JP2008544067A - 硬化触媒、組成物、電子機器及び関連する方法 - Google Patents

硬化触媒、組成物、電子機器及び関連する方法 Download PDF

Info

Publication number
JP2008544067A
JP2008544067A JP2008518211A JP2008518211A JP2008544067A JP 2008544067 A JP2008544067 A JP 2008544067A JP 2008518211 A JP2008518211 A JP 2008518211A JP 2008518211 A JP2008518211 A JP 2008518211A JP 2008544067 A JP2008544067 A JP 2008544067A
Authority
JP
Japan
Prior art keywords
catalyst
composition
lewis acid
anhydride
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008518211A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008544067A5 (enExample
Inventor
スラウォミール ルビンスタイン
ジョン ロバート キャンベル
ライアン クリストファー ミルズ
サンディープ シュリカント トナピ
アナンス プラバクマール
Original Assignee
モーメンティブ・パフォーマンス・マテリアルズ・インク
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by モーメンティブ・パフォーマンス・マテリアルズ・インク filed Critical モーメンティブ・パフォーマンス・マテリアルズ・インク
Publication of JP2008544067A publication Critical patent/JP2008544067A/ja
Publication of JP2008544067A5 publication Critical patent/JP2008544067A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0237—Amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0244—Nitrogen containing compounds with nitrogen contained as ring member in aromatic compounds or moieties, e.g. pyridine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/12—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
    • B01J31/14—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron
    • B01J31/146—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron of boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8121—Applying energy for connecting using a reflow oven
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0106—Neodymium [Nd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Catalysts (AREA)
  • Paints Or Removers (AREA)
  • Polymerization Catalysts (AREA)
JP2008518211A 2005-06-23 2006-06-09 硬化触媒、組成物、電子機器及び関連する方法 Pending JP2008544067A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/167,847 US8048819B2 (en) 2005-06-23 2005-06-23 Cure catalyst, composition, electronic device and associated method
PCT/US2006/022587 WO2007001803A2 (en) 2005-06-23 2006-06-09 Cure catalyst, composition, electronic device and associated method

Publications (2)

Publication Number Publication Date
JP2008544067A true JP2008544067A (ja) 2008-12-04
JP2008544067A5 JP2008544067A5 (enExample) 2013-10-24

Family

ID=37074187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008518211A Pending JP2008544067A (ja) 2005-06-23 2006-06-09 硬化触媒、組成物、電子機器及び関連する方法

Country Status (8)

Country Link
US (1) US8048819B2 (enExample)
EP (2) EP2283922A3 (enExample)
JP (1) JP2008544067A (enExample)
KR (1) KR101391784B1 (enExample)
CN (2) CN102786665A (enExample)
BR (1) BRPI0612009A2 (enExample)
RU (1) RU2008102366A (enExample)
WO (1) WO2007001803A2 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099086A (ja) * 2009-10-07 2011-05-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた電子部品装置
WO2012036164A1 (ja) * 2010-09-15 2012-03-22 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
JP2013531721A (ja) * 2010-06-28 2013-08-08 ダウ グローバル テクノロジーズ エルエルシー 硬化性樹脂組成物
JP2013230431A (ja) * 2012-04-27 2013-11-14 Nippon Shokubai Co Ltd カチオン硬化触媒の製造方法
JP2013234231A (ja) * 2012-05-07 2013-11-21 Nippon Shokubai Co Ltd カチオン硬化性樹脂組成物
WO2021010394A1 (ja) * 2019-07-17 2021-01-21 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100017712A (ko) * 2007-05-09 2010-02-16 다우 글로벌 테크놀로지스 인크. 과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법
CO6030030A1 (es) * 2007-05-23 2009-04-30 Mi Llc Uso de emulsiones epoxicas inversas para estabilizacion de orificio de pozo
NO20075120L (no) * 2007-05-23 2008-11-24 Mi Llc Anvendelse av direkte epoksyemulsjoner for borehullstabilisering
WO2008147641A1 (en) * 2007-05-29 2008-12-04 Dow Global Technologies Inc. Isocyanate-epoxy formulations for improved cure control
CN101772553A (zh) 2007-08-02 2010-07-07 陶氏环球技术公司 热固性阻尼材料
EP2176348B1 (en) * 2007-08-02 2017-01-18 Dow Global Technologies LLC Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
TW200922959A (en) 2007-10-26 2009-06-01 Dow Global Technologies Inc Epoxy resin composition containing isocyanurates for use in electrical laminates
WO2009070488A1 (en) * 2007-11-29 2009-06-04 Dow Global Technologies Inc. Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
CN101878101A (zh) * 2007-11-29 2010-11-03 陶氏环球技术公司 可微波加热的单乙烯基芳族聚合物
BRPI0905387B1 (pt) * 2008-01-08 2019-08-06 Dow Global Technologies Inc. Composição curável e resina termofixa enrijecida
US7629203B2 (en) * 2008-03-31 2009-12-08 Intel Corporation Thermal interface material for combined reflow
BRPI0907275A2 (pt) 2008-04-14 2015-07-21 Dow Global Technologies Inc Processo para formar um catalisador de epóxi-imidazol sólido, catalisador de epóxi-imidazol sólido, composição curável, processo para formar uma composição curável e processo para formar uma composição termofixa
KR20110059726A (ko) * 2008-08-28 2011-06-03 다우 글로벌 테크놀로지스 엘엘씨 인-함유 화합물 및 이를 포함하는 중합체 조성물
EP2389406A1 (en) 2008-12-16 2011-11-30 Dow Global Technologies LLC Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates
EP2385974A4 (en) * 2009-01-06 2012-12-05 Dow Global Technologies Llc METAL STABILIZERS FOR EPOXY RESINS AND DISPERSION METHOD
KR20110131222A (ko) 2009-02-24 2011-12-06 다우 글로벌 테크놀로지스 엘엘씨 경화성 에폭시 수지 조성물 및 이로부터의 경화물
WO2010138346A1 (en) 2009-05-27 2010-12-02 Dow Global Technologies Inc. Polymeric glycidyl ethers reactive diluents
SG176923A1 (en) 2009-06-22 2012-01-30 Dow Global Technologies Llc Hardener composition for epoxy resins
EP2480586B1 (en) 2009-09-22 2014-11-12 Dow Global Technologies LLC Process for preparing episulfide resins
CA2770354A1 (en) 2009-09-25 2011-03-31 Dow Global Technologies Llc Curable epoxy resin compositions and composites made therefrom
JP5584301B2 (ja) 2009-09-30 2014-09-03 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂組成物
KR20120097511A (ko) 2009-11-12 2012-09-04 다우 글로벌 테크놀로지스 엘엘씨 폴리옥사졸리돈 수지
SG181461A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Epoxy resin compositions
WO2011068645A1 (en) 2009-12-02 2011-06-09 Dow Global Technologies Inc. Coating compositions
SG181485A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Composite compositions
JP2013512997A (ja) 2009-12-03 2013-04-18 ダウ グローバル テクノロジーズ エルエルシー ジビニルアレーンジオキシドに基づく付加物
US8975343B2 (en) 2009-12-08 2015-03-10 Dow Global Technologies Llc Hydroxyl-functional polyester resins
CN102666520B (zh) 2009-12-09 2015-05-20 陶氏环球技术有限责任公司 二乙烯基芳烃二氧化物树脂
JP2013513694A (ja) 2009-12-09 2013-04-22 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂組成物
WO2011097009A2 (en) 2010-02-02 2011-08-11 Dow Global Technologies Llc Curable epoxy resin compositions
KR20130062915A (ko) 2010-03-24 2013-06-13 다우 글로벌 테크놀로지스 엘엘씨 강인화제로서 폴리(프로필렌 옥사이드) 폴리올을 포함하는 에폭시 수지 조성물
TWI506010B (zh) 2010-05-21 2015-11-01 Dow Global Technologies Llc 用於可熱固樹脂組成物之硬化劑
CA2803851A1 (en) 2010-06-25 2011-12-29 Dow Global Technologies Llc Curable epoxy resin compositions and composites made therefrom
EP2585520A2 (en) 2010-06-25 2013-05-01 Dow Global Technologies LLC Polymer concrete composition
US20110315916A1 (en) * 2010-06-29 2011-12-29 Dow Global Technologies Inc. Curable composition
CN103635531A (zh) 2011-04-26 2014-03-12 陶氏环球技术有限责任公司 可固化组合物
RU2014110182A (ru) 2011-08-18 2015-09-27 ДАУ ГЛОБАЛ ТЕКНОЛОДЖИС ЭлЭлСи Отверждаемые полимерные композиции
JP6162698B2 (ja) 2011-08-18 2017-07-12 ブルー キューブ アイピー エルエルシー 硬化型樹脂組成物
IN2014CN03362A (enExample) 2011-11-08 2015-07-03 Dow Global Technologies Llc
EP2785762A2 (en) 2011-12-01 2014-10-08 Dow Global Technologies LLC Liquid accelerator composition for hardeners
US9006357B2 (en) * 2011-12-29 2015-04-14 3M Innovative Properties Company Curable polysiloxane composition
WO2013101740A2 (en) 2011-12-30 2013-07-04 Dow Global Technologies Llc Low temperature curable epoxy system
EP2836675A4 (en) 2012-04-09 2015-10-07 Mi Llc TRIGGERED HEATING OF DRILLING LIQUIDS BY CARBON NANOMATERIALS
CN105121493A (zh) 2012-12-14 2015-12-02 蓝立方知识产权有限责任公司 可固化组合物
KR102123710B1 (ko) 2012-12-14 2020-06-16 블루 큐브 아이피 엘엘씨 개질된 에폭시 수지
US9677371B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Fluid loss well treatment
JP6426163B2 (ja) * 2013-07-03 2018-11-21 ローディア オペレーションズ 硬化性組成物およびエポキシ熱硬化性樹脂の製造方法
EP2829570A1 (en) 2013-07-22 2015-01-28 Rhodia Operations Curable composition and process for the manufacture of an epoxy thermoset
CA2940327A1 (en) * 2014-02-24 2015-08-27 Sika Technology Ag Furan-based amines as curing agents for epoxy resins in low voc applications
WO2016053641A1 (en) 2014-09-29 2016-04-07 Blue Cube Ip Llc Adduct composition
BR112017006651B1 (pt) 2014-10-10 2022-09-13 Dow Global Technologies Llc Composição surfactante funcionalizada com epóxi, composição de resina epóxi, e, composição de dispersão de epóxi à base de água
TW201641531A (zh) 2015-04-30 2016-12-01 藍色立方體有限責任公司 硬化劑組成物
WO2017120025A1 (en) 2016-01-04 2017-07-13 Dow Global Technologies Llc Fiber composites with reduced surface roughness and methods for making them
EP3585607B1 (en) 2017-02-26 2021-12-15 Dow Global Technologies, LLC Fiber composite with reduced surface roughness and method for its manufacture
WO2019036189A1 (en) 2017-08-15 2019-02-21 Covestro Llc ADDITIVE FOR ENOUGHING EPOXY-BASED RESINS FOR USE IN OIL FIELD APPLICATIONS
TWI654218B (zh) 2018-01-08 2019-03-21 財團法人工業技術研究院 樹脂組合物與導熱材料的形成方法
US20190390066A1 (en) 2018-06-22 2019-12-26 Covestro Llc Waterborne compositions containing inorganic ion-exchangers to improve corrosion resistance
US20190390065A1 (en) 2018-06-22 2019-12-26 Covestro Llc Waterborne compositions containing organic ion-exchangers to improve corrosion resistance
US20190390064A1 (en) 2018-06-22 2019-12-26 Covestro Llc Solventborne compositions containing inorganic ion-exchangers to improve corrosion resistance
US20190390063A1 (en) 2018-06-22 2019-12-26 Covestro Llc Solventborne compositions containing organic ion-exchangers to improve corrosion resistance
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
EP3980426B1 (en) 2019-06-04 2023-04-19 Dow Silicones Corporation Bridged frustrated lewis pairs as thermal trigger for reactions between si-h and si-o-si
KR20220016899A (ko) 2019-06-04 2022-02-10 다우 실리콘즈 코포레이션 실릴 수소화물과 실록산의 열적으로 개시된 산 촉매화된 반응
KR20220016902A (ko) 2019-06-04 2022-02-10 다우 실리콘즈 코포레이션 Si-H와 Si-OR의 반응을 위한 열 트리거로서의 가교된 불완전 루이스 쌍
WO2020247338A1 (en) 2019-06-04 2020-12-10 Dow Silicones Corporation BRIDGED FRUSTRATED LEWIS PAIRS AS THERMAL TRIGGER FOR REACTIONS BETWEEN Si-H AND EPOXIDE
CN113950514B (zh) 2019-06-04 2023-01-24 美国陶氏有机硅公司 甲硅烷基氢化物与α-β不饱和酯之间的热引发酸催化反应
US12116459B2 (en) 2019-06-04 2024-10-15 Dow Silicones Corporation Thermally initiated acid catalyzed reaction between silyl hydride and silyl ether and/or silanol
US12104019B2 (en) 2019-06-04 2024-10-01 Dow Silicones Corporation Bridged frustrated Lewis pairs as thermal trigger for reactions between Si—H and alpha-beta unsaturated esters
KR102775243B1 (ko) * 2020-04-20 2025-03-04 삼성디스플레이 주식회사 표시 장치, 접합 장치 및 이를 이용하는 표시 장치 제조 방법
WO2021247210A1 (en) 2020-06-04 2021-12-09 Dow Silicones Corporation Epoxy-curable silicone release coating composition and methods for its preparation and use
CN116134074B (zh) 2020-06-24 2024-12-27 美国陶氏有机硅公司 用于由氟化芳基硼烷路易斯酸催化的甲硅烷基氢化物反应的组合物和方法
JP7748400B2 (ja) 2020-06-24 2025-10-02 ダウ シリコーンズ コーポレーション フッ素化アリールボランルイス酸によって触媒される有機ケイ素化合物とシリルヒドリドとの反応のための組成物及び方法
JP7727666B2 (ja) 2020-06-24 2025-08-21 ダウ シリコーンズ コーポレーション 多官能性オルガノシロキサンの製造方法及びそれを含有する組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0598216A (ja) * 1991-04-29 1993-04-20 Natl Starch & Chem Investment Holding Corp アクリル接着剤配合物
JPH0687948A (ja) * 1992-09-07 1994-03-29 Three Bond Co Ltd エポキシ樹脂組成物
US5721183A (en) * 1995-03-10 1998-02-24 The Dow Chemical Company Catalyst system comprising amine or phosphine adducts of tris(organyl)borane compounds
JPH11181060A (ja) * 1997-12-19 1999-07-06 Sumitomo Bakelite Co Ltd 樹脂組成物、並びにそれを用いた半導体封止材料および積層板
JP2003517009A (ja) * 1999-12-17 2003-05-20 ダウ グローバル テクノロジーズ インコーポレイティド アミンオルガノボラン錯体重合開始剤および重合性組成物
WO2003076485A2 (en) * 2002-03-05 2003-09-18 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970130A (en) * 1958-01-07 1961-01-31 Westinghouse Electric Corp Catalysts for glycidyl polyethers, products produced thereby and method of producing said catalysts
US3255153A (en) * 1960-11-14 1966-06-07 United States Borax Chem Curing epoxy resins with aminoborane curing agents
US3347827A (en) * 1964-10-21 1967-10-17 Callery Chemical Co Epoxide resin composition containing an amine borane accelerator
DE3716372A1 (de) 1987-05-15 1988-11-24 Wacker Chemie Gmbh Verfahren zur herstellung von organopolysiloxanen und ein neues organopolysiloxan
AU4342289A (en) * 1988-10-05 1990-05-01 E.I. Du Pont De Nemours And Company Curing agents for epoxy/anhydride resins
US5280119A (en) * 1991-11-01 1994-01-18 Boron Biologicals, Inc. Heterocyclic amine-boranes, and method of inhibiting DNA topoisomerase activity and/or combatting inflammation, hyperlipidemia, and/or neoplasia using amine-borane compounds
DE69425288T2 (de) 1993-03-23 2001-01-04 Reilly Industries, Inc. Katalysatore auf Basis von bizyclischen Amidinen und ihre Verwendung in heisshärtbaren Zusammensetzungen
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
TR200002404T2 (tr) * 1998-02-20 2001-01-22 The Dow Chemical Company Genişletilmiş anyonlar ihtiva eden katalizör etkinleştiriciler
US20020010291A1 (en) * 1998-12-04 2002-01-24 Vince Murphy Ionic liquids and processes for production of high molecular weight polyisoolefins
FR2800380B1 (fr) 1999-10-29 2002-01-18 Rhodia Chimie Sa Amorceur de polymerisation et/ou reticulation de polyorganosiloxanes a groupements fonctionnels reticulables, compositions correspondantes et leurs utlisations
FR2806930B1 (fr) * 2000-04-04 2002-06-28 Rhodia Chimie Sa Utilisation d'un derive de bore a titre de catalyseur thermoactivable pour la polymerisation et/ou reticulation de silicone par deshydrogenocondensation
GB0009289D0 (en) * 2000-04-15 2000-05-31 Dow Corning Process for the condensation of compounds having silicon bonded hydroxy or alkoxy groups
US7176269B2 (en) * 2000-07-25 2007-02-13 Mitsui Chemicals, Inc. Curable composition and its use
US6667194B1 (en) * 2000-10-04 2003-12-23 Henkel Loctite Corporation Method of bonding die chip with underfill fluxing composition
US6458472B1 (en) * 2001-01-08 2002-10-01 Henkel Loctite Corporation Fluxing underfill compositions
FR2824835A1 (fr) 2001-05-15 2002-11-22 Rhodia Chimie Sa Composition silicone polymerisable reticulable par voie cationique, sous activation thermique et au moyen d'un amorceur de type adduit acide/base de lewis
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
KR20040075353A (ko) 2002-01-17 2004-08-27 제너럴 일렉트릭 캄파니 양이온성 개시제로서 약하게 배위된 이미다졸리딘음이온을 포함하는 오늄 염
US20050048700A1 (en) * 2003-09-02 2005-03-03 Slawomir Rubinsztajn No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US7064173B2 (en) * 2002-12-30 2006-06-20 General Electric Company Silicone condensation reaction
US7241851B2 (en) * 2002-12-30 2007-07-10 Momentive Performance Materials Inc. Silicone condensation reaction
JP3952189B2 (ja) * 2003-02-06 2007-08-01 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
WO2005118682A1 (en) 2004-05-20 2005-12-15 General Electric Company Silicone condensation reaction
US20060011295A1 (en) * 2004-07-14 2006-01-19 Karsten Danielmeier Aspartic ester functional compounds
US20060211836A1 (en) * 2005-03-15 2006-09-21 General Electric Company Disproportionation of hydridosiloxanes and crosslinked polysiloxane network derived therefrom

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0598216A (ja) * 1991-04-29 1993-04-20 Natl Starch & Chem Investment Holding Corp アクリル接着剤配合物
JPH0687948A (ja) * 1992-09-07 1994-03-29 Three Bond Co Ltd エポキシ樹脂組成物
US5721183A (en) * 1995-03-10 1998-02-24 The Dow Chemical Company Catalyst system comprising amine or phosphine adducts of tris(organyl)borane compounds
JPH11181060A (ja) * 1997-12-19 1999-07-06 Sumitomo Bakelite Co Ltd 樹脂組成物、並びにそれを用いた半導体封止材料および積層板
JP2003517009A (ja) * 1999-12-17 2003-05-20 ダウ グローバル テクノロジーズ インコーポレイティド アミンオルガノボラン錯体重合開始剤および重合性組成物
WO2003076485A2 (en) * 2002-03-05 2003-09-18 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099086A (ja) * 2009-10-07 2011-05-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた電子部品装置
US9695272B2 (en) 2010-06-28 2017-07-04 Blue Cube Ip Llc Divinylarene dioxide resin compositions
JP2013531721A (ja) * 2010-06-28 2013-08-08 ダウ グローバル テクノロジーズ エルエルシー 硬化性樹脂組成物
JP5579859B2 (ja) * 2010-09-15 2014-08-27 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012036164A1 (ja) * 2010-09-15 2012-03-22 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
KR20130118339A (ko) 2010-11-05 2013-10-29 가부시키가이샤 닛폰 쇼쿠바이 카티온 경화성 수지 조성물
JP5680668B2 (ja) * 2010-11-05 2015-03-04 株式会社日本触媒 カチオン硬化性樹脂組成物
JP2013230431A (ja) * 2012-04-27 2013-11-14 Nippon Shokubai Co Ltd カチオン硬化触媒の製造方法
JP2013234231A (ja) * 2012-05-07 2013-11-21 Nippon Shokubai Co Ltd カチオン硬化性樹脂組成物
WO2021010394A1 (ja) * 2019-07-17 2021-01-21 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料
JP2021017462A (ja) * 2019-07-17 2021-02-15 株式会社ダイセル 硬化性組成物、及び線維強化複合材料
JP7306903B2 (ja) 2019-07-17 2023-07-11 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料

Also Published As

Publication number Publication date
RU2008102366A (ru) 2009-07-27
EP1926554A2 (en) 2008-06-04
CN101257973A (zh) 2008-09-03
WO2007001803A2 (en) 2007-01-04
US20060293172A1 (en) 2006-12-28
WO2007001803A3 (en) 2007-03-15
BRPI0612009A2 (pt) 2010-10-13
KR101391784B1 (ko) 2014-05-07
EP2283922A3 (en) 2013-07-03
US8048819B2 (en) 2011-11-01
EP2283922A2 (en) 2011-02-16
CN102786665A (zh) 2012-11-21
KR20080034438A (ko) 2008-04-21
CN101257973B (zh) 2014-07-30

Similar Documents

Publication Publication Date Title
JP2008544067A (ja) 硬化触媒、組成物、電子機器及び関連する方法
JP6366590B2 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
KR20110081221A (ko) 리드프리 전도성 조성물 및 그 사용 방법
JP2010001427A (ja) エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
JP2018009177A (ja) エポキシ樹脂、エポキシ樹脂組成物および硬化物
WO2003044089A1 (en) Thermosetting resin compositions useful as underfill sealants
JP2002097257A (ja) 液状エポキシ樹脂組成物及び半導体装置
JP2003183351A (ja) 液状エポキシ樹脂組成物及び半導体装置
KR20040032099A (ko) 광반도체 봉지용 수지 조성물
JP2017071706A (ja) エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物
CN105555827B (zh) 环氧树脂混合物、环氧树脂组合物、固化物和半导体装置
JP7281246B1 (ja) 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物
US6818318B2 (en) Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex
CN107207706A (zh) 鏻化合物、含有其的环氧树脂组成物及使用其制造的半导体装置
JP7005170B2 (ja) エポキシ樹脂組成物
JP2003183480A (ja) 液状エポキシ樹脂組成物及びフリップチップ型半導体装置
KR101702704B1 (ko) 포스포늄 이온 함유 화합물, 이를 포함하는 에폭시수지 조성물, 및 이를 사용하여 제조된 장치
JPS5817214B2 (ja) 酸無水物系の耐熱性硬化剤組成物
CN1831075A (zh) 包含苯并噁嗪的助熔不流动底层填料组合物
KR101706823B1 (ko) 술포늄 이온 함유 화합물, 이를 포함하는 에폭시수지 조성물 및 이를 사용하여 제조된 장치
JPH0299514A (ja) 半導体封止用半田耐熱性エポキシ樹脂組成物
KR101622016B1 (ko) 에폭시수지 조성물용 경화 촉매, 이를 포함하는 에폭시수지 조성물 및 이를 사용하여 제조된 장치
JP4521974B2 (ja) 結晶性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
KR101645074B1 (ko) 피리디늄계 화합물, 이를 포함하는 에폭시수지 조성물 및 이를 사용하여 제조된 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090528

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111129

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120217

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120224

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120328

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120404

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120425

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120528

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130305

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130605

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130612

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130703

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130710

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130805

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130812

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20130905

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140325