109757061B (zh) | 2017-11-03 | 2021-06-11 | 阿里巴巴集团控股有限公司 | 冷却机柜及冷却系统 |
RU2695089C2 (ru) * | 2017-12-26 | 2019-07-19 | Общество с ограниченной ответственностью "Научно-Технический Центр ИннТех" | Система непосредственного жидкостного охлаждения электронных компонентов |
JP2019216192A (ja) * | 2018-06-13 | 2019-12-19 | 富士通株式会社 | 電子機器 |
JP7081361B2 (ja) * | 2018-07-17 | 2022-06-07 | 富士通株式会社 | 液浸槽 |
US11516948B2 (en) * | 2019-04-02 | 2022-11-29 | Eaton Intelligent Power Limited | Immersion cooling systems and methods for electrical power components |
CN111225543B (zh) * | 2019-10-31 | 2022-04-26 | 苏州浪潮智能科技有限公司 | 一种浸没式液冷服务器管理系统和服务器 |
CN112788914B (zh) * | 2019-11-11 | 2022-08-12 | 富联精密电子(天津)有限公司 | 散热装置及散热系统 |
US10939581B1 (en) * | 2020-01-15 | 2021-03-02 | Quanta Computer Inc. | Immersion liquid cooling rack |
EP3908092B1 (en) * | 2020-05-04 | 2023-03-15 | ABB Schweiz AG | Subsea power module |
US10966349B1 (en) * | 2020-07-27 | 2021-03-30 | Bitfury Ip B.V. | Two-phase immersion cooling apparatus with active vapor management |
US20220078942A1 (en) * | 2020-09-10 | 2022-03-10 | Scott Douglas Bennett | Systems and methods for optimizing flow rates in immersion cooling |
US11464135B2 (en) * | 2020-12-04 | 2022-10-04 | Schneider Electric It Corporation | Liquid cooling enclosure for circuit components |
US11477913B2 (en) | 2021-01-07 | 2022-10-18 | Baidu Usa Llc | Integrating thermal storage system in electronics cooling |
US11729953B2 (en) * | 2021-01-07 | 2023-08-15 | Baidu Usa Llc | Pressure based regulating design in fluid conditioning and distribution system |
EP4068925A1 (en) * | 2021-04-01 | 2022-10-05 | Ovh | Scissor structure for cable/tube management of rack-mounted liquid-cooled electronic assemblies |
CA3151725A1 (en) | 2021-04-01 | 2022-10-01 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
CA3153037A1 (en) | 2021-04-01 | 2022-10-01 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
US11696422B2 (en) * | 2021-08-18 | 2023-07-04 | Baidu Usa Llc | Highly serviceable immersion cooling structural design for servers |
US11700714B2 (en) * | 2021-08-24 | 2023-07-11 | Baidu Usa Llc | Integrated immersion system for servers |
US11523543B1 (en) * | 2022-02-25 | 2022-12-06 | Peter C. Salmon | Water cooled server |
US11445640B1 (en) * | 2022-02-25 | 2022-09-13 | Peter C. Salmon | Water cooled server |
US11925946B2 (en) * | 2022-03-28 | 2024-03-12 | Green Revolution Cooling, Inc. | Fluid delivery wand |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04279098A (ja) * | 1991-03-07 | 1992-10-05 | Fujitsu Ltd | 冷却システム |
JP2000349480A (ja) * | 1999-06-02 | 2000-12-15 | Advantest Corp | 発熱素子冷却装置 |
JP2010063195A (ja) * | 2008-09-01 | 2010-03-18 | Meidensha Corp | パルス電源の冷却装置 |
JP2011518395A (ja) * | 2008-04-21 | 2011-06-23 | ハードコア コンピューター、インク. | 配列接続された電子装置の液体浸漬冷却用ケース及びラックシステム |
JP2013187251A (ja) * | 2012-03-06 | 2013-09-19 | Sohki:Kk | 電子装置の冷却システムおよび方法 |
JP2016513304A (ja) * | 2013-01-24 | 2016-05-12 | ダウ グローバル テクノロジーズ エルエルシー | 電子デバイス冷却のための液体冷却媒体 |
WO2016088280A1 (ja) * | 2014-12-05 | 2016-06-09 | 株式会社ExaScaler | 電子機器の冷却装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1097347A (ja) * | 1996-09-20 | 1998-04-14 | Hitachi Ltd | 携帯型情報装置 |
US7403392B2 (en) * | 2006-05-16 | 2008-07-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
JP4640348B2 (ja) * | 2007-02-01 | 2011-03-02 | トヨタ自動車株式会社 | 電源装置 |
AU2009282170B2 (en) * | 2008-08-11 | 2014-11-27 | Green Revolution Cooling, Inc. | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
US8305759B2 (en) * | 2009-03-09 | 2012-11-06 | Hardcore Computer, Inc. | Gravity assisted directed liquid cooling |
US9335802B2 (en) * | 2013-02-01 | 2016-05-10 | Dell Products, L.P. | System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid |
US9328964B2 (en) * | 2013-02-01 | 2016-05-03 | Dell Products, L.P. | Partitioned, rotating condenser units to enable servicing of submerged it equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system |
US9414520B2 (en) * | 2013-05-28 | 2016-08-09 | Hamilton Sundstrand Corporation | Immersion cooled motor controller |
JP2015133384A (ja) * | 2014-01-10 | 2015-07-23 | トヨタ自動車株式会社 | パワーカード積層ユニット |
JP5853072B1 (ja) | 2014-08-25 | 2016-02-09 | 株式会社ExaScaler | 電子機器の冷却システム |
WO2016053260A1 (en) * | 2014-09-29 | 2016-04-07 | Hewlett Packard Enterprise Development Lp | Immersion cooled top-loading computing cartridges |
EP3249496A4 (en) * | 2015-01-22 | 2018-09-12 | Exascaler Inc. | Electronic instrument and cooling apparatus for electronic instrument |
US9872415B2 (en) * | 2015-12-01 | 2018-01-16 | Dell Products, L.P. | Dry power supply assembly for immersion-cooled information handling systems |
JP6690314B2 (ja) * | 2016-03-10 | 2020-04-28 | 富士通株式会社 | 電子機器 |
JP2017163065A (ja) * | 2016-03-11 | 2017-09-14 | 富士通株式会社 | 電子機器 |
JP6278053B2 (ja) * | 2016-03-28 | 2018-02-14 | 富士通株式会社 | 液浸冷却装置 |
-
2016
- 2016-09-16 JP JP2017528228A patent/JP6217885B1/ja active Active
- 2016-09-16 WO PCT/JP2016/077527 patent/WO2018051501A1/ja active Application Filing
-
2017
- 2017-07-05 US US15/641,669 patent/US10212849B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04279098A (ja) * | 1991-03-07 | 1992-10-05 | Fujitsu Ltd | 冷却システム |
JP2000349480A (ja) * | 1999-06-02 | 2000-12-15 | Advantest Corp | 発熱素子冷却装置 |
JP2011518395A (ja) * | 2008-04-21 | 2011-06-23 | ハードコア コンピューター、インク. | 配列接続された電子装置の液体浸漬冷却用ケース及びラックシステム |
JP2010063195A (ja) * | 2008-09-01 | 2010-03-18 | Meidensha Corp | パルス電源の冷却装置 |
JP2013187251A (ja) * | 2012-03-06 | 2013-09-19 | Sohki:Kk | 電子装置の冷却システムおよび方法 |
JP2016513304A (ja) * | 2013-01-24 | 2016-05-12 | ダウ グローバル テクノロジーズ エルエルシー | 電子デバイス冷却のための液体冷却媒体 |
WO2016088280A1 (ja) * | 2014-12-05 | 2016-06-09 | 株式会社ExaScaler | 電子機器の冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2018051501A1 (ja) | 2018-03-22 |
JPWO2018051501A1 (ja) | 2018-09-13 |
US10212849B2 (en) | 2019-02-19 |
US20180084671A1 (en) | 2018-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6217885B1 (ja) | 液浸槽および液浸槽を有する装置 | |
JP6720752B2 (ja) | 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法 | |
US10674637B2 (en) | Cooling device, cooling system, and cooling method for electronic circuitry | |
EP4018793B1 (en) | Mitigating vapor loss in a two-phase immersion cooling system | |
US8351206B2 (en) | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit | |
US10143113B2 (en) | Partitioned, rotating condenser units to enable servicing of submerged IT equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system | |
KR20220136946A (ko) | 전자 장치를 수용하기 위한 랙 시스템 | |
US10010012B2 (en) | Shield can assembly and electronic device having the same | |
US7724524B1 (en) | Hybrid immersion cooled server with integral spot and bath cooling | |
US12004321B2 (en) | Rack-mountable immersion cooling system | |
US20120314364A1 (en) | Computer casing having liquid cooling unit | |
US20190098796A1 (en) | Liquid immersion server | |
TWI712873B (zh) | 轉接器托架以及載具裝置 | |
WO2013011904A1 (ja) | 冷却装置及びそれを用いた機器収納装置 | |
US20200305310A1 (en) | Rack mountable immersion cooling enclosures | |
US20050237715A1 (en) | Cooling systems and methods for same | |
TW201144994A (en) | Server and server system | |
JP2018194211A (ja) | 冷却装置、電子装置、冷却システム | |
CN115209685A (zh) | 机架系统 | |
JP2018046281A (ja) | 液浸槽 | |
Ghaffari et al. | Two-phase closed-loop thermosyphon filled with a dielectric liquid for electronics cooling applications | |
US11606886B2 (en) | Measurement of dielectric liquid level change in single phase or two-phase immersion cooling systems | |
US20150319888A1 (en) | Container data center | |
Ramakrishnan | Viability of server module thermal management using enhanced heat sinks and low global warming potential dielectric fluids | |
Blosch | Air cooling vs. liquid immersion cooling: can liquid immersion cooling improve the energy and space efficiency of data centres? |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170801 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20170821 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170829 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170911 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6217885 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |