JP6064083B1 - 電子機器の冷却システム - Google Patents
電子機器の冷却システム Download PDFInfo
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- JP6064083B1 JP6064083B1 JP2016507720A JP2016507720A JP6064083B1 JP 6064083 B1 JP6064083 B1 JP 6064083B1 JP 2016507720 A JP2016507720 A JP 2016507720A JP 2016507720 A JP2016507720 A JP 2016507720A JP 6064083 B1 JP6064083 B1 JP 6064083B1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
100 電子機器
110 プロセッサ
111 ダイ(チップ)
112 ヒートスプレッダ
120 ボード
200、300、400 沸騰冷却装置
210 密閉容器
211 受熱側
212 放熱側
220 放熱部材(放熱フィン)
10a 開放空間
11 第1の冷却液
12 冷却槽
12a 底壁
12b 側壁
13 第2の冷却液
13a、13b、13c、13d、13e 内部隔壁
14a、14b、14c、14d、14e 内部隔壁
15aa、15ab、15ac、15ad、15ba、15bb、15bc、15bd、15ca、15cb、15cc、15cd、15da、15db、15dc、15dd 収納部
16 入口
16aa、16ab、16ac、16ad、16ba、16bb、16bc、16bd、16ca、16cb、16cc、16cd、16da、16db、16dc、16dd 流入開口
17aa、17ab、17ac、17ad、17ae、17ba、17bb、17bc、17bd、17be、17ca、17cb、17cc、17cd、17ce、17da、17db、17dc、17dd、17de、17ea、17eb、17ec、17ed、17ee 流出開口
170 流出管
171 小孔
18 出口
18aa、18ab、18ac、18ad、18ae、18ba、18bb、18bc、18bd、18be、18ca、18cb、18cc、18cd、18ce、18da、18db、18dc、18dd、18de、18ea、18eb、18ec、18ed、18ee 底部開口
19 液面
20 天板
21 導液板
22、500、600 第1の熱交換器
22aa、22ab、22ac、22ad、22ba、22bb、22bc、22bd、22ca、22cb、22cc、22cd、22da、22db、22dc、22dd 分散型の第1の熱交換器
311、312 伝熱プレート
321、421 高温側流路
322、422 低温側流路
221、301、401 高温側流路の入口
222、302、402 高温側流路の出口
223、303、403 低温側流路の入口
224、304、404 低温側流路の出口
423 金属平板の壁
24 第2の熱交換器
26 第1の流通路
30 第2の流通路 40 ポンプ
50 流量調整バルブ
70 流量計
90 第3の熱交換器
Claims (9)
- 電子機器を冷却液中に浸漬して直接冷却する、冷却システムであって、
少なくとも1つの発熱体を有する電子機器の前記発熱体に熱的に接続される沸騰冷却装置であって、沸点T1を有する第1の冷却液が封入されている沸騰冷却装置と、
前記第1の冷却液の沸点T1と同じ又は前記第1の冷却液の沸点T1よりも高い沸点T2(T2=T1又はT2>T1)を有する第2の冷却液が入れられた冷却槽であって、前記沸騰冷却装置及び前記電子機器が前記第2の冷却液中に浸漬されて直接冷却される冷却槽と、
狭い隙間又は微小流路の集合体からなり前記第2の冷却液が通る高温側流路と、狭い隙間又は微小流路の集合体からなり前記第2の冷却液の沸点T2と同じ又は前記第2の冷却液の沸点T2よりも低い沸点T3(T3=T2又はT3<T2)を有する第3の冷媒が通る低温側流路とが、壁を隔てて交互に設けられている第1の熱交換器であって、前記第2の冷却液から前記第3の冷媒に熱を伝える第1の熱交換器と、
前記冷却槽内で暖められた前記第2の冷却液を、前記第1の熱交換器の前記高温側流路の入口に向けて圧送するポンプと、
を含み、
前記冷却槽はさらに、前記冷却槽の上部開口に対して着脱可能又は開閉可能に取り付けられた天板を有し、該天板が前記第1の熱交換器を保持している、冷却システム。 - 前記沸騰冷却装置は、受熱側と放熱側を有する密閉容器と、前記放熱側に設けられた放熱部材とを有し、前記沸騰冷却装置及び前記電子機器が前記第2の冷却液中に浸漬されるとき、前記放熱側が前記受熱側より上に位置するように前記発熱体に熱的に接続されている、請求項1に記載の冷却システム。
- 前記第1の冷却液の沸点が100℃以下であり、前記第2の冷却液の沸点が150℃以上であり、前記第3の冷媒の沸点が50℃以下である、請求項1又は2に記載の冷却システム。
- 前記第1の冷却液及び/又は前記第3の冷媒が、主成分としてフッ化炭素化合物を含む、請求項3に記載の冷却システム。
- 前記第2の冷却液が、主成分として完全フッ素化物を含む、請求項3に記載の冷却システム。
- 前記第1の熱交換器が、プレート式熱交換器、又はマイクロチャネル熱交換器である、請求項1に記載の冷却システム。
- 前記冷却槽の外部に置かれた、前記第3の冷媒を冷やす第2の熱交換器をさらに有し、前記第1の熱交換器の前記低温側流路の入口及び出口と、前記第2の熱交換器とは、第1の流通路により連結されている、請求項1に記載の冷却システム。
- 前記冷却槽の外部に置かれた、前記第2の冷却液を冷やす第3の熱交換器をさらに有し、前記冷却槽の前記第2の冷却液の入口及び出口と、前記第1の熱交換器の前記高温側流路の入口及び出口と、前記ポンプと、前記第3の熱交換器とは、第2の流通路により連結されている、請求項1に記載の冷却システム。
- 複数の電子機器を冷却液中に浸漬して直接冷却する冷却システムであって、
底壁及び側壁によって形成される開放空間を有する冷却槽と、
前記冷却槽内に複数の内部隔壁を設けることにより前記開放空間を分割して形成される、配列された複数の収納部であって、各収納部に少なくとも1つの電子機器を収納するための収納部と、
前記複数の収納部の各々に形成される、冷却液の流入開口及び流出開口と、
を有し、
前記流入開口は、各収納部の底部又は側面に形成され、前記流出開口は、各収納部を流通する前記冷却液の液面近傍に形成されており、
前記冷却システムはさらに、
前記少なくとも1つの電子機器が有する少なくとも1つの発熱体に熱的に接続される沸騰冷却装置であって、沸点T1を有する第1の冷却液が封入されている沸騰冷却装置と、
狭い隙間又は微小流路の集合体からなり前記第1の冷却液の沸点T1と同じ又は前記第1の冷却液の沸点T1よりも高い沸点T2(T2=T1又はT2>T1)を有する第2の冷却液が通る高温側流路と、狭い隙間又は微小流路の集合体からなり前記第2の冷却液の沸点T2と同じ又は前記第2の冷却液の沸点T2よりも低い沸点T3(T3=T2又はT3<T2)を有する第3の冷媒が通る低温側流路とが、壁を隔てて交互に設けられている第1の熱交換器であって、前記第2の冷却液から前記第3の冷媒に熱を伝える第1の熱交換器と、
前記冷却槽内で暖められた前記第2の冷却液を、前記第1の熱交換器の前記高温側流路の入口に向けて圧送するポンプと、を有し、
前記冷却槽はさらに、前記冷却槽の上部開口に対して着脱可能又は開閉可能に取り付けられた天板を有し、該天板が前記第1の熱交換器を保持しており、
前記複数の収納部の各々において、前記沸騰冷却装置及び前記少なくとも1つの電子機器が各収納部内の前記第2の冷却液中に浸漬されて直接冷却される、
冷却システム。
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