WO2016088280A1 - 電子機器の冷却装置 - Google Patents
電子機器の冷却装置 Download PDFInfo
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- WO2016088280A1 WO2016088280A1 PCT/JP2014/082342 JP2014082342W WO2016088280A1 WO 2016088280 A1 WO2016088280 A1 WO 2016088280A1 JP 2014082342 W JP2014082342 W JP 2014082342W WO 2016088280 A1 WO2016088280 A1 WO 2016088280A1
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- cooling
- inflow
- pipe
- outflow
- cooling device
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D9/00—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D9/00—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00
- F25D9/005—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00 using fluorinated halogenous hydrocarbons
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/10—Geothermal energy
Definitions
- the present invention relates to an electronic device cooling apparatus, and more particularly to efficiently cool an electronic device that requires super-high performance operation or stable operation such as a supercomputer or a data center and generates a large amount of heat from itself.
- the present invention relates to a cooling device for electronic equipment.
- a plurality of containers for storing servers are stored in a rack installed in a data center, and a plurality of servers are stored in each container, and are directed from the inlet to the outlet of each container.
- a refrigerant circulation mechanism that forms a flow of liquid refrigerant is connected. For this reason, in one container, the temperature of the liquid refrigerant increases as the distance from the inlet to the outlet increases, and the flow of the liquid refrigerant is hindered and warmed by the electronic equipment stored in a large volume of the container at high density.
- the cooling system disclosed in Patent Document 2 employs a sealed module configuration that houses one or more heat-generating electronic devices. For this reason, the entire mechanism for circulating the coolant through the individual sealed modules is complicated, and the entire electronic device cannot be easily taken out from the sealed module, resulting in poor maintenance of the electronic device. is there.
- the target to be cooled is not only CPU (Central Processing Unit), but also GPU (Graphics Processing Unit), high-speed memory, chipset, network unit, bus switch There are many units, SSDs (Solid State Drives), AC-DC converters, DC-DC voltage converters, etc., and one or more of these electronic components, or a combination of these electronic components
- a single board or a plurality of boards are mounted (for example, a single motherboard and a plurality of general-purpose boards mounted with a GPU are mounted in combination).
- the size is 70 to 90 cm high and the width is about 45 cm, and the weight is large.
- a lifting crane is used in order to insert a server into or out of an immersion rack. Therefore, the conventional immersion cooling device has a problem that it is inconvenient to handle a large and heavy electronic device, and it takes time to install and maintain it.
- the conventional immersion cooling apparatus has a problem in that a temperature distribution is generated in the cooling liquid in the cooling tank, and the cooling performance of the electronic device varies greatly depending on the storage position of the electronic device.
- the whole mechanism for circulating the coolant through the sealed module is complicated and the maintainability of the electronic device is poor.
- handling of electronic equipment having a large size and weight is inconvenient, and it takes time to install and maintain it.
- Another object of the present invention is to provide a cooling device that solves the above-described problems of the prior art, improves the cooling performance of a plurality of electronic devices, and stabilizes the cooling performance without variation.
- Another object of the present invention is to provide a cooling device that improves handling and maintenance of a plurality of electronic devices in immersion cooling.
- a cooling device for directly cooling a plurality of electronic devices by immersing them in a cooling liquid
- the cooling tank having an open space formed by a bottom wall and a side wall And a plurality of arranged storage units formed by dividing the open space by providing a plurality of internal partition walls in the cooling tank for storing at least one electronic device in each storage unit And a cooling liquid inflow opening and an outflow opening formed in each of the plurality of storage parts, wherein the inflow opening is formed on a bottom or a side surface of each of the storage parts, and the outflow opening Is provided with a cooling device formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.
- the outflow opening and / or the inflow opening are formed at or near a position where the plurality of internal partition walls forming each storage portion intersect each other. You may comprise.
- the cooling device further includes an outflow pipe that extends through the bottom wall to the vicinity of the liquid surface, and the outflow opening is formed at one end of the outflow pipe. You can do it.
- one or more small holes may be formed in the longitudinal direction of the outflow pipe.
- the cooling device further includes an inflow pipe that extends through the bottom wall to the vicinity of the liquid level, and the inflow pipe has a plurality of nozzles in a longitudinal direction of the inflow pipe. And the inflow opening may be formed in each of the plurality of nozzles.
- the cooling device further includes an inflow pipe and an outflow pipe extending through the bottom wall to the vicinity of the liquid surface, and a plurality of the inflow pipes are provided in the longitudinal direction of the inflow pipe.
- the inflow opening is formed in each of the plurality of nozzles
- the outflow opening is formed in the upper end of the outflow pipe
- the inflow pipe and the outflow pipe form the respective storage portions.
- the plurality of internal partition walls may be alternately arranged at a position where they intersect each other or in the vicinity thereof.
- the cooling device further includes an inflow pipe and an outflow pipe that extend through the bottom wall to the vicinity of the liquid surface, and a plurality of the inflow pipes are provided in a longitudinal direction of the inflow pipe.
- the inflow opening is formed in each of the plurality of nozzles, the outflow opening is formed in an upper end of the outflow pipe, and the inflow pipe and the outflow pipe are connected to the outflow pipe in the inflow pipe.
- the double pipe may be arranged at a position where the plurality of internal partition walls forming the storage portions intersect with each other or in the vicinity thereof.
- the cooling liquid may be configured to contain a fully fluorinated product as a main component.
- the cooling tank passes through an inlet for distributing the coolant toward the inflow opening of each storage unit and the outflow opening of each storage unit.
- An outlet for collecting the coolant, and the outlet and the inlet are connected by a flow passage outside the cooling tank, and at least one for moving the coolant into the flow passage.
- One pump and a heat exchanger for cooling the cooling liquid may be provided.
- an input signal corresponding to a temperature change in each storage unit is received, and the flow rate of the coolant passing through the inflow opening of each storage unit or the inflow pipe is received.
- the cooling device when a first temperature sensor for liquid is provided in each storage unit, and a temperature higher than a preset temperature is detected by the first temperature sensor, the electronic device stored in the storage unit may be stopped, or a mechanism for cutting off power supply to the electronic device may be further included.
- a second temperature sensor is provided in the electronic device stored in each storage unit or in the peripheral part of the electronic device stored in each storage unit, and set in advance.
- the electronic device may further include a mechanism for stopping the operation of the electronic device or cutting off the power supply to the electronic device.
- the cooling device of the present invention by providing a plurality of internal partition walls in a cooling tank having an open space formed by a bottom wall and a side wall, the open space is divided and a plurality of storage units arranged are arranged. It is formed. And at least 1 electronic device is accommodated in each accommodating part.
- an inflow opening and an outflow opening for the cooling liquid are formed in each of the plurality of storage units.
- the inflow opening is formed in a bottom portion or a side surface of each storage unit, and the outflow opening is a cooling liquid flowing through each storage unit. It is formed near the liquid level.
- the volume of the open space of the cooling tank is about 1/4 or less than about 1/4 (for example, about 1/9 of the volume of the open space (when divided into 3 ⁇ 3), 1/12 (when divided into 3 ⁇ 4 in the vertical direction) and 1/16 (when divided into 4 ⁇ 4 in the horizontal direction) storage portions are smaller than conventional ones (for example, about 1/2, 1 / 3, 1/4) electronic devices are housed and the coolant is individually circulated, whereby a plurality of electronic devices can be cooled individually and efficiently.
- the warmed coolant can be discharged also from the central portion of the cooling tank, the coolant is not discharged as in the prior art in which the warmed coolant is discharged from the side surface of the cooling tank.
- the cooling tank having the “open space” in the present specification includes a cooling tank having a simple sealed structure that does not impair maintainability of the electronic device.
- the structure in which the top plate is detachably attached to the opening of the cooling tank via packing or the like can be said to be a simple sealed structure.
- a cooling device according to the present invention will be described in detail with reference to the drawings.
- a total of 16 electronic devices one unit having a structure in which three processor boards each equipped with a CPU or GPU processor are arranged as one electronic device are arranged in each cooling tank.
- the configuration of a high-density cooling device that is housed in the housing and cooled is described. This is merely an example, and the number and type (CPU or GPU) of processors per board are arbitrary, and the number of electronic devices in the high-density cooling device is also arbitrary.
- the configuration is not limited.
- a cooling device 10 includes a cooling tank 12, and an open space 10a is formed by a bottom wall 12a and a side wall 12b of the cooling tank 12.
- an open space 10a is formed by a bottom wall 12a and a side wall 12b of the cooling tank 12.
- storage unit 15aa 16 storage units 15aa, 15ab, 15ac, 15ad, 15ba, 15bb, 15bc, 15bd, 15ca, 15cb, 15cc, 15cd, 15da, 15db, 15dc, 15dd (hereinafter collectively referred to as “storage unit 15aa”) May be described as “ ⁇ 15dd”). And at least 1 electronic device 100 is accommodated in each accommodating part. In the open space 10 a of the cooling tank 12, the cooling liquid 11 is put up to the liquid level 19.
- the bottoms of the storage portions 15aa, 15ab, 15ac, 15ad, 15ba, 15bb, 15bc, 15bd, 15ca, 15cb, 15cc, 15cd, 15da, 15db, 15dc, 15dd have inflow openings 16aa, 16ab, 16ac, 16 ad, 16 ba, 16 bb, 16 bc, 16 bd, 16 ca, 16 cb, 16 cc, 16 cd, 16 da, 16 db, 16 dc, 16 dd (hereinafter may be collectively referred to as “inflow openings 16aa to 16dd”) are formed. .
- the outflow openings 17aa, 17ab, 17ac, 17ad, 17ae, 17ba, 17bb, 17bc, 17bd, 17be, 17ca, 17cb, 17cc, 17cd , 17ce, 17da, 17db, 17dc, 17dd, 17de, 17ea, 17eb, 17ec, 17ed, and 17ee (hereinafter sometimes collectively referred to as “outflow openings 17aa to 17ee”).
- the outflow opening is formed at a position where a plurality of internal partition walls forming each storage portion intersect with each other or in the vicinity thereof.
- the storage portion 15aa is formed by vertical internal partition walls 13a and 13b and horizontal internal partition walls 14a and 14b, and the internal partition wall 13a and the internal partition wall 14a intersect each other.
- Outflow openings 17aa, 17ba, 17ab, so as to be located at a point where the partition wall 13a and the inner partition wall 14b intersect, a point where the inner partition wall 13b and the inner partition wall 14a intersect, and a point where the inner partition wall 13b and the inner partition wall 14b intersect, respectively. 17bb is formed.
- FIG. 1 the storage portion 15aa is formed by vertical internal partition walls 13a and 13b and horizontal internal partition walls 14a and 14b, and the internal partition wall 13a and the internal partition wall 14a intersect each other.
- Outflow openings 17aa, 17ba, 17ab so as to be located at a point where the partition wall
- the storage portion 15bb is formed by vertical internal partition walls 13b and 13c and horizontal internal partition walls 14b and 14c, and the internal partition wall 13b and the internal partition wall 14b intersect.
- the outflow openings 17bb, 17cb are respectively positioned at the point where the internal partition wall 13b and the internal partition wall 14c intersect, the point where the internal partition wall 13c and the internal partition wall 14b intersect, and the point where the internal partition wall 13c and the internal partition wall 14c intersect. 17bc and 17cc are formed.
- the outflow opening is formed at one end of the outflow pipe 170 that extends through the bottom wall 12a of the cooling bath 12 to the vicinity of the liquid surface 19.
- the outflow openings 17bb, 17cb, 17bc, 17cc are formed by vertical internal partition walls 13b, 13c and horizontal internal partition walls 14b, 14c. 13b and the inner partition wall 14b intersect, the inner partition wall 13b and the inner partition wall 14c intersect, the inner partition wall 13c and the inner partition wall 14b intersect, and the inner partition wall 13c and the inner partition wall 14c intersect, respectively. It is formed at one end of the outflow pipe 170.
- the other end of the outflow pipe has a bottom opening 18aa, 18ab, 18ac, 18ad, 18ae, 18ba, 18bb, 18bc, 18bd, 18be, 18ca, 18cb, 18cc, 18cd, 18ce, 18da, 18db, 18dc, 18dd, 18de, 18ea, 18eb, 18ec, 18ed, and 18ee (hereinafter, collectively referred to as “bottom openings 18aa to 18ee”) are formed.
- outflow openings 17bb, 17bc, 17cb, and 17cc are formed by the outflow pipes 170 arranged at the four corners.
- the outflow opening 17bb is a part of the outflow opening for the storage part 15aa and at the same time a part of the outflow opening for the storage parts 15ab, 15ba, and 15bb.
- outflow openings 17bc, 17cb, and 17cc are arbitrary, and one or a plurality of outflow pipes may be provided in the vicinity of a position where a plurality of internal partition walls forming each storage part intersect each other.
- the outflow pipe does not need to be integrated with the internal partition, and may be a pipe disposed away from the internal partition.
- one or more small holes 171 may be formed in the outflow pipe 170 in the longitudinal direction of the outflow pipe 170. As will be described later, these small holes 171 promote the circulation of the coolant 11 in the middle of the storage portion in the depth direction.
- the inflow openings 16aa to 16dd do not need to be cylindrical openings as shown in the figure.
- a header having a plurality of nozzles is connected to one end of the cylinder to form inflow openings by a number of nozzles. May be.
- each of the storage units 15aa to 15dd three processor boards 110 each equipped with a CPU and two processor boards 112 each equipped with a GPU are mounted on one surface and the other surface of the board 120.
- the electronic device 100 is housed and immersed in the coolant 11.
- the processor boards 110 and 112 include heat radiating members (heat radiating fins) 114 that are thermally connected to the processor.
- peripheral electronic components are naturally mounted on the processor boards 110 and 112 and the board 120 of the electronic device 100, but these electronic components are not shown.
- the present inventor is a compound in which a fully fluorinated product has high electrical insulation and high heat transfer ability, is inert, has high thermal and chemical stability, is nonflammable, and does not contain oxygen. Therefore, paying attention to the excellent characteristics such as zero ozone depletion coefficient, a coolant containing such a fully fluorinated product as a main component is used as a coolant for immersion cooling of high-density electronic equipment.
- the invention of the cooling system to be used has been completed and a patent application has been filed (Japanese Patent Application No. 2014-170616).
- the cooling tank 12 has an inlet 16 for distributing the coolant 11 through distribution pipes (not shown) toward the inflow openings 16aa to 16dd provided in the storage portions 15aa to 15dd, and the storage portions.
- An outlet 18 is provided for collecting the coolant 11 that has passed through the outlet openings 17aa to 17ee of 15aa to 15dd through a collecting pipe (not shown).
- the cooling liquid 11 cooled to a desired temperature is continuously supplied to each of the electronic devices 100 stored in the storage portions 15aa to 15dd so as to be kept at a predetermined temperature or lower during operation.
- the heated cooling liquid 11 that has come out from the outlet 18 of the cooling tank 12 is cooled by a heat exchanger, and the cooled cooling liquid is supplied to the inlet 16 of the cooling tank 12.
- the return flow passage 30 may be configured. As shown in the figure, the outlet 18 and the inlet 16 of the cooling tank 12 are connected by a flow passage 30, and a pump 40 that moves the cooling liquid 11 and a heat exchanger 90 that cools the cooling liquid 11 are provided in the flow passage 30. It has been.
- a flow rate adjusting valve 50 and a flow meter 70 for adjusting the flow rate of the coolant 11 flowing through the flow passage 30 are also provided in the flow passage 30.
- the pump 40 preferably has a performance of moving a liquid having a relatively large kinematic viscosity (a kinematic viscosity at room temperature of 25 ° C. exceeds 3 cSt).
- a kinematic viscosity at room temperature of 25 ° C. exceeds 3 cSt For example, when Fluorinert FC-43 or FC-40 is used as the coolant 11, the kinematic viscosity of FC-43 is about 2.5 to 2.8 cSt, and the kinematic viscosity of FC-40 is 1.8 to 2 This is because it is about 2 cSt.
- the flow rate adjustment valve 50 may be manually operated, or may be provided with an adjustment mechanism that keeps the flow rate constant based on the measurement value of the flow meter 70.
- the heat exchanger 90 may be various circulating heat exchangers (radiators or chillers) or coolers.
- the coolant 11 that has entered from the inlet 16 is distributed toward inflow openings 16aa to 16dd formed at the bottoms of the storage portions 15aa to 15dd via a distribution pipe (not shown).
- the coolant 11 blows upward from the inflow openings 16aa to 16dd, and the CPU, GPU, and peripheral electronic components (not shown) mounted on the three processor boards 112, 110, 112 on the board 120 of the electronic device 100. Directly).
- the heat dissipation is thermally connected to the CPU and GPU mounted on the three processor boards 112, 110, and 112.
- the volume of the storage portions 15aa to 15dd is as small as about 1/16 of the volume of the open space 10a of the cooling bath 12, and the electronic device 100 stored therein is also about 1 / of the width of the cooling bath 12. Therefore, the cooling efficiency of the electronic device 100 by the coolant 11 is extremely good, and the coolant 11 can be effectively prevented from staying around the electronic device 100.
- each of the outflow pipes 170 has six small holes 171 formed at regular intervals. However, this is merely an example, and those skilled in the art can arbitrarily determine the number and position of the small holes. Good.
- the temperature of each storage unit is constantly monitored in a control device (not shown), and an input signal according to a temperature change in the storage unit transmitted from the control device is received.
- Another flow rate adjusting valve (not shown) for adjusting the flow rate of the coolant 11 passing through the inflow openings 16aa to 16dd of the storage portions 15aa to 15dd is provided for each distribution pipe (from the inlet 16 to the inflow openings 16aa to 16dd). (Not shown).
- the cooling strength of the electronic device by the cooling liquid can be individually managed by individually adjusting the flow rate of the cooling liquid flowing through each storage unit, so that the cooling performance of a plurality of electronic devices Can be managed in detail.
- a first temperature sensor for liquid is provided in each of the storage portions 15aa to 15dd, and a temperature higher than a preset temperature is detected by the first temperature sensor.
- a mechanism for stopping the operation of the electronic device 100 housed in the housing portion where the temperature is detected or cutting off the power supply to the electronic device 100 when the temperature is detected. Good.
- an abnormal temperature rise exceeding the set temperature does not occur in the coolant 11 flowing through each storage section, and damage to electronic equipment and harmful compounds from fluorocarbons are prevented. Occurrence can be prevented.
- a second temperature sensor (not shown) is provided in the periphery of 100, and when the second temperature sensor detects a temperature higher than a preset temperature, the operation of the electronic device 100 is stopped, or the electronic device A mechanism (not shown) for cutting off power supply to 100 may be further provided.
- the inflow opening is formed at the bottom of each storage unit.
- the inflow opening may be formed on the side surface of each storage unit.
- a cooling device according to another embodiment of the present invention will be described with reference to FIGS. 6 and 7, and a cooling device according to another embodiment will be described with reference to FIG. 8.
- FIGS. 6 and 7 are a plan view and a longitudinal sectional view showing a configuration of a main part of a cooling device according to another embodiment, and an inflow opening of the cooling liquid 11 at the bottom of each of the storage portions 15aa to 15dd of the cooling device 10.
- Inflow openings are formed by the inflow pipes 160 provided on the side surfaces of the storage portions 15aa to 15dd. That is, the cooling device 10 further includes an inflow pipe 160 that passes through the bottom wall 12a and extends to the vicinity of the liquid surface 19, and the inflow pipe 160 includes a plurality of nozzles 161 in the longitudinal direction of the inflow pipe 160.
- the inflow pipe 160 and the outflow pipe 170 may be alternately arranged at or near the position where the plurality of internal partition walls forming the storage portions 15aa to 15dd intersect each other. Therefore, for example, referring to FIG. 6, the storage portion 15bb is formed by the vertical internal partition walls 13b and 13c and the horizontal internal partition walls 14b and 14c, and the internal partition wall 13b and the internal partition wall 14c intersect.
- the outflow pipe 170 is disposed at the point where the internal partition wall 13c and the internal partition wall 14b intersect, and the outflow openings 17cb and 17bc are formed at the upper end of the outflow pipe 170, respectively, as in FIG. is there.
- an inflow pipe 160 is arranged at a point where the internal partition wall 13b and the internal partition wall 14b intersect, and at a point where the internal partition wall 13c and the internal partition wall 14c intersect, and the inflow pipe 160 includes a plurality of nozzles 161 in its longitudinal direction.
- the inflow opening 116bb is formed in each of the plurality of nozzles. Note that the inflow pipe and the outflow pipe do not need to be integrated with the internal partition wall, and may be pipes arranged away from the internal partition wall.
- the inflow pipe 160 has a structure in which the inside is divided into four sections, and the coolant 11 flowing through one of the sections is an inflow formed in each of the plurality of nozzles 161. It blows out into the storage portion 15bb through the opening 116bb. Therefore, in this embodiment, a pair of inflow openings are formed in the diagonal direction on the side surface of each storage portion. Further, since the inflow pipe 160 has a structure in which the inside is divided into four sections, the flow rate of the coolant flowing through each section can be individually controlled.
- each storage unit is constantly monitored by a control device (not shown), and an inflow opening of the plurality of nozzles 161 is received in response to an input signal transmitted from the control device according to a temperature change in the storage unit.
- Another flow rate adjustment valve (not shown) for adjusting the flow rate of the cooling liquid 11 passing through the pipe may be provided at an appropriate position on the path from the bottom opening to the inflow opening described later for each section. Thereby, it is possible to individually control the flow rate of the coolant from the pair of inflow openings in the diagonal direction for each storage unit.
- the outflow openings 17 bc and 17 cb may be formed at the upper end of the outflow pipe 170 without forming a small hole in the outflow pipe 170. Note that these outflow openings can be a common outflow opening for a plurality of storage units, as in the outflow openings in the embodiment shown in FIGS.
- three processor boards 112 respectively mounted on both sides of the board 120 from a plurality of inflow openings 116bb formed in a pair of diagonal directions on the side surface of the storage portion 15bb in the depth direction, Since the electronic device 100 is forcibly cooled by the plurality of flows of the coolant 11 toward 110 and 112, the cooling efficiency is further improved.
- the position and number of the inflow pipe and the outflow pipe are arbitrary, and the inflow pipe and the outflow pipe are respectively provided in the vicinity of the position where the plurality of internal partition walls forming each storage part intersect each other. Of course, one or more may be provided.
- the outflow pipe 170 constitutes a double pipe 180 containing the outflow pipe 170 in the inflow pipe 160, in other words, a double pipe having the outflow pipe 170 as an inner pipe and the inflow pipe 160 as an outer pipe. It is characterized in that 180 is configured.
- the inflow pipe 160 has a plurality of nozzles 161 in the longitudinal direction of the inflow pipe 160, and the inflow openings 116aa to 116ee are formed in each of the plurality of nozzles 161, and the upper end of the inflow pipe 160 is completely closed.
- the inflow pipe 160 has a structure in which the inside is divided into four sections, and the cooling liquid 11 flowing through one of the sections is an inflow opening 116aa formed in each of the plurality of nozzles 161. It is the same as in the embodiment shown in FIGS. 6 and 7 that it is blown into the storage portions 15aa to 15dd through .about.116ee.
- the double pipe 180 may be disposed at a position where a plurality of internal partition walls forming the storage portions 15aa to 15dd intersect each other or in the vicinity thereof. That is, the point where the internal partition 13b and the internal partition 14b intersect, the point where the internal partition 13b and the internal partition 14c intersect, the point where the internal partition 13c and the internal partition 14b intersect, and the point where the internal partition 13c and the internal partition 14c intersect
- the double pipes 180 may be arranged so as to be located respectively. Note that the double pipe need not be integrated with the internal partition, and may be a pipe disposed away from the internal partition.
- inflow openings are formed at the four corners of the side surface of each storage unit.
- the inflow pipe 160 has a structure in which the inside is divided into four sections, the flow rate of the coolant flowing through each section can be individually controlled. That is, the temperature of each storage unit is constantly monitored by a control device (not shown), and an inflow opening of the plurality of nozzles 161 is received in response to an input signal transmitted from the control device according to a temperature change in the storage unit.
- Another flow rate adjustment valve (not shown) for adjusting the flow rate of the cooling liquid 11 passing through may be provided at an appropriate position on the path from the bottom opening to the inflow opening for each section.
- bottom openings 118aa to 118ee are formed at the lower end of the inflow pipe 160 corresponding to the outer pipe of the double pipe 180.
- the bottom openings 118aa to 118ee correspond to four compartments inside the inflow pipe 160, respectively.
- the upper end of the inflow pipe 160 corresponding to the outer pipe of the double pipe 180 is completely closed.
- bottom openings 18aa to 18ee are formed.
- outflow opening formed at the upper end of the outflow pipe 170 corresponding to the inner pipe of the double pipe 180 can be a common outflow opening for a plurality of storage portions is the same as the outflow opening in the embodiment shown in FIGS. It is the same.
- the three processor boards 112, 110, 112 respectively mounted on both sides of the board 120 are directed. Since the electronic device 100 is forcibly cooled by the plurality of flows of the coolant 11, the cooling efficiency is further improved.
- the position and number of the double pipes are arbitrary, and one or a plurality of double pipes are provided in the vicinity of a position where a plurality of internal partition walls forming each storage part intersect each other. Of course, it may be provided.
- FIG. 6 and FIG. 7 and the embodiment shown in FIG. 8 as an example of forming the inflow opening on the side surface of each storage unit, an example of forming a pair in the diagonal direction of each storage unit; An example of forming at the four corners of each storage portion will be described, and in order to form an inflow opening on the side surface of each storage portion, an inflow pipe having a plurality of nozzles formed with inflow openings will be used.
- the pipes are arranged at a position where a plurality of internal partition walls forming each storage portion intersect with each other or in the vicinity thereof, but the form of forming the inflow opening on the side surface of each storage portion is not limited thereto.
- a hollow internal partition is employed, and one or more slits are formed in the wall of the internal partition to form an inflow opening, and the cooled coolant is contained inside
- the coolant may flow through the partition wall and blow out the cooling liquid into the housing through one or more slits.
- a branch pipe through which the cooled coolant passes is provided on a part or the entire surface of the inner partition wall, and an inflow opening is formed at an arbitrary position and number of branch pipes. The coolant may be blown out into the storage unit.
- the processor boards 110 and 112 are mounted on the board 120 of the electronic device 100
- the processor may include either or both of a CPU and a GPU.
- a high-speed memory a chip set, a network unit, a PCI Express bus, a bus switch unit, an SSD, and a power unit (AC-DC converter, DC-DC voltage converter, etc.) (not shown) may be included.
- the electronic device 100 may be an electronic device such as a server including a blade server, a storage device such as a router, and an SSD.
- a width for example, about 1/2, 1/3, 1/4
- an electron having a width smaller than that of the conventional case is accommodated in a storage portion having a volume of about 1/4 or less than about 1/4 of the volume of the open space of the cooling tank.
- the present invention can be widely applied to cooling devices that efficiently cool electronic devices.
- Cooling device 10a Open space 100 Electronic device 110 Processor board (CPU mounting) 112 Processor board (GPU installed) 114 Heat dissipation member 120 Board 11 Cooling liquid 12 Cooling tank 12a Bottom wall 12b Side wall 13a, 13b, 13c, 13d, 13e Internal partition 14a, 14b, 14c, 14d, 14e Internal partition 15aa, 15ab, 15ac, 15ad, 15ba, 15bb, 15bc, 15bd, 15ca, 15cb, 15cc, 15cd, 15da, 15db, 15dc, 15dd storage section 16 inlet 16aa, 16ab, 16ac, 16ad, 16ba, 16bb, 16bc, 16bd, 16ca, 16cb, 16cc, 16cd, 16da, 16b , 16dc, 16dd Inflow opening 116aa, 116ab, 116ac, 116ad, 116ae
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Abstract
Description
10a 開放空間
100 電子機器
110 プロセッサボード(CPU搭載)
112 プロセッサボード(GPU搭載)
114 放熱部材
120 ボード
11 冷却液
12 冷却槽
12a 底壁
12b 側壁
13a、13b、13c、13d、13e 内部隔壁
14a、14b、14c、14d、14e 内部隔壁
15aa、15ab、15ac、15ad、15ba、15bb、15bc、15bd、15ca、15cb、15cc、15cd、15da、15db、15dc、15dd 収納部
16 入口
16aa、16ab、16ac、16ad、16ba、16bb、16bc、16bd、16ca、16cb、16cc、16cd、16da、16db、16dc、16dd 流入開口
116aa、116ab、116ac、116ad、116ae、116ba、116bb、116bc、116bd、116be、116ca、116cb、116cc、116cd、116ce、116da、116db、116dc、116dd、116de、116ea、116eb、116ec、116ed、116ee 流入開口
160 流入管
161 ノズル
17aa、17ab、17ac、17ad、17ae、17ba、17bb、17bc、17bd、17be、17ca、17cb、17cc、17cd、17ce、17da、17db、17dc、17dd、17de、17ea、17eb、17ec、17ed、17ee 流出開口
170 流出管
171 小孔
18 出口
180 二重管
18aa、18ab、18ac、18ad、18ae、18ba、18bb、18bc、18bd、18be、18ca、18cb、18cc、18cd、18ce、18da、18db、18dc、18dd、18de、18ea、18eb、18ec、18ed、18ee 底部開口
118aa、118ab、118ac、118ad、118ae、118ba、118bb、118bc、118bd、118be、118ca、118cb、118cc、118cd、118ce、118da、118db、118dc、118dd、118de、118ea、118eb、118ec、118ed、118ee 底部開口
19 液面
30 流通路
40 ポンプ
50 流量調整バルブ
70 流量計
90 熱交換器
Claims (13)
- 複数の電子機器を冷却液中に浸漬して直接冷却する冷却装置であって、
底壁及び側壁によって形成される開放空間を有する冷却槽と、
前記冷却槽内に複数の内部隔壁を設けることにより前記開放空間を分割して形成される、配列された複数の収納部であって、各収納部に少なくとも1つの電子機器を収納するための収納部と、
前記複数の収納部の各々に形成される、冷却液の流入開口及び流出開口と、
を有し、
前記流入開口は、各収納部の底部又は側面に形成され、前記流出開口は、各収納部を流通する前記冷却液の液面近傍に形成されている、
冷却装置。 - 前記流出開口及び/又は前記流入開口は、各収納部を形成している前記複数の内部隔壁が互いに交差する位置もしくはその近傍に形成されている、請求項1に記載の冷却装置。
- 前記底壁を貫通し前記液面近傍まで延びる流出管をさらに有し、該流出管の一端に前記流出開口が形成されている、請求項1又は2に記載の冷却装置。
- 前記流出管の長手方向に1つ以上の小孔が形成されている、請求項3に記載の冷却装置。
- 前記底壁を貫通し前記液面近傍まで延びる流入管をさらに有し、
前記流入管は、該流入管の長手方向に複数のノズルを有し、該複数のノズルの各々に前記流入開口が形成されている、請求項1又は2に記載の冷却装置。 - 前記底壁を貫通し前記液面近傍まで延びる流入管及び流出管をさらに有し、
前記流入管は、該流入管の長手方向に複数のノズルを有し、該複数のノズルの各々に前記流入開口が形成され、
前記流出管の上端に前記流出開口が形成され、
前記流入管及び前記流出管が、各収納部を形成している前記複数の内部隔壁が互いに交差する位置もしくはその近傍に、交互に配置されている、
請求項1に記載の冷却装置。 - 前記底壁を貫通し前記液面近傍まで延びる流入管及び流出管をさらに有し、
前記流入管は、該流入管の長手方向に複数のノズルを有し、該複数のノズルの各々に前記流入開口が形成され、
前記流出管の上端に前記流出開口が形成され、
前記流入管及び前記流出管が、該流入管内に該流出管を内包する二重管を構成している、
請求項1に記載の冷却装置。 - 前記二重管が、各収納部を形成している前記複数の内部隔壁が互いに交差する位置もしくはその近傍に配置されている、請求項7に記載の冷却装置。
- 前記冷却液が、主成分として完全フッ素化物を含む、請求項1から8のいずれかに記載の冷却装置。
- 前記冷却槽は、各収納部の前記流入開口に向けて前記冷却液を分配するための入口と、
各収納部の前記流出開口を通った前記冷却液を集めるための出口とを有し、
前記出口と前記入口が、前記冷却槽の外部にある流通路により連結されており、
前記流通路中に、前記冷却液を移動させる少なくとも1つのポンプと、前記冷却液を冷やす熱交換器が設けられている、請求項1又は2に記載の冷却装置。 - 各収納部内の温度変化に応じた入力信号を受けて、各収納部の前記流入開口を通る前記冷却液の流量、又は前記流入管に設けられた各ノズルを通る前記冷却液の流量を調整する機構をさらに有している、請求項10に記載の冷却装置。
- 各収納部内に液体用の第1の温度センサーを設けるとともに、予め設定された以上の温度が前記第1の温度センサーにより検知された場合に、該収納部内に収納された前記電子機器の運用を中止させ、又は前記電子機器への電源供給を遮断する機構をさらに有している、請求項1から11のいずれかに記載の冷却装置。
- 各収納部内に収納された電子機器内、又は各収納部内に収納された電子機器周辺部に第2の温度センサーを設けるとともに、予め設定された以上の温度が前記第2の温度センサーにより検知された場合に、前記電子機器の運用を中止させ、又は前記電子機器への電源供給を遮断する機構をさらに有している、請求項1から11のいずれかに記載の冷却装置。
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EP14907366.0A EP3229103A4 (en) | 2014-12-05 | 2014-12-05 | Electronic apparatus cooling device |
JP2016507716A JP5956097B1 (ja) | 2014-12-05 | 2014-12-05 | 電子機器の冷却装置 |
PCT/JP2014/082342 WO2016088280A1 (ja) | 2014-12-05 | 2014-12-05 | 電子機器の冷却装置 |
US15/533,348 US10123453B2 (en) | 2014-12-05 | 2014-12-05 | Electronic apparatus cooling system |
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Also Published As
Publication number | Publication date |
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EP3229103A1 (en) | 2017-10-11 |
EP3229103A4 (en) | 2018-07-11 |
JP5956097B1 (ja) | 2016-07-20 |
US10123453B2 (en) | 2018-11-06 |
JPWO2016088280A1 (ja) | 2017-04-27 |
US20170354061A1 (en) | 2017-12-07 |
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