JP2011165856A - 炭化珪素半導体装置の製造方法 - Google Patents
炭化珪素半導体装置の製造方法 Download PDFInfo
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 66
- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 46
- 239000012535 impurity Substances 0.000 claims abstract description 35
- 150000002500 ions Chemical class 0.000 claims abstract description 19
- 238000002513 implantation Methods 0.000 claims description 77
- 238000005468 ion implantation Methods 0.000 description 26
- 239000010410 layer Substances 0.000 description 15
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000005684 electric field Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/0455—Making n or p doped regions or layers, e.g. using diffusion
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
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Abstract
【解決手段】本発明の炭化珪素半導体装置の製造方法は、(a)炭化珪素半導体層上に複数の単位マスクよりなる注入マスクを形成する工程と、(b)注入マスクを用いて炭化珪素半導体層に所定の注入エネルギーで所定のイオンを注入する工程と、を備える。工程(a)では、単位マスク内の任意の点から単位マスクの端までの距離を、所定の注入エネルギーで所定のイオンを炭化珪素に注入した場合の散乱距離以下とし、単位マスクの寸法と配置間隔が異なる複数の領域を持つように注入マスクを形成する。
【選択図】図2
Description
図1は、炭化珪素にAlを700keVでイオン注入したときのシミュレーション結果を示している。図より、炭化珪素中にイオン注入されたAlは、深さ方向と垂直な方向に約250nm散乱する。したがって、Alを700keV以上でイオン注入した場合、深さ方向と垂直な方向に250nm以上散乱する。
実施の形態1の炭化珪素半導体装置の製造方法によれば、既に述べたとおり以下の効果を奏する。すなわち、実施の形態1の炭化珪素半導体装置の製造方法は、(a)炭化珪素半導体層上に複数の単位マスクよりなる注入マスクを形成する工程と、(b)注入マスクを用いて炭化珪素半導体層に所定の注入エネルギーで所定のイオンを注入する工程と、を備える。工程(a)では、単位マスク内の任意の点から単位マスクの端までの距離を、所定の注入エネルギーで所定のイオンを炭化珪素に注入した場合の散乱距離以下とし、単位マスクの寸法と配置間隔が異なる複数の領域を持つように注入マスクを形成する。これにより、熱拡散が殆ど生じない炭化珪素半導体層において、不純物濃度の異なる複数の領域を一度のマスク工程とイオン注入工程で形成することが出来る。
Claims (11)
- (a)炭化珪素半導体層上に複数の単位マスクよりなる注入マスクを形成する工程と、
(b)前記注入マスクを用いて前記炭化珪素半導体層に所定の注入エネルギーで所定のイオンを注入する工程と、を備え、
前記工程(a)は、前記単位マスク内の任意の点から前記単位マスクの端までの距離を、前記所定の注入エネルギーで前記所定のイオンを炭化珪素に注入した場合の散乱距離以下とし、前記単位マスクの寸法と配置間隔が異なる複数の領域を持つように前記注入マスクを形成する工程である、炭化珪素半導体装置の製造方法。 - 前記工程(a)は、前記単位マスク内の任意の点から前記単位マスクの端までの距離を250nm以下とする工程であり、
前記工程(b)は、前記注入マスクに対して700keV以上でAlイオンを注入する工程である、請求項1に記載の炭化珪素半導体装置の製造方法。 - 前記工程(a)は、ストライプ状の前記単位マスクよりなる注入マスクを形成する工程である、請求項2に記載の炭化珪素半導体装置の製造方法。
- 前記工程(a)は、円状の前記単位マスクよりなる注入マスクを形成する工程である、請求項2に記載の炭化珪素半導体装置の製造方法。
- 前記工程(a)は、長方形形状の前記単位マスクよりなる注入マスクを形成する工程である、請求項2に記載の炭化珪素半導体装置の製造方法。
- 前記工程(a)は、十字形の前記単位マスクよりなる注入マスクを形成する工程である、請求項2に記載の炭化珪素半導体装置の製造方法。
- 終端部にJTE構造を持つ炭化珪素半導体装置の製造方法であって、
前記JTE構造を構成する不純物濃度の異なる複数の領域を、請求項1〜6のいずれかに記載の炭化珪素半導体装置の製造方法によって形成する、炭化珪素半導体装置の製造方法。 - 前記炭化珪素半導体装置はショットキーダイオードであることを特徴とする、請求項7に記載の炭化珪素半導体装置の製造方法。
- 前記炭化珪素半導体装置はJBS又はMPS構造のショットキーダイオードであることを特徴とする、請求項8に記載の炭化珪素半導体装置の製造方法。
- 前記炭化珪素半導体装置はMOSFETであることを特徴とする、請求項7に記載の炭化珪素半導体装置の製造方法。
- 前記炭化珪素半導体装置はIGBTであることを特徴とする、請求項7に記載の炭化珪素半導体装置の製造方法。
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JP2010026406A JP5601849B2 (ja) | 2010-02-09 | 2010-02-09 | 炭化珪素半導体装置の製造方法 |
US12/899,061 US8258052B2 (en) | 2010-02-09 | 2010-10-06 | Method of manufacturing silicon carbide semiconductor device |
CN201010541286.6A CN102148144B (zh) | 2010-02-09 | 2010-11-05 | 碳化硅半导体装置的制造方法 |
KR1020110003795A KR101184270B1 (ko) | 2010-02-09 | 2011-01-14 | 탄화 규소 반도체장치의 제조방법 |
DE102011003660.1A DE102011003660B4 (de) | 2010-02-09 | 2011-02-04 | Verfahren zum Herstellen einer Siliziumcarbidhalbleitervorrichtung |
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JP2010026406A JP5601849B2 (ja) | 2010-02-09 | 2010-02-09 | 炭化珪素半導体装置の製造方法 |
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Cited By (21)
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WO2013046544A1 (ja) * | 2011-09-27 | 2013-04-04 | 株式会社デンソー | 半導体装置 |
JP2013138171A (ja) * | 2011-12-01 | 2013-07-11 | Denso Corp | 半導体装置 |
JP2013191716A (ja) * | 2012-03-14 | 2013-09-26 | Hitachi Ltd | SiC素子搭載パワー半導体モジュール |
WO2013179728A1 (ja) * | 2012-05-31 | 2013-12-05 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
WO2013179729A1 (ja) * | 2012-05-31 | 2013-12-05 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
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JP2019083317A (ja) * | 2017-10-27 | 2019-05-30 | インフィニオン テクノロジーズ アクチエンゲゼルシャフトInfineon Technologies AG | フィールドゾーンを含む終端構造を有する半導体デバイスおよびその製造方法 |
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US8258052B2 (en) | 2012-09-04 |
CN102148144B (zh) | 2014-03-12 |
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KR20110093615A (ko) | 2011-08-18 |
KR101184270B1 (ko) | 2012-09-21 |
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