JP2009135437A5 - - Google Patents

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Publication number
JP2009135437A5
JP2009135437A5 JP2008258236A JP2008258236A JP2009135437A5 JP 2009135437 A5 JP2009135437 A5 JP 2009135437A5 JP 2008258236 A JP2008258236 A JP 2008258236A JP 2008258236 A JP2008258236 A JP 2008258236A JP 2009135437 A5 JP2009135437 A5 JP 2009135437A5
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Japan
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single crystal
crystal semiconductor
semiconductor substrate
substrate
layer
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JP2008258236A
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English (en)
Japanese (ja)
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JP5688203B2 (ja
JP2009135437A (ja
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Priority claimed from JP2008258236A external-priority patent/JP5688203B2/ja
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Publication of JP2009135437A5 publication Critical patent/JP2009135437A5/ja
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JP2008258236A 2007-11-01 2008-10-03 半導体基板の作製方法 Expired - Fee Related JP5688203B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008258236A JP5688203B2 (ja) 2007-11-01 2008-10-03 半導体基板の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007285559 2007-11-01
JP2007285559 2007-11-01
JP2008258236A JP5688203B2 (ja) 2007-11-01 2008-10-03 半導体基板の作製方法

Publications (3)

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JP2009135437A JP2009135437A (ja) 2009-06-18
JP2009135437A5 true JP2009135437A5 (enExample) 2011-11-04
JP5688203B2 JP5688203B2 (ja) 2015-03-25

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JP2008258236A Expired - Fee Related JP5688203B2 (ja) 2007-11-01 2008-10-03 半導体基板の作製方法

Country Status (5)

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US (1) US20090115028A1 (enExample)
JP (1) JP5688203B2 (enExample)
KR (1) KR101511070B1 (enExample)
CN (1) CN101425449B (enExample)
TW (1) TWI533363B (enExample)

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JP5654206B2 (ja) 2008-03-26 2015-01-14 株式会社半導体エネルギー研究所 Ｓｏｉ基板の作製方法及び該ｓｏｉ基板を用いた半導体装置
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JP6764305B2 (ja) 2016-10-04 2020-09-30 株式会社日本製鋼所 レーザ照射装置、半導体装置の製造方法、及び、レーザ照射装置の動作方法
CN106645809A (zh) * 2016-10-14 2017-05-10 厦门大学 一种双重包覆壳层隔绝针尖的制备方法
CN107293483A (zh) * 2017-06-09 2017-10-24 苏晋苗 一种激光芯片平坦化加工装置及方法
JP6546230B2 (ja) * 2017-08-28 2019-07-17 ファナック株式会社 機械学習装置、機械学習システム及び機械学習方法
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JP7112879B2 (ja) * 2018-05-15 2022-08-04 株式会社サイオクス 窒化物半導体積層物の製造方法、膜質検査方法および半導体成長装置の検査方法
JP2020031151A (ja) * 2018-08-23 2020-02-27 キオクシア株式会社 半導体記憶装置およびその製造方法
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CN114815329B (zh) 2018-11-08 2025-10-10 日本碍子株式会社 电光元件用的复合基板及其制造方法
JP7218056B2 (ja) * 2019-02-20 2023-02-06 株式会社ディスコ チップ及び枠体の少なくともいずれかを製造する方法
JP7336256B2 (ja) * 2019-05-10 2023-08-31 東京エレクトロン株式会社 載置台及び載置台の作製方法
CN110517981A (zh) * 2019-08-29 2019-11-29 上海新傲科技股份有限公司 器件层减薄的方法及衬底的制备方法
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JP7182577B2 (ja) * 2020-03-24 2022-12-02 株式会社Kokusai Electric 基板処理方法、半導体装置の製造方法、基板処理装置、およびプログラム
CN113008798A (zh) * 2021-03-15 2021-06-22 上海华力微电子有限公司 一种照明光路、缺陷检测装置及光强测量方法
CN113253492B (zh) * 2021-04-27 2023-01-03 苏州科韵激光科技有限公司 一种显示屏修复方法及装置
CN113552856B (zh) * 2021-09-22 2021-12-10 成都数之联科技有限公司 工艺参数根因定位方法和相关装置
JP2024066112A (ja) * 2022-11-01 2024-05-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
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