JP5800095B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5800095B2 JP5800095B2 JP2014536549A JP2014536549A JP5800095B2 JP 5800095 B2 JP5800095 B2 JP 5800095B2 JP 2014536549 A JP2014536549 A JP 2014536549A JP 2014536549 A JP2014536549 A JP 2014536549A JP 5800095 B2 JP5800095 B2 JP 5800095B2
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- 239000004065 semiconductor Substances 0.000 title claims description 153
- 238000002513 implantation Methods 0.000 claims description 231
- 239000012535 impurity Substances 0.000 claims description 218
- 230000005684 electric field Effects 0.000 claims description 177
- 230000002093 peripheral effect Effects 0.000 claims description 41
- 238000002347 injection Methods 0.000 claims description 35
- 239000007924 injection Substances 0.000 claims description 35
- 150000002500 ions Chemical class 0.000 claims description 20
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 238000005468 ion implantation Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 39
- 230000015556 catabolic process Effects 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 238000004088 simulation Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 239000007943 implant Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Description
まず、本発明の実施の形態1にかかる半導体装置であるショットキーダイオード100の構成を説明する。以下において、第1導電型の半導体をn型の半導体とし、第2導電型の半導体をp型の半導体として説明するが、これに限定されるものではなく、第1導電型の半導体をp型の半導体とし第2導電型の半導体をn型の半導体としてもよい。また、以下において、半導体装置である炭化珪素(SiC)からなる縦型構造のショットキーダイオードに本発明を適用する場合について説明するが、MOSFET(Metal Oxide Semiconductor Field Effect Transistor)等の他の半導体装置に用いることもできる。さらに、以下の説明において、内側とは半導体装置の中央部側である活性領域側を指すものとし、外側とは半導体装置の外周側である終端領域側を指すものとする。
実施の形態1においては、2回の注入工程によって形成することができる終端領域60を備えた半導体装置について説明したが、これに限定されることなく、3回の注入工程によって形成された終端領域を備えることとしてもよい。以下、実施の形態2にかかる半導体装置として、3回の注入工程で形成される終端領域60を備えたショットキーダイオード102について説明する。なお、実施の形態2にかかる半導体装置において、実施の形態1にかかる半導体装置と同一または対応する部分についての説明は省略し、相違する部分について説明を行う。
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第一の注入領域12のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域からなる電界緩和領域(電界緩和領域30B)
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域からなる電界緩和領域
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第一の注入領域12のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第二の注入領域13のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第三の注入領域22のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第一の注入領域12のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域(電界緩和領域30C)
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第二の注入領域13のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域(電界緩和領域30D)
・第一の注入領域12のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第一の注入領域12のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域
・第一の注入領域12のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第三の注入領域22のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域
・第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第二の注入領域13のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域
・第二の注入領域13のドーズ量と第三の注入領域12のドーズ量とを合わせたドーズ量で定まる不純物濃度の小領域と、第三の注入領域22のドーズ量で定まる不純物濃度の小領域からなる電界緩和領域(電界緩和領域30E)
・第一の注入領域12のドーズ量で定まる不純物濃度の電界緩和領域
・第二の注入領域13のドーズ量で定まる不純物濃度の電界緩和領域
・第三の注入領域22のドーズ量で定まる不純物濃度の電界緩和領域(電界緩和領域30F)
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量とを合わせたドーズ量で定まる不純物濃度の電界緩和領域
・第一の注入領域12のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の電界緩和領域
・第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の電界緩和領域
・第一の注入領域12のドーズ量と第二の注入領域13のドーズ量と第三の注入領域22のドーズ量とを合わせたドーズ量で定まる不純物濃度の電界緩和領域
Claims (12)
- 第一導電型の半導体層と、
前記半導体層の表面の一部に形成され、かつ、第二導電型で第一の不純物濃度である第一の小領域と第二導電型で前記第一の不純物濃度よりも低い第二の不純物濃度である第二の小領域とがそれぞれ交互に設けられた第一の電界緩和領域と、
前記第一の電界緩和領域の外周側に向かって前記第一の電界緩和領域を囲むように形成され、かつ、第二導電型で前記第一の不純物濃度以上の第三の不純物濃度である複数の第三の小領域と第二導電型で前記第二の不純物濃度よりも低い第四の不純物濃度である複数の第四の小領域とがそれぞれ交互に設けられた第二の電界緩和領域と、
を備えたことを特徴とする半導体装置。 - 前記第三の不純物濃度は、前記第一の不純物濃度であり、
前記第一の不純物濃度は、前記第二の不純物濃度と前記第四の不純物濃度の和である、
ことを特徴とする請求項1に記載の半導体装置。 - 前記複数の第一の小領域の幅は外周側に向かうにつれて小さくなる、
ことを特徴とする請求項1又は2に記載の半導体装置。 - 前記複数の第二の小領域の幅は外周側に向かうにつれて大きくなる、
ことを特徴とする請求項1ないし3のいずれか1項に記載の半導体装置。 - 前記複数の第三の小領域の幅は外周側に向かうにつれて小さくなる、
ことを特徴とする請求項1ないし4のいずれか1項に記載の半導体装置。 - 前記複数の第四の小領域の幅は外周側に向かうにつれて大きくなる、
ことを特徴とする請求項1ないし5のいずれか1項に記載の半導体装置。 - 前記半導体層は炭化珪素半導体である、
ことを特徴とする請求項1ないし6のいずれか1項に記載の半導体装置。 - 第二導電型の不純物を前記半導体層にイオン注入することにより形成される第一の注入領域及び第二の注入領域を備え、
前記第一の注入領域は、前記第一の小領域と前記第二の小領域と前記第三の小領域とを含み、
前記第二の注入領域は、前記第一の小領域と前記第三の小領域と前記第四の小領域とを含み、
前記第一の注入領域は、前記第二の注入領域と前記イオン注入の深さが異なる、
ことを特徴とする請求項1ないし7のいずれか1項に記載の半導体装置。 - 前記半導体層内において、前記第一の電界緩和領域の内側に設けられ、前記第一の注入領域及び前記第二の注入領域に含まれる、第二導電型のガードリングと、
をさらに備えた請求項8に記載の半導体装置。 - 前記ガードリング、前記第一の電界緩和領域及び前記第二の電界緩和領域が形成された前記半導体層の表面にエピタキシャル成長された、前記半導体層よりも高い不純物濃度を有する第一導電型の領域をさらに備えた、
ことを特徴とする請求項9に記載の半導体装置。 - 前記ガードリング、前記第一の電界緩和領域及び前記第二の電界緩和領域が形成された前記半導体層の表面に第一導電型の不純物イオンを注入することにより形成された、前記半導体層よりも高い不純物濃度を有する第一導電型の領域をさらに備えた、
ことを特徴とする請求項9に記載の半導体装置。 - 前記半導体装置は、MOSFETである、
ことを特徴とする請求項1ないし11のいずれか1項に記載の半導体装置。
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