CN110996610B - Heat pipe data center heat sink under water - Google Patents
Heat pipe data center heat sink under water Download PDFInfo
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- CN110996610B CN110996610B CN201911076597.7A CN201911076597A CN110996610B CN 110996610 B CN110996610 B CN 110996610B CN 201911076597 A CN201911076597 A CN 201911076597A CN 110996610 B CN110996610 B CN 110996610B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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Abstract
The invention provides a cooling device for an underwater heat pipe data center, which is used for cooling IT equipment and comprises: the heat exchange bin is internally inserted with a plurality of heat pipes, and the heat pipes are divided into an upper condensation section and a lower evaporation section; the heat exchange fins are sleeved outside the heat pipe and used for increasing the heat exchange area; the server rack is arranged inside the heat exchange bin and used for placing IT equipment; the immersed cooling liquid is arranged inside the heat exchange bin and used for exchanging heat for the IT equipment; and the support frame is arranged at the bottom of the heat exchange bin and used for supporting the heat exchange bin. The cooling device for the underwater heat pipe data center is simple in structure and convenient to use, and can be used in seawater or lake water with constant temperature all the year round by aiming at a chip-level immersed heat exchange mode.
Description
Technical Field
The invention relates to a cooling device, in particular to a cooling device for an underwater heat pipe data center.
Background
With the development of 5G technology, artificial intelligence and big data in China, a data center will have huge requirements in a future period of time, and the data center runs uninterruptedly all day long, and belongs to a high-energy-consumption system. The literature shows that the global data center power consumption is expected to account for 5% of the total global power usage in 2020, with about 40% being used to power its cooling systems. With the development of technology, server efficiency is gradually increased and the size is still decreasing, so that the heat load in a unit space is continuously increasing. Due to insufficient local heat dissipation and dense server rack layout, energy consumption of the data center may increase dramatically. Therefore, effective thermal management of high power electronics is a major research direction in cooling data centers.
Data center cooling can be classified into air cooling or liquid cooling according to the type of cooling system, and mainly uses an air cooling method, and is limited by air cooling, and the unit heat flux density of IT equipment is increasing, so that the liquid cooling method is more and more emphasized. In the case of air recirculation and short circuiting of the air flow in an air cooling system, the occurrence of local over-temperature will have a significant impact on the thermal management and energy efficiency of the heat dissipation infrastructure. Such inefficiencies can be optimized by utilizing various thermal management and efficiency enhancement techniques, for example, in terms of device chips, servers, racks, static chambers, rooms, and the like. The liquid cooling data center has various cooling modes such as immersion cooling, jet cooling, spray cooling and indirect liquid cooling, namely single-phase cooling, two-phase cooling, heat pipe cooling and the like.
Air cooling equipment is various in types, mainly comprises a machine room air conditioner, a blower, a special air supply/return channel and the like, and generally needs to isolate a cold channel and a hot channel in order to improve the operating efficiency of an air cooling system. At present, relatively more researches are conducted on air cooling type data centers, and the low-efficiency phenomena such as air flow recirculation and the like are mainly avoided through researching air supply modes. Due to the maturity of refrigeration technology and the perfection of indoor air conditioning equipment, air cooling is widely applied to the market by virtue of the principle of the air cooling. However, the air cooling system has a complex structural design, high initial investment cost, low space utilization rate, low air heat exchange efficiency and the like, which influence the further development.
Liquid cooling has a high heat exchange efficiency, but places high demands on the arrangement of the heat exchangers. At present, IT equipment in a data center is continuously upgraded and updated, and along with the progress of technology, the size of the IT equipment is continuously reduced under the condition of ensuring the same computing efficiency and storage capacity. Although the heat generated on a single processor chip of a server is not large, the heat flux density of the chip is multiplied due to the continuous reduction of the volume of the chip, and how to rapidly take away the heat of the microchip is the key point. At present, IBM and Intel corporation successively proposed liquid cooling devices directly embed small-sized pipelines inside a server to be closely attached to a chip, directly exchange heat with the chip through a heat conduction mode by cooling liquid, and accurately control the temperature of the server by adjusting the flow rate and the temperature of the liquid. Therefore, the heat exchanger is relatively complex in structure, and meanwhile, the flowing of cooling water needs the kinetic energy provided by the water pump to drive heat exchange.
Disclosure of Invention
The invention is made to solve the above problems, and an object of the invention is to provide a cooling device for an underwater heat pipe data center.
The invention provides an underwater heat pipe data center cooling device, which is used for cooling IT equipment and has the characteristics that: the heat exchange bin is internally inserted with a plurality of heat pipes, and the heat pipes are divided into an upper condensation section and a lower evaporation section; the heat exchange fins are sleeved outside the heat pipe and used for increasing the heat exchange area; the server rack is arranged inside the heat exchange bin and used for placing IT equipment; the immersed cooling liquid is arranged inside the heat exchange bin and used for exchanging heat for the IT equipment; and the support frame is arranged at the bottom of the heat exchange bin and used for supporting the heat exchange bin.
The underwater heat pipe data center cooling device provided by the invention can also have the following characteristics: the condensation section is a part of the heat pipe extending out of the heat exchange bin, the condensation section is in contact with seawater or river water to exchange heat, the evaporation section is a part of the heat pipe in the heat exchange bin, and the evaporation section exchanges heat with the immersed cooling liquid.
The underwater heat pipe data center cooling device provided by the invention can also have the following characteristics: wherein the immersion cooling liquid is fluoride or fluorohydride.
The underwater heat pipe data center cooling device provided by the invention can also have the following characteristics: the server rack is a cross rack which is crossed with each other, and the heat pipes are distributed in the central position of the heat exchange bin and four crossed corners of the server rack.
The underwater heat pipe data center cooling device provided by the invention can also have the following characteristics: the working medium in the heat pipe is selected according to the working temperature of the IT equipment.
Action and Effect of the invention
According to the underwater heat pipe data center cooling device, the heat exchange bin is arranged, so that the heat pipe can be inserted into the heat exchange bin, and the heat exchange fins and the immersed cooling liquid are arranged, so that heat exchange can be carried out, and the temperature of IT equipment is controlled; because the bottom in heat transfer storehouse is provided with the support frame, so can guarantee the stability of device, can also increase the heat transfer area of heat transfer storehouse and external rivers, and then guaranteed the heat transfer between heat transfer storehouse bottom and sea water or the river water.
In addition, the cooling device for the underwater heat pipe data center combines the characteristics of heat pipe refrigeration: the chip-scale submerged heat exchange device has the advantages of no moving parts, no energy consumption, simple structure, two-phase heat exchange and the like, and can be used in seawater or lake water with constant temperature all the year round by aiming at a chip-scale submerged heat exchange mode.
Therefore, the underwater heat pipe data center cooling device simplifies the structure of the system, greatly improves the space utilization efficiency of the device in the embodiment by combining liquid cooling, saves energy consumption equipment such as a machine room air conditioner, a cooling water pump and an air supply device, and effectively reduces the noise and the PUE value of the system.
Drawings
FIG. 1 is a schematic perspective view of a cooling device of an underwater heat pipe data center according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of an embodiment of an underwater heat pipe data center cooling device of the present invention;
FIG. 3 is a top view of an embodiment of an underwater heat pipe data center cooling device of the present invention;
FIG. 4 is a schematic structural diagram of the floating type underwater heat pipe data center cooling device of the present invention.
Detailed Description
In order to make the technical means and functions of the present invention easy to understand, the present invention is specifically described below with reference to the embodiments and the accompanying drawings.
Example (b):
as shown in fig. 1 to fig. 3, an underwater heat pipe data center cooling device 100 of the present embodiment includes: the heat exchange device comprises a heat exchange bin 1, heat exchange fins 2, a server rack 3, immersion cooling liquid 4 and a support frame 5.
A plurality of heat pipes 6 are inserted into the heat exchange bin 1, and the heat pipes 6 are divided into an upper condensation section and a lower evaporation section.
In this embodiment, the condensation section is the part of heat pipe 6 that stretches out heat transfer storehouse 1, and the condensation section contacts with sea water or river water and carries out the heat transfer, and the evaporation zone is the part of heat pipe 6 in heat transfer storehouse 1, and the evaporation section carries out the heat transfer with submergence coolant liquid 4.
In this embodiment, the working medium in the heat pipe is selected according to the working temperature of the IT device, and when the working temperature is 20 ℃, the working medium with the phase transition temperature point of about 10 ℃ should be selected.
In this embodiment, the heat pipes 6 are distributed in the central position of the heat exchange bin 1 and four crossed corners of the server rack 3, the central position is provided with 8 heat pipes 6, every two heat pipes 6 are adjacently arranged, every corner is provided with 4 heat pipes, every two heat pipes are adjacently arranged, and an interval is left between the adjacent heat pipes, in addition, the heat pipes 6 can also be arranged in an equidistant circumference manner.
The heat exchange fins 2 are sleeved outside the heat pipe 6 and used for increasing the heat exchange area and further strengthening the heat exchange effect. In addition, the quantity of heat exchange fins 2 is the size of the heat exchange area, and can be calculated and determined according to actual conditions, and only the heat exchange balance of two sides is required to be ensured, as shown in fig. 2, the heat exchange fins 2 can be sleeved only on the outer side of the condensation section of the heat pipe 6, or when the heat exchange effect is required to be enhanced, the heat exchange fins 2 can be sleeved on the outer side of the evaporation section of the heat pipe 6.
In this embodiment, the heat exchange fins 2 are circular fins, and other heat exchange enhancing methods can be used in addition to the heat exchange fins 2 sleeved outside the heat pipe 6.
The server rack 3 is arranged inside the heat exchange bin 1 and used for placing IT equipment.
In this embodiment, the server racks 3 are cross racks that intersect with each other, and in addition, the server racks 3 may also be arranged in other shapes and methods, such as: the heat exchange bin 1 is directly arranged after being layered according to the disc.
The immersed cooling liquid 4 is arranged in the heat exchange bin 1 and used for exchanging heat for IT equipment and maintaining normal temperature.
In this embodiment, the immersion cooling liquid is a non-conductive liquid such as fluoride or fluorohydride.
The quantity of support frame 5 is 4, all sets up in the bottom in heat transfer storehouse 1 for support heat transfer storehouse 1, and support frame 5 had both guaranteed the stability of device, still made the heat transfer area of heat transfer storehouse 1 and external rivers increase, left sufficient space promptly for heat transfer storehouse 1 and seabed or riverbed, thereby guaranteed the heat transfer between heat transfer storehouse bottom and sea water or the river.
The working principle of the cooling device for the underwater heat pipe data center of the embodiment is as follows:
in the heat pipe data center heat sink 100 under water of this embodiment, homothermal sea water or river water and the 6 condensation segment heat exchanges of heat pipe that increase has heat transfer fin 2, the working medium condensation in the heat pipe 6 is liquid, liquid working medium flows to the 6 evaporation zone of heat pipe along 6 inner wall surfaces of heat pipe downwards, the heat evaporation that the working medium absorbs immersion coolant 4 at the evaporation zone is the gaseous state, natural convection accomplishes a circulation to the condensation segment again, and the immersion coolant 4 that is cooled is direct with the IT equipment heat convection in the server frame 3, thereby control the temperature of IT equipment.
Effects and effects of the embodiments
According to the underwater heat pipe data center cooling device related to the embodiment, the heat exchange bin is arranged, so that the heat pipe can be inserted into the heat exchange bin, and the heat exchange fins and the immersed cooling liquid are arranged, so that heat exchange can be carried out, and the temperature of IT equipment can be controlled; because the bottom in heat transfer storehouse is provided with the support frame, so can guarantee the stability of device, can also increase the heat transfer area of heat transfer storehouse and external rivers, and then guaranteed the heat transfer between heat transfer storehouse bottom and sea water or the river water.
In addition, the heat pipe data center heat sink under water of this embodiment has combined the refrigerated characteristics of heat pipe: the chip-scale submerged heat exchange device has the advantages of no moving parts, no energy consumption, simple structure, two-phase heat exchange and the like, and can be used in seawater or lake water with constant temperature all the year round by aiming at a chip-scale submerged heat exchange mode.
Therefore, the structure of the system is simplified by the underwater heat pipe data center cooling device, the space utilization efficiency of the device is greatly improved by combining liquid cooling, meanwhile, energy consumption devices such as a machine room air conditioner, a cooling water pump and an air supply device are omitted, and the noise and the PUE value of the system are effectively reduced.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention.
For example, in the above embodiment, the bottom of the heat exchange chamber is supported and replaced by a support frame, but in the present invention, the support frame at the bottom of the heat exchange chamber may be replaced by a wedge-shaped float whose top is connected by a high-strength anti-torque steel wire, so as to suspend the heat exchange chamber in water, as shown in fig. 4. When the wedge-shaped floating is adopted, a throttling effect is formed in the space of the heat pipe condensation section on the top surface of the heat exchange bin to a certain extent, namely, the local flow velocity is increased, so that the heat exchange is enhanced, the condensation of working media in the heat pipe is facilitated, and the cooling capacity is improved.
Claims (2)
1. The utility model provides an underwater heat pipe data center heat sink for cool down IT equipment, ITs characterized in that includes:
the heat exchange bin is internally inserted with a plurality of heat pipes, the heat pipes are divided into an upper condensation section and a lower evaporation section, working media in the heat pipes are selected according to the working temperature of the IT equipment, the condensation section is a part of the heat pipes extending out of the heat exchange bin, the condensation section is in contact with seawater or river water for heat exchange, the evaporation section is a part of the heat pipes in the heat exchange bin, and the evaporation section is in heat exchange with immersed cooling liquid;
the heat exchange fins are sleeved outside the heat pipe and used for increasing the heat exchange area;
the server rack is arranged inside the heat exchange bin and used for placing the IT equipment; and
the immersed cooling liquid is arranged inside the heat exchange bin and is used for exchanging heat for the IT equipment,
wherein when the underwater mode of the cooling device of the underwater heat pipe data center is sinking, the bottom of the heat exchange bin is provided with a support frame for supporting the heat exchange bin,
when the underwater heat pipe data center cooling device is floating in an underwater mode, the top of the heat exchange bin is connected with a wedge-shaped floater used for suspending the heat exchange bin in water through an anti-torque steel wire,
the server rack is a cross rack which is mutually crossed,
the heat pipes are distributed in the central positions of the heat exchange bins and in the four crossed corners of the server rack, the central positions are provided with a plurality of heat pipes, the same number of heat pipes are arranged at each corner, the heat pipes are adjacent, intervals are reserved between the heat pipes, or the heat pipes are arranged in an equidistant circle.
2. The underwater heat pipe data center cooling device of claim 1, wherein:
wherein the immersion cooling liquid is fluoride or fluorohydride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911076597.7A CN110996610B (en) | 2019-11-06 | 2019-11-06 | Heat pipe data center heat sink under water |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911076597.7A CN110996610B (en) | 2019-11-06 | 2019-11-06 | Heat pipe data center heat sink under water |
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| CN110996610A CN110996610A (en) | 2020-04-10 |
| CN110996610B true CN110996610B (en) | 2021-08-24 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340296B (en) * | 2020-09-28 | 2023-03-31 | 深圳欧特海洋科技有限公司 | Component of underwater data cabin, data cabin and seabed IDC system |
| CN114650690A (en) * | 2021-01-10 | 2022-06-21 | 深圳欧特海洋科技有限公司 | Data cabin and data center |
| CN113056167A (en) * | 2021-03-05 | 2021-06-29 | 上海菡威装备有限公司 | Liquid cooling server heat exchange equipment based on separate heat pipe heat exchanger |
| CN113099694A (en) * | 2021-04-06 | 2021-07-09 | 龚晶晶 | Terminal equipment for industrial equipment information management based on big data |
| US11533829B2 (en) | 2021-04-09 | 2022-12-20 | Microsoft Technology Licensing, Llc | Systems and methods for immersion-cooled datacenters |
| US11606878B2 (en) | 2021-04-09 | 2023-03-14 | Microsoft Technology Licensing, Llc | Systems and methods for immersion-cooled datacenters |
| CN113939169A (en) * | 2021-11-23 | 2022-01-14 | 南京航空航天大学 | Totally-enclosed intelligent green base station |
| CN114278928B (en) * | 2021-11-25 | 2023-08-15 | 北京动力机械研究所 | Air inlet flow guiding structure and method for realizing uniform flow distribution from rectangular center to periphery |
| GB2617193B (en) * | 2022-04-01 | 2024-04-10 | Iceotope Group Ltd | High thermal capacity heat sink |
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Patent Citations (4)
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| WO2018020582A1 (en) * | 2016-07-26 | 2018-02-01 | 富士通株式会社 | Cooling device and electronic device |
| CN206255168U (en) * | 2016-10-20 | 2017-06-16 | 国脉科技股份有限公司 | Architecture of base station under water |
| CN108471699A (en) * | 2018-04-16 | 2018-08-31 | 大连泰思曼科技有限公司 | A kind of deep-sea power supply cooling system |
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