GB2617193B - High thermal capacity heat sink - Google Patents

High thermal capacity heat sink Download PDF

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Publication number
GB2617193B
GB2617193B GB2204760.9A GB202204760A GB2617193B GB 2617193 B GB2617193 B GB 2617193B GB 202204760 A GB202204760 A GB 202204760A GB 2617193 B GB2617193 B GB 2617193B
Authority
GB
United Kingdom
Prior art keywords
heat sink
high thermal
thermal capacity
capacity heat
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2204760.9A
Other versions
GB2617193A (en
GB202204760D0 (en
Inventor
Edmunds Neil
Cushen Alexander
Heyes Oliver
Amos David
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iceotope Group Ltd
Original Assignee
Iceotope Group Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iceotope Group Ltd filed Critical Iceotope Group Ltd
Priority to GB2204760.9A priority Critical patent/GB2617193B/en
Publication of GB202204760D0 publication Critical patent/GB202204760D0/en
Priority to PCT/GB2023/050794 priority patent/WO2023187355A1/en
Publication of GB2617193A publication Critical patent/GB2617193A/en
Application granted granted Critical
Publication of GB2617193B publication Critical patent/GB2617193B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB2204760.9A 2022-04-01 2022-04-01 High thermal capacity heat sink Active GB2617193B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2204760.9A GB2617193B (en) 2022-04-01 2022-04-01 High thermal capacity heat sink
PCT/GB2023/050794 WO2023187355A1 (en) 2022-04-01 2023-03-28 High thermal capacity heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2204760.9A GB2617193B (en) 2022-04-01 2022-04-01 High thermal capacity heat sink

Publications (3)

Publication Number Publication Date
GB202204760D0 GB202204760D0 (en) 2022-05-18
GB2617193A GB2617193A (en) 2023-10-04
GB2617193B true GB2617193B (en) 2024-04-10

Family

ID=81581424

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2204760.9A Active GB2617193B (en) 2022-04-01 2022-04-01 High thermal capacity heat sink

Country Status (2)

Country Link
GB (1) GB2617193B (en)
WO (1) WO2023187355A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980001000A1 (en) * 1978-11-07 1980-05-15 K Sharp Cooling of surfaces adjacent molten metal
US20020056908A1 (en) * 1999-11-12 2002-05-16 Michael Philip Brownell Heatpipesink having integrated heat pipe and heat sink
US20090260777A1 (en) * 2008-04-21 2009-10-22 Hardcore Computer, Inc. case and rack system for liquid submersion cooling of electronic devices connected in an array
US20100226094A1 (en) * 2009-03-09 2010-09-09 Hardcore Computer, Inc. Gravity assisted directed liquid cooling
US20160227672A1 (en) * 2015-01-29 2016-08-04 Cooler Master Co., Ltd. Water-cooling heat dissipation device and water block thereof
CN216058098U (en) * 2021-10-27 2022-03-15 姚胜南 Cooling device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780928A (en) * 1994-03-07 1998-07-14 Lsi Logic Corporation Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices
US6411512B1 (en) 1999-06-29 2002-06-25 Delta Engineers High performance cold plate
US8345423B2 (en) * 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
TWI836706B (en) 2017-09-06 2024-03-21 英商艾瑟歐托普集團有限公司 Heat sink, heat sink arrangement and module for liquid immersion cooling
CN110996610B (en) * 2019-11-06 2021-08-24 上海理工大学 Heat pipe data center heat sink under water

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980001000A1 (en) * 1978-11-07 1980-05-15 K Sharp Cooling of surfaces adjacent molten metal
US20020056908A1 (en) * 1999-11-12 2002-05-16 Michael Philip Brownell Heatpipesink having integrated heat pipe and heat sink
US20090260777A1 (en) * 2008-04-21 2009-10-22 Hardcore Computer, Inc. case and rack system for liquid submersion cooling of electronic devices connected in an array
US20100226094A1 (en) * 2009-03-09 2010-09-09 Hardcore Computer, Inc. Gravity assisted directed liquid cooling
US20160227672A1 (en) * 2015-01-29 2016-08-04 Cooler Master Co., Ltd. Water-cooling heat dissipation device and water block thereof
CN216058098U (en) * 2021-10-27 2022-03-15 姚胜南 Cooling device

Also Published As

Publication number Publication date
GB2617193A (en) 2023-10-04
WO2023187355A1 (en) 2023-10-05
GB202204760D0 (en) 2022-05-18

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