JP5956099B1 - 電子機器の冷却システム - Google Patents
電子機器の冷却システム Download PDFInfo
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- 239000000110 cooling liquid Substances 0.000 claims abstract description 66
- 239000003507 refrigerant Substances 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 239000002344 surface layer Substances 0.000 claims abstract description 19
- 238000005192 partition Methods 0.000 claims description 41
- 239000007788 liquid Substances 0.000 claims description 20
- -1 fluorocarbon compound Chemical class 0.000 claims description 3
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 11
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Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
100 電子機器
110 プロセッサ
111 ダイ(チップ)
112 ヒートスプレッダ
120 ボード
200、300、400 沸騰冷却装置
210 密閉容器
211 受熱側
212 放熱側
220 放熱部材(放熱フィン)
10a 開放空間
11 第1の冷却液
12 冷却槽
12a 底壁
12b 側壁
13 第2の冷却液
13a、13b、13c、13d、13e 内部隔壁
14a、14b、14c、14d、14e 内部隔壁
15aa、15ab、15ac、15ad、15ba、15bb、15bc、15bd、15ca、15cb、15cc、15cd、15da、15db、15dc、15dd 収納部
16 入口
16aa、16ab、16ac、16ad、16ba、16bb、16bc、16bd、16ca、16cb、16cc、16cd、16da、16db、16dc、16dd 流入開口
17aa、17ab、17ac、17ad、17ae、17ba、17bb、17bc、17bd、17be、17ca、17cb、17cc、17cd、17ce、17da、17db、17dc、17dd、17de、17ea、17eb、17ec、17ed、17ee 流出開口
170 流出管
171 小孔
18 出口
18aa、18ab、18ac、18ad、18ae、18ba、18bb、18bc、18bd、18be、18ca、18cb、18cc、18cd、18ce、18da、18db、18dc、18dd、18de、18ea、18eb、18ec、18ed、18ee 底部開口
19 液面
20 天板
22 第1の熱交換器
22aa、22ab、22ac、22ad、22ba、22bb、22bc、22bd、22ca、22cb、22cc、22cd、22da、22db、22dc、22dd 分散型の第1の熱交換器
24 第2の熱交換器
26 第1の流通路
30 第2の流通路
40 ポンプ
50 流量調整バルブ
70 流量計
90 第3の熱交換器
Claims (9)
- 電子機器を冷却液中に浸漬して直接冷却する、冷却システムであって、
少なくとも1つの発熱体を有する電子機器の前記発熱体に熱的に接続される沸騰冷却装置であって、沸点T1を有する第1の冷却液が封入されている沸騰冷却装置と、
前記第1の冷却液の沸点T1と同じ又は前記第1の冷却液の沸点T1よりも高い沸点T2(T2=T1又はT2>T1)を有する第2の冷却液が入れられた冷却槽であって、前記沸騰冷却装置及び前記電子機器が前記第2の冷却液中に浸漬されて直接冷却される冷却槽と、
前記第1の冷却液の沸点T1と同じ又は前記第1の冷却液の沸点T1よりも低い沸点T3(T3=T1又はT3<T1)を有する第3の冷媒が封入されている第1の熱交換器であって、前記冷却槽内の前記第2の冷却液中の表層部に浸漬される第1の熱交換器と、
を含む冷却システム。 - 前記沸騰冷却装置は、受熱側と放熱側を有する密閉容器と、前記放熱側に設けられた放熱部材とを有し、前記沸騰冷却装置及び前記電子機器が前記第2の冷却液中に浸漬されるとき、前記放熱側が前記受熱側より上に位置するように前記発熱体に熱的に接続されている、請求項1に記載の冷却システム。
- 前記第1の冷却液の沸点が100℃以下であり、前記第2の冷却液の沸点が150℃以上であり、前記第3の冷媒の沸点が50℃以下である、請求項1又は2に記載の冷却システム。
- 前記第1の冷却液及び/又は前記第3の冷媒が、主成分としてフッ化炭素化合物を含む、請求項3に記載の冷却システム。
- 前記第2の冷却液が、主成分として完全フッ素化物を含む、請求項3に記載の冷却システム。
- 前記冷却槽の外部に置かれた、前記第3の冷媒を冷やす第2の熱交換器をさらに有し、前記第1の熱交換器と前記第2の熱交換器は第1の流通路により連結されている、請求項1に記載の冷却システム。
- 前記冷却槽が、前記冷却槽の上部開口に対して着脱可能又は開閉可能に取り付けられた天板を有し、該天板が前記第1の熱交換器を保持している、請求項1に記載の冷却システム。
- 前記冷却槽は、前記第2の冷却液の入口と出口を有し、
前記出口と前記入口が、前記冷却槽の外部にある第2の流通路により連結されており、
前記流通路中に、前記第2の冷却液を移動させる少なくとも1つのポンプと、前記第2の冷却液を冷やす第3の熱交換器が設けられている、請求項1に記載の冷却システム。 - 複数の電子機器を冷却液中に浸漬して直接冷却する冷却システムであって、
底壁及び側壁によって形成される開放空間を有する冷却槽と、
前記冷却槽内に複数の内部隔壁を設けることにより前記開放空間を分割して形成される、配列された複数の収納部であって、各収納部に少なくとも1つの電子機器を収納するための収納部と、
前記複数の収納部の各々に形成される、冷却液の流入開口及び流出開口と、
を有し、
前記流入開口は、各収納部の底部又は側面に形成され、前記流出開口は、各収納部を流通する前記冷却液の液面近傍に形成されており、
前記冷却システムはさらに、
前記少なくとも1つの電子機器が有する少なくとも1つの発熱体に熱的に接続される沸騰冷却装置であって、沸点T1を有する第1の冷却液が封入されている沸騰冷却装置と、
前記第1の冷却液の沸点T1と同じ又は前記第1の冷却液の沸点T1よりも低い沸点T3(T3=T1又はT3<T1)を有する第3の冷媒が封入されている第1の熱交換器とを有し、
前記複数の収納部の各々には、前記第1の冷却液の沸点T1と同じ又は前記第1の冷却液の沸点T1よりも高い沸点T2(T2=T1又はT2>T1)を有する第2の冷却液が入れられ、前記沸騰冷却装置及び前記少なくとも1つの電子機器が各収納部内の前記第2の冷却液中に浸漬されて直接冷却され、
前記第1の熱交換器が各収納部内の前記第2の冷却液中の表層部に浸漬されている、
冷却システム。
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PCT/JP2015/060031 WO2016157396A1 (ja) | 2015-03-30 | 2015-03-30 | 電子機器の冷却システム |
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EP (1) | EP3279764A4 (ja) |
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JP6939034B2 (ja) * | 2017-04-05 | 2021-09-22 | 富士通株式会社 | 冷却システム、冷却装置、及び電子システム |
JP7019981B2 (ja) * | 2017-06-30 | 2022-02-16 | 富士通株式会社 | 冷却装置、冷却システム及び電子装置の冷却方法 |
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- 2015-03-30 JP JP2016507718A patent/JP5956099B1/ja not_active Expired - Fee Related
- 2015-03-30 EP EP15887549.2A patent/EP3279764A4/en not_active Withdrawn
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Also Published As
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US10123454B2 (en) | 2018-11-06 |
EP3279764A4 (en) | 2018-12-05 |
JPWO2016157396A1 (ja) | 2017-04-27 |
EP3279764A1 (en) | 2018-02-07 |
WO2016157396A1 (ja) | 2016-10-06 |
US20180092243A1 (en) | 2018-03-29 |
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